CN207731316U - A kind of RFID water-washing labels - Google Patents
A kind of RFID water-washing labels Download PDFInfo
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- CN207731316U CN207731316U CN201721158712.1U CN201721158712U CN207731316U CN 207731316 U CN207731316 U CN 207731316U CN 201721158712 U CN201721158712 U CN 201721158712U CN 207731316 U CN207731316 U CN 207731316U
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Abstract
The utility model discloses a kind of RFID water-washing labels, this programme on flexible parent metal antenna stack by covering coated polyimide epiphragma, and weld chip and antenna, to ensure stability, reliability, resistance to alkali cleaning, high temperature resistant and the durability of performance during label uses.This programme can operate with the two-band label of high-frequency band label, ultra-high frequency band label or both the above frequency.
Description
Technical field
The utility model is related to radio frequency arts, and in particular to RFID electronic label technology.
Background technology
RFID radio frequency identifications are a kind of contactless automatic identification technologies, it passes through radiofrequency signal automatic identification mesh
Mark object simultaneously obtains related data, and identification work is operable with various adverse circumstances without manual intervention.RFID technique is recognizable
High-speed moving object simultaneously can identify multiple electronic tags simultaneously, swift and convenient to operate, frequently be used in supermarket.
RFID water-washing labels are as a kind of special tag, in view of the particularity of use environment, to the reliability of label, especially
Being bending resistance has very high requirement.
And the manufacturing method of existing RFID washing electronic labels is all using flip-chip in antenna, then packet flexible glue at present
(such as silica gel) and do the scheme that antenna adds dozen gold thread bonding dispensings to do chip package around plain conductor suture.
It is easy to cause antenna fine fisssure or braking effect antenna during being used based on the prepared label of such method
Performance, bending will cause chip to connect the failure phenomenons such as unreliable, wafer damage or module explosion energetically repeatedly under high temperature, with
The upper durability and reliability for just influencing label, while low production efficiency and product thickness or local thickness's height are influenced with comfortable
Sense, part producing equipment also need to develop again, and corresponding cost is also high.
Utility model content
For problem present in existing RFID washing electronic labels reliability aspect, a kind of new RFID washing electronics is needed
Label scheme, to improve the durability and reliability of RFID washing electronic labels.
For this purpose, the purpose of this utility model is to provide a kind of RFID water-washing labels, RFID water stable and reliable for performance
Wash label.
In order to achieve the above object, RFID water-washing labels provided by the utility model, including：
Antenna part, the antenna part include flexible parent metal antenna stack and the coated polyimide that is covered on antenna stack
Epiphragma reserves the hole of chip connection on the cover film；
Chip part, the chip part are assemblied in by SMT welding procedures on the flexible parent metal antenna stack of antenna part.
Further, the flexible parent metal antenna stack is the antenna stack being made of polyimide base material, the polyimides
Base material is to press the high flexibility that copper foil is constituted by polyimides to have glue copper foil base material；The flexible parent metal antenna stack is by height
The antenna stack that flexible glue-free copper foil base material is constituted.
Further, in the RFID water-washing labels further include protection part, the protection portion point includes being arranged in chip
The filling glue of bottom, be arranged chip top Protection glue, be arranged around chip cofferdam component, be installed on antenna part device
The buffer substrate tablet of part rigging position reverse side, be installed on it is one or more in the stiffening plate of antenna part device rigging position reverse side.
Further, the buffer substrate tablet is the polyimide piece of the flexible-belt hot-setting adhesive between base material and reinforcement,
On be provided with recess corresponding with antenna and chip chamber connecting line.
Further, the cofferdam component is cofferdam ring or cofferdam device, and the cofferdam device is by several same cofferdam members
Device encloses.
In order to achieve the above object, RFID water-washing labels provided by the utility model, including：
Outer antennas part, the antenna part include that flexible parent metal antenna stack and full page are covered in gathering on antenna stack
Acid imide cover film；
Chip module part, the chip module part include that chip and miniature antenna unit PCB, the chip pass through
SMT welding procedures are assemblied on miniature antenna unit PCB；
The chip module part is integrally placed on outer antennas, the miniature antenna unit in the chip module part
PCB is coupled with outer antennas part；The outer antennas part receives miniature antenna in high-power signal coupling driving chip module
Unit drives chip operation, the good signal of chip processing to amplify by the miniature antenna unit coupled peripheral antenna part of chip module
Transmitting.
Further, the chip module is the chip prepared by the assembly of SMT welding procedures in PCB antenna, and
Point protection glue and cure.
Further, the cover board of covering chip part is set on the outer antennas part.
Further, the cover board is specifically on chip part, and chip part is integrally folded in peripheral big antenna and is worked as
In so that PCB antenna is substantially remained in the big antenna in periphery on same plane thereon.
Further, in the RFID water-washing labels further include protection part, the protection portion point includes being arranged in chip
The filling glue of bottom, be arranged chip top Protection glue, be arranged around chip cofferdam component, be installed on antenna part device
The buffer substrate tablet of part rigging position reverse side, be installed on it is one or more in the stiffening plate of antenna part device rigging position reverse side.
