CN209448911U - Micro- heating plate of composite construction - Google Patents
Micro- heating plate of composite construction Download PDFInfo
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- CN209448911U CN209448911U CN201822231805.3U CN201822231805U CN209448911U CN 209448911 U CN209448911 U CN 209448911U CN 201822231805 U CN201822231805 U CN 201822231805U CN 209448911 U CN209448911 U CN 209448911U
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Abstract
The utility model discloses a kind of micro- heating plates of composite construction, including the first substrate and it is successively set on the first insulating layer, thermal insulation layer, heating layer, second insulating layer and the test layer of the first substrate first surface, the second surface of first substrate is formed with cavity structure, the second surface and the opposite facing setting of first surface.Wherein quartz substrate, monocrystalline substrate can be respectively adopted in the first, second substrate.The structure of micro- heating plate of composite construction provided by the utility model is simple, secured, high reliablity, and stability is good; especially there are efficient heating properties; its preparation process is simply easily operated simultaneously, can use MEMS technology Rapid Implementation, is suitable for large-scale production.
Description
Technical field
The utility model relates to a kind of micro- heating plate, in particular to micro- heating plate of a kind of composite construction belongs to semiconductor
Technical field of micro and nano fabrication.
Background technique
Gas sensor mainly has semiconductor-type, electric chemical formula, catalytic combustion type etc. several at this stage, wherein semiconductor-type
The most practical a kind of gas sensor of gas sensor.It has it is low in cost, be simple to manufacture, high sensitivity, fast response time,
The advantages that service life is long, and circuit low to humidity sensitive is simple.Mature semiconductor-type gas sensor is at present with micro- heating plate
Basis coats sensitive material above it, and sensitive material is made to work at a certain temperature, and semiconductor-type gas sensing may be implemented
The works fine of device.
For currently used micro- heating plate mainly based on ceramic bases or silicon base, ceramic bases are mainly used for traditional height
Temperature sensitive material is heated, and relative volume is larger, for the more of traditional gas sensor.The micro- heating plate of silicon substrate is mainly with outstanding
Based on hollow structure, body of overleaf beginning to speak, surface silicon nitride, silica form composite layer, for insulation and thermal insulation layer.From the U.S.
Since proposing the micro- heating plate of MEMS earliest, lot of domestic and international researcher has carried out a large amount of research to it, for example, some
The micro- heating plate research carried out using SOI silicon as substrate is reported in document.But there is also yields for the micro- heating plate of current MEMS silicon substrate
It is low, be difficult to the shortcomings that resistant to high temperatures, support film is easily damaged etc..Specifically, the micro- heating plate one of existing MEMS silicon substrate
As using the back side formed cavity, surface silicon nitride, silica etc. formed supporting layer, insulation insulating layer, then formed above
Heating structure, still, one side silicon itself are the good conductors of heat, and thermal loss will affect working efficiency during the work time, separately
On the one hand when etching silicon back chamber, Surface Oxygen SiClx and silicon nitride film is often damaged, its yield of devices is influenced.
Summary of the invention
The main purpose of the utility model is to provide a kind of micro- heating plate of composite construction, manufacture craft is simple, energy
It works at high temperature, long service life, to overcome the deficiencies in the prior art.
The another object of the utility model is to provide a kind of method of micro- heating plate for making the composite construction.
For realization aforementioned invention purpose, the technical solution adopted in the utility model includes:
The utility model embodiment provides a kind of micro- heating plate of composite construction comprising the first substrate and successively sets
Set the first insulating layer, thermal insulation layer, heating layer, second insulating layer and the test layer in the first substrate first surface, first lining
The second surface at bottom is formed with cavity structure, the second surface and the opposite facing setting of first surface.
The utility model embodiment additionally provides a kind of production method of micro- heating plate of composite construction comprising:
It processes to form cavity structure in the second surface of one first substrate；
It is successively grown in one second substrate surface and forms thermal insulation layer and the first insulating layer；
First insulating layer is bonded with the first surface of first substrate, the first surface and second surface phase
Back to removing second substrate later；
Heating layer, second insulating layer and test layer are sequentially formed on the thermal insulation layer.
In some embodiments, aforementioned first substrate uses quartz substrate, especially high-purity quartz substrate.
In some embodiments, aforementioned second substrate uses monocrystalline substrate (that is, Silicon Wafer).
The utility model embodiment additionally provides micro- heating plate of the composite construction in preparing in micro- heating sensor
Using.
Compared with prior art, micro- heating plate of composite construction provided by the utility model is simple and strong in structure, reliably
Property it is high, stability is good, especially has efficient heating properties, while its preparation process is simply easily operated, can use
MEMS technology Rapid Implementation, is adapted for industrialized production.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of micro- heating plate of composite construction in one exemplary embodiments of the utility model；
Fig. 2 is a kind of preparation technology flow chart of micro- heating plate of composite construction in one exemplary embodiments of the utility model；
Fig. 3 is a kind of preparation process schematic diagram of micro- heating plate of composite construction in one exemplary embodiments of the utility model.
Specific embodiment
As previously mentioned, inventor is studied for a long period of time and largely practiced in view of many defects of the existing technology, obtain
To propose the technical solution of the utility model.The technical solution, its implementation process and principle etc. will further be solved as follows
Release explanation.
A kind of production method of the micro- heating plate for composite construction that the one aspect of the utility model embodiment provides includes:
It processes to form cavity structure in the second surface of one first substrate；
It is successively grown in one second substrate surface and forms thermal insulation layer and the first insulating layer；
First insulating layer is bonded with the first surface of first substrate, the first surface and second surface phase
Back to removing second substrate later；
Heating layer, second insulating layer and test layer are sequentially formed on the thermal insulation layer.
The test layer includes test electrode.The test electrode can be with patterned structures.
In some embodiments, the production method specifically includes: using three-dimensional hot press forming technology, described the
The second surface of one substrate is processed to form cavity structure.Wherein, hot-forming by using three-dimensional, it can be to avoid conventional wet process
Compound or dry etching technique can significantly improve it to destruction caused by the heating of substrate face or test electrode
Yield.
In some embodiments, the production method specifically includes: second substrate is adequately cleaned,
The mode of cleaning include pickling, alkali cleaning, organic solvent cleaning, deionized water cleaning in the combination of any one or more, it
Vacuum drying or the drying in nitrogen atmosphere afterwards, then successively grown in the second substrate surface and form thermal insulation layer and the first insulating layer.
In some embodiments, the production method specifically includes: exhausted by described first using anode linkage technique
Edge layer is bonded with the first surface of first substrate.Using this bonding technology, two kinds of stronger knots of substrate can be made
Altogether, guarantee the mechanical strength of device.
In some embodiments, the production method specifically includes: second substrate is removed using reduction process,
To make the thermal insulation layer expose, the first substrate is etched later, makes the cavity structure axially through the first substrate.It is such
Operation, can make device general levels thinner, can preferably control the fuel factor of heating plate.
In some embodiments, the production method specifically includes: grown using CVD method to be formed it is described heat-insulated
At least one of layer, the first insulating layer, second insulating layer.
In some embodiments, the production method specifically includes: grown using PVD method to be formed the heating layer,
At least one of test layer.
In some more specific embodiments, the production method be may include steps of:
(1) using three-dimensional hot press forming technology, a cavity is formed at the first substrate (such as high-purity quartz substrate) back side
Structure (also known as back chamber), can be round, rectangular etc., the length size of cavity can be in 100um-5000um or so.It is excellent
Choosing, in this step, the cavity structure is not along axial direction completely through first substrate, that is, in the cavity structure bottom
It is remaining that there are also the composition materials of the first substrate.It so can control the thermal diffusion of heating plate, so that heating plate has good add
Thermal effect.
(2) by the second substrate (such as monocrystalline substrate) sufficiently clean, including pickling, alkali cleaning, organic solvent cleaning, go from
Sub- water cleaning, it is sufficiently dry in vacuum drying oven or nitrogen drying later.
(3) heat insulation layer (such as silicon nitride layer) and first is grown on a side surface of the second substrate in the way of CVD absolutely
Edge layer (such as silicon oxide layer).
(4) anode linkage technique is utilized, the first surface of insulating layer and the first substrate face are bonded together.
(5) remaining second substrate is removed by reduction process, exposes heat insulation layer.
(6) the first substrate is carried on the back extra substrate material above chamber (such as quartz) to remove with dry etch process, exposes the
One insulating layer.So device general levels can be made thinner, can preferably control the fuel factor of heating plate.
(7) PVD deposition heating layer is utilized in insulation layer surface.
(8) second insulating layer is deposited in the way of CVD in heating layer surface.
(9) test layer is deposited in the way of PVD on second insulating layer surface.
A kind of micro- heating plate for composite construction that the other side of the utility model embodiment provides includes the first substrate
And it is successively set on the first insulating layer, thermal insulation layer, heating layer, second insulating layer and the test layer of the first substrate first surface,
The second surface of first substrate is formed with cavity structure, the second surface and the opposite facing setting of first surface.
Further, first substrate includes quartz substrate.
Further, second substrate includes monocrystalline substrate.
Further, first insulating layer, second insulating layer material include silica, such as can be silica
Layer.
Further, the material of the thermal insulation layer includes silicon nitride, such as can be silicon nitride layer.
Further, the material of the heating layer includes metal, such as can be any one in Pt, Mo, W or two kinds
The structured metal layer that above combination or its alloy are formed.
Further, the material of the test layer includes metal, such as can be the gold that Au and/or Ag or its alloy are formed
Belong to structure sheaf.
In some embodiments, first substrate and the first insulating layer by anode linkage technique in conjunction with.
It is more preferred, first insulating layer, second insulating layer with a thickness of 100nm-5000nm.
It is more preferred, the thermal insulation layer with a thickness of 100nm-5000nm.
It is more preferred, the heating layer with a thickness of 100nm-1000nm.
It is more preferred, the test layer with a thickness of 100nm-1000nm.
More preferred, the cavity structure is axially through first substrate.
More preferred, the length of the cavity structure is having a size of 100 μm -5000 μm.
It is arranged by using structural parameters above-mentioned, can enables the good combination of each structure sheaf in the heating plate
Together, facilitate good heating effect, and the yield of integral device can be made to be controlled in higher level.
The other side of the utility model embodiment additionally provide micro- heating plate of the composite construction in prepare it is micro- plus
Application in heat sensor.For example, the utility model embodiment provides a kind of device, described device includes aforementioned composite construction
Micro- heating plate, it is preferred that the apparatus may include micro- heating sensors.
The structure of micro- heating plate of composite construction provided by the utility model is simple, secured, high reliablity, stability are good,
Heating properties are efficient, while its preparation process is simply easily operated, can use MEMS technology Rapid Implementation, are adapted for industry
Metaplasia produces.
Clear, complete description is carried out to the technical solution of the utility model below in conjunction with attached drawing and typical case.
Refering to Figure 1, in an exemplary embodiments of the utility model, a kind of micro- heating plate packet of composite construction
It includes the first substrate 1 and is successively set on the first insulating layer 2, thermal insulation layer 3, heating layer 4, second of the first substrate first surface absolutely
Edge layer 5 and test layer 6, the second surface of first substrate are formed with cavity structure 7, the second surface and first surface phase
Back to setting.Preferably, the cavity structure is axially through first substrate.
Further, first substrate can use high-purity quartz substrate.
Further, second substrate can use Silicon Wafer, i.e. monocrystalline substrate.
Further, first insulating layer, second insulating layer may each be silicon oxide layer.
Further, the thermal insulation layer can be silicon nitride layer.
Further, the heating layer can be by any one or the two or more combinations or its conjunction in Pt, Mo, W
Gold is formed.
Further, the test layer can be is formed by Au and/or Ag or its alloy.
Further, first substrate can be with the first insulating layer by conjunction with anode linkage technique.
Further, first insulating layer, second insulating layer thickness can be 100nm-5000nm.
Further, the thermal insulation layer with a thickness of 100nm-5000nm.
Further, the heating layer with a thickness of 100nm-1000nm.
Further, the test layer with a thickness of 100nm-1000nm.
Further, the length of the cavity structure is having a size of 100 μm -5000 μm.
Micro- heating plate of the embodiment can use MEMS technology production, for example, a kind of method for making micro- heating plate
It can be refering to shown in Fig. 2, Fig. 3.The production method specifically comprises the following steps:
(1) prepare high-purity quartz substrate 1, monocrystalline substrate 8, wherein the thickness of quartz substrate can be about 200-
The thickness of 500um, monocrystalline substrate can be about 200-500um.
(2) monocrystalline substrate is sufficiently cleaned, comprising: a, with the concentrated sulfuric acid, 85 DEG C are boiled 15 minutes；B, it then uses
50wt% potassium hydroxide solution impregnates 10min；C, with acetone soln ultrasound 15min, deionized water solution ultrasound 15min；Later
It is sufficiently dry (120 DEG C of drying about 1h) in vacuum drying oven or nitrogen drying.
(3) growth as the silicon nitride layer 3 of heat insulation layer and is made on a side surface of monocrystalline substrate 8 in the way of CVD
For the silicon oxide layer 2 of insulating layer.Silicon nitride layer 3, silicon oxide layer 2 thickness can be respectively 100nm-5000nm.
(4) using three-dimensional hot press forming technology, hot pressing temperature is controlled in 500-800min, pressure is in 20-100kg, in stone
1 back side of English substrate forms a cavity structure 7 ' (also known as back chamber), can be round, rectangular etc., length size can be 100
μm -5000 μm or so.In this step, the cavity structure is not along axial direction completely through first substrate, that is, in the cavity
There are also the composition materials of the first substrate to remain for structural base, thickness about 20-50um.
(5) anode linkage technique is utilized, control bonding temperature is in 200-500 degree, and pressure is in 10-200MPa, absolutely by first
Edge layer surface is bonded together with the first substrate face.
(6) remaining monocrystalline substrate 8 is removed by reduction process, exposes silicon nitride layer 3.
(7) quartz substrate is carried on the back substrate material extra above chamber to remove with dry etch process, forms cavity structure 7,
And expose silicon oxide layer 2.
(8) heating layer 4 is formed using the metals such as PVD deposition Pt, Mo, W or its alloy on 3 surface of silicon nitride layer.The heating
The thickness of layer can be 100nm-1000nm.
(9) on 4 surface of heating layer, cvd silicon oxide etc. forms insulating layer 5 in the way of CVD.The thickness of the insulating layer can be with
For 100nm-5000nm.
(10) metals such as Au, Ag are deposited in the way of PVD on 5 surface of insulating layer or its alloy is formed plus test layer 6.The survey
The thickness for trying layer can be 100nm-1000nm.
The process conditions of the CVD, PVD, the dry etching that use in aforementioned production method etc. may each be known to industry.
In the production method that the embodiment provides, by the bonding face of Silicon Wafer, being pre-formed certain thickness oxygen
Change layer and nitration case as support, and, in the good cavity structure of quartz substrate back side pre-production, then by Silicon Wafer and high-purity
Quartz substrate combines, and forms the synthesis of silicon and quartz, can then form micro- heating using quartz substrate as support construction
Plate, up to achieving efficient heating properties.The production method is simply easily operated, and it is quickly real to can use MEMS technology
Apply, be suitable for large-scale production, and make the simple and strong in structure of micro- heating plate of composite construction formed, heating efficiency it is high,
High reliablity, good operating stability.
The technology contents and technical characteristic of the utility model have revealed that as above, however those skilled in the art still may be used
Can teaching based on the utility model and announcement and make various replacements and modification without departing substantially from the spirit of the present invention, therefore, this
Utility model protection range should be not limited to the revealed content of embodiment, and should include the various replacements without departing substantially from the utility model
And modification, and covered by present patent application claim.
Claims (10)
1. a kind of micro- heating plate of composite construction, it is characterised in that including the first substrate and be successively set on the first substrate first
The second surface of first insulating layer, thermal insulation layer, heating layer, second insulating layer and the test layer on surface, first substrate is formed
There are cavity structure, the second surface and the opposite facing setting of first surface.
2. micro- heating plate of composite construction according to claim 1, it is characterised in that: first substrate is using quartz lining
Bottom.
3. micro- heating plate of composite construction according to claim 1, it is characterised in that: first insulating layer, second are absolutely
Edge layer uses silicon oxide layer.
4. micro- heating plate of composite construction according to claim 1, it is characterised in that: the thermal insulation layer uses silicon nitride
Layer.
5. micro- heating plate of composite construction according to claim 1, it is characterised in that: the heating layer, test layer use
Structured metal layer.
6. micro- heating plate of composite construction according to claim 1, it is characterised in that: first substrate and the first insulation
Layer is combined by anode linkage technique.
7. micro- heating plate of composite construction according to claim 1, it is characterised in that: first insulating layer, second are absolutely
Edge layer with a thickness of 100nm-5000nm.
8. micro- heating plate of composite construction according to claim 1, it is characterised in that: the thermal insulation layer with a thickness of
100nm-5000nm。
9. micro- heating plate of composite construction according to claim 1, it is characterised in that: the heating layer with a thickness of
100nm-1000nm；And/or the test layer with a thickness of 100nm-1000nm.
10. micro- heating plate of composite construction according to claim 1, it is characterised in that: the cavity structure is passed through along axial direction
Wear first substrate；And/or the length of the cavity structure is having a size of 100 μm -5000 μm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201822231805.3U CN209448911U (en) | 2018-12-28 | 2018-12-28 | Micro- heating plate of composite construction |
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| CN201822231805.3U CN209448911U (en) | 2018-12-28 | 2018-12-28 | Micro- heating plate of composite construction |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109587846A (en) * | 2018-12-28 | 2019-04-05 | 苏州甫电子科技有限公司 | Micro- heating plate of composite construction and preparation method thereof |
| CN116170906A (en) * | 2022-12-06 | 2023-05-26 | 东北林业大学 | MEMS micro-heater of supporting beam and manufacturing method thereof |
-
2018
- 2018-12-28 CN CN201822231805.3U patent/CN209448911U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109587846A (en) * | 2018-12-28 | 2019-04-05 | 苏州甫电子科技有限公司 | Micro- heating plate of composite construction and preparation method thereof |
| CN116170906A (en) * | 2022-12-06 | 2023-05-26 | 东北林业大学 | MEMS micro-heater of supporting beam and manufacturing method thereof |
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