CN201478427U - Multilayer coplanar waveguide transmission line - Google Patents
Multilayer coplanar waveguide transmission line Download PDFInfo
- Publication number
- CN201478427U CN201478427U CN2009202335678U CN200920233567U CN201478427U CN 201478427 U CN201478427 U CN 201478427U CN 2009202335678 U CN2009202335678 U CN 2009202335678U CN 200920233567 U CN200920233567 U CN 200920233567U CN 201478427 U CN201478427 U CN 201478427U
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- transmission line
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Abstract
Disclosed is a multilayer coplanar waveguide transmission line. A metal signal wire and a grounding metal surface are arranged on a dielectric slab. The transmission line is characterized in that the metal signal wire is disposed on the dielectric slab, the grounding metal surface is disposed under the dielectric slab, a clearance is arranged on the grounding metal surface, the clearance is positioned under the metal signal wire, and simultaneously a bottom layer dielectric slab is disposed under the grounding metal surface. The width of the clearance of the grounding metal surface is larger than the width of the signal wire or smaller than the width of the signal wire or equal to the width of the signal wire. The transmission line simultaneously realizes impedance with ultra-low or ultra-high characteristics, has the advantages of both a micro-strip line and a coplanar waveguide; computer simulation indicates that the transmission line has comparatively low conductor loss under the circumstance of high resistance; and the transmission line is adaptable to multilayer structures such as a 3D-SOC and the like. The mainly applied field of the transmission line includes interconnection in multilayer medium structures, stepped impedance low pass filters, coupling band pass filters and the like.
Description
Technical field
The utility model relates to a kind of transmission line of electromagnetic signal, is specifically related to a kind of multilayer coplanar waveguide transmission line, can be applied in various microwaves, millimetre-wave circuit and the device.
Background technology
Common transmission line comprises that microstrip transmission line (or claims microstrip line, Microstrip), strip line (Stripline), coplanar waveguide transmission line (or claiming co-planar waveguide, Co-planar Waveguide) etc. in the microwave technology.Wherein, being most widely used of microstrip line, as shown in Figure 1.It is made of metallic signal lines above the dielectric-slab and following grounding metal plane, and its characteristic impedance is mainly determined by the ratio of holding wire width and dielectric-slab thickness.Though microstrip line is widely used, but still have two significant disadvantages: 1) be difficult to realize high characteristic impedance, this mainly is because the narrower in width of high impedance requirement holding wire, the holding wire that width is lower than 100 μ m is difficult to realize with traditional PCB technology, and under the situation of high resistant, microstrip line shows bigger conductor losses.2) be difficult to be grounded, ground connection is mainly adopted the mode of etching metallization via hole on the dielectric-slab, introduces bigger ghost effect under high frequency situations easily.Co-planar waveguide is widely used in the transmission line form of microwave, millimetre-wave circuit as another kind, can solve above two problems effectively.The holding wire of co-planar waveguide and ground plane are in the same plane of dielectric-slab, as shown in Figure 2.Its characteristic impedance depends primarily on the wide ratio with the holding wire width of seam between holding wire and ground plane.Under the certain situation of holding wire width, can realize high characteristic impedance effectively by the seam between increase holding wire and ground plane is wide.In addition, because holding wire and ground plane are in same plane, ground connection need not via hole, and ghost effect is less.But co-planar waveguide also has a significant defective, and that is difficult to realize low characteristic impedance exactly, and main cause is that the seam between Low ESR requirement holding wire and ground plane is wide narrow, and the slit that width is lower than 100 μ m is difficult to realize with traditional PCB technology.
Summary of the invention
The purpose of this utility model provides a kind of existing above-mentioned deficiency of waveguide transmission line that can solve prior art effectively, and the coplanar waveguide transmission line of new construction can be realized high characteristic impedance and low characteristic impedance effectively simultaneously; And keep relatively low conductor losses.
The scheme of finishing the foregoing invention task is: a kind of multilayer coplanar waveguide transmission line, on dielectric-slab, be provided with metallic signal lines and grounding metal plane, and it is characterized in that:
Described metallic signal lines be arranged on dielectric-slab above, described grounding metal plane is arranged on following (for to distinguish mutually with hereinafter " bottom dielectric-slab ", this dielectric-slab also can be described as " intermediate medium plate ") of this dielectric-slab;
Described grounding metal plane is provided with the slit, this slit be positioned at holding wire under (being the vertical projecting line of described grounding metal plane slit center line and the central lines of described metallic signal lines), its width can greater than, also can be less than the width of holding wire; Can also equal the width of described holding wire.The width in slit is wide more, and the characteristic impedance of transmission line is high more; Otherwise the characteristic impedance of transmission line is low more.
Simultaneously, below described grounding metal plane, also be provided with the bottom dielectric-slab.
The utility model proposes a kind of new coplanar waveguide transmission line structure based on sandwich construction, this structure can be regarded a kind of expansion of conventional co-planar waveguide transmission line as, be about to holding wire and grounding metal plane and place two-layerly respectively, wherein the slit on the grounding metal plane still keeps, as shown in Figure 3.The dielectric material of grounding metal plane above and below (promptly " intermediate medium plate " distinguished mutually with " bottom dielectric-slab ") can be identical, also can be different.Because ground plane can extend to the holding wire below, so this structure can be easy to realize low characteristic impedance.On the other hand, by enlarging the slit on the ground plane, can realize high characteristic impedance easily, and keep relatively low conductor losses.Therefore, this structure has the advantage of microstrip line and co-planar waveguide concurrently, can realize the characteristic impedance of wide range, is specially adapted to step impedance filter and some other impedance conversion device etc.In addition, this structure can also be at sandwich constructions such as 3D-SOC as the interconnected transmission line of signal.
In sum, this structural transmission line has the following advantages: 1) can realize ultralow simultaneously and characteristic impedance superelevation, have the advantage of microstrip line and co-planar waveguide concurrently; 2) Computer Simulation shows that this transmission line is less in the loss of high resistant situation lower conductor; 3) be applicable to sandwich constructions such as 3D-SOC.Its main application fields comprises: 1) interconnected in the multilayer dielectric structure; 2) step impedance low pass filter; 3) coupling line band pass filter etc.
Description of drawings
Fig. 1 is the microstrip line construction schematic diagram;
Fig. 2 is the coplanar waveguide structure schematic diagram;
Fig. 3 is the utility model structural representation.
Embodiment
Embodiment 1, and the multilayer coplanar waveguide transmission line is with reference to Fig. 3: be provided with metallic signal lines 2 on dielectric-slab 1; (be to distinguish mutually with hereinafter " bottom dielectric-slab ", this dielectric-slab also can be described as " intermediate medium plate ") is provided with grounding metal plane 3 below this dielectric-slab; Grounding metal plane 3 is provided with slit 4, this slit 4 that the position is set is corresponding with the position of described metallic signal lines 2; Simultaneously, below described grounding metal plane, also be provided with bottom dielectric-slab 5.The width in the slit of described grounding metal plane can greater than, also can be less than the width of holding wire; Can also equal the width of described holding wire.
Claims (3)
1. a multilayer coplanar waveguide transmission line is provided with metallic signal lines and grounding metal plane on dielectric-slab, it is characterized in that,
Described metallic signal lines be arranged on dielectric-slab above, described grounding metal plane be arranged on this dielectric-slab below;
Described grounding metal plane is provided with the slit, this slit be positioned at metallic signal lines under.
Simultaneously, below described grounding metal plane, also be provided with the bottom dielectric-slab.
2. multilayer coplanar waveguide transmission line according to claim 1 is characterized in that the width in the slit of described grounding metal plane is greater than the width of described holding wire; Or less than the width of described holding wire; Or equal the width of described holding wire.
3. multilayer coplanar waveguide transmission line according to claim 1 and 2 is characterized in that, the dielectric-slab below the dielectric-slab above the described grounding metal plane and this grounding metal plane adopts the dielectric-slab of same media, or adopts the dielectric-slab of different medium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202335678U CN201478427U (en) | 2009-08-04 | 2009-08-04 | Multilayer coplanar waveguide transmission line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202335678U CN201478427U (en) | 2009-08-04 | 2009-08-04 | Multilayer coplanar waveguide transmission line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201478427U true CN201478427U (en) | 2010-05-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202335678U Expired - Fee Related CN201478427U (en) | 2009-08-04 | 2009-08-04 | Multilayer coplanar waveguide transmission line |
Country Status (1)
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| CN (1) | CN201478427U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103296364A (en) * | 2013-05-30 | 2013-09-11 | 中国电子科技集团公司第四十一研究所 | Novel planar transmission line |
| CN105098296A (en) * | 2015-09-11 | 2015-11-25 | 中国科学技术大学 | Coplanar waveguide-based electromagnetic radiation structure |
| WO2017193340A1 (en) * | 2016-05-12 | 2017-11-16 | 华为技术有限公司 | Filtering unit and filter |
| CN112436257A (en) * | 2020-11-27 | 2021-03-02 | 北京秋点科技有限公司 | Dielectric substrate transmission line |
| WO2024061107A1 (en) * | 2022-09-20 | 2024-03-28 | 华为技术有限公司 | Transmission line, feed network and antenna apparatus |
-
2009
- 2009-08-04 CN CN2009202335678U patent/CN201478427U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103296364A (en) * | 2013-05-30 | 2013-09-11 | 中国电子科技集团公司第四十一研究所 | Novel planar transmission line |
| CN103296364B (en) * | 2013-05-30 | 2015-08-26 | 中国电子科技集团公司第四十一研究所 | A kind of Novel planar transmission line |
| CN105098296A (en) * | 2015-09-11 | 2015-11-25 | 中国科学技术大学 | Coplanar waveguide-based electromagnetic radiation structure |
| CN105098296B (en) * | 2015-09-11 | 2018-12-14 | 中国科学技术大学 | A kind of electromagnetic radiation structure based on co-planar waveguide |
| WO2017193340A1 (en) * | 2016-05-12 | 2017-11-16 | 华为技术有限公司 | Filtering unit and filter |
| US10673111B2 (en) | 2016-05-12 | 2020-06-02 | Huawei Technologies Co., Ltd. | Filtering unit and filter |
| CN112436257A (en) * | 2020-11-27 | 2021-03-02 | 北京秋点科技有限公司 | Dielectric substrate transmission line |
| WO2024061107A1 (en) * | 2022-09-20 | 2024-03-28 | 华为技术有限公司 | Transmission line, feed network and antenna apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100519 Termination date: 20110804 |