CN201017162Y - Dustproof heat radiating device of projector - Google Patents
Dustproof heat radiating device of projector Download PDFInfo
- Publication number
- CN201017162Y CN201017162Y CNU2007200040714U CN200720004071U CN201017162Y CN 201017162 Y CN201017162 Y CN 201017162Y CN U2007200040714 U CNU2007200040714 U CN U2007200040714U CN 200720004071 U CN200720004071 U CN 200720004071U CN 201017162 Y CN201017162 Y CN 201017162Y
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- Prior art keywords
- annular seal
- seal space
- projector
- heat
- shell
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Abstract
The utility model relates to a dust-proofing and heat-dissipating device of optic elements inside a projector. A dust-proofing and heat-dissipating device of the projector includes a crust with a seal cavity inside. The seal cavity is provided with a semiconductor refrigerating part, which is connected with heat-dissipating components. The optic elements of the projector, which cannot be polluted by dust, are placed inside the seal cavity, and the optic elements are separated from air. The heat inside the seal cavity is moved out by the semiconductor refrigerating part. The utility model not only can prevent the optic elements from contacting dust but also solves the heat-dissipating problem of the elements, which are sealed.
Description
Technical field
The utility model relates to a kind of projector, more particularly, relates to the dustproof heat abstractor of optical element in the projector.
Background technology
Along with popularizing of projector applications, the user is also progressively deepening the understanding of projector, and the dustproof and heat radiation of projector is had higher requirement.Opticator is the core that imaging shows in the projector architecture, not only can not enter too much dust, but also good performance of heat dissipation will be arranged.Bulb and liquid crystal board and near optical device thereof are the critical pieces that produces heat and be subjected to pyrolytic damage easily.Burn for fear of the inner member Yin Gaowen of projector, projector is provided with fan heat sink; Because optical device has the dustproof requirement, also need be provided with air strainer in the heat abstractor.Though the fan heat sink of existing projector can satisfy the heat radiation of main thermals source such as power supply.But when optics device unit was dispelled the heat, the cooling draught that radiator fan blows out directly acted on optical element, even good air filter is arranged, and the also difficult too much dust of optical element surface accumulation of avoiding.In a single day optical device in the projector is subjected to the pollution of dust, clears up very difficultly, when seriously polluted, also can influence the imaging effect of projector.
Summary of the invention
At the deficiencies in the prior art, the purpose of this utility model provides a kind of dustproof heat abstractor of projector, and it can prevent that not only dust from entering, but also has better radiating effect.
The purpose of this utility model is achieved in that a kind of dustproof heat abstractor of projector, comprises shell, is provided with annular seal space in the shell, and annular seal space has semiconductor refrigerating spare, and semiconductor refrigerating spare connects thermal component.
On the basis of technique scheme, the utility model also has following further scheme:
Described thermal component is the fan cooling mechanism on the shell, and the fan cooling mechanism has cooling air channel, and annular seal space is positioned at cooling air channel.
In the described annular seal space fan is arranged.
Described semiconductor refrigerating spare is a semiconductor chilling plate, and semiconductor chilling plate is positioned at the annular seal space inwall.
The outer wall of described annular seal space is made of metal material.
Described outer wall extends to outer casing bottom.
Advantage of the present utility model is as follows:
Because, being provided with annular seal space in the shell, annular seal space has semiconductor refrigerating spare, and semiconductor refrigerating spare connects thermal component.So, can place the optical element that can not be subjected to contamination by dust in the projector in the annular seal space, these optical elements and outside air are isolated, the heat in the annular seal space shifts out by semiconductor refrigerating spare, and is for further processing by thermal component.As, can place elements such as liquid crystal display and luxuriant and rich with fragrance mirror in the annular seal space.The utility model not only can prevent optical element contact dust, but also has solved the heat dissipation problem of sealed element.
Description of drawings
Accompanying drawing is a structural representation of the present utility model.
Embodiment
Below in conjunction with accompanying drawing in detail embodiment of the present utility model is described in detail:
Referring to accompanying drawing.A kind of dustproof heat abstractor of projector comprises shell 8, and shell 8 also is referred to as the cabinet of projector, and camera lens 5 is arranged on the shell 8.Because the element of projector's internal heat generation is a lot, in order to save the radiating efficiency of energy and raising annular seal space 12, can place the optical element that liquid crystal display and luxuriant and rich with fragrance mirror etc. can not be covered with dust in the annular seal space 12, bulb also only needs first half is installed in the annular seal space 12; Parts such as the latter half of bulb, lamp plate power supply, drive plate power supply can be installed in the cooling air channel in the shell 8.The elevated temperature heat holding circuit of projector inside can be used prior art, and the Switching Power Supply that defence program can be closed projector when starting automatically can guarantee serviceable life of projector so to greatest extent.
Be provided with annular seal space 12 in the shell 8, annular seal space 12 is positioned at the light channel of camera lens 5, annular seal space 12 sheet metals by good heat conductivity such as aluminium alloy or copper surround, the volume of annular seal space 12 and shape can be set according to the technical requirement of projector, and annular seal space 12 should hold the optical element that liquid crystal display and luxuriant and rich with fragrance mirror etc. can not be covered with dust.There is gland bonnet 1 shell 8 tops, and when opening gland bonnet 1, annular seal space 12 is open shape; Gland bonnet 1 or annular seal space 12 edges are provided with the soft O-ring seal that rubber is made, and when gland bonnet 1 was closed, outside air can't enter annular seal space 12.Gland bonnet 1 also can be done forr a short time, and gland bonnet 1 can cover annular seal space 12 and get final product.Semiconductor refrigerating spare 3 is housed in the annular seal space 12, and described semiconductor refrigerating spare 3 is semiconductor chilling plates, and semiconductor chilling plate is positioned at annular seal space 12 inwalls.Semiconductor refrigerating spare 3 is not limited to use semiconductor chilling plate, has suitable semiconductor refrigerating piece also can use.After semiconductor refrigerating spare 3 needs to connect thermal component, could the heat in the annular seal space 12 be shifted out.In order to ensure radiating effect, semiconductor refrigerating spare 3 can be installed polylith, and when semiconductor refrigerating spare 3 used semiconductor chilling plate, the general power of semiconductor chilling plate was more preferably greater than 120W.The outer wall 11 of annular seal space 12 is made of metal material, the outer wall 11 of annular seal space 12 is sheet metal manufacturings such as good aluminium alloy of heat conductivility or copper, the refrigeration end of semiconductor refrigerating spare 3 is fixed on the inwall of annular seal space 12, and the heating end of semiconductor refrigerating spare 3 is fixed on the outer wall 11 of annular seal space 12.Shift out shell 8 again after the heat of semiconductor refrigerating spare 3 heating end generations being shifted out annular seal space 12, semiconductor refrigerating spare 3 connects thermal components.Described thermal component is the fan cooling mechanism on the shell 8, and the fan cooling mechanism has cooling air channel, and annular seal space 12 is positioned at cooling air channel.The fan cooling mechanism is made of fan 6 of the air intake on the shell 8 and exhaust fan 7, air intake fan 6 and exhaust fan 7 have cooling air channel, cooling air channel is air admission passage 10 and air discharging channel 9, air intake fan 6 is sent into cooling air in the shell 8, cooling air is after air admission passage 10, but coolant seal chamber 12 and other heater element, under the further effect of exhaust fan 7, the heat on annular seal space 12 and other heater element is discharged shell 8 through air discharging channel 9.
On above-mentioned embodiment basis, the utility model also has following further embodiment:
In the described annular seal space 12 fan 4 is arranged.Fan 4 in the annular seal space 12 communicates with pore 2 and interlayer 13.During fan 4 work, cooling air is flowed annular seal space 12 in, cooling air, not only helps to keep the temperature in the annular seal space 12 even, but also helps annular seal space 12 interior heats are shifted out after annular seal space 12 flows by pore 2 and interlayer 13.
In order further to improve the radiating effect of annular seal space 12, described outer wall 11 extends to shell 8 bottoms.The aluminum alloy plate materials manufacturing is used in shell 8 bottoms, and outer wall 11 connects the aluminium alloy plate of shell 8 bottoms; Also heat radiator can be set on the aluminium alloy plate of shell 8 bottoms.
In order to improve the radiating effect of annular seal space 12, can super heat-conductive pipe be installed at the outer wall 11 or annular seal space 12 inwalls of annular seal space 12, on the shell 8 heat radiator is installed, the super heat-conductive pipe on the annular seal space 12 connects the heat radiator on the shell 8.
Claims (6)
1. the dustproof heat abstractor of a projector comprises shell (8), it is characterized in that, is provided with annular seal space (12) in the shell (8), and annular seal space (12) has semiconductor refrigerating spare (3), and semiconductor refrigerating spare (3) connects thermal component.
2. the dustproof heat abstractor of a kind of projector according to claim 1 is characterized in that, described thermal component is the fan cooling mechanism on the shell (8), and the fan cooling mechanism has cooling air channel, and annular seal space (12) is positioned at cooling air channel.
3. the dustproof heat abstractor of a kind of projector according to claim 1 and 2 is characterized in that, fan (4) is arranged in the described annular seal space (12).
4. the dustproof heat abstractor of a kind of projector according to claim 1 is characterized in that, described semiconductor refrigerating spare (3) is a semiconductor chilling plate, and semiconductor chilling plate is positioned at annular seal space (12) inwall.
5. the dustproof heat abstractor of a kind of projector according to claim 1 is characterized in that, the outer wall (11) of described annular seal space (12) is made of metal material.
6. the dustproof heat abstractor of a kind of projector according to claim 5 is characterized in that, described outer wall (11) extends to shell (8) bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200040714U CN201017162Y (en) | 2007-02-25 | 2007-02-25 | Dustproof heat radiating device of projector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200040714U CN201017162Y (en) | 2007-02-25 | 2007-02-25 | Dustproof heat radiating device of projector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201017162Y true CN201017162Y (en) | 2008-02-06 |
Family
ID=39057657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200040714U Expired - Fee Related CN201017162Y (en) | 2007-02-25 | 2007-02-25 | Dustproof heat radiating device of projector |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201017162Y (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101986201A (en) * | 2010-07-19 | 2011-03-16 | 深圳雅图数字视频技术有限公司 | Semiconductor cooling system of liquid crystal on silicon (LCOS) projector |
| CN101986196A (en) * | 2010-07-19 | 2011-03-16 | 深圳雅图数字视频技术有限公司 | DLP projector of totally enclosed cooling system |
| CN101986194A (en) * | 2010-07-19 | 2011-03-16 | 深圳雅图数字视频技术有限公司 | Semiconductor cooling system of liquid crystal display (LCD) projector |
| CN101986200A (en) * | 2010-07-19 | 2011-03-16 | 深圳雅图数字视频技术有限公司 | Liquid cooling and heat dissipating system for digital light processing (DLP) projector |
| CN103499909A (en) * | 2013-09-25 | 2014-01-08 | 苏州佳世达光电有限公司 | Projection device |
| CN102210146B (en) * | 2008-12-01 | 2014-03-12 | 松下电器产业株式会社 | Projection type image display device |
| CN105589286A (en) * | 2015-12-24 | 2016-05-18 | 苏州佳世达光电有限公司 | Projector |
| CN106054507A (en) * | 2015-04-08 | 2016-10-26 | 精工爱普生株式会社 | Projector |
| WO2018205421A1 (en) * | 2017-05-11 | 2018-11-15 | 深圳市光峰光电技术有限公司 | Projector |
| CN109283777A (en) * | 2018-11-20 | 2019-01-29 | 威创集团股份有限公司 | Projection device and optical projection system |
| CN111474814A (en) * | 2019-01-23 | 2020-07-31 | 中强光电股份有限公司 | Cooling module and projection device |
| CN111730861A (en) * | 2020-06-30 | 2020-10-02 | 北京闻亭泰科技术发展有限公司 | 3D prints laser processing module based on digital light processing |
| CN111752078A (en) * | 2019-03-29 | 2020-10-09 | 中强光电股份有限公司 | Cooling module and projection device |
| CN114895515A (en) * | 2022-04-18 | 2022-08-12 | 深圳市和天创科技有限公司 | Intelligent heat dissipation mechanism of sealed optical machine of single-chip projector |
-
2007
- 2007-02-25 CN CNU2007200040714U patent/CN201017162Y/en not_active Expired - Fee Related
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102210146B (en) * | 2008-12-01 | 2014-03-12 | 松下电器产业株式会社 | Projection type image display device |
| CN101986201A (en) * | 2010-07-19 | 2011-03-16 | 深圳雅图数字视频技术有限公司 | Semiconductor cooling system of liquid crystal on silicon (LCOS) projector |
| CN101986196A (en) * | 2010-07-19 | 2011-03-16 | 深圳雅图数字视频技术有限公司 | DLP projector of totally enclosed cooling system |
| CN101986194A (en) * | 2010-07-19 | 2011-03-16 | 深圳雅图数字视频技术有限公司 | Semiconductor cooling system of liquid crystal display (LCD) projector |
| CN101986200A (en) * | 2010-07-19 | 2011-03-16 | 深圳雅图数字视频技术有限公司 | Liquid cooling and heat dissipating system for digital light processing (DLP) projector |
| CN101986196B (en) * | 2010-07-19 | 2012-05-09 | 深圳雅图数字视频技术有限公司 | DLP projector with fully-sealed cooling system |
| CN101986200B (en) * | 2010-07-19 | 2012-07-18 | 深圳雅图数字视频技术有限公司 | Liquid cooling and heat dissipating system for digital light processing (DLP) projector |
| CN101986194B (en) * | 2010-07-19 | 2013-05-29 | 深圳雅图数字视频技术有限公司 | Semiconductor cooling system of liquid crystal display (LCD) projector |
| CN103499909A (en) * | 2013-09-25 | 2014-01-08 | 苏州佳世达光电有限公司 | Projection device |
| CN106054507A (en) * | 2015-04-08 | 2016-10-26 | 精工爱普生株式会社 | Projector |
| CN105589286A (en) * | 2015-12-24 | 2016-05-18 | 苏州佳世达光电有限公司 | Projector |
| CN105589286B (en) * | 2015-12-24 | 2017-11-07 | 苏州佳世达光电有限公司 | Projection arrangement |
| WO2018205421A1 (en) * | 2017-05-11 | 2018-11-15 | 深圳市光峰光电技术有限公司 | Projector |
| CN109283777A (en) * | 2018-11-20 | 2019-01-29 | 威创集团股份有限公司 | Projection device and optical projection system |
| CN111474814A (en) * | 2019-01-23 | 2020-07-31 | 中强光电股份有限公司 | Cooling module and projection device |
| CN111752078A (en) * | 2019-03-29 | 2020-10-09 | 中强光电股份有限公司 | Cooling module and projection device |
| US11194238B2 (en) | 2019-03-29 | 2021-12-07 | Coretronic Corporation | Heat dissipation module and projection apparatus |
| CN111730861A (en) * | 2020-06-30 | 2020-10-02 | 北京闻亭泰科技术发展有限公司 | 3D prints laser processing module based on digital light processing |
| CN114895515A (en) * | 2022-04-18 | 2022-08-12 | 深圳市和天创科技有限公司 | Intelligent heat dissipation mechanism of sealed optical machine of single-chip projector |
| CN114895515B (en) * | 2022-04-18 | 2023-10-03 | 深圳市和天创科技有限公司 | Intelligent heat dissipation mechanism of sealed ray apparatus of singlechip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080206 Termination date: 20100225 |