CN201119235Y - Wind hood device - Google Patents
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- CN201119235Y CN201119235Y CNU2007201817778U CN200720181777U CN201119235Y CN 201119235 Y CN201119235 Y CN 201119235Y CN U2007201817778 U CNU2007201817778 U CN U2007201817778U CN 200720181777 U CN200720181777 U CN 200720181777U CN 201119235 Y CN201119235 Y CN 201119235Y
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- 238000009434 installation Methods 0.000 claims description 5
- 239000011469 building brick Substances 0.000 claims 7
- 239000011324 bead Substances 0.000 claims 5
- 230000017525 heat dissipation Effects 0.000 description 12
- 238000000034 method Methods 0.000 description 6
- 238000005192 partition Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
Description
技术领域 technical field
本实用新型涉及一种导风罩装置,特别涉及一种应用于电子装置的导风罩装置。The utility model relates to an air guide cover device, in particular to an air guide cover device applied to an electronic device.
背景技术 Background technique
计算机系统为了满足消费者对于数据处理速度的要求,以期在最短时间内开启执行各种程序,业界无不以增加芯片精密度的手段,来达成提升处理速度及多任务运算的发展目标,而在计算机系统处理速度不断提升,更兼目前电子组件的体积日趋微小,接踵而来的便是计算机装置所产生的高发热量问题。In order to meet consumers' requirements for data processing speed and start executing various programs in the shortest time, the computer system in the industry uses means of increasing chip precision to achieve the development goal of increasing processing speed and multi-tasking computing. The processing speed of the system continues to increase, and the size of the current electronic components is becoming smaller and smaller, followed by the problem of high heat generated by the computer device.
如果不及时将热能散除,过高的温度将严重影响到芯片或是电子处理单元于运作时的稳定性及效率,甚至造成计算机装置的使用寿命缩短或是损坏的结果。因此,如何将运算处理单元产生的热能迅速地排出,已成为近年来相关研究人员着重的问题之一。If the heat energy is not dissipated in time, the high temperature will seriously affect the stability and efficiency of the chip or the electronic processing unit during operation, and even shorten the service life of the computer device or cause damage. Therefore, how to quickly discharge the heat energy generated by the computing processing unit has become one of the issues that relevant researchers have focused on in recent years.
为了解决计算机装置,例如台式计算机或是服务器的散热问题,一般最常使用的现有散热方式,于计算机装置内部装设散热风扇,并直接对高热能的电子组件吹送一强制气流进行散热,同时将废热排出计算机装置外,以降低内部环境温度。In order to solve the heat dissipation problem of computer devices, such as desktop computers or servers, the most commonly used existing heat dissipation method is to install a cooling fan inside the computer device, and directly blow a forced airflow to the electronic components with high heat energy to dissipate heat. Exhaust heat is removed from the computer unit to reduce the internal ambient temperature.
近年来更发展出利用一导风罩增进散热效率的技术。导风罩邻近设置或是覆盖于中央处理单元(central processing unit,CPU)或是周边电子零组件上,由导风罩而构成一空气流动通道,再配合设置于导风罩通道一侧边的风扇,风扇所产生的气流可经由流动通道,而更为直接且集中地针对电子组件吹送,进行更有效率的散热。In recent years, a technology of using a wind guide cover to improve heat dissipation efficiency has been developed. The air guide cover is arranged adjacent to or covered on the central processing unit (CPU) or peripheral electronic components, and an air flow channel is formed by the air guide cover, and then matched with the air guide cover arranged on one side of the air guide cover channel The fan, the airflow generated by the fan can pass through the flow channel, and is more directly and concentratedly blown to the electronic components for more efficient heat dissipation.
目前如大型服务器等计算机装置,必须采用双芯片甚至是多芯片处理系统,方可满足计算机系统可顺利地处理及运算大量信息的需求。为了同时对多个芯片系统进行散热,于中国台湾专利第M244718号专利案中揭露一种具有数个出风通道的导风罩,其中导风罩的进风口设置有至少一风扇,数出风通道分别对应于各个芯片系统,且各出风通道之间设置有隔离体,以避免各风扇所产生的气流相互影响而形成扰流,以增加整体散热效率。At present, computer devices such as large servers must adopt dual-chip or even multi-chip processing systems to meet the needs of the computer system to smoothly process and calculate a large amount of information. In order to dissipate heat from multiple chip systems at the same time, an air guide cover with several air outlet channels is disclosed in China Taiwan Patent No. The channels respectively correspond to the chip systems, and an isolator is provided between the air outlet channels to prevent the airflows generated by the fans from influencing each other to form turbulent flow, so as to increase the overall heat dissipation efficiency.
上述第M244718号专利案,虽可同时对多个产生高热能的芯片系统进行散热,但其导风罩所设定的出风通道的数量,并不一定适用于各种机型的计算机装置。若是导风罩装设于芯片系统数量较出风通道数量少的计算机装置内,其风扇所产生的气流无法经由出风通道集中吹送至芯片系统,造成资源的浪费,更导致散热效率因气流的分散而降低。Although the aforementioned patent No. M244718 can simultaneously dissipate heat from multiple chip systems that generate high heat energy, the number of air outlet channels set by the air guide cover is not necessarily applicable to various types of computer devices. If the air guide cover is installed in a computer device with a smaller number of chip systems than the number of air outlet channels, the airflow generated by the fan cannot be blown to the chip system through the air outlet channels, resulting in a waste of resources, and even lower cooling efficiency due to airflow. scattered and reduced.
发明内容 Contents of the invention
鉴于以上的问题,本实用新型提供一种导风罩装置,以改进现有技术的导风罩设置于芯片系统数量不对称于出风通道的电子装置,所产生的资源浪费及散热效率降低等问题。In view of the above problems, the utility model provides an air guide cover device to improve the air guide cover in the prior art, which is installed on an electronic device whose number of chip systems is asymmetric to the air outlet channel, resulting in waste of resources and reduced heat dissipation efficiency, etc. question.
为了实现上述目的,本实用新型揭露一种导风罩装置,设置于一电子装置的机壳内部,且电子装置具有至少一电子组件,导风罩装置用以导引一气流至电子组件进行散热。In order to achieve the above object, the utility model discloses an air guide cover device, which is arranged inside the casing of an electronic device, and the electronic device has at least one electronic component, and the air guide cover device is used to guide an airflow to the electronic component for heat dissipation .
导风照装置包括有一罩体及至少一挡风板。罩体设置于机壳上,于罩体内部区隔出至少二导风区,并于导风区一侧分别设有一对应于电子组件的风口。挡风板装设于未对应有电子组件的风口位置,挡风板相对于电子组件的一侧具有一防呆部,且防呆部与电子组件的相对位置相互重叠,以避免挡风板装设至对应有电子组件的风口。The wind guiding device includes a cover body and at least one windshield. The cover body is arranged on the casing, and at least two air guide areas are partitioned inside the cover body, and an air port corresponding to the electronic component is respectively provided on one side of the air guide area. The windshield is installed at the position of the tuyere that does not correspond to the electronic component. The side of the windshield opposite to the electronic component has a fool-proof part, and the relative positions of the fool-proof part and the electronic component overlap each other to prevent the windshield from being installed. Set to the corresponding air outlet with electronic components.
本实用新型的功效在于,导风罩装置由挡风板的设置,使得气流可集中朝向电子组件吹送,以加强机壳内部空气对流而计算机系统提升散热效率,并且挡风板上的防呆部的设计,可有效避免导风罩装置于组装过程中发生误装设的动作。The effect of the utility model is that the wind guide cover device is set by the windshield, so that the airflow can be blown concentratedly towards the electronic components, so as to strengthen the air convection inside the casing and improve the heat dissipation efficiency of the computer system, and the fool-proof part on the windshield The unique design can effectively prevent the misinstallation of the windshield device during the assembly process.
以下结合附图和具体实施例对本实用新型进行详细描述,但不作为对本实用新型的限定。The utility model will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the utility model.
附图说明 Description of drawings
图1为本实用新型第一实施例的分解示意图;Fig. 1 is the exploded schematic view of the first embodiment of the utility model;
图2为本实用新型第一实施例的立体示意图;Fig. 2 is the three-dimensional schematic view of the first embodiment of the utility model;
图3为本实用新型第一实施例的剖面侧视图;Fig. 3 is a sectional side view of the first embodiment of the utility model;
图4为本实用新型第二实施例的分解示意图;以及FIG. 4 is an exploded schematic view of the second embodiment of the present invention; and
图5为本实用新型第二实施例的立体示意图。Fig. 5 is a schematic perspective view of the second embodiment of the present invention.
其中,附图标记Among them, reference signs
100导风罩装置100 air guide hood device
110罩体110 cover body
111隔板111 Partition
112风口112 outlet
113勾扣孔113 hook hole
114定位孔114 positioning hole
120挡风板120 windshield
121防呆部121 Fool-proof department
122卡勾122 hooks
200电子装置200 electronic devices
210机壳210 chassis
211定位销211 positioning pin
220电路板220 circuit board
230电子组件230 electronic components
240风扇240 fan
具体实施方式 Detailed ways
下面结合附图对本实用新型的结构原理和工作原理作具体的描述:Below in conjunction with accompanying drawing, structural principle and working principle of the present utility model are specifically described:
本实用新型所揭露的导风罩装置,设置于电子装置内部,而所述的电子装置包括但不局限于台式计算机、笔记型计算机、服务器等具有电路板执行作动的计算机装置。以下本实用新型的详细说明中,将以服务器做为本实用新型的最佳实施例。然而所附图仅提供参考与说明,并非用以限制本实用新型。The wind deflector device disclosed in the utility model is arranged inside an electronic device, and the electronic device includes but not limited to a desktop computer, a notebook computer, a server, and other computer devices with circuit boards for performing actions. In the following detailed description of the utility model, the server will be used as the preferred embodiment of the utility model. However, the accompanying drawings are provided for reference and illustration only, and are not intended to limit the present invention.
图1、图2、及图3所示为本实用新型第一实施例的示意图。本实用新型所揭露的导风罩装置100设置于一电子装置200的机壳210内,机壳210为一内部中空略成矩形体的框架结构,用以容置一电路板220及多个风扇240,于电路板220上电性设置有数个电子组件230。本实用新型的导风罩装置100用以导引风扇240所产生的气流至电子组件230进行散热,其中电子组件230可为芯片组、中央处理器等于执行运算过程中产生高热能的电子零组件。FIG. 1 , FIG. 2 , and FIG. 3 are schematic views of the first embodiment of the present invention. The
请参阅图1至图3,本实用新型第一实施例的导风罩装置100包括有一罩体110及至少一挡风板120。Referring to FIG. 1 to FIG. 3 , the
罩体110由多个板件组合而成,并分别于罩体110的二相对侧形成一开口。罩体110装设于机壳210上,其一侧的开口邻近于电子组件230,另一侧则覆盖于数风扇240上。于罩体110内设有一沿着气流方向设置的隔板111,以将罩体110内部区隔出二导风区,并于二导风区相对于风扇240的另一侧分别形成一风口112,且二风口112对应于电子组件230,以使风扇240自机壳210外部吸入至机壳210中,并产生一气流通过导风区而吹送至电子组件230,以对电子组件230进行散热,并强迫机壳210内部产生对流,以强化机壳210的散热能力。本实用新型所揭露的实施例,其风扇240数量、隔板111数量、及隔板111所区隔出的风口112数量,可根据实际须进行散热的电子组件230数量做对应的配置与调整,并不以本实施例为限。The
请继续参阅图1至图3,当罩体110所区隔出的导风区数量多于欲散热的电子组件230数量时,可选择将挡风板120装设于未对应有电子组件230的风口112位置,使得数风扇240所产生的气流可集中吹送至电子组件230,不致造成散热效率的降低及资源的浪费。挡风板120相对于电子组件230的一侧延伸有一防呆部121,防呆部121为一板状结构,且防呆部121与电子组件230之间的相对位置相互重叠,以限定挡风板120设置于罩体110的其中一风口112的选择。Please continue to refer to FIG. 1 to FIG. 3, when the number of air guide areas separated by the
若是挡风板120设置于对应有电子组件230的风口112位置,防呆部121将与电子组件230之间产生干涉,使得罩体110无法装设于机壳210上,避免导风罩装置100于组装过程中形成误装设,达到防呆的效果。其中,本实用新型所揭露的防呆部121的外型与大小并不特别限定,但其设置位置必须与电子组件230相互重叠,且防呆部121除了本实施例所揭露与挡风板120为一体成形结构外,更可利用卡扣、铆固、焊接等方式设置于挡风板120一侧。If the
如图1及图2所示,本实用新型的挡风板120以卡扣方式固设于罩体110。于罩体110上设有数个勾扣孔113,挡风板120相对于防呆部121的另一侧延伸有数个卡勾122,其中卡勾122与勾扣孔113相互扣合,以使挡风板120固定于罩体110上而不致脱落。另外,电子装置200的机壳210凸设有数个定位销211,罩体110设有对应于该等定位销211的复数个定位孔114,定位销211穿设过定位孔114,以使罩体110固定于机壳210上。As shown in FIG. 1 and FIG. 2 , the
图4及图5所示为本实用新型第二实施例的立体示意图。本实用新型第二实施例的罩体110二相对侧分别罩覆住电子组件230及风扇240,而挡风板120的防呆部121朝向导风区方向延伸形成,并与电子组件230的相对位置重叠,以限定挡风板120设置于罩体110的其中一风口112的选择,避免误装设动作的产生。4 and 5 are schematic perspective views of the second embodiment of the present invention. The two opposite sides of the
本实用新型的导风罩装置,其挡风板可遮挡未对应有电子组件的风口,以使风扇产生的气流集中吹送至欲散热的电子组件,以加强空气对流而提升散热效率。并且,自挡风板一侧延伸的防呆部,可有效避免导风罩装置发生误装设的动作,以达到防呆的功效。In the wind guide device of the present invention, the windshield can block the air outlets not corresponding to the electronic components, so that the airflow generated by the fan can be blown to the electronic components to be radiated, so as to enhance the air convection and improve the heat dissipation efficiency. Moreover, the anti-fooling part extending from one side of the windshield can effectively prevent the misinstallation of the wind deflector device, so as to achieve the effect of anti-fooling.
当然,本实用新型还可有其它多种实施例,在不背离本实用新型精神及其实质的情况下,熟悉本领域的技术人员当可根据本实用新型作出各种相应的改变和变形,但这些相应的改变和变形都应属于本实用新型所附的权利要求的保护范围。Of course, the utility model can also have other various embodiments, and those skilled in the art can make various corresponding changes and deformations according to the utility model without departing from the spirit and essence of the utility model, but These corresponding changes and deformations should all belong to the protection scope of the appended claims of the present utility model.
Claims (4)
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CNU2007201817778U CN201119235Y (en) | 2007-10-19 | 2007-10-19 | Wind hood device |
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CNU2007201817778U CN201119235Y (en) | 2007-10-19 | 2007-10-19 | Wind hood device |
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102480895A (en) * | 2010-11-22 | 2012-05-30 | 鸿富锦精密工业(深圳)有限公司 | Electronic device and wind scooper thereof |
CN102548336A (en) * | 2010-12-11 | 2012-07-04 | 鸿富锦精密工业(深圳)有限公司 | Wind guiding cover |
CN103442542A (en) * | 2013-09-13 | 2013-12-11 | 中冶南方(武汉)自动化有限公司 | Conveniently detachable air ducting device with shielding function |
CN103901988A (en) * | 2014-04-23 | 2014-07-02 | 合肥恒研智能科技有限公司 | 1U vehicle-mounted ruggedized computer |
CN104345835A (en) * | 2013-08-09 | 2015-02-11 | 鸿富锦精密工业(深圳)有限公司 | Wind scooper |
CN103823529B (en) * | 2012-11-16 | 2017-03-15 | 英业达科技有限公司 | Electronic installation |
CN107678527A (en) * | 2017-10-23 | 2018-02-09 | 郑州云海信息技术有限公司 | A kind of wind scooper |
CN112135495A (en) * | 2020-09-30 | 2020-12-25 | 中国核动力研究设计院 | Modular modularization 1U heat abstractor |
CN118159003A (en) * | 2024-05-11 | 2024-06-07 | 西安西电电力系统有限公司 | High-pressure air-cooled valve tower based on thyristor |
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2007
- 2007-10-19 CN CNU2007201817778U patent/CN201119235Y/en not_active Expired - Fee Related
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102480895A (en) * | 2010-11-22 | 2012-05-30 | 鸿富锦精密工业(深圳)有限公司 | Electronic device and wind scooper thereof |
CN102548336A (en) * | 2010-12-11 | 2012-07-04 | 鸿富锦精密工业(深圳)有限公司 | Wind guiding cover |
CN103823529B (en) * | 2012-11-16 | 2017-03-15 | 英业达科技有限公司 | Electronic installation |
CN104345835A (en) * | 2013-08-09 | 2015-02-11 | 鸿富锦精密工业(深圳)有限公司 | Wind scooper |
CN103442542A (en) * | 2013-09-13 | 2013-12-11 | 中冶南方(武汉)自动化有限公司 | Conveniently detachable air ducting device with shielding function |
CN103442542B (en) * | 2013-09-13 | 2016-06-08 | 中冶南方(武汉)自动化有限公司 | A kind of just tear air ducting open with function of shielding |
CN103901988A (en) * | 2014-04-23 | 2014-07-02 | 合肥恒研智能科技有限公司 | 1U vehicle-mounted ruggedized computer |
CN107678527A (en) * | 2017-10-23 | 2018-02-09 | 郑州云海信息技术有限公司 | A kind of wind scooper |
CN112135495A (en) * | 2020-09-30 | 2020-12-25 | 中国核动力研究设计院 | Modular modularization 1U heat abstractor |
CN118159003A (en) * | 2024-05-11 | 2024-06-07 | 西安西电电力系统有限公司 | High-pressure air-cooled valve tower based on thyristor |
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