CN203368934U - PCB wiring inductor, and DC-DC circuit - Google Patents
PCB wiring inductor, and DC-DC circuit Download PDFInfo
- Publication number
- CN203368934U CN203368934U CN201320417872.9U CN201320417872U CN203368934U CN 203368934 U CN203368934 U CN 203368934U CN 201320417872 U CN201320417872 U CN 201320417872U CN 203368934 U CN203368934 U CN 203368934U
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Abstract
The utility model discloses a PCB wiring inductor, and a DC-DC circuit. The PCB wiring inductor comprises copper-coated wire loops which are printed onto a PCB. The copper-coated wire loops are arranged on signal layers of the PCB correspondingly. The copper-coated wire loops are connected through via holes in the PCB. In the circuit design, the copper-coated wire loops are connected with components in a circuit, wherein the components need to be connected with PCB wiring inductors. When the circuit is powered on, a magnetic field is generated due to current change, so magnetic flux exists between the copper-coated wire loops of the signal layers, the functions of a finished inductor can be realized, so the PCB wiring inductor can be used to replace an inductor in a circuit in which the inductor needs to be used, the finished inductor does not need to be used in the circuit design, the utilization of components is reduced, so that the production cost of the circuit in which the inductor needs to be used is reduced, and at the same time, a copper foil on the PCB is fully used, so the waste of resources is reduced. The PCB wiring inductor of the utility model is suitable for the design of a circuit in which an inductor needs to be used.
Description
Technical field
The utility model relates to the electronic circuit technology field, relates in particular to a kind of PCB cabling inductance and DC-DC circuit.
Background technology
In design of electronic circuits, inductance is basic energy conversion unit.For example, in the DC-DC circuit design, boost or step-down adopts inductance to realize voltage transitions, according to the operating frequency of DC-DC change-over circuit and the size of output current, the inductance value of inductance can be different, and for example, the output current one of DC-DC change-over circuit regularly, if the operating frequency of DC-DC change-over circuit is higher, the inductance value of required inductance is less.
In prior art, at needs, use in the circuit of inductance, the inductance be welded on pcb board all adopts the finished product inductance of vertical encapsulation or paster encapsulation, and adopts the finished product inductance can increase the design cost of circuit integral body.
The utility model content
Main purpose of the present utility model is to propose a kind of PCB cabling inductance and DC-DC circuit, is intended to reduce the production cost of the circuit that needs the use inductance.
In order to achieve the above object, the utility model proposes a kind of PCB cabling inductance, this PCB cabling inductance comprises being printed on and covers the copper cash pitch of the laps on pcb board, and the described copper cash pitch of the laps correspondence of covering is arranged on the signals layer of described pcb board, and described covering between the copper cash pitch of the laps connects by the via hole on described pcb board.
Preferably, described covering on the copper cash pitch of the laps is provided with the Surface Mount magnetic sheet, and described Surface Mount magnetic sheet is attached to described covering on the copper cash pitch of the laps.
Preferably, the described of a signals layer that described Surface Mount magnetic sheet is attached to described pcb board covered on the copper cash pitch of the laps.
Preferably, described covering on the copper cash pitch of the laps is provided with the punching magnetic core, and described punching magnetic core comprises attaching section and punching section, and described attaching section is attached to described covering on the copper cash pitch of the laps, described punching section is through the through hole on described pcb board, and described through hole is arranged on the described copper cash pitch of the laps center of covering.
Preferably, described attaching section is attached to the described of described pcb board top layer or bottom and covers on the copper cash pitch of the laps.
Preferably, the described copper cash pitch of the laps that covers is the swirl shape setting.
Preferably, describedly cover the rounded or oval setting of copper cash pitch of the laps.
Preferably, describedly cover the rectangular setting of copper cash pitch of the laps.
The utility model also proposes a kind of DC-DC circuit, this DC-DC circuit comprises PCB cabling inductance, this PCB cabling inductance comprises being printed on and covers the copper cash pitch of the laps on pcb board, the described copper cash pitch of the laps correspondence of covering is arranged on the signals layer of described pcb board, and described covering between the copper cash pitch of the laps connects by the via hole on described pcb board.