Washing RFID tag scheme provided by the utility model, based on high flexibility circuit board material, antenna circuit resistant to bending
Design and manufacture, the packaging technology of chip, chip welding and a variety of protections etc. are many-sided to ensure to wash in RFID tag utilization
Stability, reliability, resistance to alkali cleaning, high temperature resistant and the durability of performance.
This programme coordinates corresponding antenna moulding process by using flexible parent metal (flexible PCB), effectively improves antenna
Bending, the buffer substrate tablet of cooperation promotes bending resistance；The packaging method full size chip of this programme chips carries simultaneously
High bonding area is to promote welding fastness and reliability, and small-size chips are easy to protect, and scolding tin welds heat shock resistance and reliable
Property it is high；Stiffening plate, the metal cofferdam ring (or cofferdam device) for protecting chip, height is added in antenna structure and technological design in this programme
Intensity hot-setting adhesive, certain thickness FR4 materials miniature antenna a variety of methods such as combined further to protect and reinforce chip with cover board
Reliability；Label selected materials are resistant to be higher than 160 degrees Celsius, show the soda acid of the resistance to common intensity of material；It constitutes accordingly
Label is with durable bending, pressure-resistant washing, acid-fast alkali-proof, high temperature resistant, and technique manufacture and the simple maturation of equipment, production capacity are big, accordingly
Manufacturing cost is also low.
Washing RFID tag scheme provided by the utility model can operate with high-frequency band label, ultra-high frequency band label or
The two-band label of both the above frequency.
Description of the drawings
The utility model is further illustrated below in conjunction with the drawings and specific embodiments.
Fig. 1 is single side in the example of the utility model without gum base materials antenna schematic diagram；
Fig. 2 is that single side has gum base materials antenna schematic diagram in the example of the utility model；
Fig. 3 is two-sided no gum base materials antenna schematic diagram in the example of the utility model；
Fig. 4 has gum base materials antenna schematic diagram to be two-sided in the example of the utility model；
Fig. 5 is the structural schematic diagram of cofferdam ring in the example of the utility model；
Fig. 6 is the structural schematic diagram of cofferdam device in the example of the utility model；
Fig. 7 is the structural schematic diagram of stiffening plate in the example of the utility model；
Fig. 8 is the structural schematic diagram of buffer substrate tablet in the example of the utility model；
Fig. 9 is the assembling schematic diagram of buffer substrate tablet in the example of the utility model；
Figure 10 is single side in the example of the utility model without gum base materials outer antennas schematic diagram；
Figure 11 is that single side has gum base materials outer antennas schematic diagram in the example of the utility model；
Figure 12 is the schematic diagram of the module with miniature antenna in the example of the utility model；
Figure 13 is the preparation flow figure of chip module part shown in Figure 12；
Figure 14 is the schematic diagram of through-hole cover board in the example of the utility model；
Figure 15 is the schematic diagram of half-via cover board in the example of the utility model；
Figure 16 is the structural schematic diagram that the utility model is 1 label of example；
Figure 17 is the preparation flow figure of label shown in Figure 16；
Figure 18 is the structural schematic diagram that the utility model is 2 label of example；
Figure 19 is the preparation flow figure of label shown in Figure 18；
Figure 20 is the structural schematic diagram that the utility model is 3 label of example；
Figure 21 is the preparation flow figure of label shown in Figure 20；
Figure 22 is the structural schematic diagram that the utility model is 4 label of example；
Figure 23 is the preparation flow figure of label shown in Figure 22；
Figure 24 is the structural schematic diagram that the utility model is 5 label of example；
Figure 25 is the preparation flow figure of label shown in Figure 24；
Figure 26 is the structural schematic diagram that the utility model is 6 label of example；
Figure 27 is the preparation flow figure of label shown in Figure 26.
Specific implementation mode
In order to make the technical means, creative features, achievement of purpose, and effectiveness of the utility model be easy to understand, under
Face combines and is specifically illustrating, and the utility model is expanded on further.
The characteristics of this programme is for washing RFID tag, by selecting high flexibility circuit board, and is based on antenna electric resistant to bending
Road is designed and manufacture, the packaging technology of chip, chip weld and a variety of protection schemes, thus constitutes the washing of high reliability
RFID tag ensures stability, reliability, resistance to alkali cleaning, high temperature resistant and the durability of performance during label uses.
The washing RFID tag that this programme provides, it includes mainly antenna part, chip part and protection part to constitute；
Wherein, antenna part is used for the reception and transmitting of communication signal；Chip part coordinates with antenna part, is used for signal processing and letter
Breath storage；Protection part is for ensureing that chip and antenna are reliably connected and antenna durability.
Specifically, the antenna part in this programme is mainly by flexible parent metal antenna stack and the polyamides being covered on antenna stack
Imines cover film is constituted.Wherein flexible parent metal antenna stack by polyimides (PI) base material by drilling, patch dry film, exposure, development,
Etching forms designed dwi hastasana and constitutes；High temperature and pressure handle is passed through by polyimides cover film (PI+ glue) again on this basis
Antenna metal part protects, and the durability of antenna can be greatly improved based on the polyimides cover film；The covering simultaneously
Film reserves the hole of chip connection, convenient for being welded with chip part.
Here polyimides (PI) base material, which is high flexibility, gum base materials, mainly again by polyimides (PI) layer coating glue
Composite copper foil, then pressed through high temperature and pressure.Compound copper foil is specifically less than equal to 0.5OZ calenderings (RA) or cathode copper
Foil.
As an alternative, here high flexibility may be used without glue copper foil base material to replace in polyimides (PI) base material.
Furthermore polyimides (PI) base material or high flexibility in this programme can be single or double without glue copper foil base material
Copper foil base material, mounting surface can be determined with unlimited by being formed by antenna in this way, and production efficiency is improved convenient for the installation of chip.
As an example, following four kinds of antenna structures can be formed according to said program：
1. single side is without gum base materials antenna 100, as shown in Figure 1, the single side without gum base materials antenna 100 by select high flexibility without
Glue single side copper foil base material, and antenna pattern composition is produced using flexible PCB single sided board technique.
2. single side has gum base materials antenna 200, as shown in Fig. 2, the single side has gum base materials antenna 200 by selecting polyimides
(PI) single side copper foil base material, and antenna pattern composition is produced using flexible PCB single sided board technique.
3. two-sided no gum base materials antenna 300, as shown in figure 3, the two-sided no gum base materials antenna 300 by select high flexibility without
The two-sided copper foil base material of glue, and antenna pattern composition is produced using flexible PCB dual platen technique.
4. two-sided have gum base materials antenna 400, as shown in figure 4, this two-sided has gum base materials antenna 400 to pass through to select polyimides
(PI) two-sided copper foil base material, and antenna pattern composition is produced using flexible PCB dual platen technique.
CSP (Chip Size Package) encapsulation or common length are done by justifying wafer chips in chip part in this programme
Ball, long tin ball sealing dress are constituted.
The chip part of such structure is by SMT techniques assemble welding in above-mentioned antenna part.Such welding dress
Production efficiency can not only be greatly improved with scheme, reduces production cost；It is easy to protect using small-size chips simultaneously, with former ruler
Bonding area can be improved to promote welding fastness and reliability in very little chip, and scolding tin welding heat shock resistance and reliability are high, in this way
The reliability of finished product label can be further increased.
Protection part in this programme, can be to being welded on the coupling part of chip part and the two in antenna part
Multi-faceted protection is formed, to ensure that chip and antenna are reliably connected and antenna durability.
The protection portion point include be arranged chip bottom filling glue (underfill), protection in chip top is set
Glue (coating glue), the cofferdam ring being arranged around chip or cofferdam device are installed on antenna circuit board (i.e. flexible parent metal antenna
Layer) device rigging position reverse side buffer substrate tablet, to be installed on antenna circuit board (i.e. flexible parent metal antenna stack) device rigging position anti-
The stiffening plate in face.These guard blocks can select to be applied in combination according to the practical application of label.
Referring to Fig. 5 which shows the structural schematic diagram of cofferdam ring 102a in this example approach.Cofferdam ring 102a is used can lead
It is stamped to form after metal (such as copper foil) or surface treatment nickel, gold, tin that tin connects, then carries out braid.Each cofferdam ring 102a inner rings
Inner diameter size it is corresponding with the outer diameter for the chip part being welded in antenna part, chip can be held and be partially disposed at wherein；Together
When cofferdam ring 102a thickness be not less than chip part thickness, thus the cofferdam ring 102a of structure can be located at chip part
Around, connection structure to chip part and with antenna part forms protection, thus ensures that chip is reliably connected with antenna
With antenna durability.
Referring to Fig. 6 which shows the structural schematic diagram of cofferdam device 102b in this example approach.Cofferdam device 102b,
Directly selecting does not influence the device of antenna RF performance, and element height is slightly above chip, generally selects 4 same device sides of surrounding
Shape, the SMD of optional market standard encapsulation such as 0201,0402,0603.The cofferdam device 102b of such structure, surrounds rectangular
The internal diameter of interior zone is corresponding with the outer diameter of chip part, can hold chip and be partially disposed at wherein；Cofferdam device 102b simultaneously
Thickness be not less than chip part thickness, thus the cofferdam device 102b of structure can be located at chip portion, from four
Week, connection structure to chip part and with antenna part formed protection, thus ensured that chip and antenna are reliably connected and day
Line durability.
Referring to Fig. 7 which shows the structural schematic diagram of stiffening plate 104 in this example approach.The stiffening plate 104 is preferably justified
Shape, the stiffening plate 104 of circular design are installed on antenna circuit board (i.e. flexible parent metal antenna stack) device rigging position reverse side at it
When, in bending, antenna is not easy to form the bending for fixing a line, promotes antenna bending performance.
The stiffening plate 104 specifically uses the polyimide piece with hot-setting adhesive or expoxy glass plate, by heat posted in buffer substrate tablet
On, and high temperature and pressure presses flexible antennas, buffer substrate tablet and stiffening plate integrally.When carrying out high-temperature laminating here, 160 DEG C of high temperature
Cure 60 minutes or more.
Referring to Fig. 8 which shows the structural schematic diagram of buffer substrate tablet 103 in this example approach.The buffer substrate tablet 103 be used between
Between base material and stiffening plate, to deformation between the two into row buffering.The buffer substrate tablet 103 is preferably the PI pieces of flexible-belt hot-setting adhesive,
It is punched into at two or the circle of many places recess, these recesses are symmetrically distributed in the periphery of round buffer substrate tablet, and and antenna
It is corresponding with chip link.Buffer substrate tablet 103 is so designed when being installed on antenna circuit board (i.e. flexible parent metal antenna stack),
Antenna buckling strength can be improved, is not easily broken, in addition entire buffer substrate tablet is connected the reinforcement of soft antenna and hard, preferably
Antenna is protected to be broken from bending fatigue.
Thus configured washing RFID tag, makes the direct electrically connected antenna of chip by welding procedure, can with compared with
Low production cost and higher formation efficiency produce to obtain washing RFID tag stable and reliable for performance.
As an example, the illustratively generation of the washing RFID tag of the direct electrically connected antenna of this programme chips below
Journey.
1. preparing antenna part
Based on the demand of high flexibility high-durability, this antenna part passes through flexible PCB using high flexibility board substrate
Technique produces required antenna pattern (specific as aforementioned), recycles high temperature and pressure that polyimides cover film is pressed on antenna
On with protection and insulated antenna metal layer, and reserve on polyimides cover film the tie point of chip assembly；
Reverse side in the chip mounting area of antenna part (i.e. the high flexibility circuit board with antenna pattern) is bonded buffering
Piece and stiffening plate and high temperature and pressure pressing.
Here stiffening plate material can be polyimides (PI), glass mat (FR4) and steel disc；Here buffer substrate tablet
Material is polyimides (PI) as base material, whether sighting target label application strength conditions add, according to buffer substrate tablet, is then made
It is corresponding with chip connection circuit that buffer substrate tablet mounts notch.
2. encapsulating chip part
Circle wafer chips are directly done into CSP (Chip Size Package) encapsulation or common long ball, long tin ball sealing fill, by
This obtains chip part.The chip part so encapsulated, chip is small to be easy to protect, and is selected later according to SMT equipment situations
Chip braid or the direct SMT of wafer, formation efficiency are high and at low cost.
3. chip welds
The chip part that encapsulation obtains is passed through into the direct assemble welding of SMT welding procedures to the chip installation area of antenna part
Domain so that chip is directly electrically connected by the tie point reserved on polyimides cover film in antenna part with antenna.
On this basis protection setting is further selected according to label application strength conditions.
It can be chosen whether to need to carry out underfill to chip according to chip welding effect；
As needed, point protection glue (the coating glue) on chip and cofferdam component waits for its solidification with better protection
Chip, the Protection glue Shore hardness should be greater than D:57；
Cofferdam ring can be assembled around chip by SMT techniques or for the device in cofferdam, which is as needed
Can tin welding becket, thickness is more than or equal to the thickness of CSP chips, cofferdam device be draw materials present market standard 0201,
0402, the SMD of 0603 encapsulation is mounted on around chip and plays the role of protecting chip and resistance to compression.
The entire label being so prepared can be loaded in cloth bag according to applicable cases or be applied together with cloth pressing
(with cloth pressing portions or whole pressing).
Based on above-mentioned label preparation process, this programme can also be equally applicable to there are many evolution scheme combined.
In addition, antenna part here can not advised by the double-faced flexible wiring board of the two-sided connection of via hole according to actual demand
Determine the mounting surface of chip.
For the washing RFID tag scheme of the above-mentioned direct electrically connected antenna of the chip provided, the utility model gives
The washing RFID tag scheme that chip is coupled by individual miniature antenna with outer antennas.
In the washing RFID tag scheme of this coupled modes, by the chip module part with miniature antenna, outer antennas
Part and protection portion distribution are closed and are constituted.
Wherein, the chip module part with miniature antenna is mainly electrically connected to form by RFID chip part and miniature antenna, is used
In the reception and transmitting of communication signal and processing and the information storage of coherent signal.
Outer antennas part drives core for receiving the miniature antenna in more high-power signal coupling driving chip module part
Piece works, and the good signal of chip processing passes through the miniature antenna coupled peripheral antenna amplification transmitting of chip module part.
Part is protected, ensures that chip is reliably connected with antenna.
The washing RFID tag scheme of the implementation and the direct electrically connected antenna of chip of peripheral antenna part in this programme
The implementation of middle antenna part is identical, is equally covered by flexible parent metal antenna stack and the polyimides being covered on antenna stack
Film is constituted.Wherein flexible parent metal antenna stack is formed by polyimides (PI) base material by drilling, patch dry film, exposure, development, etching
Designed dwi hastasana is constituted；High temperature and pressure is passed through antenna metal by polyimides cover film (PI+ glue) again on this basis
It all protects, the durability of antenna can be greatly improved based on the polyimides cover film.
Here polyimides (PI) base material, which is high flexibility, gum base materials, mainly again by polyimides (PI) layer coating glue
Composite copper foil, then pressed through high temperature and pressure.Compound copper foil is specifically less than equal to 0.5OZ calenderings (RA) or cathode copper
Foil.
As an alternative, here high flexibility may be used without glue copper foil base material to replace in polyimides (PI) base material.
Furthermore polyimides (PI) base material or high flexibility in this programme can be single or double without glue copper foil base material
Copper foil base material, mounting surface can be determined with unlimited by being formed by outer antennas in this way, and production efficiency is improved convenient for the installation of chip.
As an example, scheme can form following 2 kinds of outer antennas structures accordingly：
1. single side is without gum base materials outer antennas 600, as shown in Figure 10, which passes through choosing without gum base materials outer antennas 600
With high flexibility without glue single side copper foil base material, and antenna pattern composition is produced using flexible PCB single sided board technique.
2. single side has gum base materials outer antennas 700, as shown in figure 11, which has gum base materials outer antennas 700 to pass through choosing
Antenna pattern composition is produced with polyimides (PI) single side copper foil base material, and using flexible PCB single sided board technique.
The chip module part 500 with miniature antenna is welded in through SMT techniques by RFID chip part 101 in this programme
It on PCB miniature antennas 106, and puts the solidification 60 minutes of 160 DEG C of chip Protection glue high temperature or more and constitutes, as shown in figure 12.
The RFID chip part 101 is the RF chips completed through IC package, specifically can be CSP by circle wafer chips
(Chip Size Package) is encapsulated or common long ball, long tin ball encapsulation process are constituted, and choose whether to compile according to subsequent production
Band.Thus configured RFID chip can be assembled in such a way that SMT techniques are welded.
PCB miniature antennas 106 are to form institute by drilling, patch dry film, exposure, development, etching by covering the glass mat of copper
The pcb board of the antenna pattern of design.Thus PCB miniature antennas 106 are constituted, contain antenna pattern thereon and can SMT chip bonding pads.
The chip module part 500 of such structure, specific preparation process is as follows, as shown in figure 13：
Step P511 produces PCB miniature antennas 106 based on the glass mat for covering copper by single side PCB common process；
Packaged RF chips 101 are directly welded in by SMT welding procedures on PCB miniature antennas 106 by step P512；
Step P513, chip bottom and around hot-setting adhesive 105 on point, wait for that it is solidificated on the RF chips 101 being welded
Protective layer is formed, it is protected；
Step P514, the preset heat cure glued membrane 108 on being welded with the PCB miniature antennas 106 of RF chips 101, follow-up work
The direct hot pressing of skill is used.
In this programme by SMT techniques by RFID chip part 101 (i.e. RF chips) assemble welding in PCB miniature antennas 106
Upper composition chip module part 500.
And the chip module part 500 constituted accordingly, then it can integrally be placed in outer antennas part (list as shown in Figure 10
There is gum base materials outer antennas 700 in face without single side shown in gum base materials outer antennas 600 or Figure 11) on, especially by prefabricated thereon
Heat cure glued membrane and outer antennas press to form one through high temperature and pressure, and pass through PCB miniature antennas and outer antennas thereon
Thus coupling constitutes RFID tag main body.
Such assemble welding scheme can not only greatly improve production efficiency, reduce production cost；Small ruler is used simultaneously
Very little chip is easy to protect, and bonding area can be improved with full size chip to promote welding fastness and reliability, and scolding tin welding is resistance to
Thermal shock and reliability are high, can further increase the reliability of finished product label in this way.
Protection part in this programme can be formed the coupling part of the chip and the two that are welded on miniature antenna more
The protection in orientation, to ensure that chip and antenna are reliably connected and antenna durability.
The protection portion point include be arranged chip bottom filling glue (underfill), protection in chip top is set
Glue (coating glue) is installed on the buffer substrate tablet of chip module front or back on outer antennas, is installed on chip on outer antennas
The cover board of module reverse side.These guard blocks can select to be applied in combination according to the practical application of label.
Here filling glue, Protection glue and buffer substrate tablet scheme be not as described above, be repeated here herein.
Cover board in this example is mainly used for forming protection to the chip module part 500 being placed on outer antennas.
The cover board is specifically located on chip module part 500, and chip part and miniature antenna part are folded in cover board and chip dies
In the miniature antenna PCB of block so that PCB miniature antennas are substantially remained in outer antennas on same plane thereon, to reach best
Coupling effect；Cover board covers entire chip module part 500 simultaneously so that among chip is completely in protection and surrounds, protects
Demonstrate,prove the reliability of chip connection.
Referring to Figure 14 which shows the structural schematic diagram of through-hole cover board 107a.Through-hole cover board 107a be based on common PCB without
Copper coin is formed through holes drilled through and corresponding shape technique.Through-hole in through-hole cover board 107a is used for as the avoid holes worn entirely
With 500 corresponding matching of chip module part, so that chip is partially sandwiched in the miniature antenna PCB of cover board and chip module.
The cover board for wearing avoid holes entirely for this may be used also as needed by avoid holes and chip in face of clamping outer antennas
With point protection glue after selection, further protection is formed with internal chip module part 500 so that its interior chip is completely in guarantor
Among shield and encirclement, and make the connection of chip and PCB miniature antennas relatively reliable.
Referring to Figure 15 which shows the structural schematic diagram of half-via cover board 107b.Half-via cover board 107b is based on common
PCB is formed without copper coin through boring half-via and corresponding shape technique.
Half-via on half-via cover board 107b is matched as avoid holes are partly worn for corresponding with chip module part 500
It closes, so that chip to be partially sandwiched in the miniature antenna PCB of cover board and chip module.
The cover board 107b that avoid holes are partly worn for this faces to clamp outer antennas by avoid holes and the chip partly worn, with
Internal chip module part 500 forms further protection so that among its interior chip is completely in protection and surrounds, and makes
The connection of chip and PCB miniature antennas is relatively reliable.
As an example, below illustratively this coupled modes washing RFID tag generating process.
1. prepared by outer antennas part
Based on the demand of high flexibility high-durability, this outer antennas part passes through flexible electrical using high flexibility board substrate
Road plate technique produces required antenna pattern (specific as aforementioned), recycles high temperature and pressure that cover film full page is pressed on antenna
On with protection and insulated antenna metal layer.
On this basis, the miniature antenna installing zone in peripheral antenna part can be chosen whether according to label application strength conditions
Domain is bonded buffer substrate tablet.If desired it is bonded buffer substrate tablet in miniature antenna installation region, then so that buffer substrate tablet attachment notch is connect with chip
Circuit is corresponding, and high temperature and pressure presses.Here buffering sheet material is polyimides (PI) as base material.
2. encapsulating chip part
2.1 prepare PCB miniature antennas
To cover the glass mat of copper as base material, by drilling, pasting dry film, exposure, development, etching formed it is designed
Thus PCB miniature antennas are prepared in antenna pattern.
2.2 chip package
Circle wafer chips are directly done into CSP (Chip Size Package) encapsulation or common long ball, long tin ball sealing fill, are obtained
To RFID chip part.The chip part so encapsulated, chip is small to be easy to protect, and is selected later according to SMT equipment situations
Chip braid or the direct SMT of wafer, formation efficiency are high and at low cost.
2.3 chips weld
Pacified by the chip on SMT welding procedures direct assemble welding to PCB miniature antennas the chip part that encapsulation is obtained
Region is filled, detailed process is as shown in figure 13.
On this basis protection setting is further selected according to label application strength conditions.
It can be chosen whether to need to carry out underfill to chip according to chip welding effect；
As needed, point protection glue (the coating glue) on chip waits for its solidification with better protection chip, the guarantor
Shield glue Shore hardness should be greater than D:57.
3. chip module part is pressed with outer antennas
By cover board the obtained chip module part of encapsulation is pressed from both sides into outer antennas in the middle, specially cover board is by thereon
Avoid holes (avoid holes partly worn or the avoid holes worn entirely) are with chip part in face of clamping outer antennas；
Then, it presses to form one through high temperature and pressure by heat cure glued membrane preset on chip part and outer antennas.
Cover board for wearing avoid holes entirely is also an option that the form protection chip of rear point protection glue, such laminated construction
Two coupled antennas are nearly in a plane, and more preferably, among chip is completely in protection and surrounds, what chip connected can for coupling effect
It is good by property.
The entire label being so prepared can be loaded in cloth bag according to applicable cases or be applied together with cloth pressing
(with cloth pressing portions or whole pressing).
Based on above-mentioned label preparation process, this programme can also be equally applicable to there are many evolution scheme combined.
In addition, antenna part here can not advised by the double-faced flexible wiring board of the two-sided connection of via hole according to actual demand
Determine the mounting surface of chip.
From the foregoing, it will be observed that this patent provides the washing RFID tag scheme, have production simple process ripe, the manufacturing cycle
The advantages such as short, tag performance is reliable and stable, and opposite production cost is low.
This programme is illustrated below by way of some specific label examples.
Embodiment one
Referring to Figure 16, this example provide washing RFID tag mainly by antenna 100 (as shown in Figure 1), chip 101, enclose
Weir becket 102a, buffer substrate tablet 103, stiffening plate 104, the processing of hot-setting adhesive 105 are composed.Its specific preparation process is as follows
(as shown in figure 17)：
Step P111, the reverse side of chip mounting location is successively bonded buffer substrate tablet 103 and mends on the antenna 100 machined
It is strong by 104；When being bonded buffer substrate tablet 103, make the signal wire of recess respective antenna thereon；After the alignment attachment of PI buffer substrate tablets 103,
It is pressed again through high temperature and pressure.
Chip 101 and cofferdam becket 102a are welded in 100 corresponding position of antenna by step P112 by SMT techniques.
Step P113 reinforces and protects chip by hot-setting adhesive 105 and solidification after the completion of welding, is thus prepared
The washing RFID tag of high reliability.
Entire production preparation process simple process is ripe, and the manufacturing cycle is short, and tag performance is reliable and stable, opposite production cost
It is low.
Embodiment two
Referring to Figure 18, RFID tag that this example provides is mainly by antenna 200, chip 101, cofferdam becket 102a, slow
Punching 103, stiffening plate 104, the processing of hot-setting adhesive 105 are composed.
The specific preparation process of the RFID tag is following (as shown in figure 19)：
Step P211, the reverse side of chip mounting location is successively bonded slow on the antenna 200 (as shown in Figure 2) machined
Punching 103 and reinforcement 104；When being bonded buffer substrate tablet 103, make the signal wire of recess respective antenna thereon；In PI buffer substrate tablets 103
It is aligned after mounting, then pressed through high temperature and pressure.
Chip 101 and cofferdam becket 102a are welded in 200 corresponding position of antenna by step P212 by SMT techniques；
Step P213 reinforces and protects chip by hot-setting adhesive 105 and solidification after the completion of welding, is thus prepared
The RFID tag of high reliability.
Entire production preparation process simple process is ripe, and the manufacturing cycle is short, and tag performance is reliable and stable, opposite production cost
It is low.
Embodiment three
Referring to Figure 20, RFID tag that this example provides is mainly by antenna 300, chip 101, cofferdam becket 102a, slow
Punching 103, stiffening plate 104, the processing of hot-setting adhesive 105 are composed
The specific preparation process of the RFID tag is following (as shown in figure 21)：
Step P311, the reverse side of chip mounting location is successively bonded slow on the antenna 300 (as shown in Figure 3) machined
Punching 103 and reinforcement 104；When being bonded buffer substrate tablet 103, make the signal wire of recess respective antenna thereon；In PI buffer substrate tablets 103
It is aligned after mounting, then pressed through high temperature and pressure.
Chip 101 and cofferdam becket 102a are welded in 300 corresponding position of antenna by step P312 by SMT techniques.
Step P313 reinforces and protects chip by hot-setting adhesive 105 and solidification after the completion of welding, thus made
At label.
Entire production preparation process simple process is ripe, and the manufacturing cycle is short, and tag performance is reliable and stable, opposite production cost
It is low.
Example IV
Referring to Figure 22, the RFID tag that this example provides is mainly by antenna 400, chip 101, cofferdam device 102b, buffering
Piece 103, stiffening plate 104, the processing of hot-setting adhesive 105 are composed.
The specific preparation process of the RFID tag is following (as shown in figure 23)：
Step P411, the reverse side of chip mounting location is successively bonded slow on the antenna 400 (as shown in Figure 4) machined
Punching 103 and reinforcement 104；When being bonded buffer substrate tablet 103, make the signal wire of recess respective antenna thereon；In PI buffer substrate tablets 103
It is aligned after mounting, then pressed through high temperature and pressure.
Chip 101 and cofferdam device 102b are welded in 400 corresponding position of antenna by step P412 by SMT techniques.
Step P413 reinforces and protects chip by hot-setting adhesive 105 and solidification after the completion of welding, thus made
At label.
Entire production preparation process simple process is ripe, and the manufacturing cycle is short, and tag performance is reliable and stable, opposite production cost
It is low.
Embodiment five
Referring to Figure 24, the RFID tag that this example provides is mainly by antenna 600, chip module 500, buffer substrate tablet 103 and lid
Plate 107a processing is composed.
The specific preparation process of the RFID tag is following (as shown in figure 25)：
Step P611 is successively bonded buffer substrate tablet 103 and chip dies at the prepackage chip module (as shown in Figure 10) of antenna 600
Block 500, in 600 respective faces of antenna fitting cover board 107a.When being bonded buffer substrate tablet 103, make recess respective antenna thereon
Signal wire；It is pressed after the alignment attachment of PI buffer substrate tablets 103, then through high temperature and pressure.
Step P612, with hot-setting adhesive 105 filling and leading up and curing at cover board 107a, this label just completes.
Entire production preparation process simple process is ripe, and the manufacturing cycle is short, and tag performance is reliable and stable, opposite production cost
It is low.
Embodiment six
Referring to Figure 26, RFID tag that this example provides mainly by antenna 700, chip module 500, two panels buffer substrate tablet 103,
Processing is composed.
The specific preparation process of the RFID tag is following (as shown in figure 27)：
Step P711 is successively bonded buffer substrate tablet 103 and chip dies at antenna 700 (referring to Figure 11) prepackage chip module
Block, in 700 respective faces of antenna successively fitting buffer substrate tablet 103 and cover board 107b.When being bonded buffer substrate tablet 103, make thereon recessed
The signal wire of mouth respective antenna；Here two panels buffer substrate tablet is equally big up and down, can also be different size and is more advantageous to performance buffering work
With protection antenna.
Step P712, then press to be formed through high temperature and pressure with outer antennas by heat cure glued membrane preset on chip part
One.So that chip 101, which is enclosed in completely in the cavity between cover board 107b and outer antennas, plays preferably protection work
With such label just completes.
Entire production preparation process simple process is ripe, and the manufacturing cycle is short, and tag performance is reliable and stable, opposite production cost
It is low.
Basic principles, main features, and advantages of the present invention has been shown and described above.One's own profession
The technical staff of industry is it should be appreciated that the present utility model is not limited to the above embodiments, described in above embodiments and description
Only illustrate the principles of the present invention, on the premise of not departing from the spirit and scope of the utility model, the utility model is also
It will have various changes and improvements, these various changes and improvements fall within the scope of the claimed invention.The utility model
Claimed range is defined by the appending claims and its equivalent thereof.
