CN202663676U - Shell of portable electronic device - Google Patents
Shell of portable electronic device Download PDFInfo
- Publication number
- CN202663676U CN202663676U CN 201220261061 CN201220261061U CN202663676U CN 202663676 U CN202663676 U CN 202663676U CN 201220261061 CN201220261061 CN 201220261061 CN 201220261061 U CN201220261061 U CN 201220261061U CN 202663676 U CN202663676 U CN 202663676U
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- Prior art keywords
- housing
- portable electronic
- electronic devices
- hyaline layer
- layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a shell of a portable electronic device. The shell comprises a first transparent layer made of a plastic material, a pigment layer printed above the first transparent layer, an adhesive material layer coated above the pigment layer, and a second transparent layer made of plastic material, arranged above the adhesive material layer and thermally pressed by a die to form a light, thin, artistic and wearable shell, thus, the dissolvent needed for spraying the pigment on the shell in a spray coating manner can be saved, use of plastic material is saved, and the appearance of the shell can be easily added by the change of the surface grains and printed patterns of the die so as to generate various variations.
Description
Technical field
The utility model relates to a kind of housing of portable electronic devices, refers to especially can be used for coating a kind of shell of portable electronic devices, can protect portable electronic devices to avoid scratch, simultaneously the characteristics such as tool is frivolous and attractive in appearance again.
Background technology
Plastic cement has lightweight, easily makes and characteristic with low cost, has been widely used in injection moulding or the processing procedure of thermoplastic shaping, and similarly be plastic chair, slide-mouse shell or the housing of electronic installation.The mode of moulding mainly is first the plastic cement of melting to be poured in the die cavity with special shape mould, and through the variation of pressure and temperature, plastic cement namely is shaped to required hull shape according to the shape of this die cavity.
For the outward appearance of decorative shell, can in the mode of the surface of housing to spray, spray the table lacquer according to the color that designed, to improve the attractive in appearance of product.But, the table of spraying lacquer wears no resistance, and after long-time the use, housing easily causes the many places scratch because of friction, for improving this problem, increases transparent protecting paint again.
Above-mentioned structure and the manufacture that existing housing has been described, and learn that existing housing has following problem:
(1) it is more that the table of spraying coats with lacquer required solvent: in the existing practice, the mode mainly with spraying is sprayed on pigment on the housing greatly, yet, the mode of spraying needs a lot of solvents, pigment could be sprayed on the housing, except the excessive waste of solvent, also cause environmental pollution like this.
(2) thickness of shell is blocked up: injection mo(u)lding in mould, must water first injection molding material progressive die tool, and flow for plastics can distribute in mould uniformly, must design thicker housing can injection mo(u)lding, so, the thickness of housing is difficult to accomplish below the 0.4mm, so the thickness of most on the market housing still about 0.8mm, causes the meaningless waste of plastics, limited the design space, and yield is produced in impact.
(3) make consuming time: the program of existing housing colouring forms first lines on the surface, again with color spraying on housing, so, the poor effect of color representation, and need spraying at housing last layer one deck expend manufacturing time and cost.
Therefore, because above-mentioned existing housing all has shortcoming with not enough, therefore designer of the present utility model does one's utmost research and development, finally develop the housing of a kind of portable electronic devices of the present utility model.
Summary of the invention
The first purpose of the present utility model is to provide a kind of housing of portable electronic devices, and in the mode of printing, on housing, so, the mode that can save to spray is sprayed on pigment on the housing required 80% solvent with color-printed.
The second purpose of the present utility model is to provide a kind of housing of portable electronic devices, can protect the pigment that is printed on the housing, and the thickness that reduces simultaneously housing approximately 50% lowers and produces required material usage.
The 3rd purpose of the present utility model is to provide a kind of housing of portable electronic devices, adopts the mode of printing, and pigment is imprinted on the housing, can shorten the required time of processing procedure.
