CN203437812U - Three-dimensional galvanometer laser etching machine - Google Patents
Three-dimensional galvanometer laser etching machine Download PDFInfo
- Publication number
- CN203437812U CN203437812U CN201320530401.9U CN201320530401U CN203437812U CN 203437812 U CN203437812 U CN 203437812U CN 201320530401 U CN201320530401 U CN 201320530401U CN 203437812 U CN203437812 U CN 203437812U
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- galvanometer
- axis kinematic
- kinematic system
- laser
- etching machine
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- 238000010329 laser etching Methods 0.000 title claims abstract description 11
- 239000010409 thin film Substances 0.000 claims description 10
- 238000010521 absorption reaction Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 abstract description 6
- 238000003698 laser cutting Methods 0.000 abstract description 2
- 238000001179 sorption measurement Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000033001 locomotion Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 239000000428 dust Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 235000004443 Ricinus communis Nutrition 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000004579 marble Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
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- Laser Beam Processing (AREA)
- Mechanical Optical Scanning Systems (AREA)
Abstract
The utility model relates to the technical field of laser cutting, in particular to a three-dimensional galvanometer laser etching machine. The etching machine comprises a rack, an industrial control machine, a displayer, a laser generating system, an X-Y galvanometer, a dynamic focusing galvanometer, a vacuum adsorption platform, a CCD positioning system, an X-axis moving system, a Y-axis moving system and a Z-axis moving system, wherein the dynamic focusing galvanometer is installed on the Z-axis moving system and located between the laser generating system and the X-Y galvanometer, and the dynamic focusing galvanometer and the X-Y galvanometer are combined to form a three-dimensional dynamic focusing galvanometer scanning system. Compared with an existing etching machine, the three-dimensional galvanometer laser etching machine has the advantages that due to the fact that the three-dimensional dynamic focusing laser galvanometer scanning system is used, the quality of light spots can be guaranteed when large breadth is machined, and the thread width can be controlled within 35 microns when the 300*300mm breadth is machined at one time.
Description
Technical field
The utility model belongs to laser cutting technique field, is specifically related to a kind of three-dimensional galvanometer laser etching machine.
Background technology
Along with the development of touch-screen and LCDs industry, to improving constantly of ito thin film substrate performance demand, also more and more higher to the process requirements of ito thin film, the etching laser machining that breadth is large, hot spot is little becomes study hotspot.Existing etching laser machining is generally used 2-D vibration mirror scanning device, adopt at a high speed reciprocal servomotor to drive X and two tiny mirror sheets of Y to coordinate deflecting reflection laser beams and reach the object that hot spot scans in whole plane, in etching linewidth requirements, be no more than under the condition of 35 μ m and use F-Θ lens focus single sweep operation breadth to be generally no more than 180 * 180mm, the mode that this 2-D vibration mirror scanning adds F-Θ lens focus when requiring single breadth larger is just difficult to meet the demands.
Summary of the invention
The purpose of this utility model is exactly the deficiency existing in order to solve above-mentioned background technology, and a kind of three-dimensional galvanometer laser etching machine that breadth is larger, scanning accuracy is higher that scans is provided.
The technical solution adopted in the utility model is: a kind of dual-headed laser etching machine, comprise frame, industrial computer, display, laser generating system, X-Y galvanometer, vacuum absorbing platform, CCD navigation system, X-axis kinematic system, Y-axis kinematic system and Z axis kinematic system, described industrial computer, display, laser generating system, X-axis kinematic system, Y-axis kinematic system and Z axis kinematic system are all arranged in frame; Described vacuum absorbing platform is driven by X-axis kinematic system, Y-axis kinematic system, and on vacuum absorbing platform, absorption has ito thin film; CCD navigation system is fixed on Z axis kinematic system bottom and is electrically connected to industrial computer, described X-Y galvanometer is arranged in Z axis kinematic system, it is characterized in that: also comprise dynamic focusing vibration mirror, described dynamic focusing vibration mirror is arranged in Z axis kinematic system between laser generating system and X-Y galvanometer, and described dynamic focusing vibration mirror and X-Y galvanometer are combined to form Three-Dimensional Dynamic and focus on galvanometer scanning system.
Further, described vacuum absorbing platform is fixed in Y-axis kinematic system, is positioned at X-axis kinematic system top; Described Y-axis kinematic system is arranged in X-axis kinematic system, and intersects and to be crosswise, and X-axis kinematic system is arranged in frame.
Further, the bottom delivery outlet of described X-Y galvanometer is provided with protecting window mirror.
