CN201829498U - Light emitting diode (LED) integrated light source panel - Google Patents
Light emitting diode (LED) integrated light source panel Download PDFInfo
- Publication number
- CN201829498U CN201829498U CN2010205029272U CN201020502927U CN201829498U CN 201829498 U CN201829498 U CN 201829498U CN 2010205029272 U CN2010205029272 U CN 2010205029272U CN 201020502927 U CN201020502927 U CN 201020502927U CN 201829498 U CN201829498 U CN 201829498U
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- Prior art keywords
- led
- light source
- described led
- integrated light
- source board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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Abstract
The utility model discloses a light emitting diode (LED) integrated light source panel with low cost, simple structure and process, high production efficiency and high accuracy of color temperature. The LED integrated light source panel comprises a heat-conducting insulated basal panel (1) and an LED light source unit (30), wherein the LED light source unit (30) comprises a plurality of LED modules (31), each LED module (31) is formed by integrating a plurality of LED chips (3) or is formed by a single LED chip (3) independently, the surface of the heat-conducting insulated basal panel (1) is laid with the connecting lines (21) of circuits, which comprise metal layers, and heat-radiation foil fins (22), the LED modules (31) and the connecting lines (21) of the circuits are electrically connected, the LED chips (3) and the heat-radiation foil fins (22) are connected and conduct heat, the periphery of each LED module (31) is respectively coated and encircled with a white colloid cofferdam (4) with the height of 0.3 to 1.5mm, and silica gel or resin (6) is filled into the colloid cofferdams (4) for covering the LED chips (3). The utility model can be widely applied to the field of LED integrated light sources.
Description
Technical field
The utility model relates to a kind of LED integrated light source board.
Background technology
LED is applied in various occasions as a kind of novel illumination light source just more and more widely with outstanding advantages such as its energy-saving and environmental protection, luminous efficiency height, life-span length.Adopt high-power LED light source to be applied in and can be used as large-scale light fixture use such as street lamp, wall lamp in the light fixture now.In high-power LED light source, generally led chip and lens are packaged into direct plug type light pearl or SMD encapsulation earlier, this is commonly referred to light source encapsulation for the first time, again packaged LED is welded on a light source board that forms on heat conductive insulating substrate such as aluminium base, the copper base, be called light source encapsulation for the second time, and the substrate that dispels the heat and connect as circuit by the heat conductive insulating substrate.Because it must be through the secondary light source encapsulation, its complex procedures, the cost height, production efficiency is low.
The technology that led chip is directly welded or is adhesive on heat conductive insulating substrate or the ordinary circuit board is called the technology of plane integrated optical source, and encapsulation can form light source board owing to use once, so its cost is low, production efficiency is high.But for the plane integrated LED light source, in process of production, the thickness of its fluorescent material is not easy control, therefore causes the colour temperature of light source to be not easy control, and the colour temperature accuracy is relatively poor.In addition, generally need use mould at present in the manufacture process of plane integrated LED light source, make technology complicated, cost is higher.
At present the Technology Need of plane integrated optical source is coated with last layer silica gel or resin as protective layer at led chip; still fail to form effective spherical lens on its surface; only can form planar lenses at most; its luminous efficiency is low; great majority go out light total reflection and enter and cover in its surperficial silica gel or resinite; or scatter towards periphery and can't be forward or upwards luminous, as shown in Figure 1.In addition, for spherical lens, if the focus O of spherical lens is under the luminous horizontal plane of led chip, as shown in Figure 2, its bright dipping mostly towards periphery the side distribute, and can't make progress or emission forward, therefore bright dipping is undesirable, is called astigmatic type lens, so its sphere focus of desirable spherical lens O should be positioned on the luminous horizontal plane of led chip, as shown in Figure 3, though its lighting angle is big, multidirectional preceding the ejaculation forms pantoscopic lens, if the focus O of spherical lens is positioned on the luminous horizontal plane of led chip, then most of bright dipping meetings are penetrated forward or upwards and are formed the light-focusing type lens, as shown in Figure 4.For the plane integrated LED light source, if adopt the multi-chip LED module or adopt the unit of many small-chip LED integrated packages as light source, generally adopt method as shown in Figure 5 at present, by lens all led chips in the unit are covered, promptly adopt einzel lens to join the pattern of multicore sheet, in order to cover all led chips, it is very big that signal-lens radius becomes, make that the volume of whole lens is bigger, material usage is bigger, because the material of lens adopts optics silica gel or resin, this material price costliness, make the cost height of lens, uneconomical; And the optical centre of feasible wherein each led chip of einzel lens is inconsistent, and the accuracy of lens luminous intensity distribution is subjected to certain influence.