In order to realize the purpose of this utility model, the technical scheme that designer of the present utility model proposes is as follows:
The housing of portable electronic devices, molded by mold hot, it is characterized in that, comprising:
One first hyaline layer is made with plastic material;
One coat of colo(u)r is printed on the top of this first hyaline layer;
One sticky material layer covers the top of this coat of colo(u)r; And
One second hyaline layer is made with plastic material, and is arranged on the top of this sticky material layer.
The housing of aforesaid portable electronic devices, wherein, the material of this first hyaline layer and this second hyaline layer is Merlon (Polycarbonate, PC), polyethylene terephthalate (Polyethylene terephthalate, PET) or thermoplastic poly amido formate (Thermoplastic Polyurethane, TPU).
The housing of aforesaid portable electronic devices, wherein, the material of this sticky material layer is silicon (silicon), epoxy resin (Epoxy) or heat curing-type polyurethane (PU).
The housing of aforesaid portable electronic devices, wherein, the material of this coat of colo(u)r is polyurethane ink (Polyurethane ink).
The housing of aforesaid portable electronic devices, wherein, the thickness of this first hyaline layer is 0.05～0.3mm.
The housing of the device of aforesaid Portable electricity, wherein, the thickness of this coat of colo(u)r is 0.01～0.1mm.
The housing of aforesaid portable electronic devices, wherein, the thickness of this sticky material layer is 0.01～0.1mm.
The housing of aforesaid portable electronic devices, wherein, the thickness of this second hyaline layer is 0.05～0.3mm.
The housing of aforesaid portable electronic devices, wherein, the surface of this first hyaline layer and this second hyaline layer has lines.
In addition, the utility model designer also provides another embodiment.
The housing of portable electronic devices, molded via mold hot, comprising: one first hyaline layer, make with plastic material; One sticky material layer is coated over the top of this first hyaline layer; One coat of colo(u)r is printed on the below of this second hyaline layer; And one second hyaline layer, make with plastic material, and be arranged on the top of this coat of colo(u)r; Wherein, fit according to the order of the first hyaline layer, sticky material layer, coat of colo(u)r and the second hyaline layer, form a housing with the mould heat pressure moulding again.Wherein, this first hyaline layer and this second hyaline layer can be selected from following any material: Merlon (Polycarbonate, PC), polyethylene terephthalate (Polyethylene terephthalate, PET) and thermoplastic poly amido formate (Thermoplastic Polyurethane, TPU); This sticky material layer can be selected from following any material: silicon (silicon), epoxy resin (Epoxy) and heat curing-type polyurethane (PU); The material polyurethane ink of this coat of colo(u)r (Polyurethane ink); In addition, in the utility model, the thickness of this first hyaline layer is 0.05～0.3mm; The thickness of this coat of colo(u)r is 0.01～0.1mm; The thickness of this sticky material layer is 0.01～0.1mm; The thickness of this second hyaline layer is 0.05～0.3mm.
Compared with prior art, beneficial effect of the present invention is:
(1) save the consumption of the required solvent of spraying: the utility model is in the mode of printing, and on housing, and also with second layer protection, so, the mode that can save to spray is sprayed on solvent required on the housing with pigment with color-printed.
(2) thickness of reduction housing: the utility model can be protected the pigment that is printed on the housing, and the thickness of housing can be controlled in below the 0.4mm simultaneously, lowers the waste of plastics, and improves and produce yield.
(3) shorten manufacturing time: the utility model accelerates manufacture process in the mode of printing, shortens the time of making.
Description of drawings
Fig. 1 is the schematic diagram of the housing of portable electronic devices of the present utility model;
Fig. 2 is the manufacturing flow chart of the housing of portable electronic devices of the present utility model
Fig. 3 A and Fig. 3 B are the schematic diagram of mould thermoplastic program of the present utility model;
Fig. 4 is the schematic diagram of molded housing;
Fig. 5 A and Fig. 5 B are the schematic diagram of injection moulding processing procedure of the present utility model;
Fig. 6 A-Fig. 6 C is the schematic diagram before housing not yet carries out the injection moulding processing procedure;
Fig. 6 D is the schematic diagram after housing carries out the injection moulding processing procedure; And
Fig. 7 is the schematic diagram of housing of the portable electronic devices of the utility model the second embodiment.
[main element symbol description]
1: the second hyaline layer
2: the sticky material layer
3: coat of colo(u)r
4: the first hyaline layers
5: housing
M1: hot-pressing forming die
M2: injection mould
Step (201) is the manufacturing process step of the housing of the utility model portable electronic devices to step (203).
Embodiment
In order more clearly to describe the housing of a kind of portable electronic devices that the utility model proposes, below will cooperate graphicly, elaborate preferred embodiment of the present utility model.
At first, introduce first main element of the present utility model, please refer to Fig. 1, Fig. 1 is the schematic diagram of housing of the portable electronic devices of the utility model the first embodiment, wherein, a kind of housing of portable electronic devices can be via the moulding of thermoplastic journey, and comprise: one first hyaline layer 4, make with plastic material; One coat of colo(u)r 3 is printed on the top of this first hyaline layer 4; One sticky material layer 2 is coated over the top of this coat of colo(u)r 3; And one second hyaline layer 1, make with plastic material, and be arranged on the top of this sticky material layer 2; Wherein, fit via the mould heat pressure moulding according to the order of the first hyaline layer 4, coat of colo(u)r 3, sticky material layer 2 and the second hyaline layer 1, can form a housing; Wherein, the material of this first hyaline layer 4 and this second hyaline layer 1 is Merlon (Polycarbonate, PC), polyethylene terephthalate (Polyethylene terephthalate, PET) or thermoplastic poly amido formate (Thermoplastic Polyurethane, TPU); The material of this sticky material layer 2 is silicon (silicon), epoxy resin (Epoxy) or heat curing-type polyurethane (PU); The material of this coat of colo(u)r 3 is polyurethane ink (Polyurethane ink); In addition, in the utility model, the thickness of this first hyaline layer 4 is 0.05～0.3mm; The thickness of this coat of colo(u)r 3 is 0.01～0.1mm; The thickness of this sticky material layer 2 is 0.01～0.1mm; The thickness of this second hyaline layer 1 is 0.05～0.3mm.
Please refer to Fig. 2, Fig. 2 is the manufacturing flow chart of the housing of portable electronic devices of the present utility model, the housing of portable electronic devices of the present utility model can be by the mould heat pressure moulding, and its step comprises following: (201) with the first hyaline layer, coat of colo(u)r, sticky material layer and the second hyaline layer according to sequence stack; Reach (202) and place hot-pressing forming die, again this housing of moulding via mould thermoplastic program; Wherein, hot-pressing forming die has mould, and can be customized, revises the shape of moulding according to demand, and therefore, in step (202), this second hyaline layer can produce lines via mould thermoplastic program; See also Fig. 3 A and Fig. 3 B, schematic diagram for the utility model mould thermoplastic program, wherein, the first hyaline layer, coat of colo(u)r, sticky material layer and the second hyaline layer according to sequence stack after, and be placed into a hot-pressing forming die M1, afterwards, the molded housing 5 via mould thermoplastic program, and have lines; The schematic diagram of molded housing 5 as shown in Figure 4, wherein, sticky material layer 2 is resin, and the second hyaline layer 1 has lines through mould thermoplastic program.
See also Fig. 5 A and Fig. 5 B, schematic diagram for the utility model injection moulding processing procedure, and simultaneously with reference to figure 2, wherein, the utility model is after step (202), can comprise that also step (203) places injection mould with this housing, change the shape of this housing via the injection moulding program, reach the covering property to electronic installation; Shown in Fig. 5 A, housing 5 is placed in an injection mould M2, and afterwards, shown in Fig. 5 B, the shape of housing 5 is changed; Please refer to Fig. 6 A-Fig. 6 C, for housing 5 not yet carries out schematic diagram before the injection moulding program, Fig. 6 D housing 5 carries out the schematic diagram after injection moulding is made.
