CN209312969U - Coldplate component and battery modules with heating function - Google Patents
Coldplate component and battery modules with heating function Download PDFInfo
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- CN209312969U CN209312969U CN201920370067.2U CN201920370067U CN209312969U CN 209312969 U CN209312969 U CN 209312969U CN 201920370067 U CN201920370067 U CN 201920370067U CN 209312969 U CN209312969 U CN 209312969U
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 111
- 238000001816 cooling Methods 0.000 claims abstract description 135
- 239000010410 layer Substances 0.000 claims description 202
- 238000005538 encapsulation Methods 0.000 claims description 23
- 239000012790 adhesive layer Substances 0.000 claims description 17
- 229920001721 polyimide Polymers 0.000 claims description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- 108010025899 gelatin film Proteins 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 239000011230 binding agent Substances 0.000 abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 239000012528 membrane Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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Abstract
The embodiment of the present application provides a kind of coldplate component and battery modules with heating function.The coldplate component with heating function includes: coldplate, is provided with runner；Heating layer, including at least one resistance wire；And binder course, the heating layer is connect with the coldplate.In coldplate provided by the embodiments of the present application and battery modules, heating layer is connected on the cooling plate by binder course, integrally disposed on coldplate to have heating layer, has heating function, is conducive to improve heating efficiency, realizes reliable heating.
Description
[ technical field ] A method for producing a semiconductor device
The application relates to the technical field of batteries, in particular to a cooling plate assembly with a heating function and a battery module.
[ background of the invention ]
With the gradual improvement of the electric automobile technology and the power battery technology, the requirements on the aspects of energy density, cycle life, safety performance and the like of the power battery pack are gradually improved. The battery module comprises a battery core and a thermal management system. The thermal management system is used for ensuring that the battery cell works in a proper temperature range through cold and hot regulation.
In the prior art, thermal management systems include a cold plate. The cooling plate directly carries out the heat exchange through circulation water route and electric core to cool off respectively and heat electric core, ensure that electric core is at suitable temperature range work. The cooling plate needs to be communicated with the water heater, so that heated liquid exchanges heat with the battery cell through the circulating water path, and the battery cell is heated.
However, the water heater connected to the cooling plate has the defects of high failure rate, high cost, low heating efficiency, etc., which easily causes the failure of the thermal management system and limits the output power of the battery cell, so the practical function of the cooling plate is limited.
In addition, the heating process of current cooling plate is comparatively complicated, and the heat that the heater produced transmits to the cooling plate body through the circulation water route, and then transmits to electric core, and heating efficiency is low.
[ Utility model ] content
In view of this, the embodiment of the present application provides a cooling plate assembly and a battery module with a heating function, which are beneficial to improving the heating efficiency.
In one aspect, a cooling plate assembly having a heating function is provided. This cooling plate subassembly includes:
a cooling plate provided with a flow passage;
a heating layer comprising at least one resistance wire; and
a bonding layer connecting the heating layer and the cooling plate.
Optionally, the bonding layer comprises an encapsulation layer comprising a first insulating layer on one side of the heating layer, the first insulating layer being connected with the cooling plate.
Optionally, the bonding layer comprises an adhesive layer, and the first insulating layer is adhered to the cooling plate through the adhesive layer;
the heat conductivity coefficient of the bonding layer is larger than 0.4W/mk, and the thickness of the bonding layer is smaller than 1 mm.
Optionally, the encapsulation layer further includes a second insulating layer, and the second insulating layer is disposed on a surface of the heating layer facing away from the cooling plate.
Optionally, the thermal conductivity of the encapsulation layer is greater than 0.4W/mk.
Optionally, the encapsulation layer comprises a polyimide film, and the thickness of the polyimide film is 0.05mm-0.6 mm; or,
the packaging layer comprises a silicon gel film, and the thickness of the silicon gel film is 0.8mm-1.6 mm.
Optionally, the cooling plate has a mounting surface for connecting the bonding layer, the mounting surface being arranged approximately planar;
the bonding layer is connected with the mounting surface and is attached to the mounting surface.
In another aspect, a battery module is provided. This battery module includes:
the battery pack comprises a plurality of battery cells which are arranged in a stacked mode; and
the cooling plate assembly is located on one side or multiple sides of the battery pack and extends along the stacking direction of the battery cells.
Optionally, the bonding layer comprises an encapsulation layer encasing the heating layer;
the packaging layer comprises a first insulating layer positioned on one side of the heating layer and a second insulating layer positioned on the other side of the heating layer;
the first insulating layer is connected with the cooling plate;
the second insulating layer dorsad the surface of zone of heating is provided with the heat-conducting layer, the heat-conducting layer with the group battery contact sets up.
In the cooling panel assembly and the battery module with heating function that this embodiment provided, the zone of heating passes through the anchor coat to be connected on the cooling plate, and the integrated zone of heating that is provided with on the cooling plate has the heating function, is favorable to improving heating efficiency, realizes reliable heating.
The cooling plate assembly is assembled on the battery pack, and when the battery pack needs to be heated, heat generated by the working of the heating layer can be transferred to the battery pack to realize heating; when the battery pack needs to be cooled, heat generated by the work of the battery pack can be transferred to the heat exchange medium in the cooling plate, so that cooling is realized.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a cooling plate assembly with a heating function according to a first embodiment of the present application;
FIG. 2 is a cross-sectional view of the cooling plate assembly of FIG. 1;
FIG. 3 is an exploded view of a part of the cooling plate assembly of FIG. 2;
FIG. 4 is a cross-sectional view of a cooling plate assembly provided in accordance with a second embodiment of the present application;
FIG. 5 is an exploded view of a part of the cooling plate assembly of FIG. 4;
FIG. 6 is a schematic structural view of a cooling plate assembly provided in accordance with a third embodiment of the present application;
fig. 7 is a schematic structural diagram of a battery module according to an embodiment of the present disclosure;
fig. 8 is an exploded view of parts of the battery module of fig. 7;
fig. 9 is a schematic view illustrating heat transfer during operation of the heating layer in the battery module of fig. 7.
Fig. 10 is a schematic view illustrating heat transfer during operation of a heating layer in a battery module according to another embodiment of the present application.
In the drawings, the drawings are not necessarily to scale.
Description of the labeling:
1-cooling plate assembly;
10-a cooling plate;
100-a mounting surface;
102-media in and out pipes;
104-a water chamber;
106-flow channel;
12-a heating layer;
120-resistance wire;
122-a wire outlet lug;
14-a power line;
16-a bonding layer;
160-an encapsulation layer;
160 a-a first insulating layer;
160 b-a second insulating layer;
162-an adhesive layer;
2-heat conducting layer;
3-a battery pack;
and (6) 30-cell.
[ detailed description ] embodiments
For better understanding of the technical solutions of the present application, the following detailed descriptions of the embodiments of the present application are provided with reference to the accompanying drawings.
It should be understood that the embodiments described are only a few embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It is to be understood that, unless otherwise indicated, "a plurality" means two or more; the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or order of assembly.
Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present application can be understood as appropriate by one of ordinary skill in the art.
Fig. 1 is a schematic structural diagram of a cooling plate assembly with a heating function according to a first embodiment of the present application. FIG. 2 is a cross-sectional view of the cooling plate assembly of FIG. 1. FIG. 3 is an exploded view of a part of the cooling plate assembly of FIG. 2;
referring to fig. 1 to 3, the cooling plate assembly includes a cooling plate 10, a heating layer 12, and a bonding layer 16. The cooling plate 10 is provided with a flow passage 106, and the flow passage 106 is connected to a circulating water path. A heat exchange medium can flow in the flow channel 106 to exchange heat, so as to adjust the temperature. The cooling plate 10 in this embodiment may be made of a metal material or a non-metal heat conducting material with a better heat conducting property. For example, the cooling plate 10 may be made of iron or aluminum, and has a high thermal conductivity and a good thermal conductivity.
The heating layer 12 comprises at least one resistance wire 120. The resistance wire 120 is an electrical heating element that is switched into the circuit and can be heated when energized. Whether heating is carried out or not can be controlled by switching on or off the control circuit. The bonding layer 16 connects the heating layer 12 to the cooling plate 10.
The cooling plate 10 provided by the embodiment is integrally provided with the heating layer 12, has a heating function, is beneficial to improving the heating efficiency, and realizes reliable heating. The heating layer 12 can perform the heating function even if the heating function of the cooling plate 10 itself fails.
Because the heating effect of the heating layer 12 is better, the heating function can be realized without using the cooling plate 10, the heating requirement can be met by directly providing heat from the heating layer 12 combined on the cooling plate 10, and the cooling function of only using the cooling plate 10 can be selected.
The number and specific arrangement of the resistance wires 120 may be set as desired and are not limited solely by this application. In an alternative example, the resistance wire 120 may be arranged in a zigzag manner, and the length thereof can be set longer, so as to obtain a better heating function.
To ensure safety and insulation of the heater layer 12, the bonding layer 16 may include an encapsulation layer 160. The encapsulation layer 160 includes a first insulating layer 160a between the heating layer 12 and the cooling plate 10, and the first insulating layer 160a is attached to the cooling plate 10. If the cooling plate 10 is a metal cooling plate, the first insulating layer 160a can prevent the heating layer 12 from being electrically connected to the cooling plate 10.
The first insulating layer 160a may be attached to the cooling plate 10 in various ways. In this embodiment, the first insulating layer 160a may be directly bonded to the cooling plate 10 by its material. The first insulating layer 160a is hot-pressed on the surface of the cooling plate 10 in a hot-melt state. After a set time, the first insulating layer 160a is solidified and combined with the cooling plate 10. Thus, the first insulating layer 160a is directly connected to the cooling plate 10.
The first insulating layer 160a may be made of a material with a better thermal conductivity, and has a thin sheet structure. The heat generated from the heating layer 12 can be transferred to the cooling plate 10 through the first insulating layer 160 a. The first insulating layer 160a may be made of a material having a thermal conductivity greater than 0.4W/mk, and has a good thermal conductivity, so as to perform timely and rapid heat transfer.
In an alternative example, the first insulating layer 160a may include a polyimide film (PI film). The polyimide film is of a sheet structure, the thickness D1 of the polyimide film can be set to be 0.05mm-0.6mm, the two side surfaces of the polyimide film can be respectively attached and contacted with the heating layer 12 and the cooling plate 10, and the contact area is large. The polyimide film can carry out timely and rapid heat transfer.
In another alternative example, the first insulating layer 160a may include a silicon gel film. The silica gel membrane is of a sheet structure, the thickness D1 of the silica gel membrane can be set to be 0.8mm-1.6mm, the surfaces of the two sides of the silica gel membrane can be respectively attached and contacted with the heating layer 12 and the cooling plate 10, and the contact area is large. The silica gel membrane can carry out timely and quick heat transfer.
The encapsulation layer 160 may further include a second insulation layer 160b on the other side of the heating layer 12. The second insulating layer 160b is provided on the surface of the heating layer 12 facing away from the cooling plate 10. The first insulating layer 160a and the second insulating layer 160b are respectively located at two sides of the heating layer 12 in the thickness direction, and form an encapsulation layer 160 wrapping the heating layer 12, so that the heating layer 12 can be protected, and the resistance wire 120 is prevented from being conducted with other conductive members except the access circuit. The edge portions of the first insulating layer 160a and the second insulating layer 160b are sealably connected to form a single piece to hermetically enclose the heating layer 12. The first insulating layer 160a and the second insulating layer 160b of the package layer 160 can be made of the same material, so that the connection is firm and the package effect is good.
To electrically connect the encapsulated heater layer 12 to the power supply line 14 of the external circuit, the heater layer 12 may also include a wire outlet lug 122. The resistance wire 120 and the wire outlet lug 122 can be arranged in a sheet shape, and the wire outlet lug 122 is arranged at one end of the resistance wire 120 and is electrically connected with the resistance wire 120. The power line 14 may be disposed through the packaging layer 160, and when the packaging layer 160 is completely packaged and wrapped around the heating layer 12, the power line 14 is electrically connected to the wire outlet lug 122, so as to connect the resistance wire 120 to an external circuit. For example, the power supply line 14 may be disposed through the second insulating layer 160 b.
The cooling plate 1 is applied to a battery module, and the cooling plate 2 may be connected to a battery pack of the battery module. The second insulating layer 160b is made of a material with a better thermal conductivity coefficient, and can transmit heat. The heat generated by the operation of the heating layer 12 can be transferred to the battery pack through the second insulating layer 160b, thereby achieving heating. In an alternative example, the second insulating layer 160b may include a polyimide film. The polyimide film is of a sheet structure, the thickness D2 of the polyimide film can be set to be 0.05mm-0.6mm, the two side surfaces of the polyimide film can be respectively attached and contacted with the heating layer 12 and the battery pack, and the contact area is large. The polyimide film can carry out timely and quick heat transfer, and can transfer heat generated by the heating layer 12 to the battery pack timely and quickly for heating.
In another alternative example, the second insulating layer 160b may include a silicon gel film. The silicone membrane is a sheet structure, and the thickness D2 of the silicone membrane can be set to be 0.8mm-1.6 mm. The pellosil can carry out timely, quick heat transfer, can be timely, with the heat transfer to the group battery of zone of heating 12 production fast, heat.
The bonding layer 16 connects the heating layer 12 to the outer surface of the cooling plate 10, and the outer surface of the cooling plate 10 may be provided with a mounting surface 100 for connecting the bonding layer 16. The first insulating layer 160a can be disposed on the mounting surface 100 in a fitting manner, and the contact area between the first insulating layer 160a and the cooling plate 10 can be set to be large, which is beneficial to heat transfer. The mounting surface 100 may be provided in an approximately planar configuration. The first insulating layer 160a covers the planar mounting surface 100, and is not easily deformed, so that the first insulating layer 160a and the cooling plate 10 are firmly bonded and fixed.
In this embodiment, the cooling plate 10 may be configured as a stamped cooling plate, which includes a base plate and a cover plate, and the base plate or the cover plate is stamped with a groove structure. When the cover plate is connected with the bottom plate, a flow passage 106 for the heat exchange medium to flow circularly is enclosed. The cover plate is provided with two medium inlet and outlet pipes 14 for respectively connecting to the flow channels 106 to form a circulating water path for the inflow and outflow of the medium. One side surface of the cooling plate 10 is formed with a planar structure having a large area, which can be used to provide the installation surface 100.
It can be understood that heat generated during the operation of the battery pack may also be transferred to the low-temperature heat exchange medium in the flow channel 106 through the second insulating layer 160b, the heating layer 12 and the first insulating layer 160a, so that heat exchange is performed through the circulating water channel to achieve a cooling function.
FIG. 4 is a cross-sectional view of a cooling plate assembly provided in a second embodiment of the present application. Fig. 5 is an exploded view of a part of the cooling plate assembly of fig. 4.
In the first embodiment, the structure of the cooling plate assembly is explained. In this embodiment, differences from the first embodiment are mainly described, and the same structure is not described repeatedly in this embodiment.
Referring to fig. 4 and 5, the bonding layer 16 includes an encapsulation layer 160 and an adhesive layer 162. The encapsulation layer 160 includes a first insulating layer 160a between the heating layer 12 and the cooling plate 10. The first insulating layer 160a is bonded to the cooling plate 10 by an adhesive layer 162. Both side surfaces of the adhesive layer 162 are respectively adhered to the first insulating layer 160a and the cooling plate 10, and the first insulating layer 160a and the cooling plate 10 are adhesively fixed.
The adhesive layer 162 is made of a material with a better thermal conductivity coefficient and has a thin sheet structure. In a preferred example, the adhesive layer 162 may be made of a material having a thermal conductivity greater than 0.4W/mk, which has a better thermal conductivity. The thickness D3 of the adhesive layer 162 may be set to be less than 1mm, and both side surfaces thereof are in contact with the outer surfaces of the first insulating layer 160a and the cooling plate 10, respectively, so that the contact area is large.
The first insulating layer 160a and the bonding layer 162 are made of a material with a better thermal conductivity coefficient, and have a thin sheet structure, so that timely and rapid heat transfer can be performed.
The bonding layer 16 connects the heating layer 12 to the cooling plate 10, and the cooling plate 10 is provided with a mounting surface 100 for connecting the bonding layer 16. The adhesive layer 162 can be attached to the mounting surface 100, and the contact area between the first insulating layer 160a and the cooling plate 10 can be set large, which is beneficial to heat transfer. The mounting surface 100 may be a planar structure, and the adhesive layer 162 is not easily deformed when covering the mounting surface 100, so that the adhesive layer 162 can firmly adhere and fix the first insulating layer 160a and the cooling plate 10.
It can be understood that heat generated when the battery pack operates is transferred to the low-temperature heat exchange medium in the cooling plate 10 sequentially through the second insulating layer 160b, the heating layer 12, the first insulating layer 160a, and the adhesive layer 162 to exchange heat, thereby achieving cooling.
Fig. 6 is a schematic structural diagram of a cooling plate according to a third embodiment of the present application.
In the first and second embodiments, the structure of the cooling plate assembly is explained. In this embodiment, differences from the first and second embodiments are mainly described, and the same structure is not described repeatedly in this embodiment.
Referring to fig. 6, the cooling plate 1 is a flat tube type cooling plate, which includes a plurality of split cooling plates with sub-channels, and the split cooling plates are provided with sub-channels. The split cold plates are assembled and connected to form the cooling plate 10, and the sub-channels of the split cold plates are mutually communicated and jointly form a channel 106 for circulating liquid. Two ends of the flat tube type cooling plate 10 are respectively provided with a water chamber 104, and the water chambers 104 at the two ends are respectively communicated with two medium inlet and outlet pipelines 102 for respectively supplying heat exchange media to flow in and out. One side surface of the cooling plate 10 is formed with a large-area planar structure for being disposed as the mounting surface 100. The first embodiment first insulating layer 160a or the second embodiment adhesive layer 162 may be attached to the mounting surface 100.
It should be noted that, due to the limitation of the manufacturing process, when the mounting surface 100 of the flat tube type cooling plate 10 cannot be completely provided with a planar structure and has a concave-convex structure, the first insulating layer 160a in the first embodiment or the adhesive layer 162 in the second embodiment may avoid the concave-convex structure.
Fig. 7 is a schematic structural diagram of a battery module according to an embodiment of the present disclosure.
Referring to fig. 7, the battery module includes a battery pack 3 and a cooling plate assembly 1 provided in any one of the above embodiments. The battery pack 3 includes a plurality of battery cells 30 arranged in a stacked manner. The cooling plate assembly 1 is assembled on one or more sides of the battery pack 3, and the heating layer 12 is disposed to extend in the stacking direction of the battery cells 30.
Heat can be transferred between the battery pack 3 and the cooling plate assembly 1. When the heat exchange medium flows through the flow channel 106 of the cooling plate 10, the battery pack 3 exchanges heat with the cooling plate 10, and the battery pack 3 can be heated or cooled to adjust the temperature.
When the battery pack 3 needs to be heated, the heat generated by the heating layer 12 can be transferred to the battery pack 3, so that heating is realized. When the battery pack 3 needs to be cooled, heat generated by the operation of the battery pack 3 can be transferred to the heat exchange medium in the cooling plate 10, so that cooling is realized.
The heating layer 12 is connected to the cooling plate 10 through the bonding layer 16, and the heating layer 12 is integrally arranged on the cooling plate 10, so that the heating function is realized, the heating efficiency is improved, and the reliable heating is realized. The resistive layer 12 can perform the heating function even if the heating function of the cooling plate 10 itself fails.
Because the heating effect of the heating layer 12 is better, the heating function can be realized without using the cooling plate 10, the heating requirement can be met by directly providing heat through the heating layer 12, and the cooling function of the cooling plate 10 is only selected to be used.
The mounting structure of the battery pack and the cooling plate assembly will be further described below.
Fig. 8 is an exploded view of parts of the battery module of fig. 7. Fig. 9 is a schematic view illustrating heat transfer during operation of the heating layer in the battery module of fig. 7, wherein the cooling plate assembly is the cooling plate assembly provided in the first embodiment. Fig. 10 is a schematic view illustrating heat transfer during operation of a heating layer in a battery module according to another embodiment of the present application, in which a cooling plate assembly is used as the cooling plate assembly according to the second embodiment.
Referring to fig. 8-10, bonding layer 16 includes an encapsulation layer 160 that encapsulates heater layer 12. The encapsulation layer 160 includes a first insulation layer 160a located at one side of the heating layer 12 and a second insulation layer 160b located at the other side of the heating layer 12. The bonding layer 16 and the encapsulation layer 160 may be selected from the bonding layer 16 and the encapsulation layer 160 provided in the first embodiment or the second embodiment.
The second insulating layer 160b may be provided in contact with the bottom wall and/or the side wall of the battery pack 3 through the heat conductive layer 2. The heat conducting layer 2 is disposed such that one side surface thereof is in contact with the second insulating layer 160b and the other side surface thereof is in contact with the battery pack 3, so that heat generated when the heating layer 12 operates can be transferred to the battery pack 3. For example, the heat conductive layer 2 may be provided as a heat conductive silicone pad, and the heat conductive silicone pad 2 may bond the second insulating layer 160b with the battery pack 3.
The heat conducting layer 2 is in contact with the battery pack 3, and heat can be timely and quickly transferred between the battery pack 3 and the cooling plate assembly 1.
When the battery pack 3 needs to be heated, the heat generated by the operation of the heating layer 12 can be transferred to the battery pack 3 through the second insulating layer 160b and the heat conducting layer 2, so as to realize heating.
If an abnormal situation occurs in which the cooling plate assembly 1 and the battery pack 3 are not in close contact, the cooling plate 10 can transfer heat generated from the heating layer 12 to the battery pack 3 and the air, thereby preventing heat from accumulating between the cooling plate assembly 1 and the battery pack 3, resulting in a local temperature increase and a high heat generation event.
When the battery pack 3 needs to be cooled, heat generated by the operation of the battery pack 3 can be transferred to the low-temperature heat exchange medium in the flow channel 106 through the heat conduction layer 2 and the cooling plate assembly 1 to realize heat exchange, so that the temperature of the battery pack 3 is reduced; the heat generated by the battery pack 3 during operation can be transferred to the low-temperature heat exchange medium in the flow channel 106 through the air medium to realize heat exchange, so that the temperature of the battery pack 3 is reduced.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the scope of protection of the present application.
Claims (9)
1. A cooling plate assembly (1) with heating function, characterized by comprising:
a cooling plate (10) provided with a flow channel (106);
a heating layer (12) comprising at least one resistance wire (120); and
a bonding layer (16) connecting the heating layer (12) with the cooling plate (10).
2. The cooling plate assembly (1) according to claim 1, wherein the bonding layer (16) comprises an encapsulation layer (160), the encapsulation layer (160) comprising a first insulating layer (160a) on the side of the heating layer (12), the first insulating layer (160a) being connected with the cooling plate (10).
3. The cooling plate assembly (1) according to claim 2, wherein the bonding layer (16) comprises an adhesive layer (162), the first insulating layer (160a) being adhered to the cooling plate (10) by the adhesive layer (162);
the heat conductivity coefficient of the bonding layer (162) is larger than 0.4W/mk, and the thickness of the bonding layer (162) is smaller than 1 mm.
4. The cooling plate assembly (1) according to claim 2, wherein the encapsulation layer (160) further comprises a second insulating layer (160b), the second insulating layer (160b) being provided at a surface of the heating layer (12) facing away from the cooling plate (10).
5. The cooling plate assembly (1) according to claim 2 or 4, wherein the thermal conductivity of the encapsulation layer (160) is larger than 0.4W/mk.
6. The cooling plate assembly (1) according to claim 5, wherein the encapsulation layer (160) comprises a polyimide film having a thickness of 0.05mm-0.6 mm; or,
the packaging layer (160) comprises a silicon gel film, and the thickness of the silicon gel film is 0.8mm-1.6 mm.
7. Cooling plate assembly (1) according to claim 1, wherein the cooling plate (10) has a mounting face (100) for connecting the bonding layer (16), the mounting face (100) being arranged approximately planar;
the bonding layer (16) is connected with the mounting surface (100) and is attached to the mounting surface (100).
8. A battery module, comprising:
the battery pack (3) comprises a plurality of battery cells (30) which are arranged in a stacked mode; and
the cooling plate assembly (1) of any of claims 1-7, located on one or more sides of the battery pack (3) and extending in a stacking direction of the battery cells (30).
9. The battery module according to claim 8, wherein the bonding layer (16) comprises an encapsulation layer (160) that wraps the heating layer (12);
the encapsulation layer (160) comprises a first insulating layer (160a) on one side of the heating layer (12) and a second insulating layer (160b) on the other side;
the first insulating layer (160a) is connected to the cooling plate (10);
the surface of second insulating layer (160b) dorsad zone of heating (12) is provided with heat-conducting layer (2), heat-conducting layer (2) with group battery (3) contact setting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920370067.2U CN209312969U (en) | 2019-03-22 | 2019-03-22 | Coldplate component and battery modules with heating function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920370067.2U CN209312969U (en) | 2019-03-22 | 2019-03-22 | Coldplate component and battery modules with heating function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209312969U true CN209312969U (en) | 2019-08-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920370067.2U Active CN209312969U (en) | 2019-03-22 | 2019-03-22 | Coldplate component and battery modules with heating function |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113115490A (en) * | 2021-05-10 | 2021-07-13 | 秦皇岛中晟太阳能科技有限公司 | Electric hot plate and encapsulation equipment |
| CN113140830A (en) * | 2020-01-20 | 2021-07-20 | 广州力及热管理科技有限公司 | Temperature-equalizing plate element with heating function and power battery module applying same |
-
2019
- 2019-03-22 CN CN201920370067.2U patent/CN209312969U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113140830A (en) * | 2020-01-20 | 2021-07-20 | 广州力及热管理科技有限公司 | Temperature-equalizing plate element with heating function and power battery module applying same |
| CN113115490A (en) * | 2021-05-10 | 2021-07-13 | 秦皇岛中晟太阳能科技有限公司 | Electric hot plate and encapsulation equipment |
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