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CN202217020U - High-temperature aging tester - Google Patents

High-temperature aging tester Download PDF

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Publication number
CN202217020U
CN202217020U CN2011203233912U CN201120323391U CN202217020U CN 202217020 U CN202217020 U CN 202217020U CN 2011203233912 U CN2011203233912 U CN 2011203233912U CN 201120323391 U CN201120323391 U CN 201120323391U CN 202217020 U CN202217020 U CN 202217020U
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CN
China
Prior art keywords
temperature
resistance
test
metal box
high temperature
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Expired - Fee Related
Application number
CN2011203233912U
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Chinese (zh)
Inventor
何宏
李志雄
庞卫文
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Shenzhen Netcom Electronics Co Ltd
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Shenzhen Netcom Electronics Co Ltd
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Priority to CN2011203233912U priority Critical patent/CN202217020U/en
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Abstract

The utility model is suitable for an electronic test field especially relates to a high temperature aging tester. In the embodiment of the utility model, the temperature control module of the high-temperature aging tester controls the heating condition of the heater by judging whether the environmental temperature of the metal box is consistent with the target temperature, so that the environmental temperature of the metal box is synchronous with the target temperature, the temperature drift and the error are reduced, and the set temperature range is wide and continuously adjustable; in addition, because the high-temperature aging tester is provided with the test power-on interface, the high-temperature aging tester can collect and analyze the operation parameters of the tested product under the high-temperature test, so that a tester can better know the operation condition of the tested product under the high-temperature test.

Description

A kind of high temperature ageing tester
Technical field
The utility model belongs to the Electronic Testing field, relates in particular to a kind of high temperature ageing tester.
Background technology
Burn-in test is that the various factors that analog equipment relates in real service condition produces the process that aging situation is carried out corresponding conditions reinforcement experiment to product; Aging conditions in the time of can understanding product and use under given conditions through burn-in test; Product through burn-in test is qualified can be guaranteed its fiduciary level and life cycle, and the quality that improves product is had valuable help.The burn-in test appearance is one of equipment commonly used in the various aging tests, is widely used in the test of products such as electronics, computer, communication.
The high temperature ageing tester is varied in the present aging testing apparatus; The high temperature ageing tester adopts temperature-control circuit that well heater is heated; Metal the temperature inside the box of present high temperature ageing tester is compared with target temperature, has the problem that temperature drift is big, error is big, in addition; Because the high temperature ageing tester is not provided with test and goes up electrical interface, so the operational factor of test product under high temperature test can't gathered and analyze to present high temperature ageing tester.
The utility model content
The purpose of the utility model is to provide a kind of high temperature ageing tester; Be intended to solve present high temperature ageing tester and have the problem that temperature drift is big, error is big, and there is the problem that can't gather and analyze the operational factor of test product under high temperature test in present high temperature ageing tester.
The utility model is achieved in that a kind of high temperature ageing tester, comprises metal box, and electrical interface in the test of promising test product power supply is set in the said metal box; Said high temperature ageing tester also comprises the test module of collection analysis test product operational factor, and said high temperature ageing tester also comprises temperature-control circuit, and said temperature-control circuit comprises:
The well heater of power supply termination power module;
The temperature setting module of target setting temperature;
Detect the temperature sensor of metal box environment temperature;
The first input end and second input end be jointing temp setting module and temperature sensor respectively, said metal box environment temperature and target temperature is compared the temperature comparison module of output compare result signal; And
The comparative result output terminal of input termination said temperature comparison module, the control end of heating control termination well heater is used for controlling said well heater according to said compare result signal, makes the temperature control modules that metal box environment temperature and target temperature are synchronous.
In the said structure, said temperature-control circuit also comprises the alarm module that is connected with the controlling alarm end of said temperature control modules.
In the said structure, said temperature setting module comprises a variable resistor R25, the first termination reference voltage of said variable resistor R25, the second end ground connection of said variable resistor R25, the first input end of the adjustable side jointing temp comparison module of said variable resistor R25.
In the said structure, said temperature comparison module comprises:
Operational amplifier U1, operational amplifier U2, resistance R 24, resistance R 26, resistance R 27, resistance R 28, resistance R 30, resistance R 31 and capacitor C 6;
First end of said resistance R 26 and resistance R 27 is respectively second input end of temperature comparison module; Second end of said resistance R 26 and resistance R 27 connects in-phase input end and the inverting input of operational amplifier U2 respectively; The in-phase input end of said operational amplifier U2 is through resistance R 30 ground connection; Said resistance R 28 is connected between the inverting input and output terminal of operational amplifier U2; The output terminal of said operational amplifier U2 is through capacitor C 6 ground connection, and the inverting input of said operational amplifier U1 connects the output terminal of operational amplifier U2 through resistance R 31, and the in-phase input end of said operational amplifier U1 is the first input end of temperature comparison module; First end of the output terminal connecting resistance R24 of said operational amplifier U1, second end of said resistance R 24 is the comparative result output terminal of temperature comparison module.
In the said structure, said temperature control modules comprises:
Resistance R 19, resistance R 21, resistance R 22, resistance R 23, metal-oxide-semiconductor M1, capacitor C 1, capacitor C 2, diode D2 and control chip U3;
The control end of said control chip U3 is the input end of said temperature control modules; Said capacitor C 1 and diode D2 are connected in parallel between the control end and ground of control chip U3; The replacement keyed end of said control chip U3 connects power supply through the resistance R 19 of serial connection with resistance R 21; The discharge end connecting resistance R19 of said control chip U3 and the public connecting end of resistance R 21, the power supply termination power of said control chip U3, the replacement end of said control chip U3 connects power supply through resistance R 22; The output terminal of said control chip U3 connects the grid of metal-oxide-semiconductor M1 through resistance R 23; The trigger point termination replacement keyed end of said control chip U3, the earth terminal ground connection of said control chip U3, said capacitor C 2 is connected between the earth terminal and trigger point end of control chip U3; The source ground of said metal-oxide-semiconductor M1, the drain electrode of said metal-oxide-semiconductor M1 are the heating control end of temperature control modules.
In the said structure; The inwall of said metal box is provided with the silica gel foaming plate that one deck is done heat insulation usefulness; On the said silica gel foaming plate one deck heat insulation foam is set also, but at least one pull sheet metal is set in the said metal box, but on the said pull sheet metal electrical interface in the test is installed at least; Said well heater is installed on the heat insulation foam, the external said metal box of said test module.
In the said structure; The inwall of said metal box is provided with the silica gel foaming plate that one deck is done heat insulation usefulness, and a dividing plate also is set in the said metal box, and said dividing plate is divided into space and following space with metal box; Conduct heating space between the said sky; Said test module is placed in said space down, on the silica gel foaming plate in said upward space one deck heat insulation foam is set also, but said going up in the space is provided with at least one pull sheet metal; But electrical interface in the test is installed on the said pull sheet metal at least, and said well heater is installed on the heat insulation foam.
In the said structure, electrical interface adopts the USB adapter in the said test.
In the said structure, on the diverse location a plurality of well heaters and temperature sensor are installed in the said metal box.
In the said structure, it is the NE555 chip that said control chip U3 adopts model.
In the utility model; The temperature control modules of high temperature ageing tester is through judging whether the metal box environment temperature is consistent with target temperature; Thereby the heating state of control heater makes that metal box environment temperature and target temperature are synchronous, has reduced temperature drift and error; And the design temperature scope is wide, and is adjustable continuously; In addition, go up electrical interface,, make the tester understand the ruuning situation of test product under high temperature test better so the operational factor of test product under high temperature test can gathered and analyze to the high temperature ageing tester because the high temperature ageing tester is provided with test.
Description of drawings
Fig. 1 is the structural drawing of the high temperature ageing tester that provides of the utility model first embodiment;
Fig. 2 is the modular structure figure of the temperature-control circuit that provides of the utility model embodiment;
Fig. 3 is the circuit structure diagram of the temperature-control circuit that provides of the utility model embodiment;
Fig. 4 is the structural drawing of the high temperature ageing tester that provides of the utility model second embodiment.
Embodiment
For the purpose, technical scheme and the advantage that make the utility model is clearer,, the utility model is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