In addition, designer of the present utility model is through experiment and test, find Another Application, and another embodiment is provided, and see also Fig. 7, be the schematic diagram of the housing of the portable electronic devices of the utility model the second embodiment, wherein, the utility model the second embodiment equally can the moulding via mould thermoplastic program, and comprises: one first hyaline layer 4, make with plastic material; One sticky material layer 2 is coated over the top of this first hyaline layer 4; One coat of colo(u)r 3 is printed on the below of this second hyaline layer 1; And one second hyaline layer 1, make with plastic material, and be arranged on the top of this coat of colo(u)r 3; Wherein, the sequence stack according to the first hyaline layer 4, sticky material layer 2, coat of colo(u)r 3 and the second hyaline layer 1 can form a housing via the mould heat pressure moulding; The thickness of each layer of the utility model the second embodiment is then identical with the first embodiment.
Above embodiment is exemplary embodiment of the present invention only, is not used in restriction the present invention, and protection scope of the present invention is defined by the claims.Those skilled in the art can make various modifications or be equal to replacement the present invention in essence of the present invention and protection range, this modification or be equal to replacement and also should be considered as dropping in protection scope of the present invention.
Claims (9)
1. the housing of portable electronic devices is molded by mold hot, it is characterized in that, comprising:
One first hyaline layer is made with plastic material;
One coat of colo(u)r is printed on the top of this first hyaline layer;
One sticky material layer covers the top of this coat of colo(u)r; And
One second hyaline layer is made with plastic material, and is arranged on the top of this sticky material layer.
2. the housing of portable electronic devices according to claim 1 is characterized in that, wherein, the material of this first hyaline layer and this second hyaline layer is Merlon, polyethylene terephthalate or thermoplastic poly amido formate.
3. the housing of portable electronic devices according to claim 1 is characterized in that, wherein, the material of this sticky material layer is silicon, epoxy resin or heat curing-type polyurethane.
4. the housing of a kind of portable electronic devices according to claim 1 is characterized in that, wherein, the material of this coat of colo(u)r is polyurethane ink.
5. the housing of portable electronic devices according to claim 1 is characterized in that, wherein, the thickness of this first hyaline layer is 0.05～0.3mm.
6. the housing of the device of Portable electricity according to claim 1 is characterized in that, wherein, the thickness of this coat of colo(u)r is 0.01～0.1mm.
7. the housing of portable electronic devices according to claim 1 is characterized in that, wherein, the thickness of this sticky material layer is 0.01～0.1mm.
8. the housing of portable electronic devices according to claim 1 is characterized in that, wherein, the thickness of this second hyaline layer is 0.05～0.3mm.
9. the housing of portable electronic devices according to claim 1 is characterized in that, wherein, the surface of this first hyaline layer and this second hyaline layer has lines.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220261061 CN202663676U (en) | 2012-06-04 | 2012-06-04 | Shell of portable electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220261061 CN202663676U (en) | 2012-06-04 | 2012-06-04 | Shell of portable electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202663676U true CN202663676U (en) | 2013-01-09 |
Family
ID=47458544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220261061 Expired - Fee Related CN202663676U (en) | 2012-06-04 | 2012-06-04 | Shell of portable electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202663676U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108749231A (en) * | 2018-05-31 | 2018-11-06 | 信利光电股份有限公司 | A kind of cover board production method and cover board |
| WO2019086040A1 (en) * | 2017-11-06 | 2019-05-09 | Oppo广东移动通信有限公司 | Housing and manufacturing method thereof, and electronic apparatus |
-
2012
- 2012-06-04 CN CN 201220261061 patent/CN202663676U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019086040A1 (en) * | 2017-11-06 | 2019-05-09 | Oppo广东移动通信有限公司 | Housing and manufacturing method thereof, and electronic apparatus |
| CN108749231A (en) * | 2018-05-31 | 2018-11-06 | 信利光电股份有限公司 | A kind of cover board production method and cover board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130109 Termination date: 20140604 |