Nothing Special   »   [go: up one dir, main page]

CN202632787U - 兼具热传导、热对流及热辐射的散热体构造 - Google Patents

兼具热传导、热对流及热辐射的散热体构造 Download PDF

Info

Publication number
CN202632787U
CN202632787U CN2012200562132U CN201220056213U CN202632787U CN 202632787 U CN202632787 U CN 202632787U CN 2012200562132 U CN2012200562132 U CN 2012200562132U CN 201220056213 U CN201220056213 U CN 201220056213U CN 202632787 U CN202632787 U CN 202632787U
Authority
CN
China
Prior art keywords
heat
heat radiator
radiating
utility
model
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2012200562132U
Other languages
English (en)
Inventor
王惠民
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GUANGQI SCIENCE AND TECHNOLOGY Co Ltd
Ceramate Technical Co Ltd
Original Assignee
GUANGQI SCIENCE AND TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to TW101201478U priority Critical patent/TWM431348U/zh
Application filed by GUANGQI SCIENCE AND TECHNOLOGY Co Ltd filed Critical GUANGQI SCIENCE AND TECHNOLOGY Co Ltd
Priority to CN2012200562132U priority patent/CN202632787U/zh
Priority to JP2012001377U priority patent/JP3175854U/ja
Priority to EP12002887.3A priority patent/EP2657965A1/en
Application granted granted Critical
Publication of CN202632787U publication Critical patent/CN202632787U/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/105—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being corrugated elements extending around the tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
    • F28F3/027—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements with openings, e.g. louvered corrugated fins; Assemblies of corrugated strips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Geometry (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)
  • Resistance Heating (AREA)

Abstract

本实用新型公开了一种兼具热传导、热对流及热辐射的散热体构造，其包含有：一本体，其以易导热的材料所制成，该本体弯折成一连续的S状，该本体间隔设置有多个第一散热片，且该等第一散热片的两端分别相接一第二散热片，另该等第二散热片的两端分别连接该等相邻的第一散热片的相对应端，且该等第二散热片至少分别设有一穿孔，借此，将该本体的一端与一发热元件形成相接，使该发热元件可传导热能至该本体上，除了增加该本体与外界接触的散热面积及散热距离，并同时以热传导、热对流及热辐射的方式增加散热效率。

Description

兼具热传导、热对流及热辐射的散热体构造
技术领域
本实用新型关于一种散热构造。
背景技术
汽、机车及电子元件等产品等在运作时皆会产生高温，若产生的高温无法导出，会影响其运作效率、稳定性及使用寿命，温度愈高其使用寿命越低，请参阅图1所示，为现有散热构造的立体图，因此借由一散热构造1将该产品产生的热能通过热传导方式从该产品传递至该散热构造1，再借由自然热对流与热辐射方式将热能从该散热构造1传递至外界，以防止产品因过热而烧毁。
当产品经过长时间使用后，该散热构造1易达到热饱和，使热能积存在该散热构造1及产品间，除影响其运作效率、稳定性、减少其使用寿命外，更容易造成使用者触摸产品时，产生烫伤等危害，且，一般的散热构造1采高密度、高导热系数的金属材料来制造，借以增加该散热构造1的热饱和度，同时使用平面的鳍片2型态来增加散热面积，具有导热性好、热传输速率高及加工成型容易等优点，惟若其比重大、电绝缘性差、加工过程污染严重、生产效率低及成本高，且易产生触电等危害，降低其产品竞争力，另，为提高散热效果，该散热构造1同时会搭配一风扇3，借以产生强制热对流，惟若其体积大、成本高，使产品不具竞争力，因此，如何研发出一种环保、节能、加工成型快、生产效率高、成本低、比重小，且避免产生危害，更同时具有热传导、热对流及热辐射的散热构造，确实有其必要。
实用新型内容
为了解决上述技术问题，本实用新型提供一种散热体构造，特别是指一种成本低、热饱和度高、避免产生危害且同时具有热传导、热对流及热辐射的散热构造。
本实用新型提供的兼具热传导、热对流及热辐射的散热体构造，其包含有：一本体，其以易导热的材料所制成，该本体弯折成一连续的S状，该本体间隔设置有多个第一散热片，且该等第一散热片的两端分别相接一第二散热片，另该等第二散热片的两端分别连接该等相邻的第一散热片的相对应端，且该等第二散热片至少分别设有一穿孔。
作为优选方案，其中，该本体的材料选自添加铝的塑料、添加碳的塑料或添加陶瓷的塑料的其中一种。
作为优选方案，其中，该本体采射出成型一体制成。
本实用新型所提供的一种兼具热传导、热对流及热辐射的散热体构造，将本体的一端与一发热元件形成相接，使该发热元件可传导热能至该本体上，借由该等第一散热片、该等第二散热片的设置，而增加该发热元件与外界接触的散热面积及散热距离，并于该等第二散热片上皆设有穿孔，故该本体内部的热空气可迅速的以热对流方式与外部空气形成流通，达到同时兼具热传导、热对流、热辐射的散热效果，并有效降低该发热元件的温度，且该发热元件不会因为过热而造成损坏，延长使用寿命，更有效避免使用者触摸该本体的另一端时，产生烫伤等危害，且本实用新型采射出成型一体制成，其具有环保、节能、加工成型快、生产效率高、成本低、比重小的特性，有效提高产品竞争力。
附图说明
图1为现有散热构造的立体图。
图2为本实用新型的立体图。
图3为本实用新型第一较佳实施例的立体图。
图4为本实用新型图3的纵向剖视图。
图5为本实用新型图4的AA方向剖视图。
图6为本实用新型第二较佳实施例的立体图。
图7为本实用新型图6的纵向剖视图。
元件符号说明：
1、散热构造；     2、鳍片；
3、风扇；
10、本体；
11、第一散热片； 12、第二散热片；
121、穿孔；
100、灯具；     101、灯座；
200、CPU；
具体实施方式
下面结合附图和具体实施例对本实用新型作进一步说明，以使本领域的技术人员可以更好的理解本实用新型并能予以实施，但所举实施例不作为对本实用新型的限定。
请参阅图2所示，为本实用新型的立体图，其主要包含有一本体10；其中：
该本体10，其采用易导热的材料以射出成型一体制成，于本实施例中，该本体10材料选自添加铝的塑料、添加碳的塑料或添加陶瓷的塑料的其中一种，该本体10弯折成一连续的S状，其中，该本体10间隔设置有多个第一散热片11，且该等第一散热片11的两端分别连接一第二散热片12，另该等第二散热片12的两端分别连接该等相邻的第一散热片11的相对应端，且该等第二散热片12至少分别设有一穿孔121。
为供进一步了解本实用新型构造特征、运用技术手段及所预期达成的功效，兹将本实用新型使用方式加以叙述，相信当可由此而对本实用新型有更深入且具体的了解，如下所述：
请同时参阅图3、图4及图5所示，为本实用新型的第一较佳实施例的立体图、图3的纵向剖视图及图4的AA方向剖视图，首先，将该本体10与一发热元件形成相接，于本实用新型第一较佳实施利中，该发热元件以一灯具100为例，将该本体10一端的第一散热片11包覆于该灯具100的灯座101周侧，并沿径向间隔设置多个第一散热片11，且该等第一散热片11概呈同心圆筒，且该等第一散热片11的两端分别连接一第二散热片12，另该等第二散热片12的两端分别连接该等相邻的第一散热片11的相对应端，且该等第二散热片12概呈同心圆环，当该灯具100开始运作后，该等灯具100会将部分电能转化为热能，导致该灯具100温度逐渐升高，俾使该灯具100的热能传导至该本体10上，此方式可有效增加该本体10与空气相接触的散热路径及散热面积，使该灯具100所产生的热能迅速地以热传导及热辐射方式传递至外界，另，该等第二散热片12皆环设有数个穿孔121，遂使该本体10内部的热空气可迅速的以热对流方式与外部空气形成流通，进而提升该本体10的散热效率，降低该灯具100的温度，使该灯具100的不会因为过热而造成损坏，可增加该灯具100使用寿命，又，借由该本体10的散热路径、散热面积及散热效率，当使用者触摸该本体10另端时，有效避免产生烫伤等危害，方便使用者进行拔插作业，再者，以该本体提升该灯具100的散热效果后，使用者不仅可降低该灯具100的体积，更可提升该灯具100的使用功率，且本实用新型采用射出成型一体制成，其制程简单、成本低，提高产品竞争力。
请同时参阅图6、图7所示，为本实用新型第二较佳实施例的立体图、图6的纵向剖视图，首先，将该本体10与一发热元件形成相接，于本实用新型第二较佳实施利中，该发热元件以CPU(Central Processing Unit)200为例，将该本体10一端的该第一散热片11设于该CPU 200的顶面，并沿纵向间隔设置有多个的第一散热片11，且该等第一散热片11的两端分别连接一第二散热片12，另该等第二散热片12的两端分别连接该等相邻的第一散热片11的相对应端，且该等第二散热片12至少分别设有一穿孔121，其中，该本体10以该等第一散热片11及该等第二散热片12增加热能的散热路径、散热面积，并同时以热传导、热对流及热辐射方式增加散热效率，借此，增加该发热元件使用寿命，并避免产生烫伤等危害，且本实用新型采用射出成型一体制成，其制程简单、成本低，提高产品竞争力。
以上所述实施例仅是为充分说明本实用新型而所举的较佳的实施例，本实用新型的保护范围不限于此。本技术领域的技术人员在本实用新型基础上所作的等同替代或变换，均在本实用新型的保护范围之内。本实用新型的保护范围以权利要求书为准。

Claims (2)

1.一种兼具热传导、热对流及热辐射的散热体构造，其特征在于，主要包含有：
一本体，其以易导热的材料所制成，该本体弯折成一连续的S状，该本体间隔设置有多个第一散热片，且该等第一散热片的两端分别相接一第二散热片，另该等第二散热片的两端分别连接该等相邻的第一散热片的相对应端，且该等第二散热片至少分别设有一穿孔。
2.依权利要求1所述的兼具热传导、热对流及热辐射的散热体构造，其特征在于，该本体采用射出成型一体制成。
CN2012200562132U 2012-01-20 2012-02-21 兼具热传导、热对流及热辐射的散热体构造 Expired - Fee Related CN202632787U (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW101201478U TWM431348U (en) 2012-01-20 2012-01-20 Heat dissipation body structure with thermal conduction, thermal convection and thermal radiation
CN2012200562132U CN202632787U (zh) 2012-01-20 2012-02-21 兼具热传导、热对流及热辐射的散热体构造
JP2012001377U JP3175854U (ja) 2012-01-20 2012-03-13 放熱体構造
EP12002887.3A EP2657965A1 (en) 2012-01-20 2012-04-24 Heat disperser with heat transmission, heat convection and heat radiation function

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
TW101201478U TWM431348U (en) 2012-01-20 2012-01-20 Heat dissipation body structure with thermal conduction, thermal convection and thermal radiation
CN2012200562132U CN202632787U (zh) 2012-01-20 2012-02-21 兼具热传导、热对流及热辐射的散热体构造
JP2012001377U JP3175854U (ja) 2012-01-20 2012-03-13 放熱体構造
EP12002887.3A EP2657965A1 (en) 2012-01-20 2012-04-24 Heat disperser with heat transmission, heat convection and heat radiation function

Publications (1)

Publication Number Publication Date
CN202632787U true CN202632787U (zh) 2012-12-26

Family

ID=67928533

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012200562132U Expired - Fee Related CN202632787U (zh) 2012-01-20 2012-02-21 兼具热传导、热对流及热辐射的散热体构造

Country Status (4)

Country Link
EP (1) EP2657965A1 (zh)
JP (1) JP3175854U (zh)
CN (1) CN202632787U (zh)
TW (1) TWM431348U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113554832A (zh) * 2020-04-24 2021-10-26 英研智能移动股份有限公司 门铃组件及壁挂座

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8780562B2 (en) * 2012-07-20 2014-07-15 Tai-Her Yang Heat dissipater having heat conductive rib with interval forming as flow guide hole and applied in electric luminous body

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6615910B1 (en) * 2002-02-20 2003-09-09 Delphi Technologies, Inc. Advanced air cooled heat sink
CN101368713B (zh) * 2007-08-17 2010-11-10 富准精密工业(深圳)有限公司 散热器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113554832A (zh) * 2020-04-24 2021-10-26 英研智能移动股份有限公司 门铃组件及壁挂座

Also Published As

Publication number Publication date
TWM431348U (en) 2012-06-11
EP2657965A1 (en) 2013-10-30
JP3175854U (ja) 2012-06-07

Similar Documents

Publication Publication Date Title
CN205038588U (zh) 一种移动终端降温器
CN202632787U (zh) 兼具热传导、热对流及热辐射的散热体构造
CN203645846U (zh) 一种管体带热交换孔的陶瓷加热管
CN203133734U (zh) 一种带有散热系统的全密封机箱
CN205030023U (zh) 一种电梯电控箱散热装置
CN203575914U (zh) 麻将电暖桌
CN202791914U (zh) Led灯散热及余热回收装置
CN204301013U (zh) 一种led灯散热及余热回收系统
CN203703900U (zh) 一种led灯具塑胶散热灯体的立柱式散热结构
CN203217475U (zh) 一种散热良好的电脑主机电源
CN205174009U (zh) 一种led灯散热器
CN202546383U (zh) 一种石墨衬底led灯具
CN201219340Y (zh) 散热片间距为8-18mm的热管散热器
CN202565482U (zh) 一种ptc发热器
CN205002208U (zh) 一种电暖器
CN203162681U (zh) 一种led球泡灯
CN201742578U (zh) 一种电加热器
CN103391649A (zh) 一种ptc发热器及其制作方法
CN103277754A (zh) 一种陶瓷led灯座
CN210940413U (zh) 一种成型机的隔热装置
CN102261628A (zh) 一种简易的高效传散热装置
CN202799535U (zh) 大功率用电器散热器
CN202149453U (zh) 一种led球泡灯用陶瓷座装置
CN203162799U (zh) 一种一体化工矿灯
CN203748022U (zh) Ptc发热器散热条结构

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20121226

Termination date: 20150221

EXPY Termination of patent right or utility model