The utility model content
Technical problem to be solved in the utility model is to overcome the deficiencies in the prior art, and the LED that a kind of cost is low, simple in structure, technology is simple, production efficiency is high, the colour temperature precision is high is provided integrated light source board.
The technical scheme that LED integrated light source board of the present utility model is adopted is: LED integrated light source board of the present utility model comprises the heat conductive insulating substrate, at least one led light source unit, described led light source unit comprises several LED modules, each described LED module constitutes or is made of separately single LEDs chip by the plurality of LEDs chip is integrated, the surface of described heat conductive insulating substrate is laid with the circuit connection that is made of metal level, the heat radiation paillon foil, described LED module and described circuit connection are electrically connected, described led chip is connected with described heat radiation paillon foil and conducts heat, around each described LED module all coating to be surrounded by highly be the white colloid cofferdam of 0.3～1.5mm, filling gel or resin cover described led chip in the described colloid cofferdam.
Fill fluorescent material in described silica gel or the resin.
The light direction of each described LED module all is covered with spherical lens, and described spherical lens adopts some glue mode to be formed by silica gel or resin solidification.
The focus of described spherical lens be positioned at described LED module light output surface same plane or be positioned on the light output surface of described LED module.
Described heat conductive insulating substrate is a metal substrate, and the upper surface of described metal substrate is provided with the heat conductive insulating layer.
Perhaps, described heat conductive insulating substrate is ceramic substrate or PCB circuit board.
Described colloid cofferdam is rounded or square.
Described colloid cofferdam is reflective light tight.
Described heat conductive insulating substrate is provided with some holes that install and fix.
Serial or parallel connection or connection in series-parallel are connected between the described led chip in each described LED module, and serial or parallel connection or connection in series-parallel are connected between each described LED module.
The beneficial effects of the utility model are: because LED integrated light source board of the present utility model comprises the heat conductive insulating substrate, at least one led light source unit, described led light source unit comprises several LED modules, each described LED module constitutes or is made of separately single LEDs chip by the plurality of LEDs chip is integrated, the surface of described heat conductive insulating substrate is laid with the circuit connection that is made of metal level, the heat radiation paillon foil, described LED module and described circuit connection are electrically connected, described led chip is connected with described heat radiation paillon foil and conducts heat, around each described LED module all coating to be surrounded by highly be the white colloid cofferdam of 0.3～1.5mm, filling gel or resin cover described led chip in the described colloid cofferdam, the utility model adopts better simply manufacturing process, synchronous plane packaged LED module on described heat conductive insulating substrate, only just can effectively control the thickness of silica gel or resin by the colloid cofferdam, if fill fluorescent material in silica gel or the resin, then can accurately control the colour temperature of light source, the formation in colloid cofferdam can form automatically by glue spreader commonly used, the production efficiency height, and do not need particular manufacturing craft, so LED integrated light source board cost of the present utility model is low, simple in structure, technology is simple, the production efficiency height, colour temperature precision height;
Because the light direction of each described LED module of the present utility model all is covered with spherical lens, described spherical lens adopts some glue mode to be formed by silica gel or resin solidification, can avoid planar lenses intrinsic total reflection phenomenon when lighting angle is big, therefore improved the luminous efficiency of light source, the utility model adopts the method that LED module and spherical lens thereof once encapsulate synchronously in addition, in the time of in being applied to light fixture, only needing modularization directly to install gets final product, overcome single LEDs chip independence paster packaging cost height in the prior art, the drawback that production efficiency is low, so LED integrated light source board cost of the present utility model is low, the production efficiency height can improve luminous efficiency;
Because the light direction of each described LED module of the present utility model all is covered with spherical lens, guaranteeing to cover under the situation of all led chips, the einzel lens of a long radius large volume of configuration in the led light source unit is become the form of lens of a plurality of minor radius, make the volume of whole lens reduce, material usage reduces, saved the consumption of expensive optics silica gel or resin, make the cost of lens reduce greatly, economy is obviously promoted, poly-lens makes that wherein the optical centre of each led chip is more accurate in addition, the accuracy of lens luminous intensity distribution is higher, so LED integrated light source board cost of the present utility model is low, can improve the luminous intensity distribution accuracy.
