CN207637121U - Touch panel - Google Patents
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- CN207637121U CN207637121U CN201721106558.3U CN201721106558U CN207637121U CN 207637121 U CN207637121 U CN 207637121U CN 201721106558 U CN201721106558 U CN 201721106558U CN 207637121 U CN207637121 U CN 207637121U
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Abstract
A kind of touch panel includes substrate, touch-control sensing electrode, perimeter circuit, protective layer and conductive layer.Substrate has viewing area and peripheral region；Touch-control sensing electrode is set to viewing area; perimeter circuit is set to peripheral region; touch-control sensing electrode is electrically connected at perimeter circuit; wherein touch-control sensing electrode includes at least metal nanometer line with perimeter circuit; protective layer is disposed on the touch-control sensing electrode, and conductive layer is disposed on the perimeter circuit.
Description
Technical field
The utility model is about a kind of touch panel.
Background technology
In recent years, transparent conductor can allow light to pass through simultaneously and provide electric conductivity appropriate, thus be commonly applied to many displays
Or in the relevant device of touch-control.In general, transparent conductor can be various metal oxides, such as tin indium oxide (Indium
Tin Oxide, ITO), indium zinc oxide (Indium Zinc Oxide, IZO), cadmium tin (Cadmium Tin Oxide,
) or Al-Doped ZnO (Aluminum-doped Zinc Oxide, AZO) CTO.Metal-oxide film can pass through physical vapor
Sedimentation or chemical meteorology deposition method and formed, and appropriate pattern is formed by photoetching lithography process.However, these metal oxygens
The production method of compound film may face the problem of high cost, complicated technique and low yield.In part,
The problem of patterned metal-oxide film may also be easily observed.Therefore, it has developed now a variety of transparent
Conductor, such as utilize the transparent conductor made by the materials such as nano wire.
However, still there are many problems to be solved for the technology of the nano wire, such as made using nano wire
Touch control electrode, but all there are many problems to be solved in technique and in structure for nano wire and the metal lead wire of peripheral region, such as
Traditional handicraft makes the metal lead wire of peripheral region using silver paste, and must to be overlapped on nano wire made for the metal lead wire made by silver paste
At touch control electrode on, the size of contact impedance when this bridging arrangement must consider overlap joint, such as a kind of meeting in conventional practice
Thicker resin layer is used to be formed in the touch control electrode made by nano wire to improve weatherability, but thicker resin layer can make
The contact impedance for obtaining bridging arrangement rises, and then circuit is caused to generate consume or distortion when transmitting signal.Furthermore with silver paste institute
Manufactured metal lead wire easily causes silver-colored transport phenomena in wet environment because direct current gradient exists makes reliability reduce.
On the other hand, silver paste must make the metal lead wire after being coated on peripheral region in such a way that laser etches, this one
Cumbersome takes, and causes cost of manufacture raising and yield is relatively low, therefore be difficult to mass production.
Therefore it must be redesigned according to material property in technique, on electrode structure, product is made to reach preferable performance.
Utility model content
The durability of the touch-control sensing electrode of viewing area, and shape simultaneously can be improved in some embodiments of the utility model
At a low-impedance conducting wire.In addition, in some embodiments of the utility model, it is proposed that the making of new touch control electrode
Method, thus generate different from the past touch panel structure provided.
Some embodiments according to the present utility model, a kind of production method of touch panel include to provide to have viewing area
With the substrate of peripheral region；The touch-control sensing electrode and one that offer one is set on the viewing area are set to the periphery on the peripheral region
Circuit；One protective layer being set on touch-control sensing electrode is provided；And provide a conductive layer being set on perimeter circuit；Its
Described in touch-control sensing electrode be electrically connected at perimeter circuit, touch-control sensing electrode is to include at least gold by one with perimeter circuit
The transparency conducting layer of category nano wire is patterned to be formed afterwards.
In some embodiments of the utility model, the offer one is set to the touch-control sensing electrode on viewing area
And one to be set to perimeter circuit on peripheral region include providing a film layer, the wherein metal nano linear system is embedded at shape in the film layer
At conductive network, which is collectively formed the transparency conducting layer with the metal nanometer line；And remove the metal nano of part
Line in the viewing area and the peripheral region to be respectively formed a non-conducting areas.
In some embodiments of the utility model, metal nanometer line protrudes from the surface of film layer.
In some embodiments of the utility model, a pre-treatment step is further included, by the metal nano of peripheral region
Line exposes the surface of film layer.
In some embodiments of the utility model, the material of protective layer can be identical with the material of film layer or differs.
In some embodiments of the utility model, in film layer added with crosslinking agent, polymerization inhibitor, antioxidant,
UV light stabilizing agent, interfacial agent, corrosion inhibitor or above-mentioned mixture.
In some embodiments of the utility model, provides one in a manner of plating or electroless plating and be set to the perimeter circuit
On conductive layer include：A copper plate is provided on the perimeter circuit.
In some embodiments of the utility model, provides one in a manner of plating or electroless plating and be set to the perimeter circuit
On conductive layer include：A copper plate is provided on the perimeter circuit；And a nickel coating is provided on the copper plate.
In some embodiments of the utility model, provides one in a manner of plating or electroless plating and be set to the perimeter circuit
On conductive layer include：There is provided one has the conductive layer that nucleocapsid structure (core-shell) is constituted on the perimeter circuit.
In some embodiments of the utility model, provides one in a manner of plating or electroless plating and be set to the perimeter circuit
On conductive layer include：There is provided one has the conductive layer that copper core-nickel shell structure (Cu core-Ni shell) is constituted in this week
Sideline road.
Some embodiments according to the present utility model, touch panel include substrate, touch-control sensing electrode, perimeter circuit,
Protective layer and conductive layer.Substrate has viewing area and peripheral region；Touch-control sensing electrode is set to viewing area, perimeter circuit setting
In peripheral region, touch-control sensing electrode is electrically connected at perimeter circuit, and wherein touch-control sensing electrode includes at least gold with perimeter circuit
Belong to nano wire.Conductive layer is disposed on the perimeter circuit, and conductive layer is an electroless plating, an electroplated layer or both the above
Combination.
