CN209234104U - A kind of flexible circuit board with stiffening plate - Google Patents
A kind of flexible circuit board with stiffening plate Download PDFInfo
- Publication number
- CN209234104U CN209234104U CN201821632162.7U CN201821632162U CN209234104U CN 209234104 U CN209234104 U CN 209234104U CN 201821632162 U CN201821632162 U CN 201821632162U CN 209234104 U CN209234104 U CN 209234104U
- Authority
- CN
- China
- Prior art keywords
- copper layer
- stiffening plate
- printed circuit
- flexible printed
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 44
- 229910052802 copper Inorganic materials 0.000 claims abstract description 44
- 239000010949 copper Substances 0.000 claims abstract description 44
- 239000013039 cover film Substances 0.000 claims abstract description 19
- 230000003014 reinforcing effect Effects 0.000 claims description 20
- 239000003351 stiffener Substances 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 10
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 9
- 230000002349 favourable effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000005587 bubbling Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
This application discloses a kind of flexible circuit board with stiffening plate, comprising: the first ground connection layers of copper is stacked the first PI cover film, conducting resinl, stiffening plate in the first ground connection layers of copper；Wherein, the first PI cover film has windowed regions, so that stiffening plate is bonded by windowed regions with the first ground connection layers of copper by conducting resinl.The application is provided with windowed regions due to the first PI cover film, stiffening plate can be bonded by windowed regions and the first ground connection layers of copper, stiffening plate is not only set to form good earthing effect, also help the discharge of heat and steam, and then flexible circuit board in electronic product production process can be reduced and sheet deformation occur, bubble and stiffening plate fall off and other issues, it avoids flexible circuit board and welds scrapping for material, improve the yield of product, production cost is reduced, the competitiveness of product in market is enhanced.
Description
Technical Field
The utility model relates to a circuit board preparation field especially relates to a take flexible printed circuit of stiffening plate.
Background
The Flexible Printed Circuit (FPC) is mainly another type of Printed Circuit board in which a substrate is different from a rigid Printed Circuit board, can be bent, wound, or the like, can be flexibly arranged according to an installation space, and is not limited by the installation space, thereby realizing integration of electronic component assembly and wire connection. Generally, the grounding copper layer of the FPC is closely attached to a stiffener (e.g., a steel sheet) by a conductive adhesive, and the stiffener can be a good medium for internal heat dissipation and static conduction.
However, in the production process of electronic products, the FPC needs to undergo a part of high temperature treatment process, such as a high temperature Surface Mount Technology (SMT) component welding process, and if the sealed area at the joint of the ground copper layer of the FPC and the reinforcing plate does not have a good heat dissipation and water vapor dissipation design, the heated expanding gas and water vapor inside cannot be discharged, which may cause bubbles in the local area of the FPC, deformation of the plate, and severe falling off of the reinforcing plate, etc., so that the FPC product is directly scrapped, thereby reducing the production yield and increasing the production cost.
Therefore, how to avoid the quality problems of the FPC, such as deformation of the board, bubbling, and falling of the reinforcing plate, is a technical problem to be solved urgently by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model aims at providing a take flexible printed circuit board of stiffening plate can do benefit to the discharge of heat and steam, reduces the flexible printed circuit board and appears panel deformation in the electronic product production process, and quality problems such as bubble and stiffening plate drop. The specific scheme is as follows:
a flexible circuit board with a reinforcing plate comprises: the first PI cover film, the conductive adhesive and the reinforcing plate are arranged on the first grounding copper layer in a laminated mode; wherein,
the first PI cover film is provided with a windowing area, so that the reinforcing plate is attached to the first grounding copper layer through the windowing area by means of the conductive adhesive.
Preferably, in the flexible printed circuit with a stiffener according to an embodiment of the present invention, the windowing region is located at an edge of the first PI cover film.
Preferably, in the flexible printed circuit with a stiffener provided by an embodiment of the present invention, the flexible printed circuit further includes: the substrate is positioned on the lower surface of the first grounding copper layer, the second grounding copper layer is positioned on the lower surface of the substrate, and the second PI cover film is positioned on the lower surface of the second grounding copper layer;
a through hole is arranged right below the windowing area; the via hole penetrates through the first ground copper layer, the substrate, and the second ground copper layer.
Preferably, in the flexible printed circuit with a stiffener according to an embodiment of the present invention, the diameter of the via hole is greater than or equal to 0.2 mm.
Preferably, in the flexible printed circuit with a stiffener according to an embodiment of the present invention, the first grounding copper layer is in a grid shape.
Preferably, in the flexible printed circuit with a stiffener according to an embodiment of the present invention, the second grounding copper layer is in a grid shape.
Preferably, in the flexible printed circuit with the stiffening plate provided by an embodiment of the present invention, the stiffening plate is a steel plate.
