CN208521132U - The device of film particles is removed before a kind of mask exposure - Google Patents
The device of film particles is removed before a kind of mask exposure Download PDFInfo
- Publication number
- CN208521132U CN208521132U CN201821140398.9U CN201821140398U CN208521132U CN 208521132 U CN208521132 U CN 208521132U CN 201821140398 U CN201821140398 U CN 201821140398U CN 208521132 U CN208521132 U CN 208521132U
- Authority
- CN
- China
- Prior art keywords
- light
- transmitting plate
- mask exposure
- ultrasonic wave
- patterned films
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The utility model belongs to IC manufacturing field, is related to removing the device of film particles, including light-transmitting plate, ultrasonic wave ion generator before a kind of mask exposure;The lower surface of the light-transmitting plate is for loading patterned films;The ultrasonic wave ion generator can provide concussion shape ionized gas to the patterned films surface;The blowing direction of the concussion shape ionized gas and the film surface of the patterned films are in inclination of the angle less than 90 degree.Influence of the particle to exposure performance during mask exposure can be effectively reduced in the utility model.
Description
Technical field
The utility model belongs to IC manufacturing field, is related to removing the device of film particles before a kind of mask exposure.
Background technique
Integrated circuit is then to pass through metal interconnecting wires by forming semiconductor devices in the range of several microns of silicon chip surface
These devices are interconnected to form circuit.With the development of semiconductor technology, in order to enhance product performance, cost, collection are saved
Increasing at the density of circuit, characteristic size is smaller and smaller.Wherein, in semiconductor processing, photoetching, exposure technology occupy act
The status of sufficient weight.
Exposure process can generate film particles, and the influence in order to avoid film particles to performance, the prior art is mainly in light
Infrared/chromatography/visible optical test is carried out before cover exposure, removes film particles with air/nitrogen gun.
But removing detection frequency in the method for film particles in the prior art will affect detection success rate, and need the time to be
Light shield is unloaded in cleaning.In addition, removing particle using air cannon or nitrogen gun, the viscous particle on film cannot be blown with maximum gas pressure,
Electrostatic is sticked to particle on film.
Utility model content
The utility model provides the device that film particles are removed before a kind of mask exposure, and mask exposure mistake can be effectively reduced
Influence of the particle to exposure performance in journey.
To realize the above-mentioned technical purpose, the device of film particles, including light-transmitting plate, ultrasonic wave are removed before a kind of mask exposure
Ion generator;
The lower surface of the light-transmitting plate is for loading patterned films;
The ultrasonic wave ion generator can provide concussion shape ionized gas to the patterned films surface;The concussion shape
The blowing direction of ionized gas and the film surface of the patterned films are in inclination of the angle less than 90 degree.
It further include light source and light shield as the improved technical solution of the utility model, the light shield is set to the light-transmitting plate
On;The upper surface of the light shield and the light-transmitting plate is formed with every light confined space;The light source can be by being arranged on light shield
Light source entrance is pointed into light-transmitting plate;The light-transmitting plate is light transparent material.
As the improved technical solution of the utility model, the light shield and the ultrasonic wave ion generator are mounted on exposure
On the wafer carrying platform of processing equipment.
As the improved technical solution of the utility model, the ultrasonic wave ion generator can be rotated around the light-transmitting plate.
As the improved technical solution of the utility model, the time that the ultrasonic wave ion generator rotates one week is described
The integral multiple of patterned films exposure time interval.
As the improved technical solution of the utility model, the patterned films are installed on light-transmitting plate by frame shape film frame
Lower section.
As the improved technical solution of the utility model, the blowing direction of the concussion shape ionized gas and the pattern are thin
The film surface of film is in angle between the inclination of 5-85 degree.
As the improved technical solution of the utility model, the ultrasonic wave ion generator includes variable frequency type ultrasonic ion
Generator.
Beneficial effect
The application realizes the film particle that removal mask exposure process generates using ultrasonic ion wave producer, particularly
Ultrasonic wave promotes ionized gas to shake, and the vibration of ionized gas promotes patterned films to shake, ionized gas and patterned films
Common realize of vibration improves film particles removal efficiency.
Concussion shape ionized gas is contacted with patterned films in angle, can accelerate the removal of film particles.
Detailed description of the invention
The structural schematic diagram of device in Fig. 1 illustrated embodiments;
Membrane ion removal process schematic diagram in Fig. 2 illustrated embodiments;
In figure: 1, light-transmitting plate;2, patterned films;3, ultrasonic wave ion generator;4, shape ionized gas is shaken;5, frame shape is thin
Membrane support.
Specific embodiment
To keep the purpose and technical solution of the utility model embodiment clearer, implement below in conjunction with the utility model
The attached drawing of example, is clearly and completely described the technical solution of the utility model embodiment.Obviously, described embodiment
It is a part of the embodiment of the utility model, instead of all the embodiments.Based on described the embodiments of the present invention,
Those of ordinary skill in the art's every other embodiment obtained under the premise of being not necessarily to creative work belongs to practical
Novel protected range.
Those skilled in the art of the present technique are appreciated that unless otherwise defined, all terms used herein (including technology art
Language and scientific term) there is meaning identical with the general understanding of those of ordinary skill in the utility model fields.Also
It should be understood that those terms such as defined in the general dictionary should be understood that have in the context of the prior art
The consistent meaning of meaning will not be explained in an idealized or overly formal meaning and unless defined as here.
As shown in Figure 1, removing the device of film particles before a kind of mask exposure, including light-transmitting plate 1, ultrasonic wave ion occur
Device 3;
The lower surface of the light-transmitting plate 1 is for loading patterned films 2;Patterned films are installed on by frame shape film frame 5
The lower section of light-transmitting plate 1;
The ultrasonic wave ion generator 3 can provide concussion shape ionized gas 4 on 2 surface of patterned films;The shake
The blowing direction of shape ionized gas 4 and the film surface of the patterned films 2 are swung in inclination of the angle less than 90 degree.Preferably, institute
Inclination of the film surface of the blowing direction and the patterned films 2 of stating concussion shape ionized gas 4 in angle between 5-85 degree.It is described
Ultrasonic wave ion generator 3 includes variable frequency type ultrasonic ion generator.
It further include light source and light shield as the improved technical solution of the utility model, the light shield is set to the light-transmitting plate 1
On;The upper surface of the light shield and the light-transmitting plate 1 is formed with every light confined space;The light source can be by being arranged on light shield
Light source entrance is pointed into light-transmitting plate 1;The light-transmitting plate 1 is light transparent material.The light shield is set on the light-transmitting plate 1, avoids institute
State the diverging for the light that light source is emitted;Improve exposure efficiency.
As the improved technical solution of the utility model, the light shield and the ultrasonic wave ion generator 3 are mounted on exposure
On the wafer carrying platform of light processing equipment.
In order to realize that the surface to the patterned films 2 is uniformly cleaned, the ultrasonic wave ion generator 3 can be around
The light-transmitting plate 1 rotates.When the time of the rotation one week of ultrasonic wave ion generator 3 is 2 exposure interval of patterned films
Between integral multiple.
The above is only the embodiments of the present invention, and the description thereof is more specific and detailed, but can not therefore understand
For a limitation on the scope of the patent of the present invention.It should be pointed out that for those of ordinary skill in the art, not taking off
Under the premise of from the utility model design, various modifications and improvements can be made, these belong to the protection of the utility model
Range.
Claims (8)
1. removing the device of film particles before a kind of mask exposure, which is characterized in that occur including light-transmitting plate, ultrasonic wave ion
Device;
The lower surface of the light-transmitting plate is for loading patterned films;
The ultrasonic wave ion generator can provide concussion shape ionized gas to the patterned films surface;
The blowing direction of the concussion shape ionized gas and the film surface of the patterned films are in inclination of the angle less than 90 degree.
2. removing the device of film particles before mask exposure according to claim 1, which is characterized in that further include light source with
Light shield, the light shield are set on the light-transmitting plate;The upper surface of the light shield and the light-transmitting plate is formed with every light confined space;
The light source can be pointed into light-transmitting plate by the light source entrance being arranged on light shield;The light-transmitting plate is light transparent material.
3. removing the device of film particles before mask exposure according to claim 2, which is characterized in that the light shield and institute
Ultrasonic wave ion generator is stated to be mounted on the wafer carrying platform of exposure-processed equipment.
4. before mask exposure according to claim 1 remove film particles device, which is characterized in that the ultrasonic wave from
Electronic generator can be rotated around the light-transmitting plate.
5. before mask exposure according to claim 4 remove film particles device, which is characterized in that the ultrasonic wave from
Electronic generator rotates one week time as the integral multiple of the patterned films exposure time interval.
6. removing the device of film particles before mask exposure according to claim 1, which is characterized in that the patterned films
The lower section of light-transmitting plate is installed on by frame shape film frame.
7. before mask exposure according to claim 1 remove film particles device, which is characterized in that the concussion shape from
The blowing direction of sub- gas and the film surface of the patterned films are in inclination of the angle between 5-85 degree.
8. before mask exposure according to claim 1 remove film particles device, which is characterized in that the ultrasonic wave from
Electronic generator includes variable frequency type ultrasonic ion generator.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821140398.9U CN208521132U (en) | 2018-07-18 | 2018-07-18 | The device of film particles is removed before a kind of mask exposure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821140398.9U CN208521132U (en) | 2018-07-18 | 2018-07-18 | The device of film particles is removed before a kind of mask exposure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN208521132U true CN208521132U (en) | 2019-02-19 |
Family
ID=65335089
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201821140398.9U Active CN208521132U (en) | 2018-07-18 | 2018-07-18 | The device of film particles is removed before a kind of mask exposure |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN208521132U (en) |
-
2018
- 2018-07-18 CN CN201821140398.9U patent/CN208521132U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9480375B2 (en) | Aeroacoustic duster | |
US6642531B1 (en) | Contamination control on lithography components | |
US20050268408A1 (en) | Cleaning system | |
JP2001127011A (en) | Method for dividing semiconductor wafer | |
TW201528412A (en) | Substrate processing apparatus, control method for substrate processing apparatus, and recording medium | |
US10126666B2 (en) | Apparatus and a method of forming a particle shield | |
TW201624107A (en) | Photomask cleaning apparatus and method | |
CN208521132U (en) | The device of film particles is removed before a kind of mask exposure | |
JP2010212586A (en) | Method of cleaning substrate | |
JP2007109838A (en) | Device and its manufacturing method | |
CN110737175A (en) | Method for removing film particles before exposure of masks | |
US20080282500A1 (en) | Nozzle and dust removing apparatus | |
JP2015034731A (en) | Testing apparatus and testing method | |
US20110214246A1 (en) | Aeroacoustic Duster | |
JP2015126092A (en) | Cleaning substrate and method for cleaning substrate processing device | |
KR100883280B1 (en) | Ultrasonic cleaning apparatus using by resonance | |
JP4698871B2 (en) | Soft X-ray ionizer | |
JP2011141361A (en) | Foreign matter removing apparatus, foreign matter removing method and method for manufacturing pattern substrate | |
JP2000216228A (en) | Substrate fixing stage | |
JP2005252176A (en) | Substrate processor and substrate processing method | |
JP5658803B2 (en) | Cleaning method | |
US20150109590A1 (en) | Scanner routing method for particle removal | |
JPH02257613A (en) | Removal of contamination by fine particle | |
JP2002316110A (en) | Electronic part washing method and washing apparatus used therein | |
CN113179572B (en) | Static electricity removing device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |