CN209216975U - Display device - Google Patents

Abstract

The display device of one embodiment has flexible array substrate and collapsible part.Array substrate has display unit, bending section and mounting portion.The display area for having display image is divided in display unit.External circuit substrate is installed in mounting portion.Bending section is bent and display unit is connected with mounting portion.Collapsible part is formed by the material of the stimulating responsive shunk in response to heat or light.

Description

Display device

Cross reference to related applications

The Japanese patent application 2017-226203 that the application was submitted based on November 24th, 2017, and advocate its priority, Herein by reference to and introduce entire contents.

Technical field

The embodiments of the present invention is related to the display device for making mounting portion turn back at the back side of display unit.

Background technique

It has been known that there is the display device (examples for making the mounting portion for being equipped with external circuit substrate etc. turn back at the back side of display unit Such as, referring to JP2017-142375A and JP2017-97096A).Display unit and mounting portion utilize the cloth for being formed in bending section Line electrical connection.When bending section to be bent, worry that wiring is caused to be broken because of strain.The shape of bending section is designed to wiring and is located at The neutral surface of strain will not be generated.

Composition according to display device is difficult to for being bent as design bending section sometimes.Bending section is not being bent to In the case where the shape being pre-designed, neutral surface deviates and applies burden to wiring.The purpose of this utility model is to provide curved The excellent display device of the form accuracy of pars convoluta.

Utility model content

The display device of one embodiment has flexible base plate and collapsible part.Flexible base plate has display unit, peace Dress portion and bending section.The display area for having display image is divided in display unit.External circuit substrate is installed in mounting portion. Bending section is bent and display unit is connected with mounting portion.Collapsible part is by the stimulating responsive that shrinks in response to heat or light Material is formed.

According to such composition, it is capable of providing the excellent display device of the form accuracy of bending section.

Detailed description of the invention

Fig. 1 is the perspective view for indicating the schematic configuration of display device of present embodiment.

Fig. 2 is the sectional view of the construction of the display panel in display area.

Fig. 3 is the sectional view of the construction of the bending section of the state before bending.

Fig. 4 is the sectional view of the construction of the bending section of the state after bending.

Fig. 5 is the perspective view for indicating the first variation of present embodiment.

Fig. 6 is the perspective view for indicating the second variation of present embodiment.

Specific embodiment

Several embodiments are directed at while referring to attached drawing to be illustrated.In addition, open is an example, this field skill That art personnel are readily appreciated, holding utility model purport suitably change is included in the scope of the utility model certainly. In addition, attached drawing is schematically represented compared with actual form sometimes, but this is an example in order to make explanation definitely Son, and the explanation of non-limiting the utility model.In the various figures, sometimes to the same or similar omitting elements continuously configured Appended drawing reference.In addition, in this specification and each figure, sometimes to it is stated that the figure crossed plays same or similar function Constituent element mark it is identical referring to appended drawing reference, omit duplicate detailed description.

In addition, in the present specification, " α includes A, B or C ", " α includes some in A, B and C ", " α include from This kind of expression of one selected in the group being made of A, B and C ", as long as not expressing especially, being not excluded for α includes the more of A~C The case where a combination.Moreover, this kind of expression is also not excluded for the case where α includes other element.

In various embodiments, as an example of display device, the open display as organic EL display device is filled Set DSP.In addition, display device DSP is also possible to liquid crystal display device etc..Display device DSP is for example able to use in intelligent hand Machine, tablet terminal, mobile telephone, personal computer, radiovisor, car-mounted device, game station, wearable terminal Etc. various devices.

Fig. 1 is the perspective view for indicating the schematic configuration of display device DSP of present embodiment.As shown in Figure 1, this embodiment party The display device DSP of formula has the display panel PNL for showing image on the display face and the movement for controlling the display panel PNL External circuit substrate FPC.Although it is not shown, display panel can be also equipped with the touch panel etc. for being overlapped in display panel PNL.

Display panel PNL has array substrate 10, cephacoria 20, caudacoria 30 and collapsible part 40.The formation of array substrate 10 For substantially rectangular sheet, the back side 10B with display surface 10A and the side opposite with display surface 10A.Cephacoria 20 is fixed on battle array The display surface 10A of column substrate 10.Caudacoria 30 and collapsible part 40 are fixed on the back side 10B of array substrate 10.

Array substrate 10 includes display unit 11, the bending section 12 abutted with display unit 11 and abuts with bending section 12 Mounting portion 13.Bending section 12 is equivalent to part shown in the bottom right oblique line in Fig. 1, can bend.Array substrate 10 is flexible One example of substrate.Collapsible part 40 shown in upper right oblique line is fixed on back side 10B in bending section 12.About collapsible part 40, it is described in detail later referring to Fig. 3 to Fig. 6.

The display area DA for having display image is divided on the display surface 10A of display unit 11.Display unit 11 also may include By the non-display area NDA of the display area DA frame-shaped surrounded.In the DA of display area, multiple pixels are arranged with rectangular PX.Pixel PX is the minimum unit for constituting color image, includes aftermentioned organic EL element OLED1, OLED2, OLED3.

External circuit substrate FPC is installed in mounting portion 13.Control module CTR etc. is installed in external circuit substrate FPC. Control module CTR is successively received from mainboard of the electronic equipment carried for display device DSP etc. for showing in display area DA A frame sign image data.The information such as display color of the image data including, for example, each pixel PX.Control module CTR is based on The image data received will be used to that the signal of each pixel PX to be driven to supply to display panel PNL.

Fig. 2 is the sectional view of the construction of the display panel PNL in the DA of display area.Cephacoria 20 and caudacoria 30 are in thickness side It is opposed on Z.Hereinafter, cephacoria 20 is defined as upside, from cephacoria 20, caudacoria 30 is defined as down from caudacoria 30 Side.

As shown in Fig. 2, array substrate 10 has flexible substrate 50, first to fourth insulating layer 51,52,53,54, reflection Layer 55, rib 56, sealant 57, switch element SW1, SW2, SW3, organic EL element OLED1, OLED2, OLED3.Flexible substrate 50 by having flexible and polyimide resin of insulating properties etc. to be formed, with the first face 50A and opposite with the first face 50A Second face 50B of side.

First face 50A of flexible substrate 50 is covered by the first insulating layer 51.Switch element SW1, SW2, SW3 are formed in The upside of one insulating layer 51.In the example in the figures, switch element SW1, SW2, SW3 is configured to the thin film transistor (TFT) of top gate type, But also it is configured to the thin film transistor (TFT) of bottom gate type.

In addition, switch element SW2, SW3 have the function of with switch element SW1 same shape and.Therefore, it represents Switch element SW1 is described in detail to property, about switch element SW2, SW3, repeat description is omitted.Switch element SW1 has Semiconductor layer SC on the first insulating layer 51.Semiconductor layer SC and the first insulating layer 51 are covered by second insulating layer 52 Lid.

The gate electrode WG of switch element SW1 is formed on second insulating layer 52, opposed with semiconductor layer SC.Grid electricity Pole WG and second insulating layer 52 are covered by third insulating layer 53.First is for example aoxidized by silicon to third insulating layer 51,52,53 The mineral-type materials such as object, silicon nitride are formed.

The source electrode WS and drain electrode WD of switch element SW1 is respectively arranged on third insulating layer 53.Source electrode electricity Pole WS and drain electrode WD is electrically connected via the contact hole of perforation second and third insulating layer 52,53 with semiconductor layer SC It connects.

Switch element SW1 and third insulating layer 53 are covered by the 4th insulating layer 54.4th insulating layer 54 is for example by propylene Acids organic film, polyimide organic film are formed.Reflecting layer 55 is set on the 4th insulating layer 54.Reflecting layer 55 for example by The high metal material of the light reflectivities such as aluminium, silver is formed.In addition, the surface in reflecting layer 55 can be flat surface, it is also possible to assign Light scattering male and fomale(M&F).

Organic EL element OLED1, OLED2, OLED3 are set on the 4th insulating layer 54, for example, issue respectively red (R), The light of green (G), blue (B).Organic EL element OLED1 includes pixel electrode PE1 and organic luminous layer ORG1.Equally, organic EL element OLED2 includes pixel electrode PE2 and organic luminous layer ORG2.Organic EL element OLED3 includes pixel electrode PE3 and has Machine luminescent layer ORG3.