The PCB cabling inductance the utility model proposes, by the signals layer of pcb board, arranging and cover the copper cash pitch of the laps, the copper cash pitch of the laps that covers on each signals layer connects by the via hole on pcb board.In circuit design, covering the copper cash pitch of the laps is connected with the components and parts that need connection PCB cabling inductance in circuit, when power on circuitry, can change by generation current, due to electromagnetic induction, therefore covering between the copper cash pitch of the laps on each signals layer has magnetic flux, function with finished product inductance, can replace needs to use the inductance in the circuit of inductance, do not need to use the finished product inductance while making circuit design, save the use of components and parts, thereby reduce the production cost of the circuit that needs the use inductance, take full advantage of the Copper Foil on pcb board simultaneously, reduce the wasting of resources.
The accompanying drawing explanation
Fig. 1 is the schematic diagram that cover copper cash pitch of the laps of the utility model PCB cabling inductance on pcb board first signal layer;
Fig. 2 is the schematic diagram that cover copper cash pitch of the laps of the utility model PCB cabling inductance on pcb board secondary signal layer;
Fig. 3 is the schematic diagram that cover copper cash pitch of the laps of the utility model PCB cabling inductance on pcb board the 3rd signals layer;
Fig. 4 is the schematic diagram that cover copper cash pitch of the laps of the utility model PCB cabling inductance on pcb board the 4th signals layer;
Fig. 5 is that the utility model PCB cabling inductance is arranged on the schematic diagram on pcb board;
Fig. 6 is that the utility model PCB cabling inductance is covering the schematic diagram that the Surface Mount magnetic sheet is set on the copper cash pitch of the laps;
Fig. 7 is that the utility model PCB cabling inductance is covering the schematic diagram that the punching magnetic core is set on the copper cash pitch of the laps.
The realization of the purpose of this utility model, functional characteristics and advantage, in connection with embodiment, and be described further with reference to accompanying drawing.
Embodiment
Further illustrate the technical solution of the utility model below in conjunction with Figure of description and specific embodiment.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
The utility model proposes a kind of PCB cabling inductance.
Referring to figs. 1 through Fig. 5, Fig. 1 is the schematic diagram that cover copper cash pitch of the laps 111 of the utility model PCB cabling inductance 110 on pcb board 100 first signal layers; Fig. 2 is the schematic diagram that cover copper cash pitch of the laps 111 of the utility model PCB cabling inductance 110 on pcb board 100 secondary signal layers; Fig. 3 is the schematic diagram that cover copper cash pitch of the laps 111 of the utility model PCB cabling inductance 110 on pcb board 100 the 3rd signals layer; Fig. 4 is the schematic diagram that cover copper cash pitch of the laps 111 of the utility model PCB cabling inductance 110 on pcb board 100 the 4th signals layer; Fig. 5 is the schematic diagram that the utility model PCB cabling inductance 110 is arranged on pcb board 100.
In the utility model embodiment, PCB cabling inductance 110 comprises being printed on and covers copper cash pitch of the laps 111 on pcb board 100, cover copper cash pitch of the laps 111 and be the swirl shape setting, cover copper cash pitch of the laps 111 correspondences and be arranged on the signals layer of pcb board 100, cover between copper cash pitch of the laps 111 and be connected by the via hole (as the first via hole 141, the second via hole 142 and the 3rd via hole 143) on pcb board 100.
The present embodiment be take four layers of pcb board 100 and is described as example, cover as shown in Figures 1 to 4 copper cash pitch of the laps 111, be printed on respectively on four signals layers on pcb board 100, covering on the first signal layer (as top layer) that copper cash pitch of the laps 111 is printed on pcb board 100 shown in Fig. 1 for example, covering on the secondary signal layer (as middle ground floor) that copper cash pitch of the laps 111 is printed on pcb board 100 shown in Fig. 2, covering on the 3rd signals layer (as the middle second layer) that copper cash pitch of the laps 111 is printed on pcb board 100 shown in Fig. 3, covering on the 4th signals layer (as bottom) that copper cash pitch of the laps 111 is printed on pcb board 100 shown in Fig. 4.In actual applications, the number of turns of covering copper cash pitch of the laps 111 determines according to the inductance value size of circuit actual needs inductance, if need the inductance value of inductance larger, the number of turns of covering copper cash pitch of the laps 111 is just more, otherwise, need the inductance value of inductance little, the number of turns of covering copper cash pitch of the laps 111 is just few.
As shown in Figures 1 to 4, the first signal layer, the secondary signal layer, copper cash pitch of the laps 111 correspondences of covering on the 3rd signals layer and the 4th signals layer arrange, for example the copper cash pitch of the laps 111 that covers on the first signal layer is formed by counterclockwise ecto-entad pitch of the laps by the PCB cabling, on the secondary signal layer cover copper cash pitch of the laps 111 by the PCB cabling by counterclockwise along the path of covering copper cash pitch of the laps 111 on the first signal layer from inside to outside pitch of the laps form, on the 3rd signals layer cover copper cash pitch of the laps 111 by the PCB cabling by forming along the path ecto-entad pitch of the laps that covers copper cash pitch of the laps 111 on the secondary signal layer counterclockwise, on the 4th signals layer cover copper cash pitch of the laps 111 by the PCB cabling by counterclockwise along the path of covering copper cash pitch of the laps 111 on the 3rd signals layer from inside to outside pitch of the laps form, so the copper cash pitch of the laps 111 that covers on each signals layer is stacked together, guarantee that the magnetic flux that covers generation between copper cash pitch of the laps 111 on each signals layer is enough large, make the inductance value of PCB cabling inductance 110 enough large, can replace the finished product inductance.
The top that covers copper cash pitch of the laps 111 on the first signal layer is connected with the first pad 161 on pcb board 100, this first pad 161 is for connecting the components and parts 200 that need to be connected with PCB cabling inductance 110, the end that covers copper cash pitch of the laps 111 on the first signal layer is connected to the top that covers copper cash pitch of the laps 111 on the secondary signal layer by the first via hole 141, the end that covers copper cash pitch of the laps 111 on the secondary signal layer is connected to the top that covers copper cash pitch of the laps 111 on the 3rd signals layer by the second via hole 142, the end that covers copper cash pitch of the laps 111 on the 3rd signals layer is connected to the top that covers copper cash pitch of the laps 111 on the 4th signals layer by the 3rd via hole 143, the end that covers copper cash pitch of the laps 111 on the 4th signals layer is connected with the second pad 162 on pcb board 100, this second pad 162 is for connecting the components and parts 200 that need to be connected with PCB cabling inductance 110.In circuit design, after covering copper cash pitch of the laps 111 and connecting by the first pad 161, the second pad 162 and components and parts in circuit and that need to be connected with PCB cabling inductance 110 200, when power on circuitry, because curent change can produce magnetic field, therefore covering between copper cash pitch of the laps 111 on each signals layer has magnetic flux, function with finished product inductance, can replace needs to use the inductance in the circuit of inductance, saves the finished product inductance that circuit design adopts.For example, in the DC-DC change-over circuit, PCB cabling inductance 110 can replace the finished product inductance, as the DC-DC change-over circuit, carries out the required inductance of power conversion.
With respect to prior art, the utility model PCB cabling inductance 110, replace the finished product inductance by the copper cash pitch of the laps 111 that covers that utilizes the PCB cabling to form, do not need to use the finished product inductance while making circuit design, save the use of components and parts, thereby reduce the production cost of the circuit that needs the use inductance, take full advantage of the Copper Foil on pcb board 100 simultaneously, reduce the wasting of resources.
Particularly, cover copper cash pitch of the laps 111 and be the swirl shape setting, make and cover the function that copper cash pitch of the laps 111 has the finished product inductance, and strengthen the magnetic flux between copper cash pitch of the laps 111 that covers on each signals layer.
In the embodiment of other distortion, according to the actual design needs, cover that copper cash pitch of the laps 111 is rounded, ellipse or rectangle setting.
Referring to figs. 1 through Fig. 7, wherein Fig. 6 is that the utility model PCB cabling inductance 110 is covering the schematic diagram that Surface Mount magnetic sheet 120 is set on copper cash pitch of the laps 111; Fig. 7 is that the utility model PCB cabling inductance 110 is covering the schematic diagram that punching magnetic core 130 is set on copper cash pitch of the laps 111.