Further, in described frame, be also provided with and take out dirt device, take out dirt device and be positioned at vacuum absorbing platform top.
The utility model is owing to being to utilize the deflection of two small eyeglasses of X-Y to realize scanning, so have low scanning inertia, the dynamic response feature of system is good, and galvanometer can, with high speed yaw motion, be realized high-velocity scanning; Simultaneously because two synthetic spatial relations of lens set of X-Y can complete the scanning of the visual field of exposing thoroughly; And, in the middle of laser generating system delivery outlet and X-Y galvanometer, increased dynamic focusing vibration mirror, can change the scanning errors bringing by real-time tracking compensation hot spot, scanning light spot can well be focused in whole scanning market, reach very high scanning accuracy.
The utility model, with respect to existing etching machine, has been used Three-Dimensional Dynamic laser focusing galvanometer scanning system, can in processing large format, guarantee optical quality, and single process 300 * 300 breadth live widths can be controlled in 35 μ m.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the enlarged diagram at A place in Fig. 1.
Wherein: 1-capable of regulating castor; 2-industrial computer; 3-case; 4-takes out dirt device; 5-keyboard; 6-electrical control; 7-display; 8-protecting window mirror; 9-Z axis motion system; 10-X-Y galvanometer; 11-dynamic focusing vibration mirror; 12-laser generating system; 13-CCD navigation system; 14-marble assembly; 15-ITO film; 16-vacuum absorbing platform; 17-Y axis motion system; 18-X axis motion system; 19-frame.
The specific embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail, is convenient to be well understood to the utility model, but they do not form and limit the utility model.
As shown in Figure 1 and Figure 2, the utility model comprises frame 19, industrial computer 2, display 7, laser generating system 12, X-Y galvanometer 10, dynamic focusing vibration mirror 11, vacuum absorbing platform 16, CCD navigation system 13, X-axis kinematic system 18, Y-axis kinematic system 17 and Z axis kinematic system 9, and described industrial computer 2, display 7, laser generating system 12, X-axis kinematic system 18, Y-axis kinematic system 17 and Z axis kinematic system 9 are all arranged in frame 19.Described X-Y galvanometer 10 is arranged in Z axis kinematic system 9, and the reflecting optics for protection galvanometer the inside, is provided with the protecting window mirror 8 that anti-reflection film is installed in the delivery outlet position of X-Y galvanometer 10 bottoms.Vacuum absorbing platform 16 is fixed in Y-axis kinematic system 17, is positioned at the top of X-axis kinematic system 18; Y-axis kinematic system 17 is arranged in X-axis kinematic system 18, and intersects and to be crosswise, and X-axis kinematic system 18 is arranged in frame 19.Vacuum absorbing platform 16 is driven left and right or is moved forward and backward by X-axis kinematic system 18 and Y-axis kinematic system 17, and on vacuum absorbing platform 16, absorption has ito thin film 15.CCD navigation system 13 is fixed on Z axis kinematic system 9 bottoms and is electrically connected to industrial computer 2, and show by display 7, be positioned at vacuum absorbing platform 16 tops, by industrial computer 2, control CCD navigation systems 13 and catch anchor point on ito thin films 15 and treat and carve workpiece and position.Described dynamic focusing vibration mirror 11 is arranged in Z axis kinematic system 9 between laser generating system 12 and X-Y galvanometer 10, dynamic focusing vibration mirror 11 is combined to form Three-Dimensional Dynamic with X-Y galvanometer 10 and focuses on galvanometer scanning system, guarantees beam quality when can increase processing breadth.In frame 19, be also provided with and take out dirt device 4, take out dirt device 4 and be positioned at vacuum absorbing platform 16 tops.
The utility model arranges the laser ablation figure needing in display 7 by keyboard 5, the workpiece of having reduced is put on vacuum absorbing platform 16, and the anchor point catching on ito thin film 15 by CCD navigation system 13 positions workpiece.During material loading, workpiece places by industrial computer 2 and controls 16 one-tenth adsorbed states of vacuum absorbing platform, while being convenient to work piece cut, is not shifted; During blanking, the vacuum absorbing platform 16 of work top is switched to Compressed Gas blowback by vacuum suction and floats workpiece, and gets back to material loading position, is convenient to workpiece blanking.Frame 19 structures adopt 14 assemblings of marble assembly, in the bottom of frame 19, capable of regulating castor 1 are installed, and facilitate frame 19 to adjust and move.
The utility model increases dynamic focusing vibration mirror 11 and comes real-time ensuring laser beam well to focus in real time on whole working face in scanning system light path.The light beam that laser generating system 12 sends is through becoming the directional light of energy even after beam expanding lens, then through after dynamic focusing vibration mirror 11 effects, light beam becomes convergent beam, first project on X-axis vibration mirror reflected face, through projecting again the reflecting surface of Y-axis galvanometer after X-axis vibration mirror reflected, after crossing the reflection of Y-axis galvanometer, project ito thin film 15 surfaces, the mode of destroying by LASER HEAT decomposition method or strand by the figure of design is opened useful ITO conducting film region with needing the ITO conducting film region separation of removing.Take out in dirt device 4 air blowing parts and dust suction parts are set, air blowing parts connect Compressed Gas, blow off groove rear film face in groove process, and the dust suction parts on it connect suction system, siphon away the dust after groove in groove process.In the course of work, by computer system is omnidistance, control, machine after vacuum absorbing platform is got back to material loading position and shut down.
Groove track in the utility model can be linear fashion, first top substrate layer or lower laminar substrate are positioned on vacuum absorbing platform, X-axis kinematic system 18 and 17 aggregate motions of Y-axis kinematic system, drive vacuum absorbing platform to move by demand figure, laser is focused into little luminous point via laser generator by cutting head, act on ito thin film, ito thin film on substrate is delineated into the conducting film of X-axis or Y-axis array arrangement.Groove track in the utility model also can be realized non-rectilinear mode.X-axis kinematic system 18 realizes with mobile control by each device in electrical control 6 of Y-axis kinematic system 17, at frame 19 outer setting cases 3, some structures of frame 19 inside is sealed, and guarantees that each parts are normally used.
Above-described embodiment is to provide to being familiar with person in the art and realizes or use of the present utility model; those skilled in the art can be without departing from the present invention in the case of the inventive idea; above-described embodiment is made to various modifications or variation; thereby protection domain of the present utility model do not limit by above-described embodiment, and it should be the maximum magnitude that meets the inventive features that claims mention.
Claims (4)
1. a three-dimensional galvanometer laser etching machine, comprise frame, industrial computer, display, laser generating system, X-Y galvanometer, vacuum absorbing platform, CCD navigation system, X-axis kinematic system, Y-axis kinematic system and Z axis kinematic system, described industrial computer, display, laser generating system, X-axis kinematic system, Y-axis kinematic system and Z axis kinematic system are all arranged in frame; Described vacuum absorbing platform is driven by X-axis kinematic system, Y-axis kinematic system, and on vacuum absorbing platform, absorption has ito thin film; CCD navigation system is fixed on Z axis kinematic system bottom and is electrically connected to industrial computer, described X-Y galvanometer is arranged in Z axis kinematic system, it is characterized in that: also comprise dynamic focusing vibration mirror, described dynamic focusing vibration mirror is arranged in Z axis kinematic system between laser generating system and X-Y galvanometer, and described dynamic focusing vibration mirror and X-Y galvanometer are combined to form Three-Dimensional Dynamic and focus on galvanometer scanning system.
2. three-dimensional galvanometer laser etching machine according to claim 1, is characterized in that: described vacuum absorbing platform is fixed in Y-axis kinematic system, is positioned at X-axis kinematic system top; Described Y-axis kinematic system is arranged in X-axis kinematic system, and intersects and to be crosswise, and X-axis kinematic system is arranged in frame.
3. three-dimensional galvanometer laser etching machine according to claim 1, is characterized in that: the bottom delivery outlet of described X-Y galvanometer is provided with protecting window mirror.