Organic EL element OLED1, OLED2, OLED3 also include common electrode CE.In addition, organic EL element OLED1, OLED2, OLED3 can also also include hole transporting layer (not shown), electron supplying layer.Pixel electrode PE1, PE2, PE3 and Common electrode CE by indium tin oxide (ITO), indium-zinc oxide (IZO) etc. there is the conductive material of translucency to be formed.

Pixel electrode PE1, PE2, PE3 are set on reflecting layer 55.Organic EL element OLED1 is by making pixel electrode PE1 It contacts with the drain electrode WD of switch element SW1, and is electrically connected with switch element SW1.Equally, organic EL element OLED2 passes through Pixel electrode PE2 and be electrically connected with switch element SW2.Organic EL element OLED3 passes through pixel electrode PE3 and switch element SW3 electrical connection.

Organic luminous layer ORG1 is set on pixel electrode PE1.Equally, organic luminous layer ORG2 is set to pixel electrode PE2 On, organic luminous layer ORG3 is set on pixel electrode PE3.Organic luminous layer ORG1, ORG2, ORG3 are drawn respectively by rib 56 Point.Organic luminous layer ORG1, ORG2, ORG3 and the shared electrode CE of rib 56 covering.

Sealant 57 covers from above organic EL element OLED1, OLED2, OLED3, so that array substrate 10 be sealed.It is close The anti-block of sealing 57, entrance of the moisture to organic EL element OLED1, OLED2, OLED3, inhibition organic EL element OLED1, The deterioration of OLED2, OLED3.Sealant 57 is for example made of the laminated body of organic film and inoranic membrane.

Cephacoria 20 is adhered to sealant 57 by adhesive layer AD1.Cephacoria 20 is, for example, the inclined of the outer light bring influence of inhibition Shake piece.In addition, cephacoria 20 can be the phase plate of the phase difference of compensation circular polarization light board, the saturating of sealant 57 also can protect Photosensitiveness film is also possible to their stacked film.

Caudacoria 30 is adhered to flexible substrate 50 by adhesive layer AD2.Caudacoria 30 is for example by poly terephthalic acid second two The resins such as alcohol ester (PET) are formed, and have the intensity bigger than flexible substrate 50.Caudacoria 30 inhibits the deformation of display panel PNL, and And prevent the entrance of moisture, gas to flexible substrate 50 etc..

Fig. 3 is the sectional view of the construction of the bending section 12 of the state before bending.As shown in figure 3, caudacoria 30 includes first The second supporting substrate 32 for holding substrate 31 and being configured at spaced intervals with the first supporting substrate 31.First supporting substrate 31 is being shown Back side 10B is covered in portion 11.Second supporting substrate 32 covers back side 10B in mounting portion 13.

Bending section 12 is integrally formed with display unit 11 and mounting portion 13 and the two is connected.Bending section 12 is, for example, quilt It is divided in all or part of part between the first and second supporting substrate 31,32, not covered by caudacoria 30.This Outside, bending section 12 is, for example, a part for the part not covered by cephacoria 20.Display unit 11 and curved is removed from array substrate 10 Remainder after pars convoluta 12 is mounting portion 13.

In the example shown in Fig. 3, the end face of the 4th insulating layer 54, rib 56, sealant 57 and cephacoria 20 with first The end face 31E for holding substrate 31 is aligned on thickness direction Z.First and second insulating layer 51,52 and wiring W extend to pliability The end face 50E of substrate 50.Display device DSP has the resin film 58 of acrylic resin being formed on bending section 12 etc..

Being routed W is, for example, the control wiring for controlling power supply line or image line, scan line.Wiring W can also be extended to Display area DA and be electrically connected to pixel electrode PE1, PE2, PE3.Wiring W is for example formed by the laminated body of titanium, aluminium, titanium, is configured On second and third insulating layer 52,53.The covering of resin film 58 wiring W and third insulating layer 53 or second insulating layer 52。

4th insulating layer 54 has Disengagement zone (Japanese: with flying び) in the mounting portion 13 for being supported on the second supporting substrate 32 54B.In Disengagement zone, 54B is equipped with perforation to the contact hole CH and weld pad PD for being routed W.Weld pad PD for example with pixel electrode PE1, It is formed in PE2, PE3 the same process by same material, covers the inner surface and periphery of contact hole CH.