As shown in Figure 6, cover on copper cash pitch of the laps 111 and be provided with Surface Mount magnetic sheet 120, Surface Mount magnetic sheet 120 is attached to and covers on copper cash pitch of the laps 111, covers copper cash pitch of the laps 111 and is connected with the components and parts 200 that need connection PCB cabling inductance 110 by the first pad 161, the second pad 162.When the inductance value by covering the PCB cabling inductance 110 that copper cash pitch of the laps 111 forms is not enough, Surface Mount magnetic sheet 120 is attached to and covers on copper cash pitch of the laps 111, covering increase Surface Mount magnetic sheet 120 on copper cash pitch of the laps 111, to strengthen the magnetic flux of PCB cabling inductance 110, increase the inductance value of PCB cabling inductance 110, make PCB cabling inductance 110 there is enough inductance values, to meet the inductance value requirement of required inductance in circuit.
In the present embodiment, preferably Surface Mount magnetic sheet 120 covers copper cash pitch of the laps 111, to strengthen the magnetic flux of PCB cabling inductance 110.Surface Mount magnetic sheet 120 is attached to the covering on copper cash pitch of the laps 111 an of signals layer of pcb board 100, usually Surface Mount magnetic sheet 120 is attached on the top layer or bottom of pcb board 100, so that pcb board 100 is easy to make.
As shown in Figure 7, in the embodiment of a distortion, cover on copper cash pitch of the laps 111 and be provided with punching magnetic core 130, punching magnetic core 130 comprises attaching section 131 and punching section 132, attaching section 131 is attached to be covered on copper cash pitch of the laps 111, punching section 132 is through the through hole 150 on pcb board 100, and this through hole 150 is arranged on and covers copper cash pitch of the laps 111 centers, covers copper cash pitch of the laps 111 and is connected with the components and parts 200 that need connection PCB cabling inductance 110 by the first pad 161, the second pad 162.When the inductance value by covering the PCB cabling inductance 110 that copper cash pitch of the laps 111 forms is not enough, except increasing Surface Mount magnetic sheet 120 covering on copper cash pitch of the laps 111, increase punching magnetic core 130 on copper cash pitch of the laps 111 can also covered, the attaching section 131 of punching magnetic core 130 is attached to and covers on copper cash pitch of the laps 111, the through hole 150 that the punching section of punching magnetic core 130 132 is passed on pcb board 100, make the magnetic flux covered between copper cash pitch of the laps 111 assemble, strengthen the magnetic flux of PCB cabling inductance 110, make PCB cabling inductance 110 there is enough inductance values, to meet the inductance value requirement of required inductance in circuit.
In the present embodiment, preferably copper cash pitch of the laps 111 is covered in the attaching section 131 of punching magnetic core 130, to strengthen the magnetic flux of PCB cabling inductance 110.In pcb board 100 manufacturing process, attaching section 131 can be attached to the covering on copper cash pitch of the laps 111 of pcb board 100 top layers or bottom.
The utility model also proposes a kind of DC-DC circuit, and this DC-DC circuit comprises PCB cabling inductance, and the structure of this PCB cabling inductance and beneficial effect, all with reference to above-described embodiment, repeat no more herein.
The foregoing is only preferred embodiment of the present utility model; not thereby limit the scope of the claims of the present utility model; every equivalent structure or conversion of equivalent flow process that utilizes the utility model specification and accompanying drawing content to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in scope of patent protection of the present utility model.
Claims (9)
1. a PCB cabling inductance, is characterized in that, comprises being printed on covering the copper cash pitch of the laps on pcb board, and the described copper cash pitch of the laps correspondence of covering is arranged on the signals layer of described pcb board, and described covering between the copper cash pitch of the laps connects by the via hole on described pcb board.
2. PCB cabling inductance as claimed in claim 1, is characterized in that, described covering on the copper cash pitch of the laps is provided with the Surface Mount magnetic sheet, and described Surface Mount magnetic sheet is attached to described covering on the copper cash pitch of the laps.
3. PCB cabling inductance as claimed in claim 2, is characterized in that, the described of a signals layer that described Surface Mount magnetic sheet is attached to described pcb board covered on the copper cash pitch of the laps.
4. PCB cabling inductance as claimed in claim 1, it is characterized in that, described covering on the copper cash pitch of the laps is provided with the punching magnetic core, described punching magnetic core comprises attaching section and punching section, described attaching section is attached to described covering on the copper cash pitch of the laps, described punching section is through the through hole on described pcb board, and described through hole is arranged on the described copper cash pitch of the laps center of covering.
5. PCB cabling inductance as claimed in claim 4, is characterized in that, described attaching section is attached to the described of described pcb board top layer or bottom and covers on the copper cash pitch of the laps.
6. PCB cabling inductance as described as claim 1 to 5 any one, is characterized in that, the described copper cash pitch of the laps that covers is the swirl shape setting.
7. PCB cabling inductance as described as claim 1 to 5 any one, is characterized in that, describedly covers the rounded or oval setting of copper cash pitch of the laps.
8. PCB cabling inductance as described as claim 1 to 5 any one, is characterized in that, describedly covers the rectangular setting of copper cash pitch of the laps.
9. a DC-DC circuit, is characterized in that, comprises the described PCB cabling of any one inductance in claim 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320417872.9U CN203368934U (en) | 2013-07-12 | 2013-07-12 | PCB wiring inductor, and DC-DC circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320417872.9U CN203368934U (en) | 2013-07-12 | 2013-07-12 | PCB wiring inductor, and DC-DC circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203368934U true CN203368934U (en) | 2013-12-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320417872.9U Expired - Fee Related CN203368934U (en) | 2013-07-12 | 2013-07-12 | PCB wiring inductor, and DC-DC circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203368934U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108925038A (en) * | 2018-07-25 | 2018-11-30 | 深圳市华星光电技术有限公司 | Inductance, circuit board and inductance measurement method |
| CN109661099A (en) * | 2018-12-21 | 2019-04-19 | 重庆蓝岸通讯技术有限公司 | A kind of PCB construction that excessive electric power can be recycled |
| CN111313655A (en) * | 2018-12-12 | 2020-06-19 | 台达电子工业股份有限公司 | Voltage regulation module |
| US10973127B2 (en) | 2018-10-09 | 2021-04-06 | Delta Electronics, Inc. | Voltage regulator module |
| US11158451B2 (en) | 2018-10-09 | 2021-10-26 | Delta Electronics, Inc. | Power module |
| US11166373B2 (en) | 2018-10-09 | 2021-11-02 | Delta Electronics, Inc. | Voltage regulator module |
-
2013
- 2013-07-12 CN CN201320417872.9U patent/CN203368934U/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108925038A (en) * | 2018-07-25 | 2018-11-30 | 深圳市华星光电技术有限公司 | Inductance, circuit board and inductance measurement method |
| US10973127B2 (en) | 2018-10-09 | 2021-04-06 | Delta Electronics, Inc. | Voltage regulator module |
| US11158451B2 (en) | 2018-10-09 | 2021-10-26 | Delta Electronics, Inc. | Power module |
| US11166373B2 (en) | 2018-10-09 | 2021-11-02 | Delta Electronics, Inc. | Voltage regulator module |
| US11282632B2 (en) | 2018-10-09 | 2022-03-22 | Delta Electronics, Inc. | Power module |
| US11488764B2 (en) | 2018-10-09 | 2022-11-01 | Delta Electronics, Inc. | Voltage regulator module |
| US11605495B2 (en) | 2018-10-09 | 2023-03-14 | Delta Electronics, Inc. | Electronic device |
| US11626237B2 (en) | 2018-10-09 | 2023-04-11 | Delta Electronics, Inc. | Power module and method for delivering power to electronic device |
| US11881344B2 (en) | 2018-10-09 | 2024-01-23 | Delta Electronics, Inc. | Power system |
| CN111313655A (en) * | 2018-12-12 | 2020-06-19 | 台达电子工业股份有限公司 | Voltage regulation module |
| CN109661099A (en) * | 2018-12-21 | 2019-04-19 | 重庆蓝岸通讯技术有限公司 | A kind of PCB construction that excessive electric power can be recycled |
| CN109661099B (en) * | 2018-12-21 | 2021-04-16 | 重庆蓝岸通讯技术有限公司 | PCB structure of recoverable excessive electric power |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131225 Termination date: 20210712 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |