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CN201302455Y - Package structure of eddy current transducer - Google Patents

Package structure of eddy current transducer Download PDF

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Publication number
CN201302455Y
CN201302455Y CNU2008202039627U CN200820203962U CN201302455Y CN 201302455 Y CN201302455 Y CN 201302455Y CN U2008202039627 U CNU2008202039627 U CN U2008202039627U CN 200820203962 U CN200820203962 U CN 200820203962U CN 201302455 Y CN201302455 Y CN 201302455Y
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CN
China
Prior art keywords
frequency unit
high frequency
shell
wiring board
inductive coil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2008202039627U
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Chinese (zh)
Inventor
罗福恒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CNU2008202039627U priority Critical patent/CN201302455Y/en
Application granted granted Critical
Publication of CN201302455Y publication Critical patent/CN201302455Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a package structure of an eddy current transducer, which comprises a shell, a shielding component, an induction coil frame and a high-frequency unit circuit board, wherein the high-frequency unit circuit board is provided with an oscillator and a rectifying circuit and a winding is wound around the induction coil frame to form an induction coil. The package structure of an eddy current transducer is characterized in that the shielding component is laid on the outer surface of the shell, the induction coil frame and the high-frequency unit circuit board are fixed at a mounting end face of the shell via the shielding component, the plane of the high-frequency unit circuit board is parallel to the axis of the induction coil, the shell is insulated, clearances among the shielding component, the induction coil and the high-frequency circuit board are provided with binders. The induction coil of the package structure can be closely combined with the oscillator and the rectifying circuit, and transmission distances of signals can be shortened furthest, thereby increasing stability and consistency of the eddy current transducer.

Description

The encapsulating structure of current vortex sensor
Technical field
The utility model relates to a kind of encapsulating structure of current vortex sensor.
Background technology
Existing current vortex sensor generally is that inductive coil is packaged into inductive probe separately, and signal processing circuits such as oscillator, rectification circuit, temperature correction circuit, linear correction circuit are encapsulated in another wiring board.Adopt the current vortex sensor of this encapsulating structure, combine undertighten between the high frequency unit of these two sensitivities of oscillator and rectification circuit and the inductive coil, its line makes the transmission of signal be subjected to the influence of technology and material than length, thereby the stability of sensor and consistance are limited to.
The utility model content
The technical problems to be solved in the utility model is: a kind of encapsulating structure of current vortex sensor is provided, shield member, inductive coil and signal processing circuit integral type is encapsulated in the insulation crust, thus the stability and the consistance of raising sensor.
In order to solve the problems of the technologies described above, the utility model adopts following technical scheme: the encapsulating structure of current vortex sensor, comprise shell, shield member, inductive coil skeleton, be provided with the high frequency unit wiring board of oscillator and rectification circuit, wherein winding wire is wound on the inductive coil skeleton and forms inductive coil, it is characterized in that: described shield member is laid on the inside surface of shell; Inductive coil skeleton and high frequency unit wiring board are fixed on through shield member on the installation end face of shell, wherein the axis parallel of the plane of high frequency unit wiring board and inductive coil; Described shell for the insulation, and and shield member, inductive coil and high frequency unit wiring board between the gap in be provided with cementing agent.
Described inductive coil skeleton is provided with the fixedly groove of high frequency unit wiring board.The both sides of high frequency unit wiring board are plugged on the groove, make fixing more firm that the high frequency unit wiring board hangs down.Inductive coil and high frequency unit wiring board preferred vertical are arranged on the installation end face of shell, thereby reduce the influence to magnetic field.
The installation end face part of described shell is provided with inwardly protruded boss, fixed inductor skeleton or high frequency unit wiring board on the boss.Preferably boss is arranged on the middle part that end face is installed, fixing high frequency unit wiring board on the boss.Boss helps installing end face finalizes the design with combining more of cementing agent, not yielding.
The utility model is owing to adopted said structure, and inductive coil and oscillator, rectification circuit can closely combine, and the transmission range of signal has obtained shortening to greatest extent, has improved the stability and the consistance of sensor.And shell for the insulation, shield member can be layed on the inwall of shell, covers inductive coil and wiring board, thereby the external interference signal shielding is fallen.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Embodiment
Encapsulating structure as shown in Figure 1, comprise shell 1, shield member 4, inductive coil skeleton, be provided with the high frequency unit wiring board 21 of oscillator and rectification circuit, the main circuit board 22 that is electrically connected with high frequency unit wiring board 21, wherein winding wire is wound on and forms inductive coil 3 on the inductive coil skeleton, and shell 1 is cylindrical.Shield member 4 is laid on the inside surface of shell, just on the inwall.The inductive coil skeleton is provided with the fixedly groove 31 of high frequency unit wiring board 21.The both sides of high frequency unit wiring board 21 are plugged on the groove 31, the axis parallel of its plane and inductive coil 3, and be vertically fixed on the installation end face 11 of shell 1 through shield member 4 with inductive coil 3.Be provided with cementing agent in the gap between shell 1 and shield member 4, inductive coil 3 and the high frequency unit wiring board 21, and cementing agent preferred resin in the present embodiment.
In order to optimize the filling bond effect of resin, installation end face 11 parts of shell 1 are provided with inwardly protruded boss 12, fixed inductor skeleton or high frequency unit wiring board on the boss 12.Boss 12 preferably is arranged on the middle part that end face 11 is installed, and high frequency unit wiring board 21 is fixed on the boss, the inductive coil skeleton is arranged on the periphery of boss.So, the bond area of inductive coil and resin has enlarged, and cohesive force has obtained reinforcement; End face 11 is also bonded must more firmly can not to be out of shape thereby install; And the both sides of high frequency unit wiring board 21 are plugged in the groove 31, and the encapsulation fixed effect in shell 1 is also good.
Main circuit board 22 in the present embodiment can be used for being provided with other signal processing circuit of sensor, as zero point roll-off network, temperature roll-off network, linear correction circuit etc.Main circuit board 22 is provided with hole 23 and places the inductive coil skeleton and the top of high frequency unit wiring board 21, and its plane is parallel with the installation end face 11 of shell; Thereby inductive coil 3, high frequency unit wiring board 21, shield member 4 envelopes are located in the insulation crust 1, and the output cable of sensor can be drawn in hole 23, and cementing agent such as resin etc., also can advance enclosure from perfusion in the hole.
One end of the side 14 of shell is provided with breach 15, is used to install the encapsulation end face of shell.The encapsulation end face is encapsulated in the inside of shell with main circuit board 22, high frequency unit wiring board 21, inductive coil 3 and shield member 4, does not just illustrate in the drawings.The outer wall of end face 11 is installed, also is provided with the recess 13 that caves inward, can be used for pasting the labeling of relevant sensor, as trade mark etc.

Claims (8)

1. the encapsulating structure of current vortex sensor, comprise shell, shield member, inductive coil skeleton, be provided with the high frequency unit wiring board of oscillator and rectification circuit, wherein winding wire is wound on the inductive coil skeleton and forms inductive coil, it is characterized in that: described shield member is laid on the inside surface of shell; Inductive coil skeleton and high frequency unit wiring board are fixed on through shield member on the installation end face of shell, wherein the axis parallel of the plane of high frequency unit wiring board and inductive coil; Described shell for the insulation, and and shield member, inductive coil and high frequency unit wiring board between the gap in be provided with cementing agent.
2. the encapsulating structure of current vortex sensor according to claim 1, it is characterized in that: described inductive coil skeleton is provided with the fixedly groove of high frequency unit wiring board.
3. the encapsulating structure of current vortex sensor according to claim 1, it is characterized in that: described inductive coil skeleton and high frequency unit wiring board are vertically fixed on the installation end face of shell.
4. the encapsulating structure of current vortex sensor according to claim 1 and 2, it is characterized in that: the installation end face part of described shell is provided with inwardly protruded boss, fixed inductor skeleton or high frequency unit wiring board on the boss.
5. the encapsulating structure of current vortex sensor according to claim 4 is characterized in that: described boss is arranged on the middle part that end face is installed, fixing high frequency unit wiring board on the boss.
6. according to the encapsulating structure of claim 1 or 2 or 3 or 5 described current vortex sensors, it is characterized in that: further comprise the main circuit board that is electrically connected with high frequency unit; This main circuit board places the top of inductive coil skeleton and high frequency unit wiring board, and its plane is parallel with the installation end face of shell.
7. the encapsulating structure of current vortex sensor according to claim 6, it is characterized in that: described main circuit board is provided with the hole.
8. the encapsulating structure of current vortex sensor according to claim 1, it is characterized in that: described cementing agent is a resin.
CNU2008202039627U 2008-11-25 2008-11-25 Package structure of eddy current transducer Expired - Fee Related CN201302455Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008202039627U CN201302455Y (en) 2008-11-25 2008-11-25 Package structure of eddy current transducer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008202039627U CN201302455Y (en) 2008-11-25 2008-11-25 Package structure of eddy current transducer

Publications (1)

Publication Number Publication Date
CN201302455Y true CN201302455Y (en) 2009-09-02

Family

ID=41086081

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2008202039627U Expired - Fee Related CN201302455Y (en) 2008-11-25 2008-11-25 Package structure of eddy current transducer

Country Status (1)

Country Link
CN (1) CN201302455Y (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107830797A (en) * 2017-11-18 2018-03-23 中机生产力促进中心 Wide range current vortex sensor for Deformation inspection and preparation method thereof
CN110823436A (en) * 2019-10-08 2020-02-21 珠海格力电器股份有限公司 Six-dimensional force detection method based on eddy current effect, sensor and intelligent equipment
CN110987244A (en) * 2019-10-08 2020-04-10 珠海格力电器股份有限公司 Flat disc type six-dimensional force sensor based on eddy current effect, detection method and intelligent equipment
US20210310829A1 (en) * 2020-04-02 2021-10-07 Lg Electronics Inc. Displacement sensor

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107830797A (en) * 2017-11-18 2018-03-23 中机生产力促进中心 Wide range current vortex sensor for Deformation inspection and preparation method thereof
CN107830797B (en) * 2017-11-18 2023-10-27 中机生产力促进中心 Large-range eddy current sensor for pipeline deformation detection and manufacturing method thereof
CN110823436A (en) * 2019-10-08 2020-02-21 珠海格力电器股份有限公司 Six-dimensional force detection method based on eddy current effect, sensor and intelligent equipment
CN110987244A (en) * 2019-10-08 2020-04-10 珠海格力电器股份有限公司 Flat disc type six-dimensional force sensor based on eddy current effect, detection method and intelligent equipment
WO2021068663A1 (en) * 2019-10-08 2021-04-15 珠海格力电器股份有限公司 Flat disc six-dimensional force sensor based on eddy current effect, detection method, and smart device
US20210310829A1 (en) * 2020-04-02 2021-10-07 Lg Electronics Inc. Displacement sensor
CN113494880A (en) * 2020-04-02 2021-10-12 Lg电子株式会社 Displacement sensor
US11920959B2 (en) 2020-04-02 2024-03-05 Lg Electronics Inc. Displacement sensor having a coil structure, a shield member and a housing

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090902

Termination date: 20171125

CF01 Termination of patent right due to non-payment of annual fee