CN202562341U - Impulse heat-pipe expanding heat plate - Google Patents
Impulse heat-pipe expanding heat plate Download PDFInfo
- Publication number
- CN202562341U CN202562341U CN 201220115808 CN201220115808U CN202562341U CN 202562341 U CN202562341 U CN 202562341U CN 201220115808 CN201220115808 CN 201220115808 CN 201220115808 U CN201220115808 U CN 201220115808U CN 202562341 U CN202562341 U CN 202562341U
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- substrate
- heat pipe
- pulsating heat
- heat
- hot plate
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides an impulse heat-pipe expanding heat plate which comprises a substrate, a front blocking head, a rear blocking head, an impulse heat pipe and a cover plate. A plurality of parallel capillary tube groove channels are arranged on the substrate. A slit which has a depth bigger than a width of the substrate is arranged on the substrate between two adjacent capillary tube groove channels. A plurality of protruding portions are arranged on two end faces of the substrate and two side walls of each protruding portion are in tangent connection with side walls of the capillary tube groove channels. The side of the substrate is provided with the capillary tube groove channels and the slit and is welded with the cover plate. Two end faces of the substrate are respectively welded with the front blocking head and the rear blocking head. A plurality of grooves are arranged on each blocking head. The number of the grooves is equal to that of the protruding portions. The grooves and the protruding portions form a bent head of the impulse heat pipe. One blocking head is provided with a communicated loop and a liquid charging tube. As a high-efficiency heat conduction element, the impulse heat-pipe expanding heat plate is simple in structure and easy to process, utilizes character of the impulse heat pipe and a micro-scale strengthening heat exchange method to increase heat exchange quantity so that operation property of electronic components can be reliable and widely applied to the cooling field of electronic components.
Description
Technical field
The utility model relates to a kind of pulsating heat pipe and expands hot plate, and it is a kind of high-efficiency heat conduction element that the pulsating heat pipe of preparation expands hot plate, can be widely used in the cooling field of electronic devices and components.
Technical background
At present, electronic product is widely used in fields such as computer, Aero-Space, communication, military project, consumer electronic device.And the degree of perfection of the thermal control of device own is all directly depended in the microminaturization of the increase of the improvement of electronic devices and components reliability, power capacity and structure etc., so heat dissipation problem has become electronic product stable operation, development and development key problem.
The normal working temperature scope of electronic devices and components is generally-5~+ 65 ℃, surpasses this temperature range, and the performance of element obviously descends, can not steady operation, and this will influence reliability of system operation.Research and practical application show, 10 ℃ of the every risings of the temperature of single semiconductor element, and the reliability of system will reduce by 50%, 10 ℃ of the every declines of temperature, its life-span can prolong one times.Especially along with the developing rapidly of electronic technology, the intensive and miniaturization of the high frequency of electronic device, high speed and integrated circuit makes the caloric value of unit volume electronic device increase fast.With the microelectronic chip is example, and its heat dissipation capacity has generally reached 60~90W/cm at present
2, the highest 200W/cm that reached
2This shows that the heat radiation of electronic equipment all receives much concern in a plurality of fields, become the key technical problem of being badly in need of solution.Pulsating heat pipe is as a kind of novel, heat transfer element efficiently, and is simple in structure, cost is low, can realize high hot-fluid, characteristics such as easy for installation, in the thermal control technology of the cooling of microelectronic component and aerospace field, has and uses and development potentiality.
The operation logic of pulsating heat pipe and heat-transfer character and conventional heat pipe have very big difference.During pulsating heat pipe work, generally can be divided into three parts, the two ends of pipe are respectively bringing-up section and cooling section, and the middle part of pipe is the adiabatic section, and the adiabatic section also can be omitted.As shown in Figure 1, be the basic principle schematic of pulsating heat pipe, its operation logic is: when enough hour of caliber, will form the steam binding and the liquid plug of connecting in the pipe; In bringing-up section, the liquid film between steam bubble or vapour post and the tube wall will constantly receive thermal evaporation, cause steam bubble to expand, and pressure raises; At cooling section, steam bubble dwindles condensation and breaks simultaneously, and pressure descends; Cause that to have produced driving pressure between bringing-up section and the condensation segment poor; Promotion vapour, liquid slug move back and forth between bringing-up section and cooling section, and heat passes to the other end from an end, thereby realize the transmission or the temperature control of heat.It is thus clear that in pulsating heat pipe, the phase transformation of working medium mainly is for working medium provides power, phase-change heat-exchange shared proportion in total transmission hot-fluid of pulsating heat pipe is less, and heat pipe mainly relies on the sensible heat of working medium to change and realizes the heat transmission.
Summary of the invention
The purpose of the utility model is the shortcoming and defect to the existing heat dissipation technology of electronic devices and components; Provide a kind of pulsating heat pipe to expand hot plate; To improve the radiating efficiency of electronic devices and components; Simplify the structure of thermal component, utilize the characteristic of pulsating heat pipe and minute yardstick strengthened heat exchange method to increase heat, make that the service behaviour of electronic devices and components is more reliable.
For realizing above-mentioned target; The utility model provides a kind of pulsating heat pipe to expand hot plate, and said pulsating heat pipe expands hot plate (1) and comprises substrate (9), forward and backward plug (11,12); Pulsating heat pipe (2) and cover plate (4,5,6); It is characterized in that, several parallel capillary conduits (7) are set on the said substrate (9), on the substrate (9) between the adjacent two capillary conduits (7) slit (8) that the degree of depth is no more than substrate thickness is set; The substrate both ends of the surface that are connected with forward and backward plug (11,12) are provided with several lug bosses (10); Each lug boss (10) is positioned on the substrate (9) between the adjacent two capillary conduits (7), and the sidewall of two side of each lug boss (10) and capillary conduit (7) is tangent; The one side that substrate (9) has capillary conduit (7) and slit (8) is welded with cover plate (6); On the both ends of the surface of the substrate that is formed with lug boss (10) (9), weld forward and backward plug (11,12) respectively; Several grooves (11-2,12-1) are set on each plug (11,12); The quantity of groove (11-2,12-1) is identical with the quantity of the lug boss (10) of correspondence; Groove (11-2,12-1) and lug boss (10) complement each other to form the elbow of pulsating heat pipe (2); Connection loop (11-1) and topping up pipe (3) also are set on one of them plug (11,12), and said pulsating heat pipe is filled with working medium in (2).
Preferably, said substrate (9) is no-oxygen copper plate or L2 aluminium sheet.
Preferably, said working medium is R113, R124, R134a, water, ammonia, ethanol, acetone or ethylene glycol.
Preferably, the cross section of said capillary conduit (7) is cornue or pipe.
Preferably, the mode of processing capillary conduit is mechanical engraving, Wire EDM, vibrocutting or casting on substrate.
Adopting the processing mode of mode capillary conduit on substrate of line cutting is mechanical engraving, Wire EDM, vibrocutting or casting.Mechanical engraving is pure machinery knives engraving mode owing to what adopt, and the burr of substrate surface is bigger.Wire EDM can be processed narrow slit and reached 0.07mm, and the endoporus fillet is less than 0.035mm.Vibrocutting is not suitable for behind the incision thin plate the processing of conduit, but the vibration cutting can improve machining accuracy and surface quality man-hour for plate lip-deep adding, and improves the wearability and the corrosion resistance of machined surface, guarantees its finished surface integrality.Casting technique is tradition comparatively, and the element that casts out is generally comparatively coarse, is inappropriate for the less element of casting size.Can directly mill out conduit in processing boards for plug, this quadrat method is easy; In order further to improve the quality of plug structure, can adopt vibrocutting.
Compare with prior art, the pulsating heat pipe of the utility model expands hot plate and has following significant advantage: (1) is simple in structure, and cost is low; (2) can realize that high heat flux conducts heat, be easy to realize microminiaturized; (3) under suitable filling weight, heat flow density can be dryouied very greatly and not; (4) adaptability is strong, can be bent into suitable shape according to the difference of working condition, therefore has considerable version, and the adaptability that this has increased it has greatly enlarged its application; (5) scope of application is extensive, and pulsating heat pipe can be used for level heating even top mode of heating.And conventional heat pipe is when being used for the top mode of heating, and operation receives very big restriction, and gravity assisted heat pipe then can not move at all.
Description of drawings
Fig. 1 is the basic structure sketch map that the pulsating heat pipe of the utility model expands hot plate.
Fig. 2 expands the sketch map of hot plate cross section for pulsating heat pipe.
Fig. 3 is the substrate front view.
Fig. 4 is the substrate-side view.
Fig. 5 has the plug sketch map that is communicated with loop after simplifying.
Fig. 6 is for simplifying back plug cross sectional representation.
Fig. 7 is the hot panel cross sectional representation of square sectional pulsating heat pipe capillaceous.
Fig. 8 is the hot panel cross sectional representation of circular cross-section pulsating heat pipe capillaceous.
The specific embodiment
Below in conjunction with accompanying drawing and specific embodiment; Further illustrate the utility model; Should understand these embodiment only be used to the utility model is described and be not used in the restriction the utility model scope; After having read the utility model, those skilled in the art all fall within the application's accompanying claims institute restricted portion to the modification of the various equivalent form of values of the utility model.
