CN203015375U - Printed circuit board and electromagnetic shielding film with high filling property - Google Patents
Printed circuit board and electromagnetic shielding film with high filling property Download PDFInfo
- Publication number
- CN203015375U CN203015375U CN 201220710157 CN201220710157U CN203015375U CN 203015375 U CN203015375 U CN 203015375U CN 201220710157 CN201220710157 CN 201220710157 CN 201220710157 U CN201220710157 U CN 201220710157U CN 203015375 U CN203015375 U CN 203015375U
- Authority
- CN
- China
- Prior art keywords
- electromagnetic shielding
- shielding film
- layer
- circuit board
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model, which relates to a screened film, particularly provides a printed circuit board and an electromagnetic shielding film with a high filling property. The electromagnetic shielding film with the high filling property comprises a carrier film layer, an insulation layer, a foamed metal layer, a conducting resin layer, and a protection film layer, wherein the layers are successively arranged from bottom to up. Because the foamed metal layer with the good elastic deformation capability is arranged at the electromagnetic shielding film, the electromagnetic shielding film has the good filling capability when applied to a printed circuit board with a high step and a soft-hard combination board, so that the electromagnetic shielding film with the high filling property can be widely applied to manufacturing of a circuit board having a high step.
Description
Technical field
The utility model relates to screened film, more particularly, relates to a kind of printed circuit board (PCB) and high fillibility electromagnetic shielding film.
Background technology
Flexible PCB is that make take polyimides or polyester film as base material a kind of has height reliability, excellent flexible printed circuit.It is called for short soft board or FPC, and the advantage such as have that distribution density is high, lightweight, thin thickness, configuration design are flexible is therefore in the wiring board that is widely used in recent years telecommunications, photography and vedio recording equipment, printer, mobile phone, portable computer.
Flexible PCB also has an important index when having above-mentioned plurality of advantages, be namely electromagnetic shielding.If its electromagnetic shielding is untreated, when being applied to mobile communcations system, can producing serious electromagnetic interference problem and affect the operation of communication system.At present, the shielding of flexible circuit board must form barrier film layer on its surface.
Be in the utility model patent of CN200680016573.7 in the patent No., disclose a kind of screened film for flexible PCB, this screened film comprises: diffusion barrier; Overlay film is located on a surface of this diffusion barrier; And adhesive layer, it is formed on the surface of this overlay film relative with this diffusion barrier by metal level.And adopt the printing mode to form.Outer field insulating barrier is thinner, and the peel strength of insulating barrier and screen is lower, lamination easily appears in the process of process for pressing repeatedly, in the time of in the flexible PCB that is applied to have larger step or Rigid Flex, its metal level easily breaks, and does not have the effect of shielding and ground connection.
Be in 200810220337.8 utility model patent in the patent No., a kind of ultra-thin shielding film that changes circuit impedance is disclosed, this screened film forms strippable band lattice metal fail on carrier, to be with lattice metal fail to be transferred on insulating cover, by lattice metal fail is set, make itself and insulating barrier have high peel strength, the tolerance thermal shock that can continue, can be used in the repeatedly process for pressing of Rigid Flex, simultaneously, it can reduce the thickness of dielectric layer, realizes the purpose of impedance Control.Above-mentioned this its main purpose of screened film with lattice metal fail is to change circuit impedance, although lattice metal fail also has certain intensity, strengthen its peel strength, but lattice metal fail, be the planar structure of two dimension, the grid metal easily ruptures in high step wiring board hot pressing, thereby causes opening circuit, therefore can't really realize high filling capacity, still can't be applied in the making of flexible PCB of large step.
The utility model content
Technical problem to be solved in the utility model is to overcome the defective of prior art, provide a kind of simple in structure, filling capacity is good, can be applicable to the high fillibility electromagnetic shielding film of large step circuit boards making and the printed circuit board (PCB) that adopts this high fillibility electromagnetic shielding film.
For solving the problems of the technologies described above, the technical solution of the utility model is: a kind of high fillibility electromagnetic shielding film is provided, and it comprises carrier rete, insulating barrier, foaming metal layer, conductive adhesive layer and the protective film that sets gradually from the bottom to top.
Particularly, described carrier layer is by a basement membrane and be positioned at described epilamellar release layer and form, and described release layer solidify to form by being coated on this epilamellar mould release.
Particularly, the metal of described foaming metal layer is nickel or copper or silver or chromium or alloy, and the thickness range of described foaming metal layer is 1 μ m～50 μ m.
Particularly, described conductive adhesive layer is to sneak into Ni-based or copper base or silver base conductive particle are made by thermosetting epoxy resin glue, and the thickness range of described conductive adhesive layer is 5 μ m～200 μ m.
The utility model also provides a kind of printed circuit board (PCB), comprises circuit substrate, and in the upper surface of described circuit substrate and lower surface, at least one surface is provided with above-mentioned high fillibility electromagnetic shielding film.
In the utility model, because electromagnetic shielding film is provided with the foaming metal layer, and the foaming metal layer has stronger elastic deformation ability, like this, therefore have stronger filling capacity when making electromagnetic shielding film be applied on higher step printed circuit board (PCB) and Rigid Flex, the electromagnetic shielding film of this high fillibility can be widely used in having in the making of circuit board of large step.
Description of drawings
Fig. 1 is the structure cut away view of the high fillibility electromagnetic shielding film that provides of the utility model;
Fig. 2 is the cut away view of the manufacturing process of the high fillibility electromagnetic shielding film that provides of the utility model.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explaining the utility model, and be not used in restriction the utility model.
With reference to Fig. 1, the high fillibility electromagnetic shielding membrane structure cut away view that provides for the utility model.Described high fillibility electromagnetic shielding film, it comprises carrier rete 1, insulating barrier 2, foaming metal layer 3, conductive adhesive layer 4 and the protective film 5 that sets gradually from the bottom to top.
With reference to Fig. 2 A to Fig. 2 D, be the cutaway view of the manufacturing process of high fillibility electromagnetic shielding film.Be elaborated below in conjunction with accompanying drawing:
Fig. 2 A, preparation one carrier rete 1, shaping insulating barrier 2 on carrier rete 1.
Carrier rete 1 be in basement membrane (not shown) surface uniform coating 1 μ m ~ 30 μ m without silicon mould release or silicone oil, solidify through UV, then form the carrier film that contains release layer after 50 ℃ ~ 180 ℃ baking-curings.Wherein, basement membrane can be polyimides, PPS, mylar, and its thickness selection range is between 15 μ m ~ 200 μ m.
And the formation of insulating barrier is in carrier rete 1 evenly coating modified epoxy glue or high temperature resistant printing ink form, and coating thickness then forms after 50 ℃ ~ 180 ℃ baking-curings between 3 μ m ~ 50 μ m.And coating method can adopt scraper type coating, wound rod coating, reverse the rod formula.
Fig. 2 B arranges foaming metal layer 3 on insulating barrier 2; Metal in foaming metal layer 3 can be nickel, copper, silver, chromium or alloy, and its thickness is at 0.1 μ m ~ 50 μ m.
Below take foaming metal nickel as example, introduce its continuous production processes:
Choose a continuous matrix of polyester bubble;
The mode of the continuous matrix adopting Vacuum Deposition of this polyester bubble is carried out conductive treatment, and the purpose of conductive treatment is to obtain conductive layer in order to steep on continuous matrix at polyester, thereby lays a good foundation for obtain the coat of metal on polyester bubble silk floss.Take metallic nickel as example, when adopting Vacuum Deposition to carry out conductive treatment in the present embodiment, the parameters value is: base vacuum is pressure-plated with by force: 1 * 10
-2Pa; Working vacuum is pressure-plated with by force: 0.1～1Pa; Speed: 0.5～5m/min; Resistance :≤20 Ω; Operating voltage: 500～1000V; Operating current: 230A; Argon gas amount: 20～500SCCM.
Polyester foam after above-mentioned conductive treatment is carried out electro-deposition.Electro-deposition is that metal ion or complexing metal are electrochemically-deposited in the process that material surface forms metal or alloy coating in its compound water solution, non-aqueous solution or fused salt, and it is also the basis that metallic nickel is electroplated.This process is carried out under certain electrolyte and operating condition, and the complexity of Nickel Electrodeposition and sedimental form are relevant with the nickel nature, also depends on the factors such as electrolytical composition, pH value, temperature, current density simultaneously.The present embodiment adopts sulfate nickel plating, and its each composition is:
(1) main salt: nickelous sulfate and nickel chloride.Mainly provide nickel plating required nickel ion.The content general control is at 150-350g/L.
(2) conducting salt: nickel chloride also improves the conductivity of plating solution as main salt the time as conducting salt.
(3) buffer: the pH value of plating solution is very important technological parameter in nickel plating technology.Boric acid can make pH value be maintained within a certain range as the buffer of nickel plating electrolyte.Content is controlled at 30-40g/L.
(4) anode activator: due to the existence of Chlorine in Solution ion, can destroy the oxide-film of nickel anode surface formation, therefore in order to guarantee the normal dissolving of anode, nickel chloride is as the anode activator, in order to avoid anode generation passivation.
(5) wetting agent: lauryl sodium sulfate.Due to separating out of hydrogen on negative electrode, not only reduced cathode efficiency, and be mixed in and cause hydrogen embrittlement in coating, so the surface reactive material that adds this anionic of lauryl sodium sulfate as wetting agent, reduces hydrogen in cathode surface and inner stop.
(6) brightener: in order to improve the presentation quality of product, improve the leveling effect of solution, fill up blemish, add elementary brightener asccharin and second-class brightener 14-butynediols.
The above-mentioned nickel foam of completing electro-deposition is carried out sintering and reducing.Nickel foam after electro-deposition contains the continuous carrier of bubble, removes the continuous carrier of bubble through the high temperature of 550 ℃ of left and right, fully oxidizes away the continuous material of bubble, then in hydrogen, nickel oxide is reduced to pure nickel.Wherein, oxidizing temperature: 550 ℃; Reduction temperature: 900-1000 ℃; Hydrogen Vapor Pressure: 0.05MPa.
Utilize the foaming metal nickel strap of said method production all to adopt automatic continuous production equipment, arrive the continuous heat reduction furnace through chemical plating pre-treatment, continuous electro-deposition.
Adopt at last double-roll rolling mill that the foam metal nickel band is rolled into the foaming metal layer 3 of thickness between 1 μ m ~ 50 μ m.And adopt mode and the insulating barrier 2 of thermal-adhering to carry out thermal-adhering on the foaming metal layer that makes, and between temperature 50 C ~ 180 ℃, thus acquisition structure as shown in Figure 1B.
Fig. 2 C arranges conductive adhesive layer 4 in foaming metal layer 3; Conductive adhesive layer 4 is to sneak into Ni-based or the conducting particless acquisitions such as copper base or money base by thermosetting epoxy resin glue, be Ni-based in the present embodiment, the ratio of sneaking into is between 1% ~ 50%, the coating of conductive adhesive layer 4 is identical with the coating process of insulating barrier 2, can adopt scraper type coating, wound rod coating, reverse the rod formula.Final conductive adhesive layer 4 thickness that form are between 5 μ m ~ 200 μ m.
Fig. 2 D arranges protective film 5 on conductive adhesive layer 4, so namely form high fillibility electromagnetic shielding film.This step can adopt to cold pressing and fit and the thermal-adhering mode is carried out, and protective film can be mylar, polyester release film, silica gel protected film etc., and its thickness is between 15 μ m ~ 200 μ m.
The present embodiment, when making screened film, owing to being provided with foaming metal layer 3, and foaming metal layer 3 has stronger elastic deformation ability, like this, therefore have stronger filling capacity when carrying out hot pressing on being produced on higher step printed circuit board (PCB) and Rigid Flex, can be widely used in having in the making of circuit board of large step.
The utility model also provides a kind of printed circuit board (PCB), comprises circuit substrate, and in the upper surface of described circuit substrate and lower surface, at least one surface is provided with above-mentioned high fillibility electromagnetic shielding film.
These are only preferred embodiment of the present utility model, not in order to limiting the utility model, all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.
Claims (5)
1. one kind high fillibility electromagnetic shielding film, is characterized in that: comprise the carrier rete, insulating barrier, foaming metal layer, conductive adhesive layer and the protective film that set gradually from the bottom to top.
2. high fillibility electromagnetic shielding film as claimed in claim 1 is characterized in that: described carrier layer is by a basement membrane and be positioned at described epilamellar release layer and form, and described release layer solidify to form by being coated on this epilamellar mould release.
3. high fillibility electromagnetic shielding film as claimed in claim 1, it is characterized in that: the metal of described foaming metal layer is nickel or copper or silver or chromium or alloy, and the thickness range of described foaming metal layer is 1 μ m～50 μ m.
4. high fillibility electromagnetic shielding film as claimed in claim 1 is characterized in that: described conductive adhesive layer is to sneak into Ni-based or copper base or silver base conductive particle are made by thermosetting epoxy resin glue, and the thickness range of described conductive adhesive layer is 5 μ m～200 μ m.
5. a printed circuit board (PCB), comprise circuit substrate, it is characterized in that: in the upper surface of described circuit substrate and lower surface, at least one surface is provided with high fillibility electromagnetic shielding film as described in any one in claim 1 to 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220710157 CN203015375U (en) | 2012-12-20 | 2012-12-20 | Printed circuit board and electromagnetic shielding film with high filling property |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220710157 CN203015375U (en) | 2012-12-20 | 2012-12-20 | Printed circuit board and electromagnetic shielding film with high filling property |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203015375U true CN203015375U (en) | 2013-06-19 |
Family
ID=48606925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220710157 Ceased CN203015375U (en) | 2012-12-20 | 2012-12-20 | Printed circuit board and electromagnetic shielding film with high filling property |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203015375U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103879119A (en) * | 2012-12-20 | 2014-06-25 | 深圳科诺桥科技有限公司 | Printed circuit board, high-filling-power electromagnetic shielding film and making method of film |
| CN104754861A (en) * | 2013-12-26 | 2015-07-01 | Inktec株式会社 | Method for manufacturing electromagnetic shielding film and the electromagnetic shielding film manufactured thereof |
| CN105491786A (en) * | 2015-12-18 | 2016-04-13 | 苏州城邦达力材料科技有限公司 | Electromagnetic shielding film applicable to high-frequency signal and manufacturing process thereof |
| CN105578715A (en) * | 2015-12-30 | 2016-05-11 | 深圳科诺桥科技股份有限公司 | Electromagnetic shielding film and preparation method thereof and circuit board comprising electromagnetic shielding film |
| CN106350789A (en) * | 2016-09-18 | 2017-01-25 | 电子科技大学 | Preparation method of metal layer for electromagnetic shielding film |
| CN106385759A (en) * | 2016-10-25 | 2017-02-08 | 歌尔股份有限公司 | FPC and camera module circuit board with same |
| CN107586520A (en) * | 2016-07-06 | 2018-01-16 | 中山国安火炬科技发展有限公司 | Halogen-free flameproof cover layer conducting resin composition and the method with its making electromagnetic shielding film |
| CN109338448A (en) * | 2018-09-10 | 2019-02-15 | 深圳科诺桥科技股份有限公司 | The method that foaming processing is carried out to metal film surfaces |
| WO2020052239A1 (en) * | 2018-09-10 | 2020-03-19 | 深圳科诺桥科技股份有限公司 | Electromagnetic shielding film preparation method |
-
2012
- 2012-12-20 CN CN 201220710157 patent/CN203015375U/en not_active Ceased
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103879119A (en) * | 2012-12-20 | 2014-06-25 | 深圳科诺桥科技有限公司 | Printed circuit board, high-filling-power electromagnetic shielding film and making method of film |
| CN103879119B (en) * | 2012-12-20 | 2015-07-01 | 深圳科诺桥科技有限公司 | Printed circuit board, high-filling-power electromagnetic shielding film and making method of film |
| CN104754861A (en) * | 2013-12-26 | 2015-07-01 | Inktec株式会社 | Method for manufacturing electromagnetic shielding film and the electromagnetic shielding film manufactured thereof |
| CN105491786A (en) * | 2015-12-18 | 2016-04-13 | 苏州城邦达力材料科技有限公司 | Electromagnetic shielding film applicable to high-frequency signal and manufacturing process thereof |
| CN105578715A (en) * | 2015-12-30 | 2016-05-11 | 深圳科诺桥科技股份有限公司 | Electromagnetic shielding film and preparation method thereof and circuit board comprising electromagnetic shielding film |
| CN107586520A (en) * | 2016-07-06 | 2018-01-16 | 中山国安火炬科技发展有限公司 | Halogen-free flameproof cover layer conducting resin composition and the method with its making electromagnetic shielding film |
| CN106350789A (en) * | 2016-09-18 | 2017-01-25 | 电子科技大学 | Preparation method of metal layer for electromagnetic shielding film |
| CN106385759A (en) * | 2016-10-25 | 2017-02-08 | 歌尔股份有限公司 | FPC and camera module circuit board with same |
| CN106385759B (en) * | 2016-10-25 | 2023-12-01 | 歌尔光学科技有限公司 | FPC and be provided with this FPC's camera module circuit board |
| CN109338448A (en) * | 2018-09-10 | 2019-02-15 | 深圳科诺桥科技股份有限公司 | The method that foaming processing is carried out to metal film surfaces |
| WO2020052239A1 (en) * | 2018-09-10 | 2020-03-19 | 深圳科诺桥科技股份有限公司 | Electromagnetic shielding film preparation method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103879119B (en) | Printed circuit board, high-filling-power electromagnetic shielding film and making method of film | |
| CN203015375U (en) | Printed circuit board and electromagnetic shielding film with high filling property | |
| CN105280925B (en) | Negative pole plate | |
| CN106061103A (en) | High flexible electromagnetic shielding film and manufacturing method thereof | |
| CN1817421B (en) | Thin film supporting substrate used in filter for hydrogen production and method for manufacturing filter for hydrogen production | |
| CN104125711B (en) | High-frequency circuit copper foil, copper-clad plate, printed wiring board, the copper foil with carrier, the manufacture method of electronic equipment and printed wiring board | |
| KR20170094134A (en) | Free grounding film and manufacturing method therefor, and shielding circuit board including free grounding film and grounding method | |
| CN106498467B (en) | A kind of preparation method of ultra-thin carrier copper foil that stablizing stripping | |
| KR102553081B1 (en) | Ultra-thin copper foil and the preparation method thereof | |
| CN105142897A (en) | Copper foil with carrier, printed circuit board, copper clad laminated sheet, electronic device, and printed circuit board fabrication method | |
| CN109728248A (en) | A kind of negative electrode tab and the lithium metal battery containing the negative electrode tab | |
| CN204131820U (en) | Electromagnetic shielding film and comprise the flexible circuit board of this electromagnetic shielding film | |
| KR20140145870A (en) | A heat-radiation complex sheet | |
| CN109392296B (en) | The preparation method of electromagnetic shielding film | |
| CN203554788U (en) | High fallibility electromagnetic shielding film continuous production system | |
| CN101265549A (en) | Foam iron-nickel composite metal material and preparation method thereof | |
| JP2005350761A (en) | Composite foil for negative electrode current collector of nonaqueous electrolyte secondary battery, and method for producing the same, negative electrode current collector using the composite foil, electrode for nonaqueous electrolyte secondary battery, and nonaqueous electrolyte secondary battery | |
| CN109104851B (en) | Preparation method of electromagnetic shielding film | |
| KR20210117916A (en) | Surface-treated copper foil for high-frequency circuit and method for producing the same | |
| CN204697393U (en) | Micro-induction structure on a kind of pcb board based on iron ni-based amorphous alloy magnetic core | |
| CN105489504B (en) | A kind of production method of package substrate | |
| CN101916663A (en) | Hybrid micro super capacitor and manufacturing method thereof | |
| CN209030462U (en) | It is a kind of using graphene-metallic composite as the PCB of conducting wire and a kind of motor | |
| CN207227553U (en) | Electromagnetic shielding material based on Kapton | |
| CN101318109B (en) | Production method of hydrogen production filter |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 518000 A building 16, Kwai Chung Road, Kwai Chung community, Kwai Chung street, Dapeng District, Shenzhen, Guangdong, 101 Patentee after: SHENZHEN KNQ TECHNOLOGY Co.,Ltd. Address before: 518000 A building 16, Kwai Chung community, Kwai Chung community, Kwai Chung community, Dapeng District, Shenzhen, Guangdong, Longgang 101, China Patentee before: SHENZHEN KENUOQIAO TECHNOLOGY Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| IW01 | Full invalidation of patent right |
Decision date of declaring invalidation: 20211129 Decision number of declaring invalidation: 52737 Granted publication date: 20130619 |
|
| IW01 | Full invalidation of patent right |