CN202048638U - Air conditioning device for vehicle-mounted semiconductor - Google Patents
Air conditioning device for vehicle-mounted semiconductor Download PDFInfo
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- CN202048638U CN202048638U CN2011201545657U CN201120154565U CN202048638U CN 202048638 U CN202048638 U CN 202048638U CN 2011201545657 U CN2011201545657 U CN 2011201545657U CN 201120154565 U CN201120154565 U CN 201120154565U CN 202048638 U CN202048638 U CN 202048638U
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- semiconductor
- air conditioner
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Abstract
The utility model discloses an air conditioning device for a vehicle-mounted semiconductor. A conventional air conditioning device for a vehicle-mounted semiconductor consumes 10% - 15% of the power of an automobile engine and the refrigerating capacity of the device is influenced by the running speed of the automobile, thus is unable to meet the requirement of comfort property. The air conditioning device of the utility model comprises a semiconductor refrigeration sheet (10), an air channel (1) and a fan (5). A group of water cooling plates (9) are mutually and fixedly connected with each other so as to form an outer housing. The hot end of the semiconductor refrigeration sheet is fixed to the inner sides of the water cooling plates and the cold end of the semiconductor refrigeration sheet (10) is fixed to the sidewall of the air channel. A loop is formed by the water cooling plates connected with a water source via pipelines and a water pump. The air inlet (3) of the air channel is connected with the fan (5) via a pipeline and the air outlet (4) of the air channel is connected with the supply pipe of the air conditioning device. The semiconductor refrigeration sheet is connected with a circuit system. The air conditioning device of the utility model is used for an air-conditioning system.
Description
Technical field
The utility model relates to a kind of water-cooled thermoelectric cooling system that is used for air conditioning for automobiles.
Background technology
Application popularization along with air conditioning for automobiles, people more and more pay close attention to the influence of air conditioning for automobiles to automobile itself and environment, traditional compression-type refrigeration air-conditioning needs to consume the power of automobile sustainer 10%-15% in running, cause it directly to influence the acceleration and the climbing capacity of automobile; And its refrigerating capacity also is subjected to the influence of automobile driving speed, quits work as automobile engine, and air-conditioning system is also simultaneously out of service in the car, thereby causes air conditioning for automobiles can't satisfy passenger's comfortableness requirement.The air conditioning for automobiles of design no refrigeration working medium, noiselessness, nothing leakage, pollution-free, safety and environmental protection for this reason.
In prior art, the radiating mode of semiconductor air conditioning for automobiles is substantially based on air-cooled and heat pipe heat radiation.Though the wind-cooling heat dissipating mode is simple and convenient, its efficient is very low; Heat pipe heat radiation need not the additional energy source, but efficient is still lower.The cold of semiconductor chilling plate is to be directly passed to air by the air channel wall, and heat exchange efficiency is lower, can't really satisfy the heat radiation requirement in hot junction, to such an extent as to influence the cold junction refrigeratory capacity.And existing semiconductor chilling plate generally only is arranged in the both sides up and down in air channel, and it is even inadequately to cause conducting heat during like this with the heat exchange of inner cold wind air channel, can't guarantee the temperature of air-out.Cause the non-uniform temperature of air-out like this, reduced air conditioner comfort.
Summary of the invention
The purpose of this invention is to provide a kind of thermal efficiency height, the vehicle-mounted semiconductor air conditioner device of safe ready.
Above-mentioned purpose is achieved through the following technical solutions:
Vehicle-mounted semiconductor air conditioner device, its composition comprises: semiconductor chilling plate, the air channel, blower fan, the formation overcoat is mutually permanently connected between one group of cooled plate, the hot junction of the inboard fixing described semiconductor chilling plate of described cooled plate, the cold junction of described semiconductor chilling plate is fixed on the sidewall in described air channel, described cooled plate connects the water source and forms the loop with water pump by pipeline, the air inlet in described air channel links to each other with described blower fan by pipeline, the air outlet in described air channel links to each other with vehicle-mounted semiconductor air conditioner device ajutage by pipeline, and described semiconductor chilling plate links to each other with Circuits System.
Described vehicle-mounted semiconductor air conditioner device, described Circuits System comprises: control module after water pump circuit, blower fan circuit, the parallel connection of semiconductor chilling plate circuit and described control module series connection, forms the loop with Vehicular accumulator cell again.
Described vehicle-mounted semiconductor air conditioner device, described water source is vehicle-mounted cooling water tank.
Described vehicle-mounted semiconductor air conditioner device is equipped with fin in the described air channel.
Beneficial effect:
1. the utility model has been broken through the type of cooling that used for automobile air conditioning wind for these years cools off the tradition in semiconductor chilling plate hot junction to freeze, what this product adopted is water-cooling, because specific heat of water is far longer than air, can take away the heat of original wind-cooling heat dissipating hundreds of times, the radiating efficiency ideal.
2. the water tank of the ingenious employing water-cooling system of this product cooling water source--adopt vehicle-mounted cooling water tank, gather materials on the spot, easy for installation, conserve space improves the utilization rate of cold.
3. what adopted in the air channel of this product is to be with the cold wind air channel of enhanced heat exchange fin to increase heat exchange area, thereby heat exchange efficiency is increased, can well practical requirement.
4. this product has changed existing semiconductor refrigerating air-conditioning only pastes semiconductor chilling plate in the both sides, air channel situation, be attached to the four sides, air channel through cooling piece, strengthened heat transfer area, the air in the air channel is caught a cold evenly, guaranteed that leaving air temp is stable, improved air conditioner comfort.
Description of drawings:
Fig. 1 is the structural representation of this product
Fig. 2 is the cutaway view of this product
Fig. 3 is the A-A profile of this product.
Fig. 4 is the cooled plate structural representation.
Fig. 5 is the ducting system structural representation.
Fig. 6 is electric system figure.
The specific embodiment:
Embodiment 1:
Vehicle-mounted semiconductor air conditioner device, its composition comprises: semiconductor chilling plate 10, one group of cooled plate 9, air channel 1, blower fan 5, water pump 7, the formation overcoat is mutually permanently connected between described one group of cooled plate 9, four cooled plate 9 and angle steel 8 are connected to form overcoat by modes such as screw threads, cooled plate 9 inboard fixing described semiconductor chilling plate 10 hot junctions, described semiconductor chilling plate 10 cold junctions are fixed on 1 sidewall of described air channel, described cooled plate 9 connects the water source by pipeline and described water pump 7 forms the loop, and described air channel 1 has air inlet 3 and air outlet 4, and described air inlet 3 links to each other with blower fan 5 by pipeline, described air outlet 4 links to each other with vehicle-mounted semiconductor air conditioner device ajutage by pipeline, and described semiconductor chilling plate 10 links to each other with Circuits System.
Embodiment 2:
Above-mentioned vehicle-mounted semiconductor air conditioner device, described Circuits System comprises: control module 11 and Vehicular accumulator cell 2 series connection, connect with described control module 11 again after the circuit parallel connection of the circuit of the circuit of water pump 7, blower fan 5 and semiconductor chilling plate 10, and then and described Vehicular accumulator cell 2 form loops.Control module has delay switch, controls blower fan water pump and semiconductor chilling plate respectively.When opening the control module button, semiconductor chilling plate energising, rear fan energising in 1 minute, water pump energising after 4 minutes.
Embodiment 4:
Above-mentioned vehicle-mounted semiconductor air conditioner device, described water source is vehicle-mounted cooling water tank.Serpentine coil is arranged in the cooled plate, walk cooling water in the described serpentine coil, the water inlet of described serpentine coil links to each other with vehicle-mounted cooling water tank by water pump with delivery port, forms the loop.After the water pump energising, the water in the cooled plate begin with water tank in water circulate, take away the heat that the semiconductor chilling plate hot junction produces, guarantee that cold junction temperature is up to standard.
Embodiment 5:
Above-mentioned vehicle-mounted semiconductor air conditioner device is equipped with fin 6 in the described air channel 1.Make like this wind that blower fan introduces in the air channel on current downflow, increased heat transfer area, not only reduced the air conditioner outlet temperature, also prolonged flow process simultaneously, make the air conditioner outlet temperature even.
Claims (5)
1. vehicle-mounted semiconductor air conditioner device, its composition comprises: semiconductor chilling plate, the air channel, blower fan, it is characterized in that: the formation overcoat is mutually permanently connected between one group of cooled plate, the hot junction of the inboard fixing described semiconductor chilling plate of described cooled plate, the cold junction of described semiconductor chilling plate is fixed on the sidewall in described air channel, described cooled plate connects the water source and forms the loop with water pump by pipeline, the air inlet in described air channel links to each other with described blower fan by pipeline, the air outlet in described air channel links to each other with vehicle-mounted semiconductor air conditioner device ajutage by pipeline, and described semiconductor chilling plate links to each other with Circuits System.
2. vehicle-mounted semiconductor air conditioner device according to claim 1, it is characterized in that: described Circuits System comprises: control module, after water pump circuit, blower fan circuit, the parallel connection of semiconductor chilling plate circuit and described control module series connection, form the loop with Vehicular accumulator cell again.
3. vehicle-mounted semiconductor air conditioner device according to claim 1 and 2 is characterized in that: described water source is vehicle-mounted cooling water tank.
4. vehicle-mounted semiconductor air conditioner device according to claim 1 and 2 is characterized in that: in the described air channel fin is housed.
5. vehicle-mounted semiconductor air conditioner device according to claim 3 is characterized in that: in the described air channel fin is housed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201545657U CN202048638U (en) | 2011-05-16 | 2011-05-16 | Air conditioning device for vehicle-mounted semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201545657U CN202048638U (en) | 2011-05-16 | 2011-05-16 | Air conditioning device for vehicle-mounted semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202048638U true CN202048638U (en) | 2011-11-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201545657U Expired - Fee Related CN202048638U (en) | 2011-05-16 | 2011-05-16 | Air conditioning device for vehicle-mounted semiconductor |
Country Status (1)
| Country | Link |
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| CN (1) | CN202048638U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102350933A (en) * | 2011-05-16 | 2012-02-15 | 哈尔滨商业大学 | Water-cooling thermoelectricity refrigeration automotive air conditioning |
| CN104697267A (en) * | 2015-03-26 | 2015-06-10 | 哈尔滨商业大学 | Water-cooled dual-refrigeration type semiconductor cold accumulation insulation box |
| CN105774469A (en) * | 2016-03-07 | 2016-07-20 | 无锡职业技术学院 | Air conditioner controller used for pure electric automobile and based on fuzzy control algorithm |
| CN108895580A (en) * | 2018-06-20 | 2018-11-27 | 安徽南国机电科技发展有限公司 | One kind being based on surface emissivity formula ice-melt cold-exchange |
| CN110779193A (en) * | 2019-11-25 | 2020-02-11 | 彭从文 | Improved central air conditioner air duct system |
| CN114655047A (en) * | 2022-03-16 | 2022-06-24 | 哈尔滨商业大学 | Electric automobile wireless charging vehicle-mounted equipment cooling device based on pulsating heat pipe |
-
2011
- 2011-05-16 CN CN2011201545657U patent/CN202048638U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102350933A (en) * | 2011-05-16 | 2012-02-15 | 哈尔滨商业大学 | Water-cooling thermoelectricity refrigeration automotive air conditioning |
| CN104697267A (en) * | 2015-03-26 | 2015-06-10 | 哈尔滨商业大学 | Water-cooled dual-refrigeration type semiconductor cold accumulation insulation box |
| CN105774469A (en) * | 2016-03-07 | 2016-07-20 | 无锡职业技术学院 | Air conditioner controller used for pure electric automobile and based on fuzzy control algorithm |
| CN108895580A (en) * | 2018-06-20 | 2018-11-27 | 安徽南国机电科技发展有限公司 | One kind being based on surface emissivity formula ice-melt cold-exchange |
| CN110779193A (en) * | 2019-11-25 | 2020-02-11 | 彭从文 | Improved central air conditioner air duct system |
| CN114655047A (en) * | 2022-03-16 | 2022-06-24 | 哈尔滨商业大学 | Electric automobile wireless charging vehicle-mounted equipment cooling device based on pulsating heat pipe |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111123 Termination date: 20120516 |