Claims (10)
1. a kind of RFID water-washing labels, which is characterized in that including：
Antenna part, the antenna part include flexible parent metal antenna stack and the polyimides being covered on antenna stack covering
Film reserves the hole of chip connection on the cover film；
Chip part, the chip part are assemblied in by SMT welding procedures on the flexible parent metal antenna stack of antenna part.
2. RFID water-washing labels according to claim 1, which is characterized in that the flexible parent metal antenna stack is by polyamides Asia
The antenna stack that amido material is constituted, the polyimide base material are to press the high flexibility that copper foil is constituted by polyimides to have glue copper foil base
Material；The flexible parent metal antenna stack or the antenna stack to be made of without glue copper foil base material high flexibility.
3. RFID water-washing labels according to claim 1, which is characterized in that further include protection in the RFID water-washing labels
Part, the protection portion point include be arranged chip bottom filling glue, be arranged in the Protection glue on chip top, setting in chip
The cofferdam component of surrounding, the buffer substrate tablet for being installed on antenna part device rigging position reverse side are installed on the assembly of antenna part device
It is one or more in the stiffening plate of position reverse side.
4. RFID water-washing labels according to claim 3, which is characterized in that the buffer substrate tablet be between base material and reinforcement it
Between flexible-belt hot-setting adhesive polyimide piece, be provided with recess corresponding with antenna and chip chamber connecting line.
5. RFID water-washing labels according to claim 3, which is characterized in that the cofferdam component is cofferdam ring or cofferdam device
Part, the cofferdam device are enclosed by several same cofferdam components.
6. a kind of RFID water-washing labels, which is characterized in that including：
Outer antennas part, the antenna part includes flexible parent metal antenna stack and full page to be covered in the polyamides on antenna stack sub-
Amine cover film；
Chip module part, the chip module part include that chip and miniature antenna unit PCB, the chip are welded by SMT
Technique is connect to be assemblied on miniature antenna unit PCB；
The chip module part is integrally placed on outer antennas, the miniature antenna unit PCB in the chip module part with
Outer antennas part couples；The outer antennas part receives small antenna element band in high-power signal coupling driving chip module
Dynamic chip operation, the good signal of chip processing amplify transmitting by the miniature antenna unit coupled peripheral antenna part of chip module.
7. RFID water-washing labels according to claim 6, which is characterized in that the chip module is led in PCB antenna
Cross SMT welding procedures and assemble the chip that has prepared, and point protection glue with cure.
8. RFID water-washing labels according to claim 6, which is characterized in that setting covering core on the outer antennas part
The cover board of piece part.
9. RFID water-washing labels according to claim 8, which is characterized in that the cover board specifically on chip part, and
Chip part is integrally folded in peripheral big antenna so that PCB antenna substantially remains in same with peripheral big antenna thereon
In plane.
10. RFID water-washing labels according to claim 6, which is characterized in that further include protecting in the RFID water-washing labels
Protect part, the protection portion point include be arranged chip bottom filling glue, be arranged in the Protection glue on chip top, setting in core
Cofferdam component around piece, the buffer substrate tablet for being installed on antenna part device rigging position reverse side are installed on antenna part device dress
It is one or more in stiffening plate with position reverse side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721158712.1U CN207731316U (en) | 2017-09-11 | 2017-09-11 | A kind of RFID water-washing labels |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721158712.1U CN207731316U (en) | 2017-09-11 | 2017-09-11 | A kind of RFID water-washing labels |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207731316U true CN207731316U (en) | 2018-08-14 |
Family
ID=63090364
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721158712.1U Active CN207731316U (en) | 2017-09-11 | 2017-09-11 | A kind of RFID water-washing labels |
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| Country | Link |
|---|---|
| CN (1) | CN207731316U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107451639A (en) * | 2017-09-11 | 2017-12-08 | 上海合玉科技发展有限公司 | A kind of RFID label tag and preparation method |
| CN110378452A (en) * | 2019-08-16 | 2019-10-25 | 无锡品冠物联科技有限公司 | One kind is water-fastness to sew silica gel electronic tag and preparation method thereof |
-
2017
- 2017-09-11 CN CN201721158712.1U patent/CN207731316U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107451639A (en) * | 2017-09-11 | 2017-12-08 | 上海合玉科技发展有限公司 | A kind of RFID label tag and preparation method |
| CN107451639B (en) * | 2017-09-11 | 2024-09-20 | 林郁君 | RFID tag and preparation method thereof |
| CN110378452A (en) * | 2019-08-16 | 2019-10-25 | 无锡品冠物联科技有限公司 | One kind is water-fastness to sew silica gel electronic tag and preparation method thereof |
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Effective date of registration: 20210923 Address after: 200235 room 307, building 2, No. 100, Qinzhou Road, Xuhui District, Shanghai Patentee after: Shanghai Yierda Technology Co.,Ltd. Address before: 200011 room 579, No. 221, Baotun Road, Huangpu District, Shanghai Patentee before: JOINET INNOVATION TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right |