4. three-dimensional galvanometer laser etching machine according to claim 1, is characterized in that: in described frame, be also provided with and take out dirt device, take out dirt device and be positioned at vacuum absorbing platform top.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320530401.9U CN203437812U (en) | 2013-08-28 | 2013-08-28 | Three-dimensional galvanometer laser etching machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320530401.9U CN203437812U (en) | 2013-08-28 | 2013-08-28 | Three-dimensional galvanometer laser etching machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203437812U true CN203437812U (en) | 2014-02-19 |
Family
ID=50088886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320530401.9U Expired - Fee Related CN203437812U (en) | 2013-08-28 | 2013-08-28 | Three-dimensional galvanometer laser etching machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203437812U (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105117066A (en) * | 2015-09-16 | 2015-12-02 | 业成光电（深圳）有限公司 | Touch panel, manufacturing method thereof and laser etching device |
| CN105234561A (en) * | 2015-10-13 | 2016-01-13 | 深圳英诺激光科技有限公司 | Automatic laser cutting static electricity decarbonizing system and method for PI cover film |
| CN105269147A (en) * | 2015-10-15 | 2016-01-27 | 哈尔滨工业大学 | Three-dimensional vacuum laser machining device and method for carrying out laser machining through device |
| CN105834588A (en) * | 2015-01-12 | 2016-08-10 | 苏州新云激光科技有限公司 | Device for machining metal mirror by laser ablation |
| CN106950804A (en) * | 2017-05-19 | 2017-07-14 | 深圳市斯普莱特激光科技有限公司 | A kind of novel high-precision three-dimensional laser exposure curing equipment |
| CN107024837A (en) * | 2017-05-19 | 2017-08-08 | 深圳市斯普莱特激光科技有限公司 | A kind of high-precision three-dimensional laser explosure curing process |
| CN107030397A (en) * | 2017-05-19 | 2017-08-11 | 东莞市盛雄激光设备有限公司 | The cutter device and cutting method of a kind of composite substrate |
| CN107052571A (en) * | 2016-12-27 | 2017-08-18 | 深圳信息职业技术学院 | A kind of laser welding apparatus and method for laser welding |
| CN107127458A (en) * | 2017-05-26 | 2017-09-05 | 东莞市盛雄激光设备有限公司 | The full-automatic double-ended ultraviolet cutting machine of double |
| CN110026679A (en) * | 2019-04-17 | 2019-07-19 | 武汉吉事达科技股份有限公司 | A kind of more galvanometer laser equipments of large format |
| CN111618424A (en) * | 2019-02-28 | 2020-09-04 | 深圳市大族数控科技有限公司 | Triaxial galvanometer coaxial adjusting device and focal length confirmation method |
-
2013
- 2013-08-28 CN CN201320530401.9U patent/CN203437812U/en not_active Expired - Fee Related
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105834588A (en) * | 2015-01-12 | 2016-08-10 | 苏州新云激光科技有限公司 | Device for machining metal mirror by laser ablation |
| CN105117066A (en) * | 2015-09-16 | 2015-12-02 | 业成光电（深圳）有限公司 | Touch panel, manufacturing method thereof and laser etching device |
| CN105117066B (en) * | 2015-09-16 | 2018-10-30 | 业成光电（深圳）有限公司 | Touch panel, the manufacturing method of touch panel and laser etching device |
| CN105234561A (en) * | 2015-10-13 | 2016-01-13 | 深圳英诺激光科技有限公司 | Automatic laser cutting static electricity decarbonizing system and method for PI cover film |
| CN105269147A (en) * | 2015-10-15 | 2016-01-27 | 哈尔滨工业大学 | Three-dimensional vacuum laser machining device and method for carrying out laser machining through device |
| CN105269147B (en) * | 2015-10-15 | 2017-03-22 | 哈尔滨工业大学 | Three-dimensional vacuum laser machining device and method for carrying out laser machining through device |
| CN107052571A (en) * | 2016-12-27 | 2017-08-18 | 深圳信息职业技术学院 | A kind of laser welding apparatus and method for laser welding |
| CN107052571B (en) * | 2016-12-27 | 2019-08-30 | 深圳信息职业技术学院 | A kind of laser welding apparatus and method for laser welding |
| CN107024837A (en) * | 2017-05-19 | 2017-08-08 | 深圳市斯普莱特激光科技有限公司 | A kind of high-precision three-dimensional laser explosure curing process |
| CN107030397A (en) * | 2017-05-19 | 2017-08-11 | 东莞市盛雄激光设备有限公司 | The cutter device and cutting method of a kind of composite substrate |
| CN106950804A (en) * | 2017-05-19 | 2017-07-14 | 深圳市斯普莱特激光科技有限公司 | A kind of novel high-precision three-dimensional laser exposure curing equipment |
| CN107127458A (en) * | 2017-05-26 | 2017-09-05 | 东莞市盛雄激光设备有限公司 | The full-automatic double-ended ultraviolet cutting machine of double |
| CN111618424A (en) * | 2019-02-28 | 2020-09-04 | 深圳市大族数控科技有限公司 | Triaxial galvanometer coaxial adjusting device and focal length confirmation method |
| CN110026679A (en) * | 2019-04-17 | 2019-07-19 | 武汉吉事达科技股份有限公司 | A kind of more galvanometer laser equipments of large format |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140219 Termination date: 20180828 |