Description of drawings
Fig. 1 is the luminous schematic diagram that led chip is positioned at planar lens;
Fig. 2 is the luminous schematic diagram that led chip is positioned at the focus O top of sphere lens;
Fig. 3 is the luminous schematic diagram that led chip is positioned at the focus O place of sphere lens;
Fig. 4 is the luminous schematic diagram that led chip is positioned at the focus O below of sphere lens;
Fig. 5 is the structural representation that einzel lens is joined the pattern of multicore sheet;
Fig. 6 is the Facad structure schematic diagram of the LED integrated light source board of the utility model embodiment one;
Fig. 7 is a N-N section structure for amplifying schematic diagram shown in Figure 6;
Fig. 8 is the local structure for amplifying schematic diagram in I place shown in Figure 7;
Fig. 9 is the utility model embodiment two section structure for amplifying schematic diagram corresponding with Fig. 7 position;
Figure 10 is the local structure for amplifying schematic diagram in II place shown in Figure 9.
Embodiment
Embodiment one:
As Fig. 6～shown in Figure 8, the LED integrated light source board of present embodiment be a kind of multiple unit of synchronous production simultaneously and can directly be connected to the 220V electric main not with the planar LED integrated light source board of lens, comprise heat conductive insulating substrate 1, six mutually between independent separately uncorrelated led light source unit 30, described led light source unit 30 comprises 24 LED modules 31 of series connection mutually, mutually the led chips 3 of series connection are integrated constitutes by four for each described LED module 31, certain described LED module 31 also can be made of separately single LEDs chip 3, described heat conductive insulating substrate 1 is a metal aluminum substrate, can certainly adopt other metal substrates such as copper base, the upper surface of described metal substrate is provided with heat conductive insulating layer 10, the surface of described heat conductive insulating substrate 1 is laid with the circuit connection 21 that is made of metal level, heat radiation paillon foil 22, described LED module 31 is electrically connected with described circuit connection 21, between the described led chip 3 in each described LED module 31 and the circuit string between each described LED module 31, relation in parallel can be provided with according to the situation of practical power, certainly, the LED lighting circuit also may comprise other necessary electronic element and modules, do not repeat them here, described led chip 3 is connected with described heat radiation paillon foil 22 and conducts heat, described heat conductive insulating substrate 1 is provided with some holes 11 that install and fix of being convenient to the identification of synchronous production location, all be coated with the organic colloid cofferdam 4 that is surrounded by the White-opalescent that highly is 0.3～1.5mm around each described LED module 31, filling gel or resin 6 cover described led chip 3 in the described colloid cofferdam 4, fill fluorescent material in described silica gel or the resin 6, described colloid cofferdam 4 is rounded, can certainly be square or other shapes, described colloid cofferdam 4 is reflective light tight, help the light that send described led chip 3 sides is reflected away, improve luminous efficiency.
The manufacture method of the LED integrated light source board of present embodiment may further comprise the steps:
(a) will be fixed on by the plurality of LEDs chip 3 integrated LED modules 31 that constitute on the heat conductive insulating substrate 1 on the heat radiation paillon foil 22, by routing 5 described led chip 3 is electrically connected in series each other, both positive and negative polarity and the circuit connection 21 with described LED module 31 is electrically connected simultaneously;
(b) enclosing by automatic glue spreaders coating one around described LED module 31 highly is the ambient temperature curable of 0.3～1.5mm white, the organic silica gel colloid that semi-fluid drops down, form colloid cofferdam 4, and 100～180 ℃ of following baking-curings 30～90 minutes, can certainly adopt manual gluing, and can the coating resin colloid;
(c) in described colloid cofferdam 4, fill silica gel or the resin 6 contain fluorescent material, and under 100～180 ℃ to its baking-curing 30～90 minutes again.