Wiring W is electrically connected with weld pad PD by contact hole CH.In addition, the wiring connection method of W and weld pad PD and unlimited Due to contact hole CH.For example, it is also possible to the electrode that is formed by same material is set in gate electrode WG the same process, by cloth Line W is electrically connected with weld pad PD.

External circuit substrate FPC is installed in weld pad PD.Weld pad PD and external circuit substrate FPC for example pass through anisotropy Conductive film ACF and electrically and mechanically connected.Anisotropic conductive film ACF is comprising evenly dispersed conduction The membranaceous bonding agent of particle.

The feature of the display device DSP of the utility model first is that having collapsible part 40.Collapsible part 40 is in bending section Back side 10B is fixed in 12.Collapsible part 40 can be formed directly into the back side 10B of bending section 12, can also be by bonding agent And it is bonded.Collapsible part 40 is formed by being able to respond in the material that heat or light are shunk.If collapsible part 40 is shunk, it is bent Portion 12 deforms.

Fig. 4 is the sectional view of the construction of bending section 12 for the state after bending that shows schematically.If collapsible part 40 responds It is shunk in heat or light, then the state bending after bending section 12 is from the state before bending shown in Fig. 3 to bending shown in Fig. 4. Make bending section 12 alternatively, it is also possible to bend display device DSP mechanically while assigning to collapsible part 40 stimulates Bending.Hereinafter, the side that will be close to the center of curvature O of bending section 12 is defined as inside, will determine away from the farther away side center of curvature O Justice is outside.

In the example shown in Figure 4, the spacer that display device DSP has shown portion 11 and mounting portion 13 clips 60.The back side of display unit 11 is fixed with via adhesive layer AD3 and the first supporting substrate 31 in the upper surface 60A of spacer 60 10B.The back side of mounting portion 13 is fixed with via adhesive layer AD4 and the second supporting substrate 32 in the lower surface 60B of spacer 60 10B。

Clearance G 1, G2 are respectively formed between the first and second supporting substrate 31,32 and collapsible part 40.Due to the two Between there are clearance Gs 1, G2, therefore be not concerned about collapsible part 40 interfere so that the first and second supporting substrate 31,32 removing, Or first and second supporting substrate 31,32 deform.

Collapsible part 40 is formed as rectangle by the resin material of the stimulating responsive shunk in response to heat or light.It is receiving In the case that contracting component 40 is in response to warm, polyimide resin of the collapsible part 40 by percent thermal shrinkage than constituting flexible substrate 50 Big material is formed.One example of collapsible part 40 is shrink film, and maximum receipts can be never contracted to by heating time Contracting ground adjustment size.

Alternatively, the strain of the back side 10B of the bending section 12 for the state for bending to design shape can also be precalculated, select Percent thermal shrinkage strains roughly the same material with it in the defined temperature region that will not be brought a negative impact to display device DSP Material.For example, if the strain of the back side 10B of bending section 12 is, for example, -6%, then the outer surface 40A of collapsible part 40 is selected to receive The material of contracting -6%.

Since collapsible part 40 also has thickness, in the inner surface 40B of collapsible part 40, compared to outer surface 40A, It should change big.When in outer surface, 40A has shunk -6%, inner surface 40B for example shrinks -18%.In this case, if by leading to The material crossed heating and shrink -18% stimulating responsive forms collapsible part 40, then outer surface 40A can be made to be retracted to uncommon The size of prestige is bent bending section 12 as design.

Indicate that in collapsible part 40 be the side of 0.2mm using polyolefin resin, with the radius of inner surface 40B in table 1 Formula is bent and calculates the example of the strain of each layer.

[table 1]

In the calculated example shown in table 1, the strain of the inner surface 40B of collapsible part 40 reaches -18.58%.Using for example The polyolefin resin that 16~25% are shunk if being heated to 80~90 DEG C, as long as being heated to about 80 DEG C, it will be able to make bending section 12 Bend to the shape of design.

Equally, it indicates to use polystyrene resin in collapsible part 40 in table 2, be with the radius of inner surface 40B The mode of 0.2mm is bent and calculates the example of the strain of each layer.

[table 2]

In the calculated example shown in table 2, the strain of the inner surface 40B of collapsible part 40 reaches -17.21%.As long as selection Such as if being heated to 110 DEG C shrink 16~18% polystyrene resin, it will be able to so that bending section 12 is bent to the shape of design Shape.

Equally, it indicates to be bent in such a way that the radius of the inner surface 40B of collapsible part 40 is 0.2mm, simultaneously in table 3 The calculated example of resin film 58 is formd in a manner of being routed W and be located at neutral surface N.

[table 3]

In the calculated example shown in table 3, the strain of the inner surface 40B of collapsible part 40 reaches -23.64%.As long as selection Such as shunk if the temperature as defined in be heated to about 24% shrink film, it will be able to so that bending section 12 is bent to the shape of design

The back side 10B of the shape of bending section 12 shown in Fig. 4, i.e. display unit 11 and mounting portion 13 is individually fixed in interval Shape made of the upper surface 60A and lower surface 60B of part 60 is to obtain the support of collapsible part 40 and deform as designing Bending section 12 shape an example.In addition, the composition of spacer 60 not necessarily, also can be omitted.

If there is spacer 60, then 40 excess shrinkage of collapsible part can be prevented and to deviate bending section 12 designed Shape.If preparing that the collapsible part 40 of size can be adjusted by heating time and being combined with the spacer of various sizes 60, Then only by being heated to collapsible part 40 display unit 11 and mounting portion 13 is made to be connected to spacer 60, it will be able to freely select Select the shape of bending section 12.

In the example shown in Figure 4, resin film 58 is had adjusted to make to be routed in a manner of W is located at the neutral surface N of bending section 12 Thickness.Wiring W is located at the neutral surface N of bending section 12 or the shape than neutral surface N slightly by inside is to be retracted component 40 to draw The example of the shape of bending section 12 led and deformed as designing.In addition, the composition of resin film 58 not necessarily, it can also To omit.In this case, wiring W can also be located at the position than neutral surface N in the outer part.

The display device DSP of the present embodiment constituted as described above has is fixed on back side 10B in bending section 12 Collapsible part 40.If applying heat or light, the back side 10B for being retracted the bending section 12 of the covering of component 40 is applied convergent force. Therefore, will not to 13 side from deviating from the position of 11 side of display unit or mounting portion, the range for being fixed with collapsible part 40 can be focused on and Reliably deform.

The wiring W that display unit 11 is electrically connected with mounting portion 13 is preferably, the neutral surface N or ratio positioned at bending section 12 The position slightly by inside of neutral surface N.The position of neutral surface N can freely be designed by the thickness of resin film 58 etc..Root According to present embodiment, bending section 12 can be made to deform as design using collapsible part 40, therefore can be by wiring W reliably It is configured near neutral surface N.

The spacer 60 that present embodiment has shown portion 11 and about 13 mounting portion clips.Simply by the presence of spacer 60, even if the back side 10B of then 40 excess shrinkage of collapsible part, display unit 11 and mounting portion 13 can also be connected to spacer respectively 60 upper surface 60A and lower surface 60B and so that bending section 12 is remained the shape of design.

Present embodiment has gap between the first and second supporting substrate 31,32 and collapsible part 40 of caudacoria 30 G1,G2.Therefore, the adjacent removing of caudacoria 30 or the first and second bearing base are not concerned about deforming collapsible part 40 Material 31,32 deforms.

Then, referring to Fig. 5 and Fig. 6, the first and second variation to present embodiment is illustrated.It will be from display The direction of portion 11 towards mounting portion 13 is set as first direction X, and the direction intersected with first direction X and thickness direction Z is set as Second direction Y.Collapsible part 40 is extended along first and second direction X, Y with oblong-shaped.Hereinafter, will be close to display unit 11 Edge is set as leading edge 40F, and the edge of the side opposite with the close edge of mounting portion 13 is set as back edge 40R.

Fig. 5 is the perspective view for indicating an example of collapsible part 40 for first variation.In first variation, compare In second direction Y, the shrinking percentage of collapsible part 40 is bigger on X in a first direction.Collapsible part 40 for example can be with multiple The component of slit 41, the component for being also possible to uniaxial extension and extending to first direction X.

Y is arranged multiple slits 41 at spaced intervals in a second direction in the example shown in FIG. 5,.Each slit 41 is along One direction X extends.The depth of slit 41 can penetrate into outer surface 40A from inner surface 40B, can also be not up to outer surface 40A. As long as forming slit 41, it will be able to the shrinking percentage of collapsible part 40 is adjusted to compared to second direction Y, in a first direction on X It is bigger.

Fig. 6 is the perspective view for indicating an example of collapsible part 40 for the second variation.In the second variation, it shrinks Component 40 have in a second direction Y shape at slit 42.Slit 42 respectively can be respectively with forward edge 40F and back edge 40R One, two are formed altogether, can also only form one with the one party in forward edge 40F and back edge 40R.

By forming slit 42, the contraction range of collapsible part 40 can be adjusted freely.If having two slits 42 Collapsible part 40 is shunk, then is not retracted the region A1 entirety of the covering of component 40 but is divided between two slits 42 Region A2 be applied the power of collapsible part 40, and then array substrate 10 is bent.The curved region A2 of array substrate 10 is equivalent to Bending section 12 above-mentioned.

In addition, in the case where forward edge 40F only forms slit 42, institute between back edge 40R and slit 42 The region A2 of division becomes bending section 12.Equally, in the case where only foring slit 42 by back edge 40R, leading edge The region A2 divided between 40F and slit 42 becomes bending section 12.According to the second variation, component 40 can not be retracted Size influences the range of ground design bending section 12.As a result, collapsible part 40 is for example formed as bigger than bending section 12, Neng Gougeng Firmly fix collapsible part 40 and back side 10B.

Although the description of several embodiments of the utility model, but these embodiments prompt as an example, and It is not intended to limit the range of utility model.These new embodiments can be implemented with various other ways, can not depart from Various omissions, substitutions and changes are carried out in the range of the purport of utility model.These embodiments and modifications thereof example is included in practical It in novel range and purport, and include in utility model documented by claims and the range equivalent with it.Respectively It is configured to be appropriately combined disclosed in embodiment.

Claims (11)

1. a kind of display device, which is characterized in that have:

Show the display unit of image；

The mounting portion of external circuit substrate is installed；

Connect the curved bending section of the display unit and the mounting portion；And

It is fixed on the collapsible part of the bending section,

The collapsible part is formed by the material of the stimulating responsive shunk in response to heat or light.

2. display device as described in claim 1, which is characterized in that

The bending section has the wiring by the display unit and mounting portion electrical connection, and is bent to the wiring and is located at The neutral surface of the bending section or shape than the neutral surface in the inner part.

3. display device as described in claim 1, which is characterized in that

It is also equipped with the spacer clipped by the display unit and the mounting portion,

The back side that the bending section is bent to the display unit and the mounting portion is fixed in the shape of the spacer.

4. display device as described in claim 1, which is characterized in that

The collapsible part by shrink and can be adjusted by heating time in response to heat shrink after size resinous wood Material is formed.

5. display device as described in claim 1, which is characterized in that

The collapsible part from the display unit towards the first direction of the mounting portion and intersect with the first direction Extend on two directions,

Compared to the second direction, the shrinking percentage of the collapsible part is bigger in said first direction.

6. display device as claimed in claim 5, which is characterized in that

The collapsible part has the slit formed along the first direction.

7. display device as described in claim 1, which is characterized in that

The collapsible part from the display unit towards the first direction of the mounting portion and intersect with the first direction Extend on two directions,

The collapsible part has the slit formed along the second direction.

8. display device as described in claim 1, which is characterized in that

It is also equipped with first supporting substrate and the second of the back side for being pasted on the mounting portion at the back side for being pasted on the display unit Supporting substrate,

Between the collapsible part and first supporting substrate and the collapsible part and second supporting substrate it Between be respectively provided with gap.

9. display device as described in claim 1, which is characterized in that be also equipped with:

Across the flexible substrate of the display unit, the bending section and the mounting portion；And

The wiring that the display unit and the mounting portion are electrically connected,

The flexible substrate has second face in the first face and the side opposite with first face,

The collapsible part is configured at second surface side,

The wiring is configured at first surface side.

10. display device as claimed in claim 9, which is characterized in that

The collapsible part includes the resin material shunk in response to heat,

The percent thermal shrinkage of the collapsible part is bigger than the percent thermal shrinkage of the flexible substrate.

11. display device as described in claim 1, which is characterized in that be also equipped with:

Cover the film of the display unit；And

Resin film covers the bending section between the film and the mounting portion.