CN202111091U

CN202111091U - Led integrated package structure

Info

Publication number: CN202111091U
Application number: CN2011202118565U
Authority: CN
Inventors: 陈华
Original assignee: ZHEJIANG INTELED OPTOELETRONIC TECHNOLOGY Co Ltd
Current assignee: ZHEJIANG INTELED OPTOELETRONIC TECHNOLOGY Co Ltd
Priority date: 2011-06-22
Filing date: 2011-06-22
Publication date: 2012-01-11
Anticipated expiration: 2021-06-22

Abstract

The utility model relates to an LED (Light Emitting Diode) integrated package structure, which mainly aims to solve the technical problems of poor heat dissipation effect and light emission effect and bad air tightness of the integrated LED package structure in the prior art. The LED integrated package structure comprises a substrate and a line layer arranged on the substrate, wherein a plurality of tapered grooves are formed on the substrate; a plurality of light emitting chips are arranged on the bottom surfaces of the tapered grooves; the light emitting chips are connected to the line layer through wire bonding; the tapered grooves are evenly arranged on the substrate to form a luminous zone; a strip-like groove is formed on the substrate which is arranged at the periphery of the luminous zone; a circle of fence glue is arranged to surround the edge of the luminous zone; and the lower end of the fence glue is embedded in the strip-like groove. The LED integrated package structure has the following advantages: the light emitting chips are arranged on the bottoms of the tapered grooves and in direct contact with the substrate, so that the heat dissipation effect is good; the heat of the light emitting chips are dissipated through the substrate; current flows through the line layer on the surface of the substrate, thereby forming a thermal-electrical separation structure and improving the LED service life and the stability thereof; and the fence glue is embedded in the substrate, thus ensuring the air tightness and physical strength of the package.

Description

The LED integrated encapsulation structure

Technical field

The utility model relates to a kind of lighting technical field, especially relates to the LED integrated encapsulation structure of a kind of heat radiation, bright dipping, good sealing effect.

Background technology

Existing LED COB (Chip on Board) generally is the line layer that is arranged in luminescence chip substrate surface; Peripheral regional with the embedding that forms glue through pressing one circle plastic packaging material; Perhaps make lead frame in order to fill out enclosure wall glue at substrate surface; Perhaps pressing one deck glue material on substrate is made taper hole in the glue material, arranges led chip and sealing in the taper hole.But these encapsulation schemes also have many shortcomings, are not directly to contact with substrate like luminescence chip, but through the extremely low line layer of one deck conductive coefficient, integral heat sink poor; Luminescence chip all is positioned at substrate surface, does not have the reflector, and it is bad to go out light effect; The capsulation material of pressing, lead frame and substrate adherence are bad, phenomenons such as glue can occur leaking, and moisture in the environment and pernicious gas also infiltrate in the packaging body easily; Greatly reduce the useful life of LED, in addition, make lead frame in order to fill out enclosure wall glue; Enclosure wall glue be the associativity of contact substrate wiring layer surface and substrate be not fine, have the air-tightness problem equally.Like application number is 201010253905.1; Name is called China's invention application of chip integrated always high-power LED encapsulation technology and products thereof; It comprises wiring board, led chip, fluorescent coating and silica gel type body, and said silica gel type body surrounds end to end close-shaped in the circuit board, and the led chip setting in the circuit board; Fluorescent coating is coated on the led chip surface through binder, and led chip and fluorescent coating all are limited in close-shaped that the silica gel type body surrounds.This LED encapsulating products just has above-mentioned shortcoming, the luminescence chip setting in the circuit board, radiating effect is poor; And luminescence chip is arranged on the PCB surface, does not have reflector layer, and it is bad that luminescence chip goes out light effect; Adherence is bad between silica gel type body and the wiring board, occurs leaking the glue phenomenon easily.

Summary of the invention

The utility model mainly be solve the radiating effect that the integrated LED encapsulating structure exists in the prior art poor, go out light effect and the bad technical problem of air-tightness, the LED integrated encapsulation structure of a kind of heat radiation, bright dipping, good sealing effect is provided.

The above-mentioned technical problem of the utility model mainly is able to solve through following technical proposals: a kind of LED integrated encapsulation structure; Comprise substrate and the line layer on the substrate is set; On substrate, have a plurality of cone tanks, the cone tank bottom surface is provided with some luminescence chips, and the logical routing of luminescence chip links to each other with line layer; Said cone tank evenly is arranged in and forms a luminous zone on the substrate; The bar-shaped trough that on the peripheral substrate in luminous zone, has encloses on the edge, luminous zone and is equipped with a corral wall glue, and the lower end of said enclosure wall glue is embedded in the bar-shaped trough.Luminescence chip is arranged on the cone tank bottom surface in the utility model, has guaranteed that luminescence chip directly contacts with substrate, has improved packaging density again; Heat sheds through the high substrate of conductive coefficient; Radiating effect is better, and the logical routing of luminescence chip links to each other with line layer, and then electric current is through the line layer of substrate surface; So just constitute a kind of thermoelectric isolating construction, improved LED designed life and long-time stability.Luminescence chip sinks in the cone tank of substrate in the utility model, and this bellmouth has improved the light effect that of luminescence chip.Enclose on the edge, luminous zone and be equipped with a corral wall glue, the lower end of enclosure wall glue is embedded in the bar-shaped trough, has prevented leakage glue phenomenon, and the moisture in the environment and pernicious gas infiltrate in the packaging body, has guaranteed the air-tightness and the physical strength of encapsulation.