In some embodiments of the utility model, further include：One is set to the film layer on the substrate, wherein the display
Area and the peripheral region all have a conductive region and a non-conducting areas, which is embedded at positioned at the conductive region
The film layer in form conductive network, the film layer and the common shape of the metal nanometer line being located in the conductive region of the peripheral region
At the perimeter circuit, and the touch-control is collectively formed with the metal nanometer line in the film layer in the conductive region of the viewing area
Induction electrode.
In some embodiments of the utility model, a concentration of the zero of the metal nanometer line of the non-conducting areas,
Or the concentration of the metal nanometer line of the non-conducting areas is less than an infiltration threshold value.
In some embodiments of the utility model, which protrudes from the surface of the film layer.
In some embodiments of the utility model, a protective layer being set on the touch-control sensing electrode is further included.
In some embodiments of the utility model, the material of protective layer can be identical with the material of film layer or differs.
In some embodiments of the utility model, in film layer added with crosslinking agent, polymerization inhibitor, antioxidant,
UV light stabilizing agent, interfacial agent, corrosion inhibitor or above-mentioned mixture.
In some embodiments of the utility model, conductive layer has stacked structure.
In some embodiments of the utility model, stacked structure includes an electroless copper layer and an electroless nickel layer,
Or the stacked structure includes an electroless copper layer, a copper electroplating layer and an electroless nickel layer.
In some embodiments of the utility model, conductive layer has nucleocapsid structure (core-shell).
Description of the drawings
Fig. 1 is the flow chart according to the production method of the touch panel of some embodiments of the utility model.
Fig. 2 is the upper schematic diagram according to the substrate of some embodiments of the utility model.
Fig. 2A is the diagrammatic cross-section of the line 2A-2A along Fig. 2.
Fig. 3 is the upper schematic diagram of the step S1 in the production method of Fig. 1.
Fig. 3 A are the diagrammatic cross-section of the line 3A-3A along Fig. 3.
Fig. 4 is the upper schematic diagram of the step S2 in the production method of Fig. 1.
Fig. 4 A are the diagrammatic cross-section of the line 4A-4A along Fig. 4.
Fig. 4 B are the diagrammatic cross-section of the line 4B-4B along Fig. 4.
Fig. 5 is the upper schematic diagram of the step S3 in the production method of Fig. 1.
Fig. 5 A are the diagrammatic cross-section of the line 5A-5A along Fig. 5.
Fig. 5 B are the diagrammatic cross-section of the line 5B-5B along Fig. 5.
Fig. 6 is the upper schematic diagram of the step S4 in the production method of Fig. 1.
Fig. 6 A are the diagrammatic cross-section of the line 6A-6A along Fig. 6.
Fig. 6 B are the diagrammatic cross-section of the line 6B-6B along Fig. 6.
Fig. 7 A are the schematic diagram of the change aspect of Fig. 6 A.
Fig. 7 B are the schematic diagram of the change aspect of Fig. 6 B.
Fig. 8 is the upper schematic diagram according to the touch panel of some embodiments of the utility model.
Fig. 9 A show the SEM photograph of perimeter circuit (exposing nano-silver thread).
Fig. 9 B then show that electroless copper layer is coated in the SEM photograph of perimeter circuit.
Wherein reference numeral is：
100：Production method TE, TE1, TE2：Touch-control sensing electrode
110：Substrate CE：Connection electrode
120：Perimeter circuit D1：First direction
130：Film layer D2：Second direction
136：Non-conducting areas 150：Protective layer
140：Metal nanometer line 160：Conductive layer
162：Bridging conductor
164：Collets
170：Joint sheet
S1~S4：Step
VA：Viewing area
PA：Peripheral region
Specific implementation mode
Multiple embodiments that the utility model will be disclosed with schema below, as clearly stated, in many practices
Details will be explained in the following description.It should be appreciated, however, that the details in these practices is not applied to limit this practicality newly
Type.That is, in the utility model some embodiments, the details in these practices is non-essential.In addition, to simplify
For the sake of schema, some known usual structures and component in the drawings by a manner of simply illustrating for it.
About " about " used herein, " about " or " substantially ", generally refer to numerical value error or range in percentage
20 within, be preferably within 10, be more preferably within 5 percent.Wen Zhongruo is without clearly stating, institute
The numerical value referred to is all considered as approximation, that is, has error or range as represented by " about ", " about " or " substantially ".In addition, this
" film layer ", " coating layer ", " polymer " used in text, " pre- solid object " meaning are same or analogous component, difference
The difference of solid state is essentially consisted in, and for convenience of explanation, it may hereinafter be used interchangeably, illustrate hereby.
Fig. 1 is the flow chart according to the production method 100 of the touch panel of some embodiments of the utility model.Fig. 2
~Fig. 2A, Fig. 3~Fig. 3 A, Fig. 4~Fig. 4 B, Fig. 5~Fig. 5 B to Fig. 6~Fig. 6 B be production method 100 in multiple step S1~
The schematic top plan view and diagrammatic cross-section of the touch panel of S4.It is in the concrete technology of present embodiment：First, with reference to figure 2 with
Fig. 2A provides a substrate 110, and in some embodiments of the utility model, substrate 110 is ideally transparent substrate, in detail
For, can be a rigid transparent substrate or a flexible transparent substrate, material can be selected from glass, acryl
(polymethylmethacrylate；PMMA), polyvinyl chloride (polyvinyl Chloride；PVC), polypropylene
(polypropylene；PP), polyethylene terephthalate (polyethylene terephthalate；PET), poly- naphthalene
Naphthalate (polyethylene naphthalate；PEN), makrolon (polycarbonate；PC), polyphenyl
Ethylene (polystyrene；The transparent materials such as PS).
Then, a transparency conducting layer is made on substrate 110 such as step S1 with reference to figure 3 and Fig. 3 A, transparency conducting layer can
At least it is made of metal nanometer line 140；In the present embodiment, transparency conducting layer is for metal nanometer line 140 and 130 institute of film layer
The composite construction of formation, the specific practice are：First by with metal nanometer line 140 dispersion liquid or slurry (ink) with the side of coating
Method takes shape in the entire upper surface of substrate 110, and being dried makes metal nanometer line 140 cover in the surface of substrate 110；Change speech
It, the meeting curing molding of metal nanometer line 140 is set to the viewing area VA and peripheral region that institute's predefined goes out on substrate 110 for one
The metal nanometer line layer of PA.Can have viewing area VA and peripheral region PA, peripheral region PA to be set to the side of viewing area VA on substrate 110
Side, such as shown in Fig. 3, peripheral region PA is set to the left side of viewing area VA and the region on right side, but in other embodiments, periphery
Area PA can be then the frame-type region for the surrounding (covering right side, left side, upside and downside) for being set to viewing area VA, or to set
It is placed in the L-type region of the adjacent both sides of viewing area VA.
