CN209170514U - A kind of electronic device - Google Patents
A kind of electronic device Download PDFInfo
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- CN209170514U CN209170514U CN201920023007.3U CN201920023007U CN209170514U CN 209170514 U CN209170514 U CN 209170514U CN 201920023007 U CN201920023007 U CN 201920023007U CN 209170514 U CN209170514 U CN 209170514U
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- shell
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- camera module
- electronic device
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Abstract
This application provides a kind of electronic devices.The electronic device includes first shell, camera module, second shell and bolster, first shell offers stepped hole, camera module is accommodated in stepped hole, second shell and first shell are stacked to press fixing camera mould group, bolster has viscosity, and bolster is bonded camera module and first shell.The electronic device of the application can reduce the spoilage of camera module.
Description
Technical field
This application involves camera module technical fields, more particularly to a kind of electronic device.
Background technique
The status that electronic device is played the part of in people's lives at present is more and more important, electronic device also gradually to lightening and
Art up development, but the reliability of electronic device is but reducing, such as electronic device is easy to appear failure of taking pictures after assembling
The phenomenon that.Therefore the problem of camera module in the urgent need to address is easy to damage in an assembling process now.
Utility model content
This application provides a kind of electronic device, the electronic device include first shell, camera module, second shell and
Bolster, first shell offer stepped hole, and camera module is accommodated in stepped hole, and second shell is set with first shell stacking
It sets to press fixing camera mould group, bolster has viscosity, and bolster is bonded camera module and first shell.
In this application, camera module is accommodated in stepped hole, i.e. the stepped hole of camera module and first shell
It carries out pine to match, first shell only limits camera module, does not play fixed effect.In first shell and camera mould
Bolster is provided between group.In this way in electronic device falling process, camera module can not shake with electronic device with frequency
Dynamic, specifically, camera module lags behind electronic device vibration, and camera module is slowly fallen under the buffer function of bolster
It falls, to improve the anti-drop of camera module.In addition, by making bolster have viscosity, such bolster can glue
Camera module and first shell are connect, during assembling, camera module will not be detached from electronic device from stepped hole.
Detailed description of the invention
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, the drawings in the following description are only some examples of the present application, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
Fig. 1 is the decomposition texture schematic diagram of an embodiment of electronic device provided by the present application；
Fig. 2 is the schematic cross-section of an embodiment of electronic device provided by the present application；
Fig. 3 is the schematic cross-section of another embodiment of electronic device provided by the present application；
Fig. 4 is the schematic cross-section of another embodiment of electronic device provided by the present application；
Fig. 5 is the schematic cross-section of another embodiment of electronic device provided by the present application；
Fig. 6 is the schematic cross-section of another embodiment of electronic device provided by the present application；
Fig. 7 is the schematic cross-section of another embodiment of electronic device provided by the present application；
Fig. 8 is the schematic cross-section of an embodiment of elastic component provided by the present application.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation description.It is understood that specific embodiment described herein is only used for explaining the application, rather than to the limit of the application
It is fixed.It also should be noted that illustrating only part relevant to the application for ease of description, in attached drawing and not all knot
Structure.Based on the embodiment in the application, obtained by those of ordinary skill in the art without making creative efforts
All other embodiment, shall fall in the protection scope of this application.
Referenced herein " embodiment " is it is meant that a particular feature, structure, or characteristic described can wrap in conjunction with the embodiments
It is contained at least one embodiment of the application.Each position in the description occur the phrase might not each mean it is identical
Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and
Implicitly understand, embodiment described herein can be combined with other embodiments.
Referring to Fig. 1, Fig. 1 is the decomposition texture schematic diagram of an embodiment of electronic device provided by the present application.
This application provides an embodiment of electronic device, electronic device can with but be not limited only to include first shell 10,
Camera module 20, second shell 30 and display screen component 40.First shell 10 offers stepped hole 11, and camera module 20 is held
It sets in stepped hole 11, second shell 30 and first shell 10 are stacked to press fixing camera mould group 20.
As described in Figure 1, first shell 10 can be front housing, and accordingly, second shell 30 is rear shell, and display screen component 40 covers
It is located at the outside of first shell 10, to take the photograph for showing that the information such as image or text, camera module 20 are front camera
As head mould group 20 is through the image information of the acquisition subject of stepped hole 11 of first shell 10.It in the following embodiments, will be with
Explaining illustration is carried out based on this.
Certainly, first shell 10 is also possible to rear shell, and accordingly, second shell 30 is front housing, and the lid of display screen component 40 is set
In the outside of second shell 30, for showing that the information such as image or text, camera module 20 are rear camera, camera shooting
Head mould group 20 obtains the image information of subject through the stepped hole 11 of first shell 10.
Referring to Fig. 2, Fig. 2 is the schematic cross-section of an embodiment of electronic device provided by the present application.
Camera module 20 includes lens assembly 21, shell 22 and circuit board 23.Lens assembly 21 is housed in shell 22,
Shell 22 is connect with circuit board 23, and circuit board 23 is stretched out to be electrically connected with the main circuit board 23 of electronic device.Shell 22 can be with
It is made of metal material, specifically includes iron, copper, aluminium, stainless steel, copper alloy, aluminium alloy or magnesium alloy etc..Certainly, shell
22, which are also possible to plastic cement material, is made, for example, polyethylene terephthalate (PET), polyethylene (PE), polyvinyl chloride (PVC),
Polypropylene (PP), polystyrene (PS), polymethyl methacrylate (PMMA), polycarbonate (PC), polylactic acid (PLA), nylon
(Nylon) etc..
In order to improve electronic device camera module 20 anti-drop, camera module 20 is accommodated in by the applicant
In stepped hole 11, i.e. the stepped hole 11 of camera module 20 and first shell 10 carries out pine and matches, and first shell 10 is only to camera
Mould group 20 is limited, and does not play fixed effect.In addition, being provided with buffering between first shell 10 and camera module 20
Part 50.In this way in electronic device falling process, camera module 20 can not shake with electronic device with frequency, specifically, take the photograph
It being shaken as head mould group 20 lags behind electronic device, camera module 20 is slowly fallen under the buffer function of bolster 50, thus
Improve the anti-drop of camera module 20.Bolster 50 can be the flexible objects such as foam, rubber or spring 621
Part is constituted.
But found in the assembling process of electronic device, applicants have discovered that camera module 20 is accommodated in stepped hole
It will appear the phenomenon that being detached from stepped hole 11 generation after 11.At this point, because the circuit board 23 of camera module 20 is filled with electronics
The main circuit board 23 set is electrically connected, thus camera module 20 can only rotating dress be back in stepped hole 11.Camera module 20
Shell 22 vertex of stepped hole 11 can be touched during rotation, shell 22 can be pressed further by lens assembly 21,
Lens assembly 21 is high-precision device, and lens assembly 21 can be damaged because of the extruding of shell 22.
Therefore, in one embodiment, by making bolster 50 have viscosity, such bolster 50 can be bonded the applicant
Camera module 20 and first shell 10, for electronic device during assembling, camera module 20 will not be from stepped hole 11
It is detached from.It can be by the spreading glue on bolster 50, so that bolster 50 has viscosity；It can also be by bolster 50
Double-sided adhesive is set, so that bolster 50 has viscosity.
Specifically, stepped hole 11 successively includes the first hole 111 being nested with one another and in the direction towards second shell 30
Two holes 112, less than the aperture in the second hole 112, the shell 22 of camera module 20 is inserted to the first hole 111 for the aperture in the first hole 111
In, and toward on the top surface in the first hole 111.Bolster 50 is bonded on the top surface in the first hole 111, and bolster 50 is bonded outside
Shell 22, to avoid camera module 20 from being detached from from stepped hole 11 under the premise of providing buffer environment for camera module 20.
Referring to Fig. 3, Fig. 3 is the schematic cross-section of another embodiment of electronic device provided by the present application.In another reality
It applies in example, stepped hole 11 successively includes the first successively nested hole 111,112 and of the second hole in the direction towards second shell 30
Third hole 113, the aperture in the first hole 111, the aperture in the second hole 112, third hole 113 aperture be sequentially increased, camera module
20 shell 22 is inserted in the first hole 111, and limit is assemblied in third hole 113 toward on the top surface in the first hole 111, and further
In.Bolster 50 is bonded on the top surface in the first hole 111, and bolster 50 is bonded shell 22, to mention for camera module 20
Under the premise of high buffer environment, camera module 20 is avoided to be detached from from stepped hole 11.It in the following embodiments, will be with stepped hole
11 include carrying out explaining illustration for the first hole 111 and the second hole 112, but do not do uniqueness restriction, when stepped hole 11 includes the
It is equally applicable to following each embodiment when one hole 111, the second hole 112 and third hole 113, will not be further detailed.
Referring to Fig. 4, Fig. 4 is the schematic cross-section of another embodiment of electronic device provided by the present application.
In another embodiment, stepped hole 11 successively includes the first hole being nested with one another in the direction towards second shell 30
111 and second hole 112, less than the aperture in the second hole 112, the shell 22 of camera module 20 is inserted to for the aperture in the first hole 111
In one hole 111, and toward on the top surface in the first hole 111.Bolster 50 is arranged on the top surface in the first hole 111, between buffering
Every first shell 10 and camera module 20.
The applicant is by making bolster 50 have viscosity, and the apex angle in the second hole 112 is provided with the side of the first chamfering 114
Formula protects camera module 20.Bolster 50 can be bonded camera module 20 and first shell 10 in this way, and electronic device is in group
During dress, camera module 20 will not be detached from from stepped hole 11.Even if the adhesion failure of bolster 50, camera module
20 are detached from from stepped hole 11, and for camera module 20 when rotation is assembled in stepped hole 11, shell 22 will not bump to point
At angle, shell 22 is touched at first chamfering 114 in the second hole 112, is snapped down to stepped hole 11 in the guiding of the first chamfering 114
In.To which in the case where having the auxiliary in sticking bolster 50 and the second hole 112 with the first chamfering 114, perfection is realized
Under the premise of improving buffer environment for camera module 20, the crush injury of the lens assembly 21 of camera module 20 is avoided.
It is worth noting that, the first chamfering 114 can be bevelling, i.e. inclined-plane is arranged in the vertex in the second hole 112, such as
Fruit camera module 20 touches at the first chamfering 114, and inclined-plane can give 20 1 lateral power of camera module, makes camera mould
Group 20 quickly slides in stepped hole 11.
First chamfering 114 is also possible to rounded corner, i.e. arc surface is arranged in the vertex in the second hole 112, if camera
Mould group 20 touches at the first chamfering 114, and arc surface can give 20 1 lateral power of camera module, keeps camera module 20 fast
Ski-running is into stepped hole 11.
Referring to Fig. 5, Fig. 5 is the schematic cross-section of another embodiment of electronic device provided by the present application.
In another embodiment, stepped hole 11 successively includes the first hole being nested with one another in the direction towards second shell 30
111 and second hole 112, less than the aperture in the second hole 112, the shell 22 of camera module 20 is inserted to for the aperture in the first hole 111
In one hole 111, and toward on the top surface in the first hole 111.Bolster 50 is arranged on the top surface in the first hole 111, between buffering
Every first shell 10 and camera module 20.
The shell 22 of camera module 20 includes first 221 and second 222 to be connected to each other, first 221 assembly
Required light is shot to obtain in the first hole 111, second 222 is assemblied in the second hole 112 and abuts to bolster 50.
The applicant is by making bolster 50 have viscosity, and second 222 apex angle is provided with the side of the second chamfering 223
Formula protects camera module 20.Bolster 50 can be bonded camera module 20 and first shell 10 in this way, and electronic device is in group
During dress, camera module 20 will not be detached from from stepped hole 11.Even if the adhesion failure of bolster 50, camera module
20 are detached from from stepped hole 11, and for camera module 20 when rotation is assembled in stepped hole 11, shell 22 will not bump to point
At angle, second 222 second chamfering 223 touches the vertex in the second hole 112, is snapped down in the guiding of the second chamfering 223
In stepped hole 11.Thus in the case where having the auxiliary in sticking bolster 50 and the second hole 112 with the second chamfering 223, it is perfect
It realizes under the premise of improving buffer environment for camera module 20, avoids the extruding of the lens assembly 21 of camera module 20
Damage.
It is worth noting that, the second chamfering 223 can be bevelling, i.e. inclined-plane is arranged in the vertex at second 222, such as
Fruit second 222 second chamfering 223 touches the vertex in the second hole 112, and inclined-plane can be lateral to camera module 20 1
Power, slide to camera module 20 quickly in stepped hole 11.
Second chamfering 223 is also possible to rounded corner, i.e. arc surface is arranged in the vertex in the second hole 112, if second
222 the second chamfering 223 touches the vertex in the second hole 112, and arc surface can give 20 1 lateral power of camera module, make
Camera module 20 quickly slides in stepped hole 11.
Referring to Fig. 6, Fig. 6 is the schematic cross-section of another embodiment of electronic device provided by the present application.
In another embodiment, stepped hole 11 successively includes the first hole being nested with one another in the direction towards second shell 30
111 and second hole 112, less than the aperture in the second hole 112, the shell 22 of camera module 20 is inserted to for the aperture in the first hole 111
In one hole 111, and toward on the top surface in the first hole 111.Bolster 50 is arranged on the top surface in the first hole 111, between buffering
Every first shell 10 and camera module 20.
The applicant increases elastic component 60 by making bolster 50 have viscosity, and for electronic device, and elastic component 60 is arranged
In on the side of stepped hole 11,60 elastic top of elastic component holds camera module 20, to prevent camera module 20 from stepped hole 11
Middle disengaging.Bolster 50 can be bonded camera module 20 and first shell 10 in this way, and electronic device is taken the photograph during assembling
As head mould group 20 will not be detached from from stepped hole 11.Even if the adhesion failure of bolster 50, elastic component 60 can continue auxiliary top
Camera module 20 is handled, to prevent camera module 20 to be detached from from stepped hole 11.To have sticking bolster 50
Under the auxiliary for the elastic component 60 for holding characteristic with elastic top, perfection, which realizes, is improving buffer environment for camera module 20
Under the premise of, avoid camera module 20 from being detached from from stepped hole 11.
Referring to Fig. 7, Fig. 7 is the schematic cross-section of another embodiment of electronic device provided by the present application.The present embodiment
Difference with Fig. 6 embodiment is that camera module 20 is provided with top and holds slot 24, and elastic component 60 can be inserted top and hold slot 24, from
And enhance the bonding strength of elastic component 60 Yu camera module 20.
Fig. 7 and Fig. 8 are please referred to, Fig. 8 is the schematic cross-section of an embodiment of elastic component 60 provided by the present application.
Elastic component 60 includes body shell 61 and elastic parts 62, and body shell 61 is provided with accommodation space 63, elastic parts 62
It is contained in accommodation space 63.Elastic parts 62 is shunk to accommodation space 63 under the action of the side wall of camera module 20, when
When slot 24 is held on the alignment of elastic parts 62 top, 62 elasticity of elastic parts stretches out in body shell 61 and holds slot 24 into top, to pass through bullet
Property part 60 completes camera module 20 and connect with the buffering of first shell 10.
Further, elastic parts 62 includes spring 621 and the telescopic head 622 that connect with spring 621, spring 621 with stretch
Drop-head 622 connects, and spring 621 is in compressive state, in accommodation space 63 and is inserted into top so that telescopic head 622 is extended and holds slot
24。
Optionally, telescopic head 622 includes protruding portion 6221 and detent portion 6222, and 6221 one end of protruding portion can elasticity stretching master
The aperture of body shell 61, other end are connect with detent portion 6222, and 6222 other end of detent portion is connect with spring 621.Wherein, it dashes forward
Diameter of the portion 6221 on the direction that the elasticity of vertical telescopic head 622 is stretched out is less than or straight equal to the aperture of body shell 61 out
Diameter, diameter of the detent portion 6222 on the direction that the elasticity of vertical telescopic head 622 is stretched out are greater than opening diameter, and being arranged in this way can be with
Prevent spring 621 by the accommodation space 63 of the pop-up body shell 61 completely of telescopic head 622.It is fit into order to facilitate telescopic head 622
In the accommodation space 63 of body shell 61, telescopic head 622 is made of soft materials, such as in TPU, TPE, TPR, silica gel or rubber
One or more be made.After 6222 deformation of detent portion of telescopic head 622 on the direction that 622 elasticity of vertical telescopic head is stretched out
Diameter is less than the opening diameter of body shell 61, and such telescopic head 622 can easily be fit into the accommodation space 63 of body shell 61
It is interior.