Embodiment two:
As Fig. 9, shown in Figure 10, the LED integrated light source board of present embodiment and the distinguishing characteristics of embodiment one are: in the present embodiment, described heat conductive insulating substrate 1 is Al
2O
3Or ceramic substrate such as AlN, therefore the surface of described ceramic substrate does not need to be provided with the heat conductive insulating layer; The light direction of each described LED module 31 all is covered with spherical lens 41, described spherical lens 41 adopts some glue mode and solidify to form, the focus of described spherical lens 41 be positioned at described LED module 31 the same plane of light output surface, as shown in Figure 3, the light that this moment, led chip sent can both effectively penetrate, do not have total reflection phenomenon, the comparable embodiment one of its light emission rate improves 5～20% under the similarity condition, it is a kind of luminous intensity distribution design of pantoscopic lens, this moment, the luminous efficiency of light source was the highest, the focus of certain described spherical lens 41 also can be positioned on the light output surface of described LED module 31, as shown in Figure 4, the luminous energy that this moment, led chip sent is effectively dispersed out, and dwindled lighting angle, to reach the effect of optically focused, be a kind of luminous intensity distribution design of light-focusing type lens, described spherical lens 41 is formed by transparent silica gel or resin solidification.
In addition, the manufacture method of the LED integrated light source board of present embodiment is further comprising the steps of in step (c) back of embodiment one:
(d) be that the transparent silica gel of 25000～40000cps or resin colloid drop on the described colloid cofferdam 4 and silica gel or resin 6 zones after the curing by automatic glue spreaders with viscosity, can certainly adopt the manual glue that drips, rely on the surface tension of transparent silica gel or resin to form spherical bulge naturally, it is covered on the described LED module 31 form sphero-colloid;
(e) under 100～180 ℃, described sphero-colloid was toasted 60～300 minutes, make its curing, form described spherical lens 41.
All the other features of present embodiment are identical with embodiment one.
Present embodiment can be avoided planar lenses intrinsic total reflection phenomenon when lighting angle is big, therefore improved the luminous efficiency of light source, present embodiment adopts the method that LED module 31 and spherical lens 41 thereof once encapsulate synchronously in addition, in the time of in being applied to light fixture, only need modularization directly to install and get final product, overcome single LEDs chip independence paster packaging cost height in the prior art, drawback that production efficiency is low; Present embodiment is guaranteeing to cover under the situation of all led chips 3, the einzel lens of a long radius large volume of configuration in the led light source unit 30 is become the form of lens of a plurality of minor radius, make the volume of whole lens reduce, material usage reduces, saved the consumption of expensive optics silica gel or resin, made the cost of lens reduce greatly, economy is obviously promoted, poly-lens makes that wherein the optical centre of each led chip 3 is more accurate in addition, and the accuracy of lens luminous intensity distribution is higher; Therefore the cost of present embodiment is low, production efficiency is high, can improve luminous efficiency and luminous intensity distribution accuracy.
Described heat conductive insulating substrate 1 of the present utility model is not limited to described in the embodiment, also can adopt PCB circuit board or other heat conductive insulating substrate.
The utility model adopts better simply manufacturing process, synchronous plane packaged LED module 31 on described heat conductive insulating substrate 1, only just can effectively control the thickness of fluorescent material by colloid cofferdam 4, thereby accurately control the colour temperature of light source, the formation in colloid cofferdam 4 can form automatically by glue spreader commonly used, the production efficiency height, and do not need particular manufacturing craft, therefore LED integrated light source board cost of the present utility model is low, simple in structure, technology is simple, production efficiency is high, colour temperature precision height.
The utility model can be widely used in LED integrated optical source field.