In the embodiments of the present invention, above-mentioned dispersion liquid can be water, alcohol, ketone, ether, hydrocarbon or arsol (benzene, first
Benzene, dimethylbenzene etc.)；Above-mentioned dispersion liquid also may include additive, surfactants or binder, such as carboxymethyl cellulose
(carboxymethyl cellulose；CMC), 2- hydroxyethyl celluloses (hydroxyethyl Cellulose；HEC), hydroxyl
Base propyl methocel (hydroxypropyl methylcellulose；HPMC), sulphonic acid ester, sulfuric ester, disulfonate,
Sulfosuccinate, phosphate or fluorine-containing interfacial agent etc..And the metal nanometer line (metal nano-wires)
Layer, may be, for example, nano-silver thread (silver nano-wires) layer, gold nanowire (gold nano-wires) layer or Nanometer Copper
Line (copper nano-wires) layer is constituted；In more detail, " metal nanometer line (metal nano- used herein
Wires) " system is a collective noun, is referred to comprising multiple metal elements, (including the metal oxidation of metal alloy or metallic compound
Object) metal wire set, the quantity of metal nanometer line contained therein has no effect on the protection model that the utility model is advocated
It encloses；And at least one sectional dimension (i.e. the diameter in section) of single metal nanometer line is less than 500nm, preferably less than 100nm, and
More preferably less than 50nm；And the utility model is referred to as " line (wire) " metal Nano structure, mainly have high aspect ratio,
Such as between 10 to 100,000, in more detail, the aspect ratio (length of metal nanometer line：The diameter in section) it can be more than
10, preferably it is more than 50, and be more preferably more than 100；Metal nanometer line can be any metal, including but not limited to silver, gold, copper,
Nickel and gold-plated silver.And other terms, silk (silk), fiber (fiber), pipe (tube) if etc. equally have it is above-mentioned
Size and high aspect ratio, the scope also covered by the utility model.
And the dispersion liquid containing metal nanometer line 140 or slurry can take shape in substrate 110 in any way
Surface, such as, but not limited to：The techniques such as screen painting, nozzle coating, idler wheel coating.In some embodiments of the utility model
In, metal nanometer line 140 can be nano-silver thread or nano silver fibre (Silver nano-fibers), can have average
About 20 to 100 nanometers of diameter, average about 20 to 100 microns of length, preferably average about 20 to 70 nanometers of diameter are average
About 20 to 70 microns of length (i.e. aspect ratio is 1000).In some embodiments, the diameter of metal nanometer line 140 can be between
70 nanometers to 80 nanometers, and about 8 microns of length.
Then suitable polymer or its pre- solid object are taken shape in coating method on substrate 110, the polymer meeting
It penetrates between metal nanometer line 140 and forms filler, and the step of imposing curable polymer is to form film layer 130；In other words,
The meeting curing molding of film layer 130 is a kind of multiple to be formed with metal nanometer line 140 in the viewing area VA and peripheral region PA on substrate 110
Structure is closed, metal nanometer line 140 can form conductive network (conductive network) in film layer 130, also just form institute
The transparency conducting layer of meaning, and this composite construction forms touch-control sensing electrode TE and the periphery positioned at viewing area VA via subsequent step
The perimeter circuit 120 (as shown in Figure 4) of area PA, and touch-control sensing electrode TE is electrically connected at perimeter circuit 120.
The example of above-mentioned polymer may include, but be not limited to：Polyacrylic based resin, such as polymethacrylates
(for example, poly- (methyl methacrylate)), polyacrylate and polyacrylonitrile；Polyvinyl alcohol；Polyester is (for example, poly- terephthaldehyde
Sour second diester (PET), polyester naphthalate and makrolon)；Polymer with high aromaticity, such as phenolic resin or first
Phenol-formaldehyde, polyvinyl-toluene, polyvinyl dimethylbenzene, polyimides, polyamide, polyamidoimide, gathers polystyrene
Etherimide, polysulfones, gathers and stretches phenyl and polyphenyl ether polysulfide；Polyurethane (polyurethane；PU)；Epoxy
Resin；Polyolefin (such as polypropylene, polymethylpentene and cycloolefin)；Cellulose；Poly- silica and other silicon-containing polymers (such as
Poly- silsesquioxane and polysilane)；Polyvinyl chloride (PVC)；Poly- acetic acid esters；Polynorbornene；Synthetic rubber is (for example, the third rubber of second
Glue (ethylene-propylene rubber；EPR), butadiene-styrene rubber (styrene-Butadiene Rubber；SBR), ternary
EP rubbers (ethylene-Propylene-Diene Monomer；EPDM)；And fluoropolymer (for example, Kynoar,
Polytetrafluoroethylene (PTFE) (TFE) or polyhexafluoropropylene)；The non-conductive polymers such as fluoro-olefin and the copolymer of hydrocarbon alkene.In other realities
It applies in example, also can be used with silica, mullite, aluminium oxide, SiC, carbon fiber, MgO-Al2O3-SiO2, Al2O3-
The inorganic material such as SiO2 or MgO-Al2O3-SiO2-Li2O are as film layer 130.In addition, due to the metal nanometer line 140 of part
Being formed by composite construction with film layer 130 can be etched into subsequent technique as positioned at the touch-control sensing of viewing area VA electricity
Pole, therefore in the present embodiment, metal nanometer line 140 is formed by the light transmittance of composite construction with film layer 130
(Transmission) it can be greater than about 80%, and surface resistivity (surface resistance) is in about 10 to 1000 Ω/
Between；Preferably, the light transmittance (Transmission) that metal nanometer line 140 is formed by composite construction with film layer 130 is big
In about 85%, and surface resistivity (surface resistance) is between about 50 to 500 Ω/.
