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CN208987215U - Electronic device and its circuit board assemblies - Google Patents

Electronic device and its circuit board assemblies Download PDF

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Publication number
CN208987215U
CN208987215U CN201821388583.XU CN201821388583U CN208987215U CN 208987215 U CN208987215 U CN 208987215U CN 201821388583 U CN201821388583 U CN 201821388583U CN 208987215 U CN208987215 U CN 208987215U
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CN
China
Prior art keywords
circuit board
connector
assemblies according
antenna headroom
main part
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Application number
CN201821388583.XU
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Chinese (zh)
Inventor
范艳辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oppo Chongqing Intelligent Technology Co Ltd
Original Assignee
Oppo Chongqing Intelligent Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Oppo Chongqing Intelligent Technology Co Ltd filed Critical Oppo Chongqing Intelligent Technology Co Ltd
Priority to CN201821388583.XU priority Critical patent/CN208987215U/en
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Publication of CN208987215U publication Critical patent/CN208987215U/en
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Abstract

This application discloses a kind of circuit board assemblies, which includes: first circuit board, and first circuit board includes antenna headroom portion and non-antenna headroom portion;Second circuit board, second circuit board are fixedly connected with first circuit board, and second circuit board is stacked with first circuit board, and second circuit board at least partly covers antenna headroom portion;At least one first electronic component, is set to one side of the second circuit board far from first circuit board.Disclosed herein as well is a kind of electronic devices.By the above-mentioned means, the electronic component that the application in the case where not influencing antenna headroom, can increase circuit board can arrangement space.

Description

Electronic device and its circuit board assemblies
Technical field
The utility model relates to technical field of electronic equipment, more particularly to a kind of electronic device and its circuit board assemblies.
Background technique
Currently, with the continuous development of science and technology, the electronic devices such as smart phone increasingly become people's daily life Necessity.
Circuit board is that one of electronic device commonly uses device, with the lightening development trend of electronic device, circuit The arrangement space of plate is smaller and smaller, and with the increasingly diversification of the function of electronic device, circuit board needs the electronic component being laid out It is more and more, therefore how adequately using cloth plate suqare and not influence the function of electronic device be a weight that industry faces Hang-up.
Utility model content
The technical solution that the embodiment of the present application uses is: providing a kind of circuit board assemblies, which includes: First circuit board, first circuit board include antenna headroom portion and non-antenna headroom portion;Second circuit board, second circuit board and first Circuit board is fixedly connected, and second circuit board is stacked with first circuit board, and at least partly to cover antenna net for second circuit board Empty portion;At least one first electronic component, is set to one side of the second circuit board far from first circuit board.
Another technical solution that the embodiment of the present application uses is: providing a kind of electronic device, which includes upper The circuit board assemblies stated.
The embodiment of the present application includes: first circuit board by setting circuit board assemblies, and first circuit board includes antenna headroom Portion and non-antenna headroom portion;Second circuit board, second circuit board are fixedly connected with first circuit board, second circuit board and the first electricity The setting of road board stacking, and second circuit board at least partly covers antenna headroom portion;At least one first electronic component is set to It is net can to carry out aerial signal using the space of the thickness direction of second circuit board for one side of two circuit boards far from first circuit board Sky, and surface placement electronic component of the second circuit board far from first circuit board is utilized, it can be the case where guaranteeing antenna headroom Under, increase electronic component can arrangement space.
Detailed description of the invention
Fig. 1 is the overlooking structure diagram of the embodiment of the present application circuit board assemblies;
Fig. 2 is the antenna headroom portion of the embodiment of the present application first circuit board and the schematic diagram in non-antenna headroom portion;
Fig. 3 is in Fig. 1 along the schematic cross-sectional view in II-II ' direction;
Fig. 4 is in Fig. 1 along the schematic cross-sectional view in III-III ' direction;
Fig. 5 is III-III ' direction another kind schematic cross-sectional view in Fig. 1;
Fig. 6 is the structural schematic diagram of the embodiment of the present application electronic device.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete Site preparation description.It is understood that specific embodiment described herein is only used for explaining the application, rather than to the limit of the application It is fixed.It also should be noted that illustrating only part relevant to the application for ease of description, in attached drawing and not all knot Structure.Based on the embodiment in the application, obtained by those of ordinary skill in the art without making creative efforts Every other embodiment, shall fall in the protection scope of this application.
Referenced herein " embodiment " is it is meant that a particular feature, structure, or characteristic described can wrap in conjunction with the embodiments It is contained at least one embodiment of the application.Each position in the description occur the phrase might not each mean it is identical Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and Implicitly understand, embodiment described herein can be combined with other embodiments.
Fig. 1 and Fig. 2 are please referred to, Fig. 1 is the overlooking structure diagram of the embodiment of the present application circuit board assemblies, and Fig. 2 is this Shen It please the antenna headroom portion of embodiment first circuit board and the schematic diagram in non-antenna headroom portion.
In the present embodiment, circuit board assemblies include: first circuit board 11, second circuit board 12, at least one first electricity Subcomponent 13, at least one second electronic component 14, the first connector 15, the second connector 16.
Term " first ", " second " in the application etc. be for distinguishing different objects, rather than it is specific suitable for describing Sequence.In addition, term " includes ", it is intended that cover and non-exclusive include.Such as contain the product or equipment of a series of units It is not limited to listed unit, but optionally further comprising the unit that do not list, or optionally further comprising for these The other units of product or equipment inherently.
First circuit board 11 includes antenna headroom portion 111 and non-antenna headroom portion 112.As shown in Fig. 2, antenna headroom portion 111 parts surrounded by dotted line frame, non-antenna headroom portion 112 are the part outside dotted line frame.
Any electronic component and cabling are not provided in antenna headroom portion 111, consequently facilitating aerial signal is from antenna headroom Portion is radiate, and the metal in electronic component and cabling is avoided to influence antenna performance to the shielding of aerial signal.