Optionally, body shell 61 includes the first assembly shell 611 and the second assembly shell 612, and the first assembly shell 611 and second fills
It is detachably connected with shell 612, such as buckle or threaded connection.Because body shell 61 is to be fabricated separately ground, the first assembly shell 611
With second assembly shell 612 can light depanning, make they mold do not have to additional increase line position or ejector pin mechanism, cost
Greatly reduce.In addition, telescopic head 622 does not need be made of soft materials yet, directly first telescopic head 622 can be packed into
In first assembly shell 611 or the second assembly shell 612, the first assembly shell 611 and the second assembly shell 612 are then connected to one
It rises.
The foregoing is merely presently filed embodiments, are not intended to limit the scope of the patents of the application, all to utilize this
Equivalent structure or equivalent flow shift made by application specification and accompanying drawing content is applied directly or indirectly in other relevant
Technical field similarly includes in the scope of patent protection of the application.
Claims (10)
1. a kind of electronic device characterized by comprising first shell, camera module, second shell and bolster, it is described
First shell offers stepped hole, and the camera module is accommodated in the stepped hole, the second shell and described first
Shell is stacked to press the fixed camera module, and the bolster has viscosity, takes the photograph described in the bolster bonding
As head mould group and the first shell.
2. electronic device according to claim 1, which is characterized in that the stepped hole is in the side towards the second shell
To successively including the first hole and the second hole that are nested with one another, the bolster is arranged on the top surface in first hole.
3. electronic device according to claim 2, which is characterized in that the apex angle in second hole is provided with the first chamfering.
4. electronic device according to claim 3, which is characterized in that first chamfering is bevelling or rounded corner.
5. electronic device according to claim 2, which is characterized in that the stepped hole further includes nested with second hole
The third hole of setting, the camera module, which further limits, to be assemblied in the third hole.
6. electronic device according to claim 2, which is characterized in that the camera module includes first to be connected to each other
Portion and second, described first be assemblied in first hole with obtain shoot needed for light, described second is assemblied in institute
It states in the second hole and abuts to the bolster, second apex angle is provided with the second chamfering.
7. electronic device according to claim 1, which is characterized in that the electronic device further includes elastic component, the bullet
Property part is set on the side of the stepped hole, and the elastic component elastic top holds the camera module.
8. electronic device according to claim 7, which is characterized in that the camera module is provided with top and holds slot, described
Elastic component includes body shell and elastic parts, and the body shell is provided with accommodation space, and the elastic parts limit is assemblied in institute
It states in accommodation space, and elasticity stretches out in the body shell to be inserted into the top and hold slot.
9. electronic device according to claim 8, which is characterized in that the elastic parts include spring and with the spring
The telescopic head of connection, the telescopic head, which stretches out in the body shell and is inserted into the top, holds slot.
10. electronic device according to claim 9, which is characterized in that the body shell includes the first assembly shell and second
Shell is assembled, the first assembly shell and the second assembly shell are threadedly coupled.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920023007.3U CN209170514U (en) | 2019-01-03 | 2019-01-03 | A kind of electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920023007.3U CN209170514U (en) | 2019-01-03 | 2019-01-03 | A kind of electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209170514U true CN209170514U (en) | 2019-07-26 |
Family
ID=67328207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920023007.3U Active CN209170514U (en) | 2019-01-03 | 2019-01-03 | A kind of electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209170514U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114677909A (en) * | 2020-12-24 | 2022-06-28 | 乐金显示有限公司 | Display device and display apparatus |
-
2019
- 2019-01-03 CN CN201920023007.3U patent/CN209170514U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114677909A (en) * | 2020-12-24 | 2022-06-28 | 乐金显示有限公司 | Display device and display apparatus |
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