CN200973203Y - Printed circuit board structure of LED - Google Patents
Printed circuit board structure of LED Download PDFInfo
- Publication number
- CN200973203Y CN200973203Y CN 200620148846 CN200620148846U CN200973203Y CN 200973203 Y CN200973203 Y CN 200973203Y CN 200620148846 CN200620148846 CN 200620148846 CN 200620148846 U CN200620148846 U CN 200620148846U CN 200973203 Y CN200973203 Y CN 200973203Y
- Authority
- CN
- China
- Prior art keywords
- insulating barrier
- layer
- circuit board
- printed circuit
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a LBD carrying board printing circuit board structure, which comprises a base board and a primary insulation layer, wherein the primary insulation layer is overlapped on the above base board side; a copper layer, wherein the copper layer is overlapped on the above base board side, and a secondary insulation layer; as well as a surface layer that is overlapped on the above base board side and is proximate to a side of the secondary insulation. Thereby the printing circuit board can reach an optimal heat conduction effect in use and has a low cost and easy structure in manufacture.
Description
Technical field
The utility model relates to a kind of printed circuit board arrangement of light-emitting diode support plate, especially refer to that a kind of this printed circuit board (PCB) that makes reaches preferable radiating effect when using, and when making, have the printed circuit board arrangement of the light-emitting diode support plate that reduces cost and be easy to make.
Background technology
Press, the general printed circuit board arrangement such as the TaiWan, China patent gazette of usefulness are announced No. 430959 " heat conductive structure of printed circuit board (PCB) ", and it includes a thermal conductance layer, the surface of tool one convex-concave pattern structure; One mucigel is on this thermal conductance layer; And a surface metal-layer, on this thermal conductance layer and this mucigel, wherein, this surface metal-layer of part is directly or be close to and directly link to each other with this thermal conductance layer.Should " heat conductive structure of printed circuit board (PCB) " also can include a thermal conductance layer, the surface of tool one convex-concave pattern structure in addition; One mucigel is at this thermal conductance laminar surface; One surface metal-layer, on this thermal conductance layer and this mucigel, wherein, this surface metal-layer of part is direct or intimate directly to link to each other with this thermal conductance layer; And an external fin, device is on this surface metal-layer.
Though " heat conductive structure of printed circuit board (PCB) " of above-mentioned usefulness can make printed circuit board (PCB) have heat conductive structure, but because this printed circuit board (PCB) is when making, need accurate stacking mode to be made, so must expend higher cost and during than the farm labourer and operation, and this printed circuit board (PCB) only conducts as thermal source with a thermal conductance layer, therefore, its heat-conducting effect is unsatisfactory.
The utility model content
Technical problem to be solved in the utility model is at the deficiencies in the prior art, to provide a kind of printed circuit board arrangement that makes printed circuit board (PCB) reach the light-emitting diode support plate of preferable radiating effect.
For solving the problems of the technologies described above, the technical scheme that the utility model adopted is: a kind of printed circuit board arrangement of light-emitting diode support plate, and it includes: a substrate; One first insulating barrier, these first insulation series of strata are stacking on the one side of aforesaid substrate; One bronze medal layer, these copper series of strata are stacking on the one side of above-mentioned first insulating barrier; And the top layer, this top layer system is repeatedly on the one side of above-mentioned copper layer; It is characterized in that: have second insulating barrier on the described copper layer, described top layer is adjacent to second insulating barrier, one side.
The thickness of this substrate is between 0.1mm～4mm.
This first insulating barrier is the insulation film with heat-conducting effect.
The thickness of this first insulating barrier is between 2 μ m～125 μ m.
The thickness of this copper layer is between 12 μ m～175 μ m.
Compared with prior art, the beneficial effects of the utility model are: this substrate 10 can produce with copper layer 12 when the utility model uses thermal source, at this moment, promptly can this first insulating barrier 11 and second insulating barrier 121 dispel the heat, and make printed circuit board (PCB) 1 when using, can reach preferable radiating effect, and when making, have and reduce cost and be easy to make effect.
Description of drawings
Fig. 1 is the profile status schematic diagram of the utility model first embodiment.
Fig. 2 is the user mode generalized section of the utility model first embodiment.
Fig. 3 is the profile status schematic diagram of the utility model second embodiment.
Fig. 4 is the user mode generalized section of the utility model second embodiment.
Label declaration:
Single-clad board 1 substrate 10
First insulating barrier, 11 bronze medal layers 12
Second insulating barrier, 121 top layers 13,131
Double-sided printed-circuit board 2 substrates 20
First insulating barrier, 21 first bronze medal layers 22
Second insulating barrier, 23 second bronze medal layers 24
The 3rd insulating barrier 241 tool thermal hole copper layers 242
Embodiment
Seeing also shown in Figure 1ly, is the profile status schematic diagram of the utility model first embodiment.As shown in the figure: the utility model is a kind of printed circuit board arrangement of light-emitting diode support plate, comprise single face and double-sided printed-circuit board, this single-clad board 1 is made of a substrate 10, one first insulating barrier 11, a bronze medal layer 12 and top layer 13, can make this printed circuit board (PCB) when using, reach preferable radiating effect, and when making, have and reduce cost and be easy to make effect.
The above-mentioned substrate of carrying 10 is to can be aluminium sheet or be aluminium flake, and the thickness of this substrate 10 system is between 0.1mm～4mm.
This first insulating barrier 11 is stacking on the one side of aforesaid substrate 10, and this first insulating barrier 11 is to be formed on the one side of substrate 10 in modes such as anode treatment, rigid anode treatment, spraying, dash coat or other chemical treatments, and this first insulating barrier 11 is insulating ceramics film or the insulation film for having heat-conducting effect with heat-conducting effect, and the thickness of this first insulating barrier 11 system is between 2 μ m～125 μ m in addition.
This copper layer 12 is can be in no electrolytics mode, spraying or sputter modes such as (SPUTTER) are formed on the one side of first insulating barrier 11, and be to make shielding (MASK) earlier on this copper layer 12, the zone that required circuit (LAYOUT) is outer covers to form the circuit (not shown), and the thickness of this copper layer 12 system is between 12 μ m～175 μ m, and this copper layer 12 be can electro-coppering or spraying method thicken to demand thickness, cording has second insulating barrier 121 on this copper layer 12 in addition, this second insulating barrier 121 is to can be the welding resistance printing ink of coating on the copper layer 12, anti-welding green lacquer, or for being formed at the insulation film that insulating ceramics film on the copper layer 12 etc. has heat-conducting effect, and the thickness of this second insulating barrier 121 system is between 2 μ m～125 μ m.
This top layer 13 is repeatedly on the one side of above-mentioned copper layer 12 and be adjacent to second insulating barrier, 121 1 sides, and this top layer 13 is to can be surface treatment modes such as chemical nickel and gold, organic solderability preservative (OSP), silver, tin, spray tin.
Seeing also shown in Figure 2ly, is the user mode generalized section of the utility model first embodiment.As shown in the figure: when the utility model first embodiment in when utilization, system can be provided with required electronic building brick 14 on this copper layer 12, and on this electronic building brick 14, electrically connect or directly link (BONDING) in the top layer 131 with lead 141 and top layer 13, this substrate 10 is can produce thermal source is arranged with copper layer 12 when using, at this moment, promptly can this first insulating barrier 11 and second insulating barrier 121 dispel the heat, and make this single-clad board 1 when using, can reach preferable radiating effect.
Seeing also shown in Figure 3ly, is the profile status schematic diagram of the utility model second embodiment.As shown in the figure: the double-sided printed-circuit board 2 of the utility model second embodiment is by a substrate 20, one first insulating barrier 21, one first bronze medal layer 22, one second insulating barrier 23, one second bronze medal layer 24 and top layer 25 and tool thermal hole copper layer 242 at least, wherein have thermal hole copper layer 242 tool one thermal hole 243, can be with 22 formation of thermal conductance to the first copper layer of the second bronze medal layer 24, can make this printed circuit board (PCB) when using, reach preferable radiating effect, and when making, have and reduce cost and be easy to make effect.
The above-mentioned substrate of carrying 20 is to can be aluminium sheet or be aluminium flake, and the thickness of this substrate 20 system is between 0.1mm～4mm.
This first insulating barrier 21 is to be formed on the one side of substrate 20 in modes such as anode treatment, rigid anode treatment, other chemical treatments, and this first insulating barrier 21 is to have the insulation film that the insulating ceramics film etc. of heat-conducting effect has heat-conducting effect, and the thickness of this first insulating barrier 21 system is between 2 μ m～125 μ m.
This first bronze medal layer 22 is to be formed on the one side of first insulating barrier 21 with no electrolytics mode, spraying or sputter modes such as (SPUTTER), and the thickness of this first bronze medal layer 22 system is between 12 μ m～175 μ m, in addition this first bronze medal layer 22 be can electro-coppering or spraying method thicken to demand thickness.
This second insulating barrier 23 is to be formed on the one side of the first bronze medal layer 22 in modes such as anode treatment, rigid anode treatment, spraying or other chemical treatments, and this second insulating barrier 23 is to have the insulation film that the insulating ceramics film etc. of heat-conducting effect has heat-conducting effect, and the thickness of this second insulating barrier 23 system is between 2 μ m～125 μ m.
This second bronze medal layer 24 is in no electrolytics mode, spraying or sputter modes such as (SPUTTER) are formed on the one side of second insulating barrier 23, and be to make shielding (MASK) earlier on this second bronze medal layer 24, the zone that required circuit (LAYOUT) is outer covers to form the circuit (not shown), and the thickness of this second bronze medal layer 24 system is between 12 μ m～175 μ m, in addition this second bronze medal layer 24 be can electro-coppering or spraying method thicken to demand thickness, and cording has the 3rd insulating barrier 241 on this second bronze medal layer 24, the 3rd insulating barrier 241 is to can be the welding resistance printing ink of coating on the second bronze medal layer 24, anti-welding green lacquer, or for being formed at the insulation film that insulating ceramics film on the second bronze medal layer 24 etc. has heat-conducting effect, and the thickness of the 3rd insulating barrier 241 system is between 2 μ m～125 μ m.
This top layer 25 is stacking on the one side of the above-mentioned second bronze medal layer 24 and be adjacent to the 3rd insulating barrier 241 1 sides, and this top layer 25 is to can be surface treatment modes such as chemical nickel and gold, organic solderability preservative (OSP), silver, tin, spray tin.
Seeing also shown in Figure 4ly, is the user mode generalized section of the utility model second embodiment.As shown in the figure: when the utility model second embodiment in when utilization, system can be provided with required electronic building brick 26 on this second bronze medal layer 24, and in electrically connecting with lead 261 and top layer 25 on this electronic building brick 26 or directly electronic building brick 26 being linked on the tool thermal hole copper layer 242, this substrate 20 is can produce thermal source is arranged with first and second copper layer 22,24 when using, at this moment, promptly can this first insulating barrier 21, second insulating barrier 23 and the 3rd insulating barrier 241 dispel the heat, and make this double-sided printed-circuit board 2 when using, can reach preferable radiating effect.
In sum, the printed circuit board arrangement of the utility model light-emitting diode support plate can effectively improve the various shortcoming of usefulness, can make this printed circuit board (PCB) when using, reach preferable radiating effect, and when making, have and reduce cost and be easy to make effect, and then make generation of the present utility model can more progressive, more practical, more meet user institute palpus, really met the utility application important document, the whence proposes patent application in accordance with the law.
Only the above only is the utility model preferred embodiment, when not limiting the utility model practical range with this; So, all according to the utility model claims and simple equivalent that description is done variation and modification, all should still belong in the utility model patent covering scope.
Claims (5)
1. the printed circuit board arrangement of a light-emitting diode support plate, it includes: a substrate; One first insulating barrier, these first insulation series of strata are stacking on the one side of aforesaid substrate; One bronze medal layer, these copper series of strata are stacking on the one side of above-mentioned first insulating barrier; And the top layer, this top layer system is repeatedly on the one side of above-mentioned copper layer; It is characterized in that: have second insulating barrier on the described copper layer, described top layer is adjacent to second insulating barrier, one side.
2. the printed circuit board arrangement of light-emitting diode support plate according to claim 1 is characterized in that, the thickness of this substrate is between 0.1mm～4mm.
3. the printed circuit board arrangement of light-emitting diode support plate according to claim 1 is characterized in that, this first insulating barrier is the insulation film with heat-conducting effect.
4. the printed circuit board arrangement of light-emitting diode support plate according to claim 1 is characterized in that, the thickness of this first insulating barrier is between 2 μ m～125 μ m.
5. the printed circuit board arrangement of light-emitting diode support plate according to claim 1 is characterized in that, the thickness of this copper layer is between 12 μ m～175 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620148846 CN200973203Y (en) | 2006-11-09 | 2006-11-09 | Printed circuit board structure of LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620148846 CN200973203Y (en) | 2006-11-09 | 2006-11-09 | Printed circuit board structure of LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN200973203Y true CN200973203Y (en) | 2007-11-07 |
Family
ID=38884451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620148846 Expired - Fee Related CN200973203Y (en) | 2006-11-09 | 2006-11-09 | Printed circuit board structure of LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN200973203Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010108361A1 (en) * | 2009-03-23 | 2010-09-30 | Shen Lihao | Pcb including heat radiating structure with heat conducting and heat radiating ink |
| CN101988636A (en) * | 2009-07-31 | 2011-03-23 | 歌尔声学股份有限公司 | White light LED (light-emitting diode) and preparation method thereof |
| CN101988637A (en) * | 2009-07-31 | 2011-03-23 | 歌尔声学股份有限公司 | White-light light-emitting diode (LED) light sourceS, manufacturing method thereof and street lamp using white-light LED sources |
-
2006
- 2006-11-09 CN CN 200620148846 patent/CN200973203Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010108361A1 (en) * | 2009-03-23 | 2010-09-30 | Shen Lihao | Pcb including heat radiating structure with heat conducting and heat radiating ink |
| CN101988636A (en) * | 2009-07-31 | 2011-03-23 | 歌尔声学股份有限公司 | White light LED (light-emitting diode) and preparation method thereof |
| CN101988637A (en) * | 2009-07-31 | 2011-03-23 | 歌尔声学股份有限公司 | White-light light-emitting diode (LED) light sourceS, manufacturing method thereof and street lamp using white-light LED sources |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101489159B1 (en) | Method for manufacturing metal printed circuit board | |
| US8324724B2 (en) | LED assembly and manufacturing method thereof | |
| CN1946271A (en) | Printed circuit board and manufacturing method thereof | |
| CN101076223A (en) | Metal circuit board of aluminum baseplate magnetic-controlled sputtering-jetted and LED illuminating device | |
| CN1551712A (en) | Electronic circuit connection structure and its connection method | |
| CN101039548A (en) | Anodized metal substrate module | |
| CN1788531A (en) | Connection structure of inner conductor and multilayer substrate | |
| CN1725930A (en) | Printed circuit board | |
| CN200956685Y (en) | Electronic element-component package aluminium substrate | |
| CN200973203Y (en) | Printed circuit board structure of LED | |
| CN101472449A (en) | Combined structure and method of radiator and circuit | |
| CN1650680A (en) | Circuit board with at least one electronic component | |
| CN201426215Y (en) | Heat dissipating structure of circuit board | |
| CN101159300B (en) | Copper base high power LED packaging | |
| CN1324448C (en) | Capacitance type touch pad of using film, and preparing method | |
| CN101042498A (en) | LED backlight unit without printed circuit board and method of manufacturing the same | |
| CN1829415A (en) | Composite structure of flexible printed circuit and electronic component | |
| CN2831692Y (en) | Printed circuit board assembly and power source appts including the same | |
| KR20140082599A (en) | Method for manufacturing metal printed circuit board | |
| CN201490177U (en) | Metal-based copper clad laminate for mounting semiconductor power devices | |
| CN2886805Y (en) | Structure in which LED circuit is integrated in radiation baseplate | |
| CN101079459A (en) | Lighting device | |
| CN203340400U (en) | Printed circuit board with heat conduction column for LED installation | |
| CN1171517C (en) | Technology for making printed circuit board with additional layers | |
| TWM311116U (en) | Improved PCB structure of LED carrier |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071107 Termination date: 20101109 |