For being laid out electronic component and corresponding cabling in non-antenna headroom portion 112.Second electronic component 14 is set to In the non-antenna headroom portion 112 of one circuit board 11.
Second circuit board 12 is fixedly connected with first circuit board 11, and second circuit board 12 is set with the stacking of first circuit board 11 It sets.
Second circuit board 12 at least partly covers antenna headroom portion 111.In this way, the first circuit is effectively utilized The plate face arrangement space in the antenna headroom portion 112 of plate 11, and antenna letter is carried out using the thickness direction space of second circuit board 12 Number to external radiation, i.e., aerial signal at least can be by antenna headroom area 111 and the side of second circuit board 12 to external radiation Aerial signal.
In order to which the space of antenna to external radiation is bigger, the thickness of second circuit board 12 can be set greater than the first circuit The thickness of plate 11 carries out thickening processing to the thickness of second circuit board 12, increase the lateralarea of second circuit board 12, thus Increase the area of empty regions.
Optionally, first circuit board 11 with a thickness of 0.8mm-1mm, second circuit board 12 with a thickness of 1.8mm-2mm.It will Second circuit board 12 thickeies extremely 1mms more than 11 than first circuit board or so, to increase 12 side empty regions of second circuit board Area.
First electronic component 13 is set to second circuit board 12 and (calls second circuit in the following text far from the one side of first circuit board 11 First face of plate 12).First electronic component 13 can be the first face for being welded in second circuit board 12.It can be appreciated that having In the case where one electronic component 13, it can also arrange that corresponding cabling realizes the first electronics member on the first face of second circuit board 12 The conducting of part 13 and other devices.
Second circuit board 12 is not provided with electricity close to the one side (the second face for calling second circuit board 12 in the following text) of first circuit board 11 Subcomponent and cabling.
By the above-mentioned means, can use plate since electronic component and cabling is arranged in the first face of second circuit board 12 The arrangement space of interior empty regions is laid out electronic component, and is not provided with electronic component in the second face of second circuit board 12 and walks Line can be blocked to avoid the antenna headroom portion 111 on first circuit board 11, so that aerial signal can pass through antenna headroom portion 111 and second circuit board 12 side to external radiation.
The cabling quantity being connect in non-antenna headroom portion 112 with the second electronic component 14 be greater than in second circuit board 12 The quantity of the upper cabling being connect with the first electronic component 13.In other words, the member that the cabling for needing to connect in electronic component is less Part designs on second circuit board 12, so that the aerial signal radiated from antenna headroom portion 111 not only can be with It goes out, can also be radiate from the plate face of second circuit board 12 from the side radiation of second circuit board 12.
Optionally, second circuit board 12 may include interconnecting piece 121 and main part 122.
Optionally, interconnecting piece 121 and main part 122 are rectangle.
The length (lateral dimension of the interconnecting piece 121 in Fig. 1) of interconnecting piece 121 is less than the length of main part 122, connection The width (longitudinal size of the interconnecting piece 121 in Fig. 1) in portion 121 is less than the width of main part 122.
The long side edge of interconnecting piece 121 is connect with the long side edge of main part 122, interconnecting piece 121 and main part 122 1 It is body formed.The division of interconnecting piece 121 and main part 122 is only to facilitate explanation.
Optionally, interconnecting piece 121 is connected to the interlude edge of main part 122, to be formed prominent relative to main part 122 Interconnecting piece 121 out.
It should be understood that the shape of interconnecting piece 121 and main part 122 is not limited to above-mentioned shape, can carry out according to actual needs Others setting, the embodiment of the present application do not limit this.
Optionally, antenna headroom portion 111 is completely covered in upright projection of the main part 122 on first circuit board 11.Antenna The area in headroom portion 111 is equal to the area of main part 122.
Optionally, first circuit board 11 by the thickness at the first area of the projection covering of second circuit board 12 less than the The thickness in other regions of one circuit board 11 in addition to first area.In other words, first circuit board 11 is recess in first area Region.
By the above-mentioned means, second circuit board 12 can be arranged in the recessed position of first circuit board 11, first is realized Overlapping on the thickness direction of circuit board 11 and second circuit board 12, so as to save circuit board assemblies integrally occupied thickness Spend size.
Fig. 3 and Fig. 4 are further regarded to incorporated by reference to Fig. 1, Fig. 3 is in Fig. 1 along the schematic cross-sectional view in II-II ' direction.Figure 4 be in Fig. 1 along the schematic cross-sectional view in III-III ' direction.
Interconnecting piece 121 is connect by the first connector 15 with non-antenna headroom portion 112.
Main part 122 is connect by the second connector 16 with antenna headroom portion 111.
First circuit board 12 realizes electric signal transmission with second circuit board 12 by the first connector 15.