As a kind of preferred version, said cone tank is bowl-shape, and the aperture area of cone tank is greater than the area of bottom surface.This bowl-shape cone tank forms a reflection shield structure, makes the bright dipping better effects if of luminescence chip.

As a kind of preferred version, in said cone tank, be filled with fluorescent glue, in the zone that said enclosure wall glue is enclosed, be filled with transparent adhesive tape.Be filled with fluorescent glue in the cone tank, in order to the compound generation white light of luminescence chip, in the zone that enclosure wall glue is enclosed, be filled with transparent adhesive tape, realize sealing and protection to the chip gold thread.

As a kind of preferred version, said bar-shaped trough is divided into two sections, is symmetricly set on the both sides of luminous zone respectively.

As a kind of preferred version, said substrate is an aluminium base.Make substrate have good thermal conductivity, substrate also is not limited only to aluminium base in the utility model, also can be other material substrates such as copper base.

Therefore, the utility model has the advantages that: 1. luminescence chip is arranged on the cone tank bottom and directly contacts good heat dissipation effect with substrate; 2. luminescence chip dispels the heat through substrate, and electric current has constituted a kind of thermoelectric isolating construction through the line layer of substrate surface, has improved LED life-span and stability; 3. enclosure wall glue is embedded in the substrate, has guaranteed the air-tightness and the physical strength of encapsulation.

Description of drawings

Accompanying drawing 1 is a kind of structural representation of the utility model;

Accompanying drawing 2 is a kind of structural representations after the utility model removes enclosure wall glue;

Accompanying drawing 3 is structural representations always of cone tank in the utility model;

Accompanying drawing 4 is that A-A in the accompanying drawing 1 is to cross-sectional view.

1-substrate 2-line layer 3-cone tank 4-enclosure wall glue 5-luminous zone 6-bar-shaped trough 7-luminescence chip 8-fluorescent glue 9-transparent adhesive tape.

Embodiment

Pass through embodiment below, and combine accompanying drawing, do further bright specifically the technical scheme of the utility model.

Embodiment:

A kind of LED integrated encapsulation structure of present embodiment like Fig. 1, Fig. 2 and shown in Figure 4, comprises substrate 1; This substrate is an aluminium base, on the surface of substrate, is compounded with one deck line layer 2, on substrate, has 25 cone tanks 3; As shown in Figure 3; This cone tank is bowl-shape, and the area of cone tank opening is long-pending greater than the bottom face amount, on the bottom of cone tank, is connected with four small-power luminescence chips 7; To be example based on the blue-light-emitting chip, luminescence chip realizes that with the line layer on the substrate circuit is connected through routing in the present embodiment.Point scribbles fluorescent glue 8 in each cone tank, and this fluorescent glue is a yellow fluorescent glue, is mixed the compound generation white light of yellow fluorescent glue and blue chip by fluorescent material and silica gel.Cone tank is evenly arranged on substrate surface, forms a square luminous zone 5, on the substrate of the both sides of luminous zone, has bar-shaped trough 6; On the edge of luminous zone, enclose and be equipped with a corral wall glue 4; As shown in Figure 4, the bottom of enclosure wall glue is embedded in the bar-shaped trough 6, and this enclosure wall glue surrounds the square region of a sealing; In this zone, be filled with transparent adhesive tape 9, this transparent adhesive tape is a silica gel.

Specific embodiment described herein only is that the utility model spirit is illustrated.The utility model person of ordinary skill in the field can make various modifications or replenishes or adopt similar mode to substitute described specific embodiment, but can't depart from the spirit of the utility model or surmount the defined scope of appended claims.

Although this paper has used terms such as cone tank, substrate, line layer, bar-shaped trough, enclosure wall glue morely, do not get rid of the possibility of using other term.Using these terms only is in order to describe and explain the essence of the utility model more easily; It all is contrary with the utility model spirit being construed to any additional restriction to them.

Claims

1. LED integrated encapsulation structure; Comprise substrate and the line layer on the substrate is set; It is characterized in that: on substrate (1), have a plurality of cone tanks (3), the cone tank bottom surface is provided with some luminescence chips (7), and the logical routing of luminescence chip links to each other with line layer; Said cone tank evenly is arranged in and forms a luminous zone (5) on the substrate; The bar-shaped trough (6) that on the peripheral substrate in luminous zone, has encloses on the edge, luminous zone and is equipped with a corral wall glue (4), and the lower end of said enclosure wall glue is embedded in the bar-shaped trough.

2. LED integrated encapsulation structure according to claim 1 is characterized in that said cone tank (3) is bowl-shape, and the aperture area of cone tank is greater than the area of bottom surface.

3. LED integrated encapsulation structure according to claim 1 is characterized in that in said cone tank (3), being filled with fluorescent glue (8), in the zone that said enclosure wall glue (4) is enclosed, is filled with transparent adhesive tape (9).

4. according to claim 1 or 2 or 3 described LED integrated encapsulation structures, it is characterized in that said bar-shaped trough (6) is divided into two sections, is symmetricly set on the both sides of luminous zone (5) respectively.

5. according to claim 1 or 2 or 3 described LED integrated encapsulation structures, it is characterized in that said substrate (1) is an aluminium base.