In addition it is implemented on it is noted that not limited forming polymer in the step on substrate 110 with coating method
After dispersion liquid or slurry of the solidification containing metal nanometer line 140；That is dispersion liquid containing metal nanometer line 140 with it is upper
The polymer stated can be sequentially coated on substrate 110, further and carry out curing operation.In some embodiments, film layer 130
Polymer material is liquid, for example, transparent colloid, therefore can mutually be mixed with the slurry containing metal nanometer line 140, and is made
Metal nanometer line 140 is directly mixed in polymer, therefore after hardening, metal nanometer line 140 is just embedded in film layer 130.In
In some embodiments, the solvent contained by the slurry containing metal nanometer line 140 can have an effect with film layer 130 (such as makes film
130 dissolving of layer or softening, this processing step are known as swelling), metal nanometer line 140 can penetrate into film layer 130, therefore
Above-mentioned process sequence can be adjusted：It is initially formed film layer 130, then the slurry containing metal nanometer line 140 is coated on film layer 130
On, so that transparent film layer 130 is dissolved or is softened, and metal nanometer line 140 is allow to penetrate into film layer 130.
In addition, above-mentioned polymer can assign the composite junction that film layer 130 is formed with metal nanometer line 140 after solidification
The certain specific chemistry of structure, machinery and optical characteristics, such as the tackness of composite construction and substrate 110 is provided, or preferably
Entity mechanical strength, therefore film layer 130 can be referred to matrix (matrix) again.Another aspect uses certain specific polymer systems
Make film layer 130, makes composite construction that there is the surface protection of additional anti-scratch scrape along abrasion, in this case, film layer 130 again can quilt
Referred to as hard conating (hard coat), using such as polyacrylate, epoxy resin, polyurethane, polysilane, poly- silica,
Poly- (silicon-acrylic acid) etc. can make composite construction have higher surface strength to improve resistance to scraping ability.Furthermore film layer 130 is poly-
Crosslinking agent, polymerization inhibitor, stabilizer (such as, but not limited to antioxidant, UV light stabilizing agent (UV can be added by closing in object
Stabilizers)), interfacial agent or above-mentioned analog or mixture with improve composite construction anti-uv-ray or
Reach compared with long shelf life.In other embodiments, film layer 130 can further include corrosion inhibitor.However, above-mentioned is only to say
The additive composition of bright film layer 130, the possibility of additional function/title, are not intended to limit the utility model.
Preferably, the technique (such as sedimentation time) for making film layer 130 can be controlled so that the thickness of film layer 130 is thin to be arrived
It is enough the surface (for example, less than about 90 nanometers) for enabling metal nanometer line 140 to expose to film layer 130.It is worth noting that being
Keep diagram clear, metal nanometer line 140 is embedded in film layer 130 without aobvious by the utility model for the sectional view of touch panel
Expose.
Preferably, being formed by metal nanometer line 140 can further be post-processed to improve its electrical conductivity, this post-processing
It includes process steps such as heating, plasma-based, corona discharge, UV ozone or pressure that can be.For example, being formed by curing metal nanometer line
After the step of layer, brought pressure to bear on thereon using idler wheel, it in one embodiment, can be by one or more idler wheels to metal nano
Line layer applies 50 to 3400psi pressure, can preferably apply 100 to 1000psi, 200 to 800psi or 300 to 500psi's
Pressure.In some embodiments, the post-processing of heating and pressure can be carried out at the same time；In detail, it is formed by metal nanometer line
140 can apply pressure via one or more idler wheels as described above, and heat simultaneously, such as the pressure applied by idler wheel is
10 to 500psi, preferably 40 to 100psi；Idler wheel is heated to about between 70 DEG C and 200 DEG C simultaneously, preferably to about 100 DEG C
Between 175 DEG C, the electrical conductivity of metal nanometer line 140 and/or coating layer can be improved.In some embodiments, metal is received
Rice noodles 140, which can be preferably exposed in reducing agent, to be post-processed, such as the metal nanometer line 140 being made of nano-silver thread preferably may be used
It is exposed in silver reductor and is post-processed, silver reductor includes boron hydride, such as sodium borohydride；Boron-nitrogen compound, such as diformazan
Base aminoboranes (DMAB)；Or gaseous reducing agent, such as hydrogen (H2).And about 10 seconds to the about 30 points exposure duration
Clock, preferably about 1 minute to about 10 minutes.And the step of above-mentioned application pressure, can implement according to actual demand in coating film layer 130
The step of before or after.
Come again, patterning steps are carried out such as step S2 with reference to figure 4 to Fig. 4 B, by transparency conducting layer (i.e. film layer 130 and gold
Belong to nano wire 140 and be formed by composite construction) it is patterned, such as patterned using etching, the specific practice can be used
Patterned photomask (not shown) is on transparency conducting layer, and wherein patterned photomask has the first pattern light corresponding to peripheral region PA
Second pattern mask of cover and viewing area VA, the pattern of the first pattern mask is then defining the follow-up perimeter line to be formed
The quantity of the pattern on road 120, perimeter circuit 120 can be one or more；The pattern of second pattern mask then to define after
The quantity of the pattern of the continuous touch-control sensing electrode TE to be formed, touch-control sensing electrode TE can be one or more.In more detail,
Be shielding with patterned photomask, and to patterned photomask metal nanometer line 140 in uncovered composite construction be etched,
To form perimeter circuit 120 and touch-control sensing electrode TE.In above-mentioned etching step, as shown in Figure 4 A, it is located at viewing area VA
Transparency conducting layer can be etched liquid according to aforementioned second pattern mask pattern etch and define touch-control sensing electrode TE and
The pattern of non-conducting areas 136；Meanwhile as shown in Figure 4 B, positioned at the transparency conducting layer of peripheral region PA can also be etched liquid according to
The pattern of aforementioned first pattern mask and be etched and define as perimeter circuit 120 and non-conducting areas 136.For example,
When metal nanometer line 140 is nano-silver thread, phosphoric acid/hydrochloric acid can be selected as etching solution.Alternatively, in other embodiment
In, nitric acid, phosphoric acid, hydrochloric acid, a combination thereof or other materials appropriate can also be selected as etching solution.Etching solution will can not be schemed
Metal nanometer line 140 in the film layer 130 that case light shield is covered removes, since this etching solution is not easy to etching film layer 130,
Therefore transparent film layer 130 can be carried over.Thus, which not being patterned the transparency conducting layer that light shield is covered can form
Electric conductivity is poor or does not have the non-conducting areas 136 of electric conductivity, and being patterned transparency conducting layer that light shield is covered then can shape
At perimeter circuit 120 (being located at peripheral region PA) and touch-control sensing electrode TE (being located at viewing area VA) with satisfactory electrical conductivity.Letter
For it, this step be remove part metal nanometer line 140 to be respectively formed nonconductive regions in viewing area VA and peripheral region PA
Domain 136, and the metal nanometer line 140 that left behind just forms perimeter circuit 120 (being located at peripheral region PA) and touch-control sensing electrode
TE (is located at viewing area VA).
In more detail, above-mentioned etching step is to penetrate into film layer 130 using etching solution or solvent not to be patterned light
Metal nanometer line 140 in the covered transparency conducting layer of cover is removed, such as carries out an overetch (over-etch) step
(or being fully etched) makes the metal nanometer line not being patterned in the transparency conducting layer that light shield is covered 140 be completely removed,
That is, after overetch, it is not patterned among the transparency conducting layer that light shield is covered and does not remain metal nano
Line 140 (i.e. a concentration of zero) of metal nanometer line 140, and only remaining film layer 130, to define non-conductive insulating regions.From
Above-mentioned steps it is found that the touch-control sensing electrode TE in the VA of viewing area is constituted by being not etched transparency conducting layer, and other
Region (i.e. non-electrode region or non-conducting areas 136) is constituted through the remaining film layer of overetch institute 130；Similarly, periphery
Perimeter circuit 120 in area PA is constituted by being not etched transparency conducting layer, and other region (i.e. non-circumferential line areas
Or non-conducting areas 136) it is then to be constituted through the remaining film layer of overetch institute 130.Furthermore due to still there is film layer 130 to remain on
Between adjacent electrode, therefore in the present embodiment, the polymer for making film layer 130 is preferably non-conductive polymer.
Come again, takes shape in protective layer 150 on touch-control sensing electrode TE such as step S3 with reference to figure 5 to Fig. 5 B.It is real one
It applies in example, protective layer 150 is set to viewing area VA, therefore can cover the touch-control sensing electrode TE in the VA of viewing area and through overetch institute
Remaining film layer 130 (such as Fig. 5 A and Fig. 5 B), protective layer 150 can avoid touch-control sensing electrode by follow-up electroless plating/galvanizer
The influence of skill, furthermore, protective layer 150 can improve the durability of product.
The material of protective layer 150 can select polymer identical with film layer 130, can also be suitable according to actually required selection
When material.Preferably, transparent and material with antiacid alkali, anti-scratch property can be selected in protective layer 150.In another embodiment
In, the material of protective layer 150 can be selected differently from film layer 130, such as a kind of photoresist proximate matter material (such as dry film) is attached at aobvious
Show area VA to protect touch-control sensing electrode TE not influenced by subsequent technique；No matter and the material of protective layer 150, in subsequent conductive
After the technique of layer 160, protective layer 150 can will also be removed depending on product requirement.
Come again, conductive layer 160 is taken shape in into the composite construction positioned at peripheral region PA such as step S4 with reference to figure 6 to Fig. 6 B
On (i.e. perimeter circuit 120), conductive layer 160 may make up a low-impedance signal transmission line, in other words, can use conductive layer 160
The electric conductivity of perimeter circuit 120 is improved, conductive layer 160 can utilize the combination system of plating, electroless plating or both the above technique
Make.In one embodiment, conductive layer 160 is made in the way of electroless plating, i.e., with suitable in the case of no impressed current
Reducing agent, so that metal ion is reduced into metal under metal solvent catalysis and is plated and be overlying on its surface, this process is referred to as
It is also referred to as chemical plating (chemical plating) or autocatalysis plating for electroless plating (electroless plating)
(autocatalytic plating), be therefore, the conductive layer 160 of the present embodiment be also referred to as electroless plating, chemical deposit or from
Body is catalyzed coating.Protective layer 150 is coated in viewing area VA it can be seen from Fig. 6 A, therefore in the touch-control sensing electrode of viewing area VA
TE can't be by the effect or influence of electroless plating solution.Conductive layer 160 takes shape in perimeter line it can be seen from 6A, 6B figure
On road 120, without forming on the non-conducting areas 136 for being located at peripheral region PA.
It is worth noting that clear for diagram, the width of the conductive layer 160 in Fig. 6 is slightly less than perimeter circuit 120
Width, but this not to limit the utility model, in other words, the width of conductive layer 160 may be because of electroless plating parameter
It adjusts and is more than, less than or equal to the width of perimeter circuit 120.
In one embodiment, conductive layer 160 can be a single layer structure, such as an electroless copper layer, Fig. 9 A show above-mentioned week
The SEM photograph on sideline road 120, and Fig. 9 B then show that electroless copper layer is coated in the SEM photograph of above-mentioned perimeter circuit 120；Another
In one embodiment, conductive layer 160 can be the stacked structure (stack-up) of a multilayer, such as two layers of stacked structure, may include
The combination of one electroless copper layer and an electroless nickel layer, the specific practice can be：Semi-finished product (the i.e. base that first above-mentioned steps are completed
Composite construction after plate 110, one patterned and protective layer 150) the first electroless plating liquid is immersed, such as the plating that principal component is copper sulphate
Liquid, composition can be but be not limited to：The copper sulphate (copper sulfate) of a concentration of 5g/L, the ethylenediamine of a concentration of 12g/L
Tetraacethyl (ethylenediaminetetraacetic acid), the formaldehyde (formaldehyde) of a concentration of 5g/L, electroless plating
The pH of copper electrolyte is adjusted to about 11~13 with sodium hydroxide (sodium hydroxide), and plating bath is about 50~70 DEG C, leaching
The reaction time of bubble is 1~5 minute；When carrying out electroless reaction, copper product can be in the metal nano with catalytic capability
It is nucleated on line 140 (such as nano silver wire), then leans on self catalysis of copper to continue copper film of growing up, that is to say, that due to being located at periphery
The electric conductivity and catalysis characteristics that metal nanometer line 140 in the perimeter circuit 120 of area PA is provided are not necessary to use additional work
Change layer, so that it may directly to carry out the reaction of electroless copper in perimeter circuit 120.Then, then the second electroless plating liquid is immersed, such as main
Ingredient is the plating solution of nickel sulfate, and composition can be but be not limited to：The nickel sulfate (nickel sulfate) of a concentration of 35g/L is dense
Degree is the ammonium chloride (NH4Cl) of 50g/L, the citric acid (citric acid) of a concentration of 50g/L and the secondary phosphorus of a concentration of 15g/L
The pH of sour sodium (sodium hypophosphite), electroless nickel plating plating solution is adjusted to about with ammonium hydroxide (ammonium hydroxide)
8~10, plating bath is about 40~60 DEG C, and the reaction time of immersion is 10~60 seconds, same to carry out electroless nickel plating reaction and cover
It is placed on outside electroless copper layer and forms electroless nickel layer, for the conductive layer 160 of double-layer lap structure, electroless copper layer can improve week
The electric conductivity on sideline road 120；And electroless nickel layer can improve the oxidation resistance of perimeter circuit 120 and electroless copper layer and resist
Chemical attack ability.In another embodiment, conductive layer 160 can be the stacked structure (stack-up) of a multilayer, such as three layers
Stacked structure may include the combination of electroless copper layer, electroless nickel layer and electroless palladium plating (Pb) layer.
In another embodiment, in order to improve the thickness of electroless copper layer, a thickening step, such as electroplating technology can be added,
Its electroplate liquid composition can be but be not limited to:The copper sulphate (copper sulfate) of a concentration of 200g/L, the sulphur of a concentration of 80g/L
Sour (sulfuric acid), the chlorion (chloride ion) of a concentration of 50mg/L, pH is adjusted to about 3~5, current density
It is about 1~10A/dm2, plating bath is about 25~45 DEG C, to make electroless copper layer, copper electroplating layer and the heap of electroless nickel layer
Stack structure.And the sequence of above-mentioned electroless plating and electroplating technology can be adjusted according to actual demand, not to be limited herein, such as
Sequentially make copper electroplating layer, electroless copper layer and electroless nickel layer stacked structure.In other embodiments, thickening step can be
Another electroless plating, such as using electroless plating liquid composition different from the plating solution progress electroless plating of above-mentioned first electroless copper plating liquid
Process for copper is to improve the thickness of electroless copper layer, to make the first electroless copper layer, the second electroless copper layer (or thickening layer)
And the stacked structure of electroless nickel layer.
In another embodiment, conductive layer 160 can be the nucleocapsid structure (core-shell) of arbitrary two kinds or more metals
The coating constituted, such as, but not limited to copper core-nickel shell (Cu core-Ni shell), copper core-molybdenum shell (Cu core-Mo
Shell), copper core-palladium shell (Cu core-Pd shell), copper core-nickel/palladium shell (Cu core-Ni/Pd shell) or galactic nucleus-
Copper/nickel shell (Ag core-Cu/Ni shell).For example, can be first if the chemical reaction of above-mentioned carry out electroless copper is to deposit no electricity
Copper plate recycles sodium borohydride (NaBH4, 98%) and it is mixed into ethylene glycol and is used as reducing agent, by nickel ion (such as by chlorination
Nickel, NiCl26H2O is added in above-mentioned solution) be reduced into nickel metal, and nickel metal will in the form of heterogeneous nucleation in layers of copper shape
At the nucleocapsid structure of copper core-nickel shell (Cu core-Ni shell).In another embodiment, conductive layer 160 can be composite wood
The coating that the nucleocapsid structure (core-shell) of material is constituted, such as micron order high molecular material (such as polystyrene)/silver
Complex conductive particle.
In one embodiment, nucleocapsid structure is plastic on metal nanometer line 140, or wraps partially or completely
Cover metal nanometer line 140；And nucleocapsid structure can be any shape, such as its section can be round or hexagon etc..
It in one embodiment, can be by the sheet resistance of the perimeter circuit 120 of nano-silver thread by 60 by electroless copper layer
Ω/ is reduced to 0.1 Ω/.That is, by the preferable electric conductivity of conductive layer, a low-impedance conducting wire can be formed,
Conductive layer also can provide better resistance (such as oxidation resistance or resistance to chemical attack) simultaneously.
So far, the touch panel of the present embodiment has been produced completion, and the touch-control sensing electrode TE positioned at viewing area VA can be used
In the touch position or gesture of sensing user, the perimeter circuit 120 positioned at peripheral region PA is then electrically connected at touch-control sensing electrode
The touch-control sensing electrode TE sensing signals measured are sent to a peripheral control unit (not shown) by TE, and on perimeter circuit 120
It is provided with conductive layer 160, conductive layer 160 can reduce the circuit impedance of the touch panel of the present embodiment, to reach preferable electricity
Characteristics of signals.On the other hand, matcoveredn 150 is set on the touch-control sensing electrode TE of viewing area VA, therefore in the tactile of viewing area VA
Control induction electrode TE can't be influenced by electroless plating solution, in other words, the physics of the touch-control sensing electrode TE of viewing area VA
Property, translucency, mist degree, electric conductivity etc. are not influenced by electroless plating step, and this implementation also can be improved in protective layer 150
The properties such as the antiacid alkali of touch panel of example, therefore there is preferable durability.In another embodiment, protective layer 150 can quilt
It removes.
In one embodiment, perimeter circuit 120 have more joint sheet (bonding pad) 170, and or welded gasket,
On be again provided with conductive layer 160, as shown in Figure 6.Therefore a external circuit board, such as flexible circuit board are subsequently connected to touch surface
When the step of plate (i.e. bonding steps), the conductive layer 160 on joint sheet 170 can be welded directly with flexible circuit board
And form conductive path.In other embodiment, other welding can also be formed in the conductive layer 160 on joint sheet 170
Auxiliary layer (not shown), then carry out with flexible circuit board the bonding steps such as welding.Therefore, generally, conductive layer 160 with
Perimeter circuit 120 can form a kind of low-impedance signaling path, be used for transmission touch-control sensing electrode TE and said external
Control signal between controller and touch-control sensing signal, and due to its low-impedance characteristic, contribute to reduce signal transmission in fact
Consume.
The touch panel of the present embodiment is a kind of touch panel of single side non-bridging formula (non-cross), and this practicality is new
The process of type can be applied to the touch panel of other structures.
In one embodiment, it more may include a pre-treatment step, with preferably will be in the perimeter circuit 120 of peripheral region PA
Metal nanometer line 140 exposes the surface of film layer 130.Such as using plasma-based processing step, perimeter circuit 120 is removed with plasma-based
The film layer 130 of middle part, makes metal nanometer line 140 expose, in more detail, using argon (Ar) plasma-based to film layer 130 into
The row processing, the parameter of argon (Ar) plasma-based can be power：200~400W, gas flow：50~100ml/min, gas pressure
Power：10~50pa, processing time：60~120sec.And the pre-treatment step can protective layer 150 forming step it
It is preceding or implement later, such as implement above-mentioned plasma-based processing after the forming step of protective layer 150, plasma-based can be directed to simultaneously
Peripheral region PA and viewing area VA processing can remove a part by plasma-based positioned at the film layer 130 of peripheral region PA and expose gold
Belong to nano wire 140；And the protective layer 150 in the VA of viewing area can also be removed a part, but the film layer of 150 lower section of protective layer by plasma-based
130 are not influenced then with metal nanometer line 140 by plasma-based.
Fig. 7 A to Fig. 7 B then show that another state sample implementation of above-mentioned touch panel, the variation that wherein Fig. 7 A are Fig. 6 A are real
Structure is applied, Fig. 7 B are the change structure of Fig. 6 B.It is non-conductive in viewing area VA and peripheral region PA in this state sample implementation
Still there is metal nanometer line 140 to be distributed in wherein in region 136, but the metal nano in the film layer 130 of non-conducting areas 136
The concentration of line 140 is less than an infiltration threshold value (percolation threshold).In general, film layer 130 is received with metal
The electrical conductivity of the composite construction of rice noodles 140 is mainly by following factor controlling：A) electrical conductivity of single metal nanometer line 140, b) gold
The number of category nano wire 140 and c) connectivity between such metal nanometer line 140 (also known as contact)；If metal nanometer line
140 concentration is less than infiltration threshold value (percolation threshold), due between the metal nanometer line 140 in film layer 130
Every too far, therefore the monolithic conductive degree of the composite construction in non-conducting areas 136 is zero, implies that metal nanometer line 140 does not carry
For continuous current path, and a conductive network (conductive network) can not be formed, that is to say, that non-conducting areas 136
In metal nanometer line 140 to be formed by be non-conductive network (non-conductive network).As shown in Figure 7 A, it shows
Metal nanometer line 140 in the non-conducting areas 136 of area VA with concentration less than infiltration threshold value, and protective layer 150 then covers
In non-conducting areas 136 (region i.e. with concentration less than the metal nanometer line 140 of infiltration threshold value) and touch-control sensing electrode
On TE (region i.e. with concentration higher than the metal nanometer line 140 of infiltration threshold value)；Again shown in Fig. 7 B, the non-of peripheral region PA is led
Metal nanometer line 140 in electric region 136 with concentration less than infiltration threshold value, and conductive layer 160 is covered in perimeter circuit 120
On (region i.e. with concentration higher than the metal nanometer line 140 of infiltration threshold value), non-conducting areas 136 (has concentration low
In the region of the metal nanometer line 140 of infiltration threshold value) then it is exposed to conductive layer 160.It is worth noting that non-conducting areas
The metal nanometer line 140 that low concentration is inserted in 136 may make between non-conducting areas 136 and conductive region with more similar
Light folding between non-conducting areas 136 in optical characteristics, such as viewing area VA and conductive region (such as touch-control sensing electrode TE)
Penetrate that rate is more approximate, therefore when user watches the picture shown by display by this touch panel, with more consistent property
Display performance, in other words, the more difficult boundary line visually found between non-conducting areas 136 and conductive region of user.
Making can be such as less than the specific practice of the metal nanometer line 140 of infiltration threshold value with concentration in non-conducting areas 136
Down but it is not limited to：In the patterning steps of step S2, the parameter of etching is controlled, such as shortens the time of etching or reduces etching
The concentration of liquid makes the film layer 130 in non-conducting areas 136 remain concentration less than infiltration threshold value not exclusively to be etched
Metal nanometer line 140.It is worth noting that Fig. 7 A and the metal nanometer line for using different symbology various concentrations in Fig. 7 B
140, wherein " V " indicate concentration higher than infiltration threshold value metal nanometer line 140, and " zero " indicate concentration less than infiltration threshold value
Metal nanometer line 140.
Fig. 8 then shows another embodiment of the touch panel of the utility model, is a kind of single side bridge type (bridge)
Touch panel.This embodiment and the difference of above-described embodiment is, transparency conducting layer (the i.e. film that will be formed on substrate 110
Layer 130 is formed by composite construction with metal nanometer line 140) the patterned step of progress includes:It will be positioned at the saturating of viewing area VA
Bright Conductive Layer Etch goes out that the first touch-control sensing electrode TE1 along first direction D1 arrangement, D2 arrangements second are touched in a second direction
It controls induction electrode TE2 and is electrically connected the connection electrode CE of two the first adjacent touch-control sensing electrode TE1, and peripheral region will be located at
The transparency conducting layer of PA etches the perimeter circuit of corresponding first touch-control sensing electrode TE1 and the second touch-control sensing electrode TE2
120；Collets 164 are subsequently formed on connection electrode CE, such as collets 164 are formed with silica；Eventually form bridge joint
Conducting wire 162 forms bridging conductor 162 on collets 164, such as with copper, and bridging conductor 162 is made to be connected to second direction D2
Upper two adjacent the second touch-control sensing electrode TE2；Collets 164 between connection electrode CE and bridging conductor 162, with
Connection electrode CE and bridging conductor 162 are electrically completely cut off so that the touch control electrode on first direction D1 and second direction D2 that
This electrically completely cuts off.
Follow-up previous embodiment same for another example, carries out the forming step of protective layer 150 and conductive layer 160, and specific practice can join
It is literary before examination, it is repeated no more in this.
In addition to the touch panel of above-mentioned single-layer type, the technique of the utility model is also applicable to the touch panel of two-layer equation,
In other words, touch-control sensing electrode TE and perimeter circuit 120 are first made in the opposing sides of substrate 110 respectively, further in accordance with above-mentioned
Way formed in the opposing sides of substrate 110 protective layer 150 on touch-control sensing electrode TE and formed conductive layer 160 in week
On sideline road 120.
In some embodiments of the utility model, it is formed simultaneously positioned at display by etching transparency conducting layer the step of
The touch-control sensing electrode in area and the perimeter circuit positioned at peripheral region can save tradition and need the additional step for making circumferential metal lead
Suddenly, therefore achieve the effect that reduce cost of manufacture and improve production yield.
In some embodiments of the utility model, by the way that protective layer to be set to the touch-control sensing electrode positioned at viewing area
On, by the effect of protective layer, product is enable to pass through stringenter resistance to ring test；And due to the touch-control sensing of the utility model
Electrode and perimeter circuit are made by same layer transparency conducting layer, therefore without traditional bridging arrangement, so even using protective layer
Carry out touch-control sensing electrode protection, there will not be bridging arrangement contact impedance rise the problem of.
In some embodiments of the utility model, by the way that conductive layer is formed on perimeter circuit, the conductive layer
It is high electric conductivity with relatively transparent conductive layer, therefore a low-impedance conducting wire can be formed, and then reduces and transmit touching signals
Loss and distortion.
In some embodiments of the utility model, by the way that conductive layer is formed on perimeter circuit, the conductive layer
With repairing perimeter circuit auxiliaring effect, if such as in technique generate scratch cause the metal nanometer line in perimeter circuit to break
And the open circuit of circuit is formed, circuit breaker caused by metal nanometer line breaks can be repaired by the covering of conductive layer.
The durability of the touch-control sensing electrode of viewing area, and shape simultaneously can be improved in some embodiments of the utility model
At a low-impedance conducting wire.
In some embodiments of the utility model, the technique a large amount of batches can carry out touching for single or double simultaneously
Control the making of panel.
Although the utility model is disclosed as above with numerous embodiments, so it is not limited to the utility model, appoints
What is familiar with this those skilled in the art, without departing from the spirit and scope of the utility model, when can be used for a variety of modifications and variations, therefore this
The protection domain of utility model should be defined by the scope of the appended claims.
Claims (10)
1. a kind of touch panel, which is characterized in that include：
One substrate, the wherein substrate have a viewing area and a peripheral region；
The one touch-control sensing electrode being set on the viewing area and one it is set to perimeter circuit on the peripheral region, the wherein touch-control
Induction electrode is electrically connected at the perimeter circuit, and wherein the touch-control sensing electrode includes at least metal nano with the perimeter circuit
Line；And
One is set to the conductive layer on the perimeter circuit, and wherein the conductive layer is an electroless plating, an electroplated layer or both the above
Combination.
2. touch panel as described in claim 1, which is characterized in that further include：One is set to the film layer on the substrate, wherein
The viewing area and the peripheral region all have a conductive region and a non-conducting areas, which is embedded at leads positioned at this
Conductive network is formed in the film layer in electric region, the film layer and the metal nanometer line being located in the conductive region of the peripheral region
The perimeter circuit is collectively formed, and the film layer in the conductive region of the viewing area is collectively formed with the metal nanometer line
The touch-control sensing electrode.
3. touch panel as claimed in claim 2, which is characterized in that the metal nanometer line of the non-conducting areas it is a concentration of
Zero or the non-conducting areas the metal nanometer line concentration less than one infiltration threshold value.
4. touch panel as claimed in claim 2, which is characterized in that the metal nanometer line protrudes from the surface of the film layer.
5. touch panel as claimed in claim 2, which is characterized in that further include a guarantor being set on the touch-control sensing electrode
Sheath.
6. touch panel as claimed in claim 5, which is characterized in that the material of the protective layer and the material identical of the film layer or
It differs.
7. touch panel as claimed in claim 2, which is characterized in that be added with crosslinking agent in the film layer, polymerization inhibitor, resist
Oxidant, UV light stabilizing agent, interfacial agent, corrosion inhibitor or above-mentioned mixture.
8. touch panel as described in claim 1, which is characterized in that the conductive layer has stacked structure.
9. touch panel as claimed in claim 8, which is characterized in that the stacked structure includes an electroless copper layer and one without electricity
Nickel coating or the stacked structure include an electroless copper layer, a copper electroplating layer and an electroless nickel layer.
10. touch panel as described in claim 1, which is characterized in that the conductive layer has nucleocapsid structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721106558.3U CN207637121U (en) | 2017-08-31 | 2017-08-31 | Touch panel |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721106558.3U CN207637121U (en) | 2017-08-31 | 2017-08-31 | Touch panel |
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| Publication Number | Publication Date |
|---|---|
| CN207637121U true CN207637121U (en) | 2018-07-20 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109426386A (en) * | 2017-08-31 | 2019-03-05 | 宸鸿光电科技股份有限公司 | Touch panel and preparation method thereof |
| JP2020053004A (en) * | 2018-09-21 | 2020-04-02 | 鼎展電子股▲分▼有限公司 | Alloy suitable for trace electrode and touch panel using the same |
| CN114385018A (en) * | 2020-10-20 | 2022-04-22 | 宸美（厦门）光电有限公司 | Contact structure, electronic device, and method of manufacturing contact structure |
-
2017
- 2017-08-31 CN CN201721106558.3U patent/CN207637121U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109426386A (en) * | 2017-08-31 | 2019-03-05 | 宸鸿光电科技股份有限公司 | Touch panel and preparation method thereof |
| JP2020053004A (en) * | 2018-09-21 | 2020-04-02 | 鼎展電子股▲分▼有限公司 | Alloy suitable for trace electrode and touch panel using the same |
| CN114385018A (en) * | 2020-10-20 | 2022-04-22 | 宸美（厦门）光电有限公司 | Contact structure, electronic device, and method of manufacturing contact structure |
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