Fig. 1 shows the structure of the high temperature ageing tester that the utility model first embodiment provides, and for the ease of explanation, only shows the part relevant with the utility model embodiment, and details are as follows.
High temperature ageing tester 1 comprises metal box 101, and electrical interface 102 in the test of promising test product power supply is set in the metal box 101; High temperature ageing tester 1 also comprises the test module 103 of collection analysis test product operational factor, in the utility model embodiment, and test module 103 external metal boxes 101, high temperature ageing tester 1 also comprises the temperature-control circuit (not shown).
Fig. 2 shows the modular structure of the temperature-control circuit that the utility model embodiment provides, and for the ease of explanation, only shows the part relevant with the utility model embodiment, and details are as follows.
Temperature-control circuit comprises:
The well heater 201 of power supply termination power module;
The temperature setting module 202 of target setting temperature;
Detect the temperature sensor 203 of metal box environment temperature;
Temperature comparison module 204, its first input end and second input end be jointing temp setting module 202 and temperature sensor 203 respectively, metal box environment temperature and target temperature is compared the output compare result signal;
Temperature control modules 205, the comparative result output terminal of its input end jointing temp comparison module 204, the control end of heating control termination well heater 201 is used for according to compare result signal, and control heater 201 makes that metal box environment temperature and target temperature are synchronous.
As the utility model one embodiment, temperature-control circuit also comprises the alarm module 206 that is connected with the controlling alarm end of temperature control modules 205.
Fig. 3 shows the circuit structure of the temperature-control circuit that the utility model embodiment provides, and for the ease of explanation, only shows the part relevant with the utility model embodiment, and details are as follows.
As the utility model one embodiment; Temperature setting module 202 comprises a variable resistor R25; The first termination reference voltage VREF of variable resistor R25, the second end ground connection of variable resistor R25, the first input end of the adjustable side jointing temp comparison module 204 of variable resistor R25.
As the utility model one embodiment, temperature comparison module 204 comprises:
Operational amplifier U1, operational amplifier U2, resistance R 24, resistance R 26, resistance R 27, resistance R 28, resistance R 30, resistance R 31 and capacitor C 6;
First end of resistance R 26 and resistance R 27 is respectively second input end of temperature comparison module 204; Second end of resistance R 26 and resistance R 27 connects in-phase input end and the inverting input of operational amplifier U2 respectively; The in-phase input end of operational amplifier U2 is through resistance R 30 ground connection; Resistance R 28 is connected between the inverting input and output terminal of operational amplifier U2; The output terminal of operational amplifier U2 is through capacitor C 6 ground connection, and the inverting input of operational amplifier U1 connects the output terminal of operational amplifier U2 through resistance R 31, and the in-phase input end of operational amplifier U1 is the first input end of temperature comparison module 204; First end of the output terminal connecting resistance R24 of operational amplifier U1, second end of resistance R 24 is the comparative result output terminal of temperature comparison module 204.
As the utility model one embodiment, temperature control modules 205 comprises:
Resistance R 19, resistance R 21, resistance R 22, resistance R 23, metal-oxide-semiconductor M1, capacitor C 1, capacitor C 2, diode D2 and control chip U3;
The control end 5 of control chip U3 is the input end of temperature control modules 205; Capacitor C 1 and diode D2 are connected in parallel between the control end 5 and ground of control chip U3, and the replacement keyed end 6 of control chip U3 connects power supply, the discharge end 7 connecting resistance R19 of control chip U3 and the public connecting end of resistance R 21 through the resistance R 19 of serial connection with resistance R 21; The power end 8 of control chip U3 connects power supply; The replacement end 4 of control chip U3 connects power supply through resistance R 22, and the output terminal 3 of control chip U3 connects the grid of metal-oxide-semiconductor M1 through resistance R 23, and the trigger point end 2 of control chip U3 connects replacement keyed end 6; Earth terminal 1 ground connection of control chip U3; Capacitor C 2 is connected between the earth terminal 1 and trigger point end 2 of control chip U3, the source ground of metal-oxide-semiconductor M1, and the drain electrode of metal-oxide-semiconductor M1 is the heating control end of temperature control modules 205.
As the utility model one embodiment, it is the NE555 chip that control chip U3 adopts model.
Among Fig. 1; The inwall of metal box 101 is provided with the silica gel foaming plate 104 that one deck is done heat insulation usefulness; On the silica gel foaming plate 104 one deck heat insulation foam 105 is set also; But at least one pull sheet metal 106 is set in the metal box 101, but electrical interface 102 in the test is installed on the pull sheet metal 106 at least, well heater 201 is installed on the heat insulation foam 105.
As the utility model one embodiment, electrical interface 102 adopts the USB adapter in the test.
As the utility model one embodiment, a plurality of well heaters 201 and temperature sensor 203 are installed on the diverse location in the metal box 101.
Fig. 4 shows the structure of the high temperature ageing tester that the utility model second embodiment provides, and for the ease of explanation, only shows the part relevant with the utility model embodiment, and details are as follows.
As the utility model one preferred embodiment; The inwall of metal box 101 is provided with the silica gel foaming plate 104 that one deck is done heat insulation usefulness, and a dividing plate 107 also is set in the metal box 101, and dividing plate 107 is divided into space and following space with metal box 101; Conduct heating space between the sky; Test module 103 is placed in following space, on the silica gel foaming plate 104 in last space one deck heat insulation foam 105 is set also, but at least one pull sheet metal 106 is set in the last space; But electrical interface 102 in the test is installed on the pull sheet metal 106 at least, and well heater 201 is installed on the heat insulation foam 105.
The test module 103 of electrical interface 102 and collection analysis test product operational factor in the test of promising test product power supply is set in the high temperature ageing tester, and such design makes the tester can understand the ruuning situation of test product when doing the high temperature ageing test at any time.
Temperature comparison module 204 compares metal box environment temperature and the target temperature that temperature sensor 203 detects, the output compare result signal, and temperature control modules 205 judges according to compare result signal whether the metal box environment temperature is consistent with target temperature; If it is inconsistent; Alarm module 206 is reported to the police, and prompting the tester note, and if the metal box environment temperature be higher than target temperature; Then temperature control modules 205 output low level drive signals are closed metal-oxide-semiconductor M1, and well heater 201 stops heating; If the metal box environment temperature is lower than target temperature, then temperature control modules 205 output high level drive signals are opened metal-oxide-semiconductor M1, well heater 201 normal heating.
In the utility model embodiment; The temperature control modules of high temperature ageing tester is through judging whether the metal box environment temperature is consistent with target temperature; Thereby the heating state of control heater makes that metal box environment temperature and target temperature are synchronous, has reduced temperature drift and error; And the design temperature scope is wide, and is adjustable continuously; In addition, go up electrical interface,, make the tester understand the ruuning situation of test product under high temperature test better so the operational factor of test product under high temperature test can gathered and analyze to the high temperature ageing tester because the high temperature ageing tester is provided with test.
The above is merely the preferred embodiment of the utility model; Not in order to restriction the utility model; Any modification of being done within all spirit and principles at the utility model, be equal to replacement and improvement etc., all should be included within the protection domain of the utility model.

Claims (10)

1. a high temperature ageing tester comprises metal box, it is characterized in that, electrical interface in the test of promising test product power supply is set in the said metal box; Said high temperature ageing tester also comprises the test module of collection analysis test product operational factor, and said high temperature ageing tester also comprises temperature-control circuit, and said temperature-control circuit comprises:
The well heater of power supply termination power module;
The temperature setting module of target setting temperature;
Detect the temperature sensor of metal box environment temperature;
The first input end and second input end be jointing temp setting module and temperature sensor respectively, said metal box environment temperature and target temperature is compared the temperature comparison module of output compare result signal; And
The comparative result output terminal of input termination said temperature comparison module, the control end of heating control termination well heater is used for controlling said well heater according to said compare result signal, makes the temperature control modules that metal box environment temperature and target temperature are synchronous.
2. high temperature ageing tester as claimed in claim 1 is characterized in that, said temperature-control circuit also comprises the alarm module that is connected with the controlling alarm end of said temperature control modules.
3. high temperature ageing tester as claimed in claim 1; It is characterized in that; Said temperature setting module comprises a variable resistor R25; The first termination reference voltage of said variable resistor R25, the second end ground connection of said variable resistor R25, the first input end of the adjustable side jointing temp comparison module of said variable resistor R25.
4. high temperature ageing tester as claimed in claim 1 is characterized in that, said temperature comparison module comprises:
Operational amplifier U1, operational amplifier U2, resistance R 24, resistance R 26, resistance R 27, resistance R 28, resistance R 30, resistance R 31 and capacitor C 6;
First end of said resistance R 26 and resistance R 27 is respectively second input end of temperature comparison module; Second end of said resistance R 26 and resistance R 27 connects in-phase input end and the inverting input of operational amplifier U2 respectively; The in-phase input end of said operational amplifier U2 is through resistance R 30 ground connection; Said resistance R 28 is connected between the inverting input and output terminal of operational amplifier U2; The output terminal of said operational amplifier U2 is through capacitor C 6 ground connection, and the inverting input of said operational amplifier U1 connects the output terminal of operational amplifier U2 through resistance R 31, and the in-phase input end of said operational amplifier U1 is the first input end of temperature comparison module; First end of the output terminal connecting resistance R24 of said operational amplifier U1, second end of said resistance R 24 is the comparative result output terminal of temperature comparison module.
5. high temperature ageing tester as claimed in claim 1 is characterized in that, said temperature control modules comprises:
Resistance R 19, resistance R 21, resistance R 22, resistance R 23, metal-oxide-semiconductor M1, capacitor C 1, capacitor C 2, diode D2 and control chip U3;
The control end of said control chip U3 is the input end of said temperature control modules; Said capacitor C 1 and diode D2 are connected in parallel between the control end and ground of control chip U3; The replacement keyed end of said control chip U3 connects power supply through the resistance R 19 of serial connection with resistance R 21; The discharge end connecting resistance R19 of said control chip U3 and the public connecting end of resistance R 21, the power supply termination power of said control chip U3, the replacement end of said control chip U3 connects power supply through resistance R 22; The output terminal of said control chip U3 connects the grid of metal-oxide-semiconductor M1 through resistance R 23; The trigger point termination replacement keyed end of said control chip U3, the earth terminal ground connection of said control chip U3, said capacitor C 2 is connected between the earth terminal and trigger point end of control chip U3; The source ground of said metal-oxide-semiconductor M1, the drain electrode of said metal-oxide-semiconductor M1 are the heating control end of temperature control modules.
6. high temperature ageing tester as claimed in claim 1; It is characterized in that the inwall of said metal box is provided with the silica gel foaming plate that one deck is done heat insulation usefulness, on the said silica gel foaming plate one deck heat insulation foam is set also; But at least one pull sheet metal is set in the said metal box; But electrical interface in the test is installed on the said pull sheet metal at least, and said well heater is installed on the heat insulation foam, the external said metal box of said test module.
7. high temperature ageing tester as claimed in claim 1 is characterized in that, the inwall of said metal box is provided with the silica gel foaming plate that one deck is done heat insulation usefulness; One dividing plate also is set in the said metal box; Said dividing plate is divided into space and following space with metal box, and as the heating space, said test module is placed in said space down between the said sky; On the silica gel foaming plate in said upward space one deck heat insulation foam is set also; But said going up in the space is provided with at least one pull sheet metal, but on the said pull sheet metal electrical interface in the test is installed at least, and said well heater is installed on the heat insulation foam.
8. like claim 1,6 or 7 described high temperature ageing testers, it is characterized in that electrical interface adopts the USB adapter in the said test.
9. high temperature ageing tester as claimed in claim 1 is characterized in that, on the diverse location a plurality of well heaters and temperature sensor is installed in the said metal box.
10. high temperature ageing tester as claimed in claim 5 is characterized in that, it is the NE555 chip that said control chip U3 adopts model.
CN2011203233912U 2011-08-31 2011-08-31 High-temperature aging tester Expired - Fee Related CN202217020U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011203233912U CN202217020U (en) 2011-08-31 2011-08-31 High-temperature aging tester

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011203233912U CN202217020U (en) 2011-08-31 2011-08-31 High-temperature aging tester

Publications (1)

Publication Number Publication Date
CN202217020U true CN202217020U (en) 2012-05-09

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Application Number Title Priority Date Filing Date
CN2011203233912U Expired - Fee Related CN202217020U (en) 2011-08-31 2011-08-31 High-temperature aging tester

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102360047A (en) * 2011-08-31 2012-02-22 深圳市江波龙电子有限公司 High-temperature aging test instrument and constant-temperature control method thereof
CN103823171A (en) * 2014-02-16 2014-05-28 成都市中州半导体科技有限公司 Integrated circuit high-temperature aging test system and high-temperature aging test method
CN112230691A (en) * 2020-08-24 2021-01-15 上海季丰电子股份有限公司 Environmental test system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102360047A (en) * 2011-08-31 2012-02-22 深圳市江波龙电子有限公司 High-temperature aging test instrument and constant-temperature control method thereof
CN102360047B (en) * 2011-08-31 2014-07-30 深圳市江波龙电子有限公司 High-temperature aging test instrument and constant-temperature control method thereof
CN103823171A (en) * 2014-02-16 2014-05-28 成都市中州半导体科技有限公司 Integrated circuit high-temperature aging test system and high-temperature aging test method
CN112230691A (en) * 2020-08-24 2021-01-15 上海季丰电子股份有限公司 Environmental test system

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Granted publication date: 20120509

Termination date: 20150831

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