Shown in Fig. 1 to 6; Said pulsating heat pipe expands hot plate 1 and comprises substrate 9, forward and backward plug 11,12, pulsating heat pipe 2 and cover plate 4,5,6; It is characterized in that; Several parallel capillary conduits 7 are set on the said substrate 9, on the substrate 9 between the adjacent two capillary conduits 7 slit 8 that the degree of depth is no more than substrate thickness are set, it is as shown in Figure 2 to expand the hot plate cross section; The substrate both ends of the surface that are connected with forward and backward plug 11,12 are provided with several lug bosses 10; Like Fig. 3, shown in 4; Each lug boss 10 is on the substrate 9 between the adjacent two capillary conduits 7, and the sidewall of the two side of each lug boss 10 and capillary conduit 7 is tangent; The one side that substrate 9 has capillary conduit 7 and slit 8 is welded with cover plate 6; On the both ends of the surface of the substrate that is formed with lug boss 10 9, weld forward and backward plug 11,12 respectively; On each plug 11,12 several grooves 11-2,12-1 are set; The quantity of groove 11-2,12-1 is identical with the quantity of the lug boss 10 of correspondence; Groove 11-2,12-1 and lug boss 10 complement each other to form the elbow of pulsating heat pipe 2; Connection loop 11-1 and topping up pipe 3 also are set on one of them plug 11,12, and forward and backward plug 11,12 shapes are filled with working medium like Fig. 5, shown in 6 in the said pulsating heat pipe 2.
No-oxygen copper plate and L2 aluminium sheet are the expansion hot plate materials of preferentially selecting for use.Consider the application background that expands hot plate that designs, the working medium of choosing should be in low temperature range (200-550K).Working medium in this scope is more, water, ammonia, ethanol, acetone, ethylene glycol, R113, R124 and the R134a etc. of mainly containing relatively more commonly used.Design Selection working medium such as acetone, ethanol.For further improving the performance that pulsating heat pipe expands hot plate, also will consider in selected working medium base fluid, to add nano particle.For guaranteeing to have compatibility with shell material, working medium, will add Cu, CuO nano particle for acetone, ethanol working medium, the nano-fluid that is configured to is experimentized.
Preferably, the cross section of capillary conduit 7 is cornue or pipe, and the utility model mainly adopts the capillary channel of square sectional and circular cross-section, like Fig. 7, shown in Figure 8.As shown in Figure 7, the square length of side in capillary cross section is 1.5mm, and elbow is several 11, i.e. 22 parallel pipes altogether, and the centre-to-centre spacing between adjacent channel is 2.5mm.As shown in Figure 8, circular cross-section internal diameter capillaceous is decided to be 1.5mm, and the elbow number is 11, i.e. 22 parallel pipes altogether, and the distance of center circle between adjacent channel is 2.5mm.
The processing mode of capillary conduit 7 is mechanical engraving, Wire EDM, vibrocutting or casting on substrate 9.Mechanical engraving is pure machinery knives engraving mode owing to what adopt, and the burr on substrate 9 surfaces is bigger.Wire EDM can be processed narrow slit and reached 0.07mm, and the endoporus fillet is less than 0.035mm.Vibrocutting is not suitable for behind the incision thin plate the processing of conduit, but the vibration cutting can improve machining accuracy and surface quality man-hour for plate lip-deep adding, and improves the wearability and the corrosion resistance of machined surface, guarantees its finished surface integrality.Casting technique is tradition comparatively, and the element that casts out is generally more little coarse, is inappropriate for the less element of casting size.Can directly mill out conduit in processing boards for plug, this quadrat method is easy; For the further quality of plug structure can adopt vibrocutting.
The above only is the preferred implementation of the utility model; Should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle; Can also make some improvement and retouching, these improvement and retouching also should be regarded as the protection domain of the utility model.
Claims (5)
1. a pulsating heat pipe expands hot plate; Said pulsating heat pipe expands hot plate (1) and comprises substrate (9); Forward and backward plug (11,12), pulsating heat pipe (2) and cover plate (4,5,6) is characterized in that; Several parallel capillary conduits (7) are set on the said substrate (9), on the substrate (9) between the adjacent two capillary conduits (7) slit (8) that the degree of depth is no more than substrate thickness are set; The substrate both ends of the surface that are connected with forward and backward plug (11,12) are provided with several lug bosses (10); Each lug boss (10) is positioned on the substrate (9) between the adjacent two capillary conduits (7), and the sidewall of two side of each lug boss (10) and capillary conduit (7) is tangent; The one side that substrate (9) has capillary conduit (7) and slit (8) is welded with cover plate (6); On the both ends of the surface of the substrate that is formed with lug boss (10) (9), weld forward and backward plug (11,12) respectively; Several grooves (11-2,12-1) are set on each plug (11,12); The quantity of groove (11-2,12-1) is identical with the quantity of the lug boss (10) of correspondence; Groove (11-2,12-1) and lug boss (10) complement each other to form the elbow of pulsating heat pipe (2); Connection loop (11-1) and topping up pipe (3) also are set on one of them plug (11,12), and said pulsating heat pipe is filled with working medium in (2).
2. pulsating heat pipe according to claim 1 expands hot plate, it is characterized in that said substrate (9) is no-oxygen copper plate or L2 aluminium sheet.
3. pulsating heat pipe according to claim 1 expands hot plate, it is characterized in that said working medium is R113, R124, R134a, water, ammonia, ethanol, acetone or ethylene glycol.
4. expand hot plate according to each described pulsating heat pipe of claim 1 to 3, it is characterized in that the cross section of said capillary conduit (7) is cornue or pipe.
5. expand hot plate according to each described pulsating heat pipe of claim 1 to 3, it is characterized in that, the mode of processing capillary conduit is mechanical engraving, Wire EDM, vibrocutting or casting on substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN 201220115808 CN202562341U (en) | 2012-03-22 | 2012-03-22 | Impulse heat-pipe expanding heat plate |
Applications Claiming Priority (1)
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CN 201220115808 CN202562341U (en) | 2012-03-22 | 2012-03-22 | Impulse heat-pipe expanding heat plate |
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CN202562341U true CN202562341U (en) | 2012-11-28 |
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CN 201220115808 Withdrawn - After Issue CN202562341U (en) | 2012-03-22 | 2012-03-22 | Impulse heat-pipe expanding heat plate |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104567499A (en) * | 2015-01-20 | 2015-04-29 | 北京建筑大学 | Pulse heat pipe heat radiation device used for electronic device and heat radiation device thereof |
CN104567502A (en) * | 2014-12-25 | 2015-04-29 | 广东工业大学 | Laser preparation method of micro-heat pipe with discontinuous capillary structure |
CN104596043A (en) * | 2015-02-12 | 2015-05-06 | 珠海格力电器股份有限公司 | Controller board cooling system of air conditioning device and air conditioning device |
CN105436504A (en) * | 2016-01-12 | 2016-03-30 | 中国电子科技集团公司第二十九研究所 | Thin-wall sealing liquid cooling channel based on metal quick forming technology |
CN106767065A (en) * | 2017-03-16 | 2017-05-31 | 惠州市鼎丰泰科技有限公司 | A kind of loop circuit heat pipe |
CN109668459A (en) * | 2017-10-13 | 2019-04-23 | 讯凯国际股份有限公司 | Pulsed temperature-uniforming plate |
CN111902032A (en) * | 2020-08-19 | 2020-11-06 | 扬州船用电子仪器研究所(中国船舶重工集团公司第七二三研究所) | Air-cooled plate type pulsating heat pipe |
-
2012
- 2012-03-22 CN CN 201220115808 patent/CN202562341U/en not_active Withdrawn - After Issue
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104567502A (en) * | 2014-12-25 | 2015-04-29 | 广东工业大学 | Laser preparation method of micro-heat pipe with discontinuous capillary structure |
CN104567499A (en) * | 2015-01-20 | 2015-04-29 | 北京建筑大学 | Pulse heat pipe heat radiation device used for electronic device and heat radiation device thereof |
CN104596043A (en) * | 2015-02-12 | 2015-05-06 | 珠海格力电器股份有限公司 | Controller board cooling system of air conditioning device and air conditioning device |
CN105436504A (en) * | 2016-01-12 | 2016-03-30 | 中国电子科技集团公司第二十九研究所 | Thin-wall sealing liquid cooling channel based on metal quick forming technology |
CN105436504B (en) * | 2016-01-12 | 2018-04-03 | 中国电子科技集团公司第二十九研究所 | A kind of thin-walled sealing fluid cold passage based on metal quick shaping process |
CN106767065A (en) * | 2017-03-16 | 2017-05-31 | 惠州市鼎丰泰科技有限公司 | A kind of loop circuit heat pipe |
CN109668459A (en) * | 2017-10-13 | 2019-04-23 | 讯凯国际股份有限公司 | Pulsed temperature-uniforming plate |
CN111902032A (en) * | 2020-08-19 | 2020-11-06 | 扬州船用电子仪器研究所(中国船舶重工集团公司第七二三研究所) | Air-cooled plate type pulsating heat pipe |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
AV01 | Patent right actively abandoned |
Granted publication date: 20121128 Effective date of abandoning: 20130424 |
|
AV01 | Patent right actively abandoned |
Granted publication date: 20121128 Effective date of abandoning: 20130424 |
|
RGAV | Abandon patent right to avoid regrant |