CN202652307U

CN202652307U - GSP handset photograph module

Info

Publication number: CN202652307U
Application number: CN 201220315264
Authority: CN
Inventors: 闫玮; 陶晔
Original assignee: Omnivision Technologies Shanghai Co Ltd
Current assignee: Omnivision Technologies Shanghai Co Ltd
Priority date: 2012-06-29
Filing date: 2012-06-29
Publication date: 2013-01-02
Anticipated expiration: 2022-06-29

Abstract

The utility model provides a GSP (Chip Scale Package) handset photograph module. An IR chip unit is placed in a support constitutional unit and is directly placed on an upper surface of a CMOS chip unit to make the IR chip unit, the support constitutional unit and a substrate form a confined space so as to prevent dust in components of a CMOS chip peripheral circuit component unit, etc. in the support constitutional unit from penetrating into an image area of the CMOS chip unit and meanwhile to prevent dust generated in relative motion processes of a lens and a motor unit from dropping to the image area of the CMOS chip unit; penetrated dust can be prevented from forming a shadow zone and a production yield rate of the GSP handset photograph module can be raised.

Description

CSP mobile phone camera module

Technical field

The utility model relates to photograph module technical field, relates in particular to a kind of CSP mobile phone camera module.

Background technology

As shown in Figure 1, 2, 3, existing CSP(Chip Scale Package, wafer-level package) the mobile phone camera module under the technology generally comprises: lens unit 1, motor unit 2, supporting structure unit 3, CMOS chip unit 4, photosensitive area unit 5, IR blade unit (cutoff filter) 6, be arranged in CMOS chip periphery circuit elements device cell 7 and the substrate 8 of the supporting needs of the inner space of enclosing supporting structure unit 3.Wherein, in the photograph module of existing CSP encapsulation, lens unit 1 normal operation CSP camera lens; IR blade unit 6 is positioned at the lowermost end of camera lens, is used for guaranteeing that effective light enters photosensitive area unit 5, can only be circle, the normal operation cutoff filter; Motor unit 2 is used for the position of promotion adjustment camera lens and finishes auto-focus function; CMOS chip unit 4 has opto-electronic conversion, image is processed and imaging function, and the distance of its upper surface and photosensitive area unit 5 upper surfaces is 0.40mm; 3 connecting motor unit 2, supporting structure unit and substrate 8 are for the protection of internal components; Substrate 8 supporting bracket construction units 3 and carrying CMOS chip unit 4, photosensitive area unit 5, the CMOS chip periphery circuit elements device cell 7 of supporting needs in the inner space that itself and supporting structure unit 3 enclose, CMOS chip unit 4 passes through lead-in wire and pad bonding with substrate 8.

At present, the dustless control ability during CSP (Chip Scale Package) mobile phone camera module production is made a little less than, the dust of module internal can directly affect image, forms shadow at image.Along with progressively reducing of sensitive chip size (Pixel Size), the shadow district impact that dust forms can enlarge gradually, has a strong impact on the production yield of module.

The dust source of mobile phone camera module internal mainly contains two kinds at present:

1) lens unit 1 and motor unit 2,, the dust that in assembling process and relative motion process, increases;

2) in the inner space that supporting structure unit 3 encloses, residual dust etc. in the gap of the pad on the residual and CMOS chip unit of the dust during CMOS chip periphery circuit elements device cell 7 pasters are made 4 and the substrate 8.

Above-mentioned two parts dust may exert an influence to image immediately, also may just can drop at the image area of CMOS chip unit 4 after module uses a period of time, and image is exerted an influence.

The method of improving the dust impact in the prior art is to use adhesive tape structure mostly, adhesive tape is attached on the components and parts unit 7 of carrier unit 3 inner spaces, the dust granule of bonding module internal, but because adhesive tape cannot be realized the fully sealing in the zone that CMOS chip unit 4 image areas are outer, so the dust of carrier unit 3 inner spaces can not be avoided well.In addition, still can't improve the dust that produces in lens unit and the motor unit relative motion process.

The utility model content

The utility model proposes a kind of CSP mobile phone camera module, can reduce the dust that produces in lens unit and the motor unit relative motion process and drop at image area, image is exerted an influence.

In order to achieve the above object, the utility model proposes a kind of CSP mobile phone camera module, comprising:

Lens unit is positioned at the top of whole module, comprises camera lens;

Motor unit is positioned at the periphery of described lens unit, drives described camera motion;

Substrate is positioned at the bottom of whole module;

The photosensitive area unit is positioned on the described substrate;

The CMOS chip unit is positioned at top, described photosensitive area unit or peripheral;

The supporting structure unit is positioned at the periphery of described photosensitive area unit, and top, described supporting structure unit connects described motor unit, and the bottom connects described substrate;

The IR blade unit, be placed on the upper surface of described CMOS chip unit, and between described supporting structure unit and described substrate, the top of described IR blade unit is fixedly connected with described supporting structure unit, and described IR blade unit and supporting structure unit and substrate form seal cavity.

Further, the zone line at the top of described supporting structure unit is transmission region.

Further, the top of described IR blade unit is fixedly connected with the edge of the transmission region of described supporting structure unit.

Further, the top of described IR blade unit and described supporting structure unit form a fixed connection by hot melting way.

Further, the IR sheet of described IR blade unit is circle or polygon.

Further, the thickness of described IR sheet is 0.2 ~ 0.4mm.

Further, the upper surface of described photosensitive area unit and the distance of described IR blade unit lower surface are 0.6 ~ 0.8mm.

Further, between described supporting structure unit sidewall and described photosensitive area unit, the CMOS chip unit certain distance is arranged.

Further, described CSP mobile phone camera module also comprises: CMOS chip periphery circuit elements device cell, and on the described substrate and between described supporting structure unit and described photosensitive area unit.

Further, described substrate is flexible PCB, described CMOS chip unit and described substrate Bonding.

Further, there is not glue bonding between the upper surface of the lower surface of described IR blade unit and described CMOS chip unit.

Compared with prior art, the CSP mobile phone camera module that the utility model provides, place the supporting structure unit inner and directly be placed on the upper surface of CMOS chip unit the IR blade unit, and so that described IR blade unit and supporting structure unit and substrate form seal cavity, so that the dust such as in the components and parts of CMOS chip periphery circuit elements device cell etc. of inside, supporting structure unit can't enter the image area of CMOS chip unit, simultaneously can reduce the dust that produces in lens unit and the motor unit relative motion process drops at the image area of CMOS chip unit, prevent that the dust that enters from forming the shadow district, improves the production yield of CSP mobile phone camera module.

Description of drawings

Figure 1 shows that the schematic cross-section of superstructure of the CSP mobile phone camera module of prior art;

Figure 2 shows that the schematic cross-section of substructure of the CSP mobile phone camera module of prior art;

Figure 3 shows that the schematic cross-section of package assembly of the CSP mobile phone camera module of prior art;

Figure 4 shows that the schematic cross-section of superstructure of the CSP mobile phone camera module of the utility model one embodiment;

Figure 5 shows that the schematic cross-section of substructure of the CSP mobile phone camera module of the utility model one embodiment;

Figure 6 shows that the cross section structure schematic diagram of the CSP mobile phone camera module that Fig. 4 and Fig. 5 assembling is finished;

Fig. 7 A to 7D is depicted as the device schematic cross-section in the assembling process of substructure of CSP mobile phone camera module shown in Figure 5.

Embodiment

The utility model proposes a kind of CSP mobile phone camera module, can regard simply by superstructure and substructure to form that its key is as: the IR blade unit that belongs in the prior art in the superstructure is placed in the substructure.

In order more to understand technology contents of the present utility model, especially exemplified by specific embodiment and cooperate appended illustrate as follows.

The utility model proposes a kind of CSP mobile phone camera module, comprise superstructure and substructure.

As shown in Figure 4, the superstructure of CSP mobile phone camera module of the present utility model comprises: lens unit 1 and motor unit 2, and wherein, lens unit 1 comprises camera lens; Motor unit 2 is positioned at the periphery of described lens unit 1, drives described camera motion, adjusts lens location to finish the automatic focusing of camera lens.

As shown in Figure 5, the substructure of CSP mobile phone camera module of the present utility model comprises: substrate 8, photosensitive area unit 5, CMOS chip unit 4, supporting structure unit 3 and IR blade unit 6.Wherein, substrate 8 is positioned at the bottom of whole module; Photosensitive area unit 5, CMOS chip unit 4 and IR blade unit 6 stack gradually on described substrate 8, and CMOS chip unit 4 is positioned at 5 tops, described photosensitive area unit or periphery, and IR blade unit 6 is placed on the upper surface of described CMOS chip unit; Supporting structure unit 3 is positioned at the periphery of photosensitive area unit 5, CMOS chip unit 4 and IR blade unit 6, and between its sidewall and the described photosensitive area unit 6 certain distance is arranged, the top connects described motor unit 2, bottom connection substrate 8, its crown center zone is transparent area, and be fixedly connected with in the upper surface side week of described IR blade unit 6, supporting structure unit 3 forms seal cavities with IR blade unit 6 and substrate 8.

In the present embodiment, the substructure of CSP mobile phone camera module also comprises the CMOS chip periphery circuit elements device cell 7 on the substrate and in the space between supporting structure unit 3 and described photosensitive area unit 6, such as electric capacity, resistance, driving element etc.

Please refer to Fig. 6, superstructure shown in Figure 4 and substructure shown in Figure 5 are fitted together to obtain CSP mobile phone camera module of the present utility model.Because supporting structure unit 3 has formed seal cavity with IR blade unit 6 and substrate 8, can reduce the dust that produces in lens unit 1 and the motor unit 2 relative motion processes by IR blade unit 6 drops at the image area of CMOS chip unit 4, can also stop support construction unit 3 and described photosensitive area unit 6 between the space in dust (such as the dust in the devices such as CMOS chip periphery circuit elements device cell 7) enter the image area of CMOS chip unit, effectively prevent the formation in shadow district, improve the production yield of CSP mobile phone camera module.

Need to prove, because the IR blade unit 6 of CSP mobile phone camera module of the present utility model no longer is arranged at the camera lens bottom, so the shape of its IR sheet also just not only is defined as circle, can also be the polygons such as square, rectangle, pentagon, hexagon, octagon.The thickness of IR sheet is 0.2 ~ 0.4mm, for example is 0.21mm, 0.3mm.The image area that IR blade unit 6 directly is placed on CMOS chip unit 4 is surperficial, and it is bonding to need not glue.

Further, increase described photosensitive area unit 5 upper surfaces by the thickness with described IR blade unit 6 and (be the upper surface of CMOS chip unit in the prior art with the face of dust of dropping, be the upper surface of described IR blade unit 6 in the utility model) distance, so that dust reduces greatly at the shadow that CMOS chip unit image area forms, distance between the upper surface of described photosensitive area unit 5 and the described IR blade unit upper surface is 0.6 ~ 0.8mm, is preferably 0.70mm.

Further, IR blade unit 6 is moved on to 3 inside, supporting structure unit, and the mode by hot melt, the IR sheet is fixed on the top of supporting structure unit 3, the dust in other device cells of 3 inside, supporting structure unit reaches the effect of sealing, so that can't enter the image area of CMOS chip unit 4.

Further, described substrate is flexible PCB, described CMOS chip unit 4 and described substrate Bonding.

Please refer to Fig. 7 A to 7B, the utility model also provides a kind of hot melting way assembling or makes the method for the substructure of CSP mobile phone camera module, may further comprise the steps:

At first, provide substrate 8, paster on described substrate 8 mainly is to attach photosensitive area unit 5 and CMOS chip unit 4, and in the present embodiment, photosensitive area unit 5 is positioned at CMOS chip unit 4 inside;

Then, carry out the location of supporting structure unit 3, mainly be with supporting structure unit 3 frameworks on substrate 8, between the sidewall of supporting structure unit 3 sidewalls and photosensitive area unit 5 and CMOS chip unit 4, reserve certain distance, between the top of 3 tops, supporting structure unit and CMOS chip unit 4, reserve the distance of placing R blade unit 6, and so that middle section can be to the image area printing opacity of CMOS chip unit 4;

Then, carrying out the location of IR blade unit 6, mainly is the image area surface that IR blade unit 6 is placed on CMOS chip unit 4;

Then, hot melt is with the heat fusion joint hot melt of supporting structure unit 3 zone lines, so that the top of supporting structure unit 3 is fixedly connected with the top of IR blade unit 6, so that supporting structure unit 3 forms seal cavities with IR blade unit 6 and substrate 8.

Preferably, above-mentioned steps is all finished in dust free room.

Further, the lens unit of the superstructure of the CSP mobile phone camera module that provides of the utility model and the assembling of motor unit and the assembling of substructure and superstructure are all finished in dust free room.

In sum, the CSP mobile phone camera module that the utility model provides, place the supporting structure unit inner and directly be placed on the upper surface of CMOS chip unit the IR blade unit, and so that described IR blade unit and supporting structure unit and substrate form seal cavity, so that the image plane that the dust such as in the components and parts of CMOS chip periphery circuit elements device cell etc. of inside, supporting structure unit can't enter the CMOS chip unit, simultaneously can reduce the dust that produces in lens unit and the motor unit relative motion process drops at CMOS chip unit image area, prevent that the dust that enters from forming the shadow district, improves the production yield of CSP mobile phone camera module.

Although the utility model discloses as above with preferred embodiment; so it is not to limit the utility model; have in the technical field under any and usually know the knowledgeable; within not breaking away from spirit and scope of the present utility model; when doing a little change and retouching, therefore protection range of the present utility model is as the criterion when looking claims person of defining.

Claims

1. a CSP mobile phone camera module is characterized in that, comprising:

Lens unit is positioned at the top of whole module, comprises camera lens;

Substrate is positioned at the bottom of whole module;

The photosensitive area unit is positioned on the described substrate;

2. CSP mobile phone camera module as claimed in claim 1 is characterized in that, the zone line at the top of described supporting structure unit is transmission region.

3. CSP mobile phone camera module as claimed in claim 2 is characterized in that, the top of described IR blade unit is fixedly connected with the edge of the transmission region of described supporting structure unit.

4. such as claim 1 or 3 described CSP mobile phone camera modules, it is characterized in that the top of described IR blade unit and described supporting structure unit form a fixed connection by hot melting way.

5. CSP mobile phone camera module as claimed in claim 1 is characterized in that, the IR sheet of described IR blade unit is circle or polygon.

6. CSP mobile phone camera module as claimed in claim 1 is characterized in that, the thickness of described IR sheet is 0.2 ~ 0.4mm.

7. CSP mobile phone camera module as claimed in claim 1 is characterized in that, the distance between the upper surface of described photosensitive area unit and described IR blade unit upper surface is 0.6 ~ 0.8mm.

8. CSP mobile phone camera module as claimed in claim 1 is characterized in that, between described supporting structure unit sidewall and described photosensitive area unit, the CMOS chip unit certain distance is arranged.

9. CSP mobile phone camera module as claimed in claim 8 is characterized in that, described CSP mobile phone camera module also comprises: CMOS chip periphery circuit elements device cell, and on the described substrate and between described supporting structure unit and described photosensitive area unit.

10. CSP mobile phone camera module as claimed in claim 1 is characterized in that, described substrate is flexible PCB, described CMOS chip unit and described substrate Bonding.

11. CSP mobile phone camera module as claimed in claim 1 is characterized in that, does not have glue bonding between the upper surface of the lower surface of described IR blade unit and described CMOS chip unit.