Second connector 16 is only used for fixing first circuit board 11 and second circuit board 12, without the function of electrical connection Can, it is only merely physical connection.
By the above-mentioned means, realizing physical connection and telecommunications by the way that the first connector 15 is arranged in non-antenna headroom portion 112 Number conducting, will not to the aerial signal in antenna headroom portion 111 radiate have an impact, and antenna headroom portion 111 setting only use In the second connector 16 of physical connection, electric signal transmission will not be carried out in clearance zone, avoid generating bad shadow to antenna headroom It rings.
Optionally, the quantity of the first connector 15 is multiple, length direction of multiple first connectors 15 along interconnecting piece 121 Interval setting.The quantity of first connector can be 6.
Optionally, the quantity of the second connector 16 is two, and two the second connectors 16 are separately positioned on 122 edge of main part Both ends region on length direction.
By the above-mentioned means, since interconnecting piece 121 is connected to the edge of main part 122, two the second connector 16 difference Two end regions being set on 122 length direction of main part, so that 15 structure of the second connector 16 and the first connector At angular position relationship, the stability of connection ensure that.
Further, since the quantity of the first connector 15 is for the quantity of the second connector 16, empty regions setting compared with Few connector avoids influence of the connector to antenna headroom, and more connector is arranged in non-antenna headroom region, guarantees to connect The stability connect.
Optionally, the first connector 15 is the first pad, and the second connector 16 is the second pad.First pad is respectively with One circuit board 11 and second circuit board 12 are electrically connected, realize the signal transmission between first circuit board 11 and second circuit board 12 with And physical connection.
First pad, which specifically can be, is electrically connected the cabling of cabling and second circuit board 12 on first circuit board 11 It connects.
Second pad is not electrically connected with first circuit board 11, and the second pad is not electrically connected with second circuit board 12.Second Pad is only used for the physical connection between first circuit board 11 and second circuit board 12, without electrically conducting performance, second Pad not on first circuit board 11 any electronic component or cabling be in electrical contact, and the second pad not with second circuit board 12 On any electronic component or cabling electrical contact.
It can be appreciated that in other embodiments, the first connector and the second connector can also be using other modes, examples Such as, the first connector can be conductive adhesive layer, and the second connector can be non-conductive glue layer.On the one hand conductive adhesive layer is used for the One circuit board 11 and second circuit board 12 are fixedly connected (i.e. physical connection), are on the other hand used for 11 He of first circuit board Second circuit board 12 is electrically connected, and realizes signal transmission.And non-conductive glue layer is only used for physical connection, without electrical Conduction property.
Referring to Fig. 5, Fig. 5 is III-III ' direction another kind schematic cross-sectional view in Fig. 1.
Optionally, first circuit board 11 is can also be with by the thickness at the first area of the projection covering of second circuit board 12 Equal to the thickness in other regions of the first circuit board 11 in addition to first area.In other words, thickness is equal everywhere for first circuit board 11. And it is not limited to the case where first area is recessed.
Referring to Fig. 6, Fig. 6 is the structural schematic diagram of the embodiment of the present application electronic device.In the present embodiment, electronic device It can be smart phone, tablet computer, laptop etc..
Electronic device may include apparatus main body 51 and the circuit board assemblies 52 that are set in apparatus main body 51.
Wherein, which can be circuit board assemblies described in above-mentioned any one embodiment.
It can also include antenna in apparatus main body, the wireless signal of the antenna is at least through the first circuit in circuit board assemblies The antenna headroom portion of plate is to external radiation.
The embodiment of the present application includes: first circuit board by setting circuit board assemblies, and first circuit board includes antenna headroom Portion and non-antenna headroom portion;Second circuit board, second circuit board are fixedly connected with first circuit board, second circuit board and the first electricity The setting of road board stacking, and second circuit board at least partly covers antenna headroom portion;At least one first electronic component is set to It is net can to carry out aerial signal using the space of the thickness direction of second circuit board for one side of two circuit boards far from first circuit board Sky, and surface placement electronic component of the second circuit board far from first circuit board is utilized, it can be the case where guaranteeing antenna headroom Under, increase electronic component can arrangement space.
The foregoing is merely presently filed embodiments, are not intended to limit the scope of the patents of the application, all to utilize this Equivalent structure or equivalent flow shift made by application specification and accompanying drawing content, it is relevant to be applied directly or indirectly in other Technical field similarly includes in the scope of patent protection of the application.

Claims (16)

1. a kind of circuit board assemblies, which is characterized in that the circuit board assemblies include:
First circuit board, the first circuit board include antenna headroom portion and non-antenna headroom portion;
Second circuit board, the second circuit board are fixedly connected with the first circuit board, the second circuit board and described the One circuit board is stacked, and second circuit board at least partly covers the antenna headroom portion;
At least one first electronic component is set to one side of the second circuit board far from the first circuit board.
2. circuit board assemblies according to claim 1, which is characterized in that the circuit board assemblies further comprise the first company Fitting and the second connector, the second circuit board include interconnecting piece and main part, the interconnecting piece by the first connector with The non-antenna headroom portion connection, the main part are connect by the second connector with the antenna headroom portion, first electricity Road plate realizes electric signal transmission by first connector and the second circuit board.
3. circuit board assemblies according to claim 2, which is characterized in that first connector is the first pad, described Second connector is the second pad, and first pad is electrically connected with the first circuit board and the second circuit board respectively, Second pad is not with the first circuit board and second pad is not electrically connected with the second circuit board.
4. circuit board assemblies according to claim 2, which is characterized in that first connector is conductive adhesive layer, described Second connector is non-conductive glue layer.
5. circuit board assemblies according to claim 1, which is characterized in that the circuit board assemblies further comprise at least one A second electronic component, second electronic component is set in the non-antenna headroom portion of the first circuit board, described non- The cabling quantity connecting in antenna headroom portion with second electronic component is greater than on the second circuit board and described first The quantity of the cabling of electronic component connection.
6. circuit board assemblies according to claim 1, which is characterized in that the thickness of the second circuit board is greater than described the The thickness of one circuit board.
7. circuit board assemblies according to claim 1, which is characterized in that the second circuit board with a thickness of 1.8~ 2mm。
8. circuit board assemblies according to claim 2, which is characterized in that the interconnecting piece and the main part are square Shape, and the length of the interconnecting piece is less than the length of the main part, the width of the interconnecting piece is less than the width of the main part Degree, the long side edge of the interconnecting piece are connect with the long side edge of the main part.
9. circuit board assemblies according to claim 8, which is characterized in that the quantity of first connector be it is multiple, it is more A first connector is arranged along the length direction interval of the interconnecting piece.
10. circuit board assemblies according to claim 8, which is characterized in that the quantity of second connector be two, two A second connector be separately positioned on the main part along its length on both ends region.
11. circuit board assemblies according to claim 2, which is characterized in that the main part is on the first circuit board Upright projection the antenna headroom portion is completely covered.
12. circuit board assemblies according to claim 11, which is characterized in that the area in the antenna headroom portion is equal to described The area of main part.
13. circuit board assemblies according to claim 1, which is characterized in that the first circuit board is by second electricity Thickness at the first area of the projection covering of road plate is less than other regions of the first circuit board in addition to the first area Thickness.
14. circuit board assemblies according to claim 1, which is characterized in that be not provided with electronics member in the antenna headroom portion Part and cabling.
15. circuit board assemblies according to claim 1, which is characterized in that the second circuit board is close to first electricity Road plate is not provided with electronic component and cabling on one side.
16. a kind of electronic device, which is characterized in that the electronic device includes circuit described in claim 1-15 any one Board group part.
CN201821388583.XU 2018-08-24 2018-08-24 Electronic device and its circuit board assemblies Active CN208987215U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821388583.XU CN208987215U (en) 2018-08-24 2018-08-24 Electronic device and its circuit board assemblies

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821388583.XU CN208987215U (en) 2018-08-24 2018-08-24 Electronic device and its circuit board assemblies

Publications (1)

Publication Number Publication Date
CN208987215U true CN208987215U (en) 2019-06-14

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821388583.XU Active CN208987215U (en) 2018-08-24 2018-08-24 Electronic device and its circuit board assemblies

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110661079A (en) * 2019-10-10 2020-01-07 Oppo(重庆)智能科技有限公司 Shell assembly and electronic device
CN113301707A (en) * 2020-02-24 2021-08-24 北京小米移动软件有限公司 Circuit board and terminal equipment
WO2024168894A1 (en) * 2023-02-17 2024-08-22 深圳市虎一科技有限公司 Temperature probing apparatus for food materials and control circuit board thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110661079A (en) * 2019-10-10 2020-01-07 Oppo(重庆)智能科技有限公司 Shell assembly and electronic device
CN113301707A (en) * 2020-02-24 2021-08-24 北京小米移动软件有限公司 Circuit board and terminal equipment
WO2024168894A1 (en) * 2023-02-17 2024-08-22 深圳市虎一科技有限公司 Temperature probing apparatus for food materials and control circuit board thereof

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