CN202889856U - heat sink - Google Patents

Abstract

The utility model discloses a heat abstractor sets up on a circuit board and contacts a heat source of locating on the circuit board, and it contains a base, a plurality of fin and a heat pipe. The heat pipe is connected with the base and is connected with the heat radiating fins in series. The connecting parts are arranged on the side edges of the radiating fins in the middle, so that excessive connecting parts are not needed, and the cost is saved.

Description

heat sink

technical field

The utility model relates to a heat dissipation device, in particular to a heat dissipation device whose heat dissipation fins have through holes. the

Background technique

Radiators are now widely used in various computer fields, such as personal computers, industrial computers, or server hosts. Existing radiators generally include a heat pipe. The two ends of the heat pipe are respectively connected to a metal heat dissipation block and a fin group. The heat radiation block contacts the heat source on the motherboard and absorbs heat energy from the heat source. A plurality of fins, which are interlocked by buckling pieces extending from each fin (generally, a plurality of buckling pieces are distributed on the outer edge of each fin to securely connect the two fins), and the heat energy is dissipated through the heat pipe The blocks are conveyed to the fin set, and the heat energy is dissipated into the air through the fin set. the

Today's computer heating power is getting higher and higher. In order to cope with the larger amount of heat energy produced by the heat source, the general radiator will add more heat pipes to take away more heat energy from the heat source. Relatively, it must install more The fins dissipate more heat energy into the air, because the number of fins increases, but the fins are arranged in layers, and the distance between the fins is close and difficult to process, so it is necessary to set buckles on the periphery of the fins to make the fins mutually The buckle is combined, and the more the number of fins is, the more buckles need to be provided, thus increasing the cost. the

Utility model content

The purpose of the utility model is to provide a heat dissipation device, in which the heat dissipation fin improves the heat convection efficiency at the central part of the heat dissipation fin through the through-hole structure. the

In order to achieve the above object, the utility model provides a heat source arranged on a circuit board and in contact with a heat source provided on the circuit board. It is characterized in that the heat dissipation device includes:

A base, the base for the heat source to contact;

A plurality of radiating fins, the radiating fins are stacked parallel to each other, a through hole is opened in the center of each radiating fin, and the through holes are aligned with each other and arranged in a row, each of the radiating fins includes two connecting parts, and each connecting part is set in the middle on the side of the cooling fin, and the two connecting parts are located on opposite sides of the through hole, the cooling fins are connected to each other through the connecting parts; and

A heat pipe, the heat pipe is connected to the base, and the heat pipe is connected in series with the cooling fins.

Further, the middle section of the heat pipe runs through the base. the

Further, the two ends of the heat pipe respectively pass through the heat sinks in series. the

Further, each of the heat sinks includes two connected metal fins, the two metal fins are connected through a strip-shaped connecting plate, the two metal fins are respectively connected to two sides of the connecting plate, the The two connecting parts are located at the two ends of the connecting board, and the two metal fins are arranged obliquely toward the circuit board from the connecting parts. the

Further, the inclination angle of each metal fin is not greater than 15 degrees. the

Further, the through hole is opened at the joint of the two metal fins. the

Further, a socket hole is opened through each of the metal fins, and the heat pipe is passed through the socket hole. the

Further, the inner edge of each socket hole is surrounded by a sleeve, and the sleeve is sleeved on the heat pipe. the

Further, the base includes a fixing part, and the fixing part is connected to the circuit board. the

Further, wherein the heat sink is rectangular, and each of the connecting parts is centrally arranged on the longer side of the heat sink. the

In the utility model, the connecting part is centrally arranged on the side of the heat sink, so each metal fin only needs to be provided with two connecting parts, thereby reducing the cost. the

Description of drawings

Fig. 1 is the three-dimensional schematic view of the heat dissipation device of the first embodiment of the utility model;

Fig. 2 is a side sectional view 1 of the cooling device in Fig. 1;

Fig. 3 is a second side sectional view of the heat sink in Fig. 1;

Fig. 4 is a schematic diagram of the cooling fins in the cooling device of the first embodiment of the present invention;

Fig. 5 is the schematic diagram of the heat dissipation device of the second embodiment of the present utility model;

FIG. 6 is a schematic diagram of a heat dissipation device of a third embodiment of the present invention.

In the figure, 100. The base;

110. Ontology;

120. Fixed part;

200. Heat sink;

201. Through hole;

202. Air duct;

210. Connection plate;

211/212. Metal fins;

220. Connection part;

230. socket hole;

231. Sleeve;

300. Heat pipes;

400. Fan.

Detailed ways

The utility model will be further described below in conjunction with the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the utility model and implement it, but the examples given are not intended to limit the utility model. the

As shown in Figures 1 to 3, a heat dissipation device is provided for the first embodiment of the present utility model, which is used to be arranged on a circuit board and contact a heat source provided on the circuit board to control heat generation. The circuit board can be a computer motherboard, and the heat source is a CPU (Central Processing Unit) arranged on the motherboard. In this embodiment, the heat dissipation device of the present invention includes a base 100 , a plurality of heat dissipation fins 200 and at least one heat pipe 300 . the

The base 100 is made of a metal with a better heat transfer coefficient (such as aluminum or copper), which is in contact with a heat source. In this embodiment, the base 100 includes a body 110 and at least one fixing portion 120 extending from the body. In this embodiment, In one example, the base 100 preferably includes four fixing parts 120 . The main body 110 is preferably one piece, the main body 110 is in contact with the aforementioned heat source (CPU), and the fixing part 120 is preferably in the shape of a leg and locked to the circuit board (but the utility model is not limited to locking), the utility model The heat dissipation device is fixedly arranged on the circuit board (computer motherboard) through the fixing portion 120 . the

As shown in Figure 4, a plurality of heat sinks 200 are stacked in parallel, and each heat sink is roughly rectangular. Each heat sink 200 includes two connected metal fins 211/212, and the two metal fins pass through a strip-shaped connecting plate. 210, the two metal fins are respectively connected to the two sides of the connection plate, and the two metal fins 211/212 are inclined from the connection point (connection plate 210) to the circuit board respectively, and the inclination angle is preferably not greater than 15 degrees. Each metal fin 211/212 is respectively penetrated with at least one set of connection holes 230. For example, in this embodiment, each metal fin 211/212 is respectively penetrated with three socket holes 230, but the utility model does not limit the socket holes 230 , preferably the inner edge of each sleeve hole 230 extends vertically to form a sleeve 231 . Each heat sink 200 includes two connecting portions 220 respectively, and each connecting portion 220 is centrally arranged on the longer side of the heat sink 200 and is located at the two ends of the connecting plate 210 where the two metal fins 211/212 connect (the connecting portions 220 It is preferably a buckle, but the present invention is not limited to the buckle), and the plurality of heat sinks 200 are connected to each other through the fastening of the connecting portion 220 . Each heat sink 200 is provided with a through hole 201 (it is preferably circular, but the utility model is not limited thereto). In this embodiment, the through hole 201 is preferably opened in the center of the heat sink 200 and located On the connecting plate where the fins 211 / 212 are connected, the two connecting parts are located on two opposite sides of the through hole. A plurality of cooling fins 200 are stacked, and the through holes 201 are aligned with each other and arranged in a row to form an air channel 202 for airflow to flow into the cooling device of the present invention. the

In this embodiment, the heat dissipation device of the present utility model preferably includes three heat pipes 300, each heat pipe 300 is a metal pipe with two ends closed, the heat pipe 300 is preferably made of copper, and the inside of the heat pipe 300 is filled with a working fluid. The phase change and flow of the working fluid absorb heat energy from the base 100 and transfer the heat energy along the heat pipe 300 . Each heat pipe 300 is preferably bent in a U-shape, but the present invention is not limited thereto. Each heat pipe 300 is connected to the base 100 , and the middle section of the heat pipe 300 is preferably disposed through the base 100 . The two ends of the heat pipe 300 respectively pass through the socket holes 230 to connect the heat sinks 200 in series, and the sleeves 231 on the inner edges of the socket holes 230 on the metal fins 211/212 are sleeved on the heat pipe 300, and the heat pipe 300 The surface is in adhesive contact with the inner side of the sleeve 231 . The middle section of the heat pipe 300 absorbs the heat energy generated by the heat source from the base 100 and transmits it to the two ends of the heat pipe 300, and transmits the heat energy to the metal fins 211/212 through the sleeve 231, and radiates to the air through the metal fins 211/212 . the

Through the aforementioned through holes 201 , the central portion of the stacked metal fins 211 / 212 has more contact area with the air. Furthermore, the base 100 can also directly exchange heat with the air through the through hole 201 . the

As shown in FIG. 5 , the second embodiment of the present invention provides a heat dissipation device, which is used to be arranged on a circuit board and contact a heat source provided on the circuit board to dissipate heat from the heat source. The heat dissipation device of the present invention includes a base 100 , a plurality of heat sinks 200 , at least one heat pipe 300 and a fan 400 . Wherein, the base 100 , the heat sink 200 and the heat pipe 300 are the same as those of the aforementioned first embodiment, and will not be repeated here. the

In this embodiment, each heat sink 200 is provided with a through hole 201 (it is preferably circular, but the utility model is not limited thereto), and a plurality of heat sinks 200 are stacked, and these through holes 201 are aligned with each other in a row Set and form an air duct 202 . The fan 400 is aligned with the through hole 201 to blow the airflow into the air duct 202 . The size of the fan 400 is preferably equivalent to the size of the through hole 201 . In this way, the airflow can flow through the base 100 to exchange heat on the base 100, and the airflow can also be guided and dispersed through the inclined metal fins 211/212 to flow into the gaps between the plurality of metal fins 211/212, and the air flows through Each metal fin 211/212 increases the heat exchange efficiency of the central part of each metal fin 211/212. the

Furthermore, the fan 400 can also suck air from the air duct 202 to create a negative pressure so that the air outside the laminated metal fins 211/212 is sucked into the gap between the plurality of metal fins 211/212 and flows through the metal fins 211 /212 and then flow out the cooling device of the present utility model by the air duct 202. the

As shown in Figure 6, the third embodiment of the present utility model provides a heat dissipation device for being arranged on a circuit board and contacting a heat source provided on the circuit board to dissipate heat from the heat source, The heat dissipation device of the present invention includes a base 100 , a plurality of heat sinks 200 , at least one heat pipe 300 and a fan 400 , and the structure and connection relationship of each component are roughly the same as those of the aforementioned second embodiment. The difference between this embodiment and the second embodiment is that in this embodiment, the fan 400 is arranged vertically on the base 100 and is located on the side of the laminated fins, so as to blow air into the gaps between the plurality of metal fins 211/212 , the through hole 201 reduces the wind resistance of the flow field between the metal fins 211/212, and after the air flows through each metal fin 211/212, the air duct 202 formed by stacking the through holes 201 flows out of the heat dissipation device of the present invention , and increase the heat exchange efficiency of the central part of each metal fin 211/212. the

Furthermore, the fan 400 can also suck the air from the air channel 202 into the gaps between the plurality of metal fins 211/212, flow through the metal fins 211/212 and then flow out of the heat dissipation device of the present invention. the

The heat dissipation device of the present invention is centrally arranged on the side of the heat sink through the connecting portion 220 , so each metal fin 211 / 212 only needs to be provided with two connecting portions 220 to reduce the cost. the

The above-mentioned embodiments are only preferred embodiments for fully illustrating the utility model, and the protection scope of the utility model is not limited thereto. Equivalent substitutions or transformations made by those skilled in the art on the basis of the present utility model are all within the protection scope of the present utility model. The scope of protection of the utility model shall be determined by the claims. the

Claims (1)

1. a heat abstractor is arranged on the circuit board, and contacts a pyrotoxin of being located on the described circuit board, it is characterized in that, this heat abstractor comprises:

One base, this base is for described pyrotoxin contact;

A plurality of fin, the stacked setting parallel to each other of those fin, respectively the central authorities of this fin offer a perforation, those perforations are arranged the homogeneous row mutually, respectively this fin comprises two connecting portions, be located at the side of this fin during respectively this connection is deployed, and this two connecting portion is in two relative sides of this perforation, those fin interconnect by those connecting portions; And

One heat pipe, this heat pipe is connected in this base, and those fin of this heat pipe concatenation.

2, heat abstractor according to claim 1 is characterized in that, wherein this base is run through in the stage casing of this heat pipe.

3, heat abstractor according to claim 1 and 2 is characterized in that, wherein two ends of this heat pipe run through respectively those fin of serial connection.

4, heat abstractor according to claim 1, it is characterized in that, wherein respectively this fin comprises two metal fins that are connected, this two metal fins is connected by the connecting plate of a strip, this two metal fins is connected to the dual side-edge of this connecting plate, this two connecting portion is in two ends of this connecting plate, this two metal fins from connecting place respectively towards described circuit board tilted configuration.

5, heat abstractor according to claim 4 is characterized in that, wherein respectively the angle of inclination of this metal fins is not more than 15 degree.

6, heat abstractor according to claim 4 is characterized in that, wherein this perforation is opened in the connecting place of this two metal fins.

7, heat abstractor according to claim 4 is characterized in that, wherein respectively this metal fins runs through and offers a sleeve joint hole, and this heat pipe is arranged in this sleeve joint hole.

8, heat abstractor according to claim 7 is characterized in that, wherein respectively the inner edge of this sleeve joint hole is arranged with a sleeve, and this jacket casing is located at this heat pipe.

9, heat abstractor according to claim 1 is characterized in that, wherein this base comprises a fixed part, and this fixed part is connected in described circuit board.

10, heat abstractor according to claim 1 is characterized in that, wherein this fin is rectangular, is located at the long side of this fin during respectively this connection is deployed.

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