Claims (10)
1. LED integrated light source board, it is characterized in that: comprise heat conductive insulating substrate (1), at least one led light source unit (30), described led light source unit (30) comprises several LED modules (31), each described LED module (31) constitutes separately by the integrated formation of plurality of LEDs chip (3) or by single LEDs chip (3), the surface of described heat conductive insulating substrate (1) is laid with the circuit connection (21) that is made of metal level, heat radiation paillon foil (22), described LED module (31) is electrically connected with described circuit connection (21), described led chip (3) is connected with described heat radiation paillon foil (22) and conducts heat, around each described LED module (31) all coating to be surrounded by highly be the white colloid cofferdam (4) of 0.3～1.5mm, interior filling gel in described colloid cofferdam (4) or resin (6) cover described led chip (3).
2. LED integrated light source board according to claim 1 is characterized in that: fill fluorescent material in described silica gel or the resin (6).
3. LED integrated light source board according to claim 1 is characterized in that: the light direction of each described LED module (31) all is covered with spherical lens (41), and described spherical lens (41) adopts some glue mode to be formed by silica gel or resin solidification.
4. LED integrated light source board according to claim 3 is characterized in that: the focus of described spherical lens (41) be positioned at described LED module (31) light output surface same plane or be positioned on the light output surface of described LED module (31).
5. according to any described LED integrated light source board of claim 1 to 4, it is characterized in that: described heat conductive insulating substrate (1) is a metal substrate, and the upper surface of described metal substrate is provided with heat conductive insulating layer (10).
6. according to any described LED integrated light source board of claim 1 to 4, it is characterized in that: described heat conductive insulating substrate (1) is ceramic substrate or PCB circuit board.
7. according to any described LED integrated light source board of claim 1 to 4, it is characterized in that: described colloid cofferdam (4) is rounded or square.
8. according to any described LED integrated light source board of claim 1 to 4, it is characterized in that: described colloid cofferdam (4) is reflective light tight.
9. according to any described LED integrated light source board of claim 1 to 4, it is characterized in that: described heat conductive insulating substrate (1) is provided with some holes (11) that install and fix.
10. according to any described LED integrated light source board of claim 1 to 4, it is characterized in that: serial or parallel connection or connection in series-parallel are connected between the described led chip (3) in each described LED module (31), and serial or parallel connection or connection in series-parallel are connected between each described LED module (31).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205029272U CN201829498U (en) | 2010-08-24 | 2010-08-24 | Light emitting diode (LED) integrated light source panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205029272U CN201829498U (en) | 2010-08-24 | 2010-08-24 | Light emitting diode (LED) integrated light source panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201829498U true CN201829498U (en) | 2011-05-11 |
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ID=43968016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205029272U Expired - Fee Related CN201829498U (en) | 2010-08-24 | 2010-08-24 | Light emitting diode (LED) integrated light source panel |
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| CN (1) | CN201829498U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101949521A (en) * | 2010-08-24 | 2011-01-19 | 广州南科集成电子有限公司 | LED integrated light source board and manufacturing method thereof |
| CN102255035A (en) * | 2011-08-16 | 2011-11-23 | 易美芯光（北京）科技有限公司 | Multi-LED chip packaging structure on substrate |
| CN112071972A (en) * | 2020-09-04 | 2020-12-11 | 谷麦光电科技股份有限公司 | LED integrated light source manufacturing process and LED integrated light source |
-
2010
- 2010-08-24 CN CN2010205029272U patent/CN201829498U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101949521A (en) * | 2010-08-24 | 2011-01-19 | 广州南科集成电子有限公司 | LED integrated light source board and manufacturing method thereof |
| CN101949521B (en) * | 2010-08-24 | 2012-11-21 | 广州南科集成电子有限公司 | LED integrated light source board and manufacturing method thereof |
| CN102255035A (en) * | 2011-08-16 | 2011-11-23 | 易美芯光（北京）科技有限公司 | Multi-LED chip packaging structure on substrate |
| CN102255035B (en) * | 2011-08-16 | 2014-04-16 | 易美芯光（北京）科技有限公司 | Multi-LED chip packaging structure on substrate |
| CN112071972A (en) * | 2020-09-04 | 2020-12-11 | 谷麦光电科技股份有限公司 | LED integrated light source manufacturing process and LED integrated light source |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110511 Termination date: 20110824 |