The utility model provides a take flexible printed circuit of stiffening plate, include: the first PI cover film, the conductive adhesive and the reinforcing plate are arranged on the first grounding copper layer in a laminated mode; the first PI cover film is provided with a windowing area so that the reinforcing plate is attached to the first grounding copper layer through the windowing area by means of conductive adhesive. The utility model discloses because first PI covers the membrane and is provided with windowing regionally, the stiffening plate can be through windowing region and the laminating of first ground connection copper layer, not only make the stiffening plate form good ground connection effect, still be favorable to the discharge of heat and steam, and then can reduce the flexible printed circuit board appearance panel deformation in the electronic product production process, play quality problems such as bubble and stiffening plate drop, avoided scrapping of flexible printed circuit board and welding material, the yield of improvement product, and the production cost is reduced, the market competitiveness of reinforcing product.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a flexible printed circuit with a stiffener according to an embodiment of the present invention;
fig. 2 is a second schematic structural diagram of a flexible printed circuit with a stiffener according to an embodiment of the present invention;
fig. 3 is a third schematic structural diagram of a flexible printed circuit with a stiffener according to an embodiment of the present invention;
fig. 4 is a top view of a first grounding copper layer according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model provides a take flexible printed circuit board of stiffening plate, as shown in fig. 1, include: a first grounding copper layer 1, a first PI cover film 2, a conductive adhesive 3 and a reinforcing plate 4 which are arranged on the first grounding copper layer 1 in a laminated manner; wherein,
the first PI cover film 2 has a window area a, so that the reinforcing plate 4 is attached to the first ground copper layer 1 through the window area a by the conductive adhesive 3.
The embodiment of the utility model provides an among the above-mentioned flexible printed circuit who takes stiffening plate that provides, because first PI covers the membrane and is provided with the windowing region, the stiffening plate can laminate with first ground connection copper layer through the windowing region, not only makes the stiffening plate form good ground connection effect, still is favorable to the discharge of heat and steam.
Further, in the implementation of the present invention, in the flexible printed circuit board with a stiffener, as shown in fig. 2, the windowing region a may be located at the edge of the first PI cover film 2. It can also be said that, the regional A of windowing can be adjusted to flexible printed circuit board appearance edge, is favorable to heat and steam to follow edge discharge like this, and the effect is better, prevents that flexible printed circuit board and stiffening plate laminating department from leading to the stiffening plate to drop because of the high temperature bubbly.
Further, in practical implementation, as shown in fig. 3, the flexible printed circuit with a stiffener according to an embodiment of the present invention may further include: a substrate 5 positioned on the lower surface of the first grounding copper layer 1, a second grounding copper layer 6 positioned on the lower surface of the substrate 5, and a second PI cover film 7 positioned on the lower surface of the second grounding copper layer 6; a through hole B is arranged right below the windowing area A; the via hole B penetrates the first ground copper layer 1, the substrate 5, and the second ground copper layer 6. It should be noted that the via is electrically neutral, may have a diameter greater than or equal to 0.2mm, and the via design is more conducive to heat and moisture removal.
When the embodiment of the present invention is implemented, in the above-mentioned flexible printed circuit with a reinforcing plate provided in the embodiment of the present invention, as shown in fig. 4, the first grounding copper layer 1 can be set to be latticed, so that the existing local solid copper is changed into grid copper, which can increase the contact area and is more favorable for the discharge of heat and water vapor. Similarly, the second grounding copper layer can also be arranged in a grid shape, so that the effect is better.
When specifically implementing, in the utility model provides an among the above-mentioned flexible printed circuit who takes the stiffening plate, the stiffening plate can select for the steel sheet, to the setting of stiffening plate, as long as satisfy thermal diffusivity and electric conductivity all good can, do not restrict here.
To sum up, the embodiment of the utility model provides a take flexible printed circuit board of stiffening plate, include: the first PI cover film, the conductive adhesive and the reinforcing plate are arranged on the first grounding copper layer in a laminated mode; the first PI cover film is provided with a windowing area so that the reinforcing plate is attached to the first grounding copper layer through the windowing area by means of conductive adhesive. The utility model discloses because first PI covers the membrane and is provided with windowing regionally, the stiffening plate can be through windowing region and the laminating of first ground connection copper layer, not only make the stiffening plate form good ground connection effect, still be favorable to the discharge of heat and steam, and then can reduce the flexible printed circuit board appearance panel deformation in the electronic product production process, play quality problems such as bubble and stiffening plate drop, avoided scrapping of flexible printed circuit board and welding material, the yield of improvement product, and the production cost is reduced, the market competitiveness of reinforcing product.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The flexible printed circuit with the stiffening plate provided by the present invention is described in detail above, and the principle and the implementation of the present invention are explained by applying a specific example, and the description of the above embodiment is only used to help understanding the method and the core idea of the present invention; meanwhile, for the general technical personnel in the field, according to the idea of the present invention, there are changes in the specific implementation and application scope, to sum up, the content of the present specification should not be understood as the limitation of the present invention.
Claims (7)
1. A flexible printed circuit with a reinforcing plate, comprising: the first PI cover film, the conductive adhesive and the reinforcing plate are arranged on the first grounding copper layer in a laminated mode; wherein,
the first PI cover film is provided with a windowing area, so that the reinforcing plate is attached to the first grounding copper layer through the windowing area by means of the conductive adhesive.
2. The flexible circuit board with stiffener of claim 1, wherein the windowed area is located at an edge of the first PI cover film.
3. The flexible wiring board with a reinforcing plate according to claim 1 or 2, further comprising: the substrate is positioned on the lower surface of the first grounding copper layer, the second grounding copper layer is positioned on the lower surface of the substrate, and the second PI cover film is positioned on the lower surface of the second grounding copper layer;
a through hole is arranged right below the windowing area; the via hole penetrates through the first ground copper layer, the substrate, and the second ground copper layer.
4. The flexible printed circuit with a stiffener according to claim 3, wherein the via hole has a diameter greater than or equal to 0.2 mm.
5. The flexible printed circuit with stiffener of claim 4, wherein the first grounding copper layer is in a grid shape.
6. The flexible printed circuit with stiffener of claim 5, wherein the second grounding copper layer is in a grid shape.
7. The flexible printed circuit with a stiffener according to claim 1, wherein the stiffener is a steel plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821632162.7U CN209234104U (en) | 2018-10-08 | 2018-10-08 | A kind of flexible circuit board with stiffening plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821632162.7U CN209234104U (en) | 2018-10-08 | 2018-10-08 | A kind of flexible circuit board with stiffening plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209234104U true CN209234104U (en) | 2019-08-09 |
Family
ID=67499654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821632162.7U Active CN209234104U (en) | 2018-10-08 | 2018-10-08 | A kind of flexible circuit board with stiffening plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209234104U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112105157A (en) * | 2020-08-31 | 2020-12-18 | 广州源康精密电子股份有限公司 | Processing method for increasing bonding force of reinforcing film of flexible circuit board |
| CN113395821A (en) * | 2021-05-17 | 2021-09-14 | 景旺电子科技(龙川)有限公司 | Flexible circuit board for side key fingerprint identification and manufacturing method thereof |
-
2018
- 2018-10-08 CN CN201821632162.7U patent/CN209234104U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112105157A (en) * | 2020-08-31 | 2020-12-18 | 广州源康精密电子股份有限公司 | Processing method for increasing bonding force of reinforcing film of flexible circuit board |
| CN113395821A (en) * | 2021-05-17 | 2021-09-14 | 景旺电子科技(龙川)有限公司 | Flexible circuit board for side key fingerprint identification and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN209234104U (en) | A kind of flexible circuit board with stiffening plate | |
| CN101472398B (en) | Multilayer flexible printed circuit board and method of manufacturing the same | |
| CN205961580U (en) | A compound glued membrane component that hinders for production of printed circuit board | |
| CN102238809A (en) | Flexible printed circuit (FPC) hollowed board and manufacturing method thereof | |
| CN104470250A (en) | Manufacturing method for flexible and rigid combined circuit board | |
| CN104735923B (en) | A kind of preparation method of rigid-flex combined board | |
| WO2017012233A1 (en) | Method for manufacturing stacked circuit board, and stacked circuit board | |
| CN207367636U (en) | A kind of hot melt adhesive film and FFC lines with shield effectiveness | |
| CN102083272B (en) | Circuit board with grounding structure | |
| CN206323642U (en) | A kind of FPC diaphragms | |
| CN104427740A (en) | Circuit board and manufacturing method thereof | |
| CN203482483U (en) | Circuit board | |
| CN102307433B (en) | Method for manufacturing flexible printed circuit board | |
| CN110493953A (en) | A kind of circuit board and preparation method thereof of low-cost aluminum production route | |
| CN206118157U (en) | Utensil electromagnetic shielding film's rigid -flex circuit board | |
| CN207766656U (en) | Fusing type flexible circuit board | |
| CN105916291A (en) | Method for manufacturing high-density interconnected printed circuit board | |
| CN216873450U (en) | Laminated structure of printed circuit board and printed circuit board | |
| CN209845427U (en) | Single-layer or multi-layer die-cut flexible circuit board | |
| CN203788548U (en) | Flexible circuit board | |
| CN219876240U (en) | Auxiliary edge structure of PCB | |
| CN220874788U (en) | Circuit board with conductive double-sided adhesive, touch panel and electronic equipment | |
| CN101087491A (en) | Electronic device, display apparatus, flexible circuit board and fabrication method thereof | |
| CN204272494U (en) | A kind of flexible circuit board | |
| CN214335693U (en) | Touch screen glass panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |