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CN207320398U - 电连接器及其组件 - Google Patents

电连接器及其组件 Download PDF

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Publication number
CN207320398U
CN207320398U CN201720672089.5U CN201720672089U CN207320398U CN 207320398 U CN207320398 U CN 207320398U CN 201720672089 U CN201720672089 U CN 201720672089U CN 207320398 U CN207320398 U CN 207320398U
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electric connector
weld part
chip module
circuit board
insulating body
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Expired - Fee Related
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Inventor
许硕修
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Foxconn Kunshan Computer Connector Co Ltd
Foxconn Interconnect Technology Ltd
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Foxconn Kunshan Computer Connector Co Ltd
Foxconn Interconnect Technology Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/24—Assembling by moulding on contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/16—Fastening of connecting parts to base or case; Insulating connecting parts from base or case
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connector Housings Or Holding Contact Members (AREA)

Abstract

本实用新型公开一种电连接器及其组件，用以将芯片模组电性连接至电路板，所述电连接器包括绝缘本体及若干导电端子，所述绝缘本体设置有用来容置芯片模组的收容空间及用来匹配电路板的安装面，所述导电端子具有凸伸入收容空间的第一焊接部与凸伸至所述安装面的第二焊接部，所述第一焊接部用来焊接于所述芯片模组，所述第二焊接部用来焊接于所述电路板。本实用新型之导电端子的两端分别焊接于芯片模组与电路板，结构更简单，制程更简便。

Description

电连接器及其组件
【技术领域】
本实用新型涉及一种电连接器及其组件，尤其有关一种电连接器的端子固持结构。
【背景技术】
中国台湾新型专利第M403772号公告了一种电连接器，所述电连接器设有第一锡球用以焊接至印刷电路板。芯片模组底部阵列设有若干第二锡球。电连接器需设置导电端子于上下两端同时固持第一锡球与第二锡球，从而实现芯片模组与印刷电路板之间的电性连接，所述电连接器结构复杂。
【实用新型内容】
本实用新型所要解决的技术问题在于：提供一种结构简单的电连接器。
为解决上述技术问题，本实用新型可采用如下技术方案：
一种电连接器，用以将芯片模组电性连接至电路板，所述电连接器包括绝缘本体及若干导电端子，所述绝缘本体设置有用来容置芯片模组的收容空间及用来匹配电路板的安装面，所述导电端子具有凸伸入收容空间的第一焊接部与凸伸至所述安装面的第二焊接部，所述第一焊接部用来焊接于所述芯片模组，所述第二焊接部用来焊接于所述电路板。
与现有技术相比，本实用新型中导电端子的两端分别焊接于芯片模组与电路板，结构更简单，制程更简便。
为解决上述技术问题，本实用新型可采用如下技术方案：
一种电连接器组件，包括芯片模组、电连接器及电路板，所述电连接器包括绝缘本体及固定在所述绝缘本体的若干导电端子，所述若干导电端子包括第一焊接部及第二焊接部，所述芯片模组收容在所述电连接器内且与所述导电端子的第一焊接部相焊接，所述电连接器安装在所述电路板且所述导电端子的第二焊接部与所述电路板相焊接。
与现有技术相比，本实用新型中导电端子的两端分别焊接于芯片模组与电路板，结构更简单，制程更简便。
【附图说明】
图1为本实用新型电连接器组件的立体图。
图2为图1所示电连接器组件的立体分解图。
图3为图1所示电连接器组件另一角度的立体分解图。
图4为图1所示电连接器组件的正视图。
图5为本实用新型导电端子被两个模板定位的示意图。
如下具体实施方式将结合上述附图进一步说明本实用新型。
【具体实施方式】
请参阅图1至图5，本实用新型公开了一种电连接器组合100，所述电连接器组合100包括电连接器10、芯片模组50及电路板60。所述电连接器10用以将芯片模组50电性连接至电路板60。所述电连接器10包括绝缘本体20、若干导电端子30及盖体40。若干导电端子30排列成行后，所述绝缘本体再通过注塑手段形成在所述若干导电端子30外侧。所述盖体40盖设于所述绝缘本体20上。所述盖体40压制住所述芯片模组50且与所述绝缘本体20相卡扣。在本实施例中，所述导电端子30为焊锡球结构，其含锡量为95.6％。
所述绝缘本体20包括本体部21及自所述本体部21向上延伸形成的挡墙24。所述挡墙24位于所述本体部21的四个角落。所述挡墙24的外侧设有用于与盖体40相卡合的卡扣部25。所述绝缘本体20设置有用来容置芯片模组50的收容空间22及用来匹配电路板60的安装面23。所述导电端子30具有凸伸入收容空间22的第一焊接部31与凸伸至所述安装面23的第二焊接部32。所述第一焊接部31用来焊接于芯片模组50，所述第二焊接部32用来焊接于电路板60。
所述盖体40包括主体部41及自所述主体部41向下延伸形成的挡止部43，所述主体部41与所述挡止部43之间设有间隔槽45。所述挡止部43位于所述主体部41的四个角落。所述挡止部43设有扣钩44，所述扣钩44扣合于所述卡扣部25。所述主体部41的中央位置设有通孔42。所述芯片模组50包括容纳在所述收容空间22的基部51及自所述基部51向上延伸的凸出部52，所述凸出部52穿过所述通孔42。所述基部51安装于所述绝缘本体20内，所述挡墙24用于限定所述基部51。
所述电连接器组合100的组装步骤如下：(1)先预先设置两个模板72，模板72上具有定位孔，上述若干锡球状的导电端子30先设置在一模板72的定位孔，另一模板71同样具有定位孔，定位在所述若干导电端子30的上方，然后将塑胶材料通过注塑方法注塑入，冷却后形成绝缘本体20，去除模板(71，72)后即可形成电连接器10；(2)先将芯片模组50安装在绝缘本体20的收容空间22内，然后盖上盖体40，将芯片模组50定位在绝缘本体20内，然后利用真空腔吸取在盖体40上；(3)将电连接器10移动至电路板60，同时高温过炉，导电端子30的第一焊接部31与第二焊接部32熔融而分别实现与芯片模组50的对接端子53与电路板60的导电片61焊接。
上述实施例为本实用新型的较佳实施方式，而非全部的实施方式，本领域普通技术人员通过阅读本实用新型说明书而对本实用新型技术方案采取的任何等效的变化，均为本实用新型的权利要求所涵盖。

Claims (10)

1.一种电连接器，用以将芯片模组电性连接至电路板，所述电连接器包括绝缘本体及若干导电端子，所述绝缘本体设置有用来容置芯片模组的收容空间及用来匹配电路板的安装面，其特征在于：所述导电端子具有凸伸入收容空间的第一焊接部与凸伸至所述安装面的第二焊接部，所述第一焊接部用来焊接于所述芯片模组，所述第二焊接部用来焊接于所述电路板。
2.如权利要求1所述的电连接器，其特征在于：所述导电端子为焊锡球结构。
3.如权利要求1所述的电连接器，其特征在于：所述电连接器还包括盖设于所述绝缘本体上的盖体，所述盖体设有向下延伸形成的挡止部；所述绝缘本体设有向上延伸的挡墙，所述挡墙的外侧设有用于与所述盖体相卡合的卡扣部。
4.如权利要求3所述的电连接器，其特征在于：所述挡墙形成在所述绝缘本体的四个角落。
5.如权利要求1所述的电连接器，其特征在于：所述若干导电端子排列成行后，所述绝缘本体再通过注塑手段形成在所述若干导电端子外侧。
6.如权利要求3所述的电连接器，其特征在于：所述盖体的中央位置设有通孔，所述芯片模组包括容纳在所述收容空间的基部及自所述基部向上延伸的凸出部，所述凸出部穿过所述通孔。
7.一种电连接器组件，包括芯片模组、电连接器及电路板，所述电连接器包括绝缘本体及固定在所述绝缘本体的若干导电端子，所述若干导电端子包括第一焊接部及第二焊接部，其特征在于：所述芯片模组收容在所述电连接器内且与所述导电端子的第一焊接部相焊接，所述电连接器安装在所述电路板且所述导电端子的第二焊接部与所述电路板相焊接。
8.如权利要求7所述的电连接器组件，其特征在于：所述导电端子为焊锡球结构。
9.如权利要求7所述的电连接器组件，其特征在于：电连接器组件还包括盖体，所述盖体压制住所述芯片模组且与所述绝缘本体相卡扣。
10.如权利要求7所述的电连接器组件，其特征在于：所述芯片模组与所述第一焊接部，以及所述第二焊接部与所述电路板同时过炉焊接。
CN201720672089.5U 2016-06-14 2017-06-09 电连接器及其组件 Expired - Fee Related CN207320398U (zh)

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TW105208794U TWM533354U (en) 2016-06-14 2016-06-14 Electrical connector
TW105208794 2016-06-14

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