CN207301958U - A kind of liquid-cooled suit business device containing preposition liquid-cooled air-cooling apparatus - Google Patents
A kind of liquid-cooled suit business device containing preposition liquid-cooled air-cooling apparatus Download PDFInfo
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- CN207301958U CN207301958U CN201721376651.6U CN201721376651U CN207301958U CN 207301958 U CN207301958 U CN 207301958U CN 201721376651 U CN201721376651 U CN 201721376651U CN 207301958 U CN207301958 U CN 207301958U
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- 238000001816 cooling Methods 0.000 title claims abstract description 257
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 201
- 239000007788 liquid Substances 0.000 claims description 86
- 238000010438 heat treatment Methods 0.000 description 12
- 230000017525 heat dissipation Effects 0.000 description 10
- 238000005057 refrigeration Methods 0.000 description 5
- 238000004378 air conditioning Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Abstract
The utility model provides a kind of liquid-cooled suit business device containing preposition liquid-cooled air-cooling apparatus, mainboard, Switching Power Supply, hard disk and preposition liquid-cooled air-cooling apparatus are equipped with liquid-cooled suit business device, preposition liquid-cooled air-cooling apparatus is arranged on liquid-cooled suit business device front end, water cooling coil pipe and fan group are equipped with preposition liquid-cooled air-cooling apparatus, fan group is arranged on preposition liquid-cooled air-cooling apparatus and is arranged on preposition liquid-cooled air-cooling apparatus towards the side of liquid-cooled suit business device towards the side outside liquid-cooled suit business device, water cooling coil pipe；Hard disk is arranged on preposition liquid-cooled air-cooling apparatus rear end, and mainboard is arranged on hard disk rear end, and mainboard is equipped with memory bar and CPU, CPU are equipped with cooled plate；Switching Power Supply is arranged on liquid-cooled suit business device rear end and is additionally provided with water inlet tube interface and water outlet interface tube close to the position of mainboard, liquid-cooled suit business device rear end, and water inlet tube interface is connected with water inlet pipe, and water outlet interface tube is connected with outlet pipe；Cooled plate and water cooling coil pipe are connected in series or in parallel.
Description
Technical Field
The utility model belongs to data center heat dissipation field, concretely relates to liquid cooling server who contains leading liquid cooling air cooling device.
Background
With the continuous development of the electronic information industry, the power of the CPU in the server is higher and higher, and the heat dissipation requirement of the high-power CPU is difficult to be satisfied by the conventional heat dissipation method using air as the cooling medium of the CPU. The liquid cooling heat dissipation is the most efficient and most advanced heat dissipation scheme developed in recent years, and the principle of the liquid cooling heat dissipation is that a liquid heat exchange medium is directly introduced into a server with a liquid cooling function, so that heat generated by a main heating element, namely a Chip (CPU), is taken away (accounting for 70-80% of the heat generated by the whole server), and the liquid cooling heat dissipation scheme is adopted, so that the heat dissipation requirement of a high-power server can be met.
The existing server water cooling technology mainly adopts a water cooling plate arranged on a CPU to directly exchange heat with the CPU, so as to take away the heat of the CPU. In the layout of the water-cooled server in the prior art as shown in fig. 1, the end of the server is provided with an inlet pipe connector 11 and an outlet pipe connector 10 for connecting with an inlet pipe and an outlet pipe outside the server. The inside inlet tube 9 that is equipped with of server links to each other with inlet tube interface 10, and the other end of inlet tube 9 links to each other with one or more water-cooling board 6 that set up on CPU 7, and the other end of water-cooling board 6 passes through outlet pipe 8 and is connected with outlet pipe interface 11. Water with lower temperature enters the server from the water inlet pipe, exchanges heat with the CPU 7 in the water cooling plate 6, takes away heat generated when the CPU 7 works, and the water temperature rises after heat exchange and is discharged to the outside of the server through the water outlet pipe 8.
In this operation mode, the water cooling plate 6 is only disposed on the CPU 7, and the cold water entering the server takes away only the heat generated by the CPU 7 during operation. Besides the CPU 7, the heating device inside the server also includes other components such as the switching power supply 4, the memory 5, the hard disk 1, the motherboard 3, and the like. The heat that above-mentioned part produced mainly takes away as the medium through the air to heat convection's mode, for realizing this radiating mode, inside fan assembly 2 that is equipped with usually of server, under fan assembly's effect, the air is got into by the server front end, discharges through the rear end behind the inside heat transfer of server, for the temperature that reduces server front end air, need be equipped with the air conditioner in the computer lab.
In the prior art, besides a cooling water system, another air conditioning system needs to be arranged to reduce the temperature of air entering the front end of the server, and the whole machine room refrigeration system (including refrigeration of water and refrigeration of air) is complex, has a plurality of fault points and is high in manufacturing cost.
This is a disadvantage of the prior art, and it is therefore highly desirable to provide a liquid cooling server including a front-mounted liquid cooling air cooling device, which addresses the above-mentioned drawbacks of the prior art.
Disclosure of Invention
An object of the utility model is to above-mentioned whole computer lab refrigerating system include to the refrigeration of water and to two sets of systems of refrigeration of air, comparatively complicated, the fault point is many, and the higher defect of cost provides a liquid cooling server who contains leading liquid cooling type air cooling device to solve above-mentioned technical problem.
In order to achieve the above purpose, the utility model provides the following technical scheme:
a liquid cooling server containing a front liquid cooling type air cooling device is provided with a mainboard, a switching power supply and a hard disk, wherein the front liquid cooling type air cooling device is also arranged in the liquid cooling server and is arranged at the front end of the liquid cooling server; the hard disk is arranged at the rear end of the front liquid-cooled air cooling device, the mainboard is arranged at the rear end of the hard disk, the mainboard is provided with a memory bank and a CPU, and the CPU is provided with a water cooling plate; the switching power supply is arranged at the position, close to the mainboard, of the rear end of the liquid cooling server, the rear end of the liquid cooling server is also provided with a water inlet pipe interface and a water outlet pipe interface, the water inlet pipe interface is connected with a water inlet pipe, and the water outlet pipe interface is connected with a water outlet pipe;
the water cooling plate is connected with the water cooling coil pipe, one of the water cooling plate and the water cooling coil pipe is connected with the water inlet pipe, and the other water cooling plate is connected with the water outlet pipe; or,
the water cooling plate is connected with the water inlet pipe and the water outlet pipe, and the water cooling coil pipe is connected with the water inlet pipe and the water outlet pipe. The air at the front end of the server and the water-cooling coil pipe perform forced convection heat exchange under the action of the fan set, the temperature of the air is reduced after heat exchange, heat exchange is performed between the air and heating components (a hard disk, a mainboard, a memory bank and a switching power supply) of the server in the server, and the heating components are cooled.
Furthermore, the number of the CPUs is several, the number of the water cooling plates is several, and each CPU is provided with one water cooling plate;
the water cooling plates are connected in series to form a water cooling plate group, the water cooling plate group is connected with the water cooling coil pipe, one of the water cooling plate group and the water cooling coil pipe is connected with the water inlet pipe, and the other water cooling plate group is connected with the water outlet pipe; or,
the water cooling plate group is connected with the water inlet pipe and the water outlet pipe, and the water cooling coil pipe is connected with the water inlet pipe and the water outlet pipe.
Furthermore, the number of the CPUs is several, the number of the water cooling plates is several, and each CPU is provided with one water cooling plate;
the water cooling plates are connected in parallel to form a water cooling plate group, the water cooling plate group is connected with the water cooling coil pipe, one of the water cooling plate group and the water cooling coil pipe is connected with the water inlet pipe, and the other water cooling plate group is connected with the water outlet pipe; or,
the water cooling plate group is connected with the water inlet pipe and the water outlet pipe, and the water cooling coil pipe is connected with the water inlet pipe and the water outlet pipe.
Furthermore, a plurality of water cooling plates are connected in series and in parallel to form a water cooling plate group, the water cooling plate group is connected with the water cooling coil pipe, one of the water cooling plate group and the water cooling coil pipe is connected with the water inlet pipe, and the other water cooling plate group is connected with the water outlet pipe; or,
the water cooling plate group is connected with the water inlet pipe and the water outlet pipe, and the water cooling coil pipe is connected with the water inlet pipe and the water outlet pipe.
The water cooling plates and the water cooling coils can be connected in series or in parallel, and the selection of the series connection and the parallel connection is determined by the coordination working mode among different CPUs and the heating power of a switching power supply, a hard disk, a memory bank and a mainboard. When the heating power of the CPU, the switching power supply, the hard disk, the memory and the mainboard is high, the parallel connection mode is adopted as much as possible, and the heat is radiated to the maximum extent; when the heating power of the CPU, the switching power supply, the hard disk, the memory and the mainboard is small, the heat dissipation requirement can be met by adopting a mixed mode of series connection and series-parallel connection.
Further, the number of the memory banks is several.
Furthermore, the liquid circulating in the water cooling plate, the water cooling coil and the water inlet and outlet pipes is water. The liquid circulating in the water cooling plate, the water cooling coil and the water inlet and outlet pipes can also be other cooling liquid.
Further, the front liquid-cooled air cooling device is movably arranged at the front end of the liquid-cooled server. And enough space is ensured for plugging and unplugging the hard disk.
Furthermore, one end of the front liquid cooling type air cooling device can be connected with the liquid cooling server in an openable mode, and the other end of the front liquid cooling type air cooling device can rotate around the liquid cooling server. The front liquid cooling type air cooling device can be opened in an opening door mode, and the hard disk can be plugged and pulled out in a sufficient space.
Further, the front liquid-cooled air cooling device is detachably arranged at the front end of the liquid-cooled server. The front liquid-cooled air cooling device can be taken down, and the hard disk can be plugged and pulled out in a sufficient space.
The beneficial effects of the utility model reside in that:
the utility model discloses a set up liquid cooling type air cooling device at the server front end, get into the inside water of server except on the water-cooling board with the CPU heat transfer, still cool off the inside air that gets into the server in leading liquid cooling type air cooling device, make and need not to arrange extra air conditioning system again in the computer lab, reduce computer lab refrigerating system's complexity, reduce the fault point of system, reduce the construction cost of computer lab.
Furthermore, the utility model relates to a principle is reliable, and simple structure has very extensive application prospect.
Therefore, compared with the prior art, the utility model has the substantive characteristics and the progress, and the beneficial effects of the implementation are also obvious.
Drawings
FIG. 1 is a schematic layout diagram of a water-cooled server in the prior art;
FIG. 2 is a schematic diagram of a liquid cooling server with a front liquid cooling air cooling device according to the present invention;
1-a hard disk; 2-a fan set; 3, a main board; 4-a switching power supply; 5-memory bank; 6-water cooling plate; 6.1 — a first water-cooled plate; 6.2-a second water-cooling plate; 7-a CPU; 7.1 — first CPU; 7.2-second CPU; 8-water outlet pipe; 9-a water inlet pipe; 10-water inlet pipe interface; 11-water outlet pipe interface; 12-front liquid-cooled air cooling device; 13-water-cooled coil.
The specific implementation mode is as follows:
in order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings in the present embodiment.
As shown in fig. 2, the utility model provides a liquid cooling server with leading liquid cooling air cooling device, be equipped with mainboard 3, switching power supply 4 and hard disk 1 in the liquid cooling server, still be equipped with leading liquid cooling air cooling device 12 in the liquid cooling server, leading liquid cooling air cooling device 12 sets up in the liquid cooling server front end, be equipped with water-cooling coil 13 and fan group 2 in leading liquid cooling air cooling device 12, fan group 2 sets up in leading liquid cooling air cooling device 12 towards the outside one side of liquid cooling server, water-cooling coil 13 sets up in leading liquid cooling air cooling device 12 towards the one side of liquid cooling server; the hard disk 1 is arranged at the rear end of the front liquid-cooled air cooling device 12, the mainboard 3 is arranged at the rear end of the hard disk 1, the memory bank 5, the first CPU 7.1 and the second CPU 7.2 are arranged on the mainboard 3, the first CPU 7.1 is provided with a first water-cooling plate 6.1, and the second CPU 7.2 is provided with a second water-cooling plate 6.2; the switching power supply 4 is arranged at the position, close to the mainboard 3, of the rear end of the liquid cooling server, the rear end of the liquid cooling server is also provided with a water inlet pipe connector 10 and a water outlet pipe connector 11, the water inlet pipe connector 10 is connected with a water inlet pipe 9, and the water outlet pipe connector 11 is connected with a water outlet pipe 8; the number of the memory banks 5 is several; the front liquid-cooled air cooling device 12 is movably arranged at the front end of the liquid-cooled server, so that enough space is ensured for plugging and unplugging the hard 1;
the first water cooling plate 6.1 and the second water cooling plate 6.2 are connected in series to form a water cooling plate group, namely the first water cooling plate 6.1 is connected with the second water cooling plate 6.2; the second water cooling plate 6.2 is connected with a water cooling coil 13, the water cooling coil 13 is connected with a water outlet pipe 8, and the first water cooling plate 6.1 is connected with a water inlet pipe 9. The first water cooling plate 6.1, the second water cooling plate 6.2, the water cooling coil 13 and the liquid circulating in the water inlet and outlet pipes are water; the air at the front end of the server and the water cooling coil 13 perform forced convection heat exchange under the action of the fan set 2, the temperature of the air after heat exchange is reduced, and heat exchange is performed between the air and heating components (the hard disk 1, the mainboard 3, the memory bank 5 and the switching power supply 4) of the server in the server to cool the heating components.
In the above embodiment, the first water-cooling plate 6.1 and the second water-cooling plate 6.2, and the first water-cooling plate 6.1 or the second water-cooling plate 6.2 and the water-cooling coil 13 may be connected in series or in parallel, and the selection of the series-parallel connection is determined by the coordination operation mode between the first CPU 7.1 and the second CPU 7.2 and the heating power of the switching power supply 4, the hard disk 1, the memory bank 5, and the main board 3. When the heating power of the first CPU 7.1, the second CPU 7.2, the switching power supply 4, the hard disk 1, the memory 5 and the mainboard 3 is high, the parallel connection mode is adopted as much as possible, and the heat is dissipated to the maximum extent; when the heating power of the first CPU 7.1, the second CPU 7.2, the switching power supply 4, the hard disk 1, the memory 5 and the mainboard 3 is small, the heat dissipation requirement can be met by adopting a series connection and series-parallel connection mixed mode.
In the above embodiments, the first water-cooling plate 6.1, the second water-cooling plate 6.2, the water-cooling coil 13, and the liquid circulating in the inlet and outlet water pipes may also be other cooling liquids.
In the above embodiment, the connection between one end of the front liquid-cooled air cooling device 12 and the liquid-cooled server may be opened, and the other end of the front liquid-cooled air cooling device 12 may rotate around the liquid-cooled server, so that the front liquid-cooled air cooling device 12 may be opened in an openable manner, thereby ensuring that the hard disk 1 is plugged and unplugged with sufficient space.
In the above embodiment, the front liquid-cooled air cooling device 12 is detachably disposed at the front end of the liquid-cooled server, so that the front liquid-cooled air cooling device 12 can be removed, and it is ensured that there is enough space for plugging and unplugging the hard disk 1
The embodiments of the present invention are illustrative, but not restrictive, and the above-mentioned embodiments only help understanding the present invention, so the present invention is not limited to the described embodiments, and all the other embodiments obtained by the technical solution of the present invention according to the present invention belong to the scope of the present invention.
Claims (9)
1. A liquid cooling server with a front liquid cooling type air cooling device is provided with a mainboard (3), a switching power supply (4) and a hard disk (1) and is characterized in that the liquid cooling server is also provided with the front liquid cooling type air cooling device (12), the front liquid cooling type air cooling device (12) is arranged at the front end of the liquid cooling server, a water cooling coil (13) and a fan set (2) are arranged in the front liquid cooling type air cooling device (12), the fan set (2) is arranged at one side of the front liquid cooling type air cooling device (12) facing the outside of the liquid cooling server, and the water cooling coil (13) is arranged at one side of the front liquid cooling type air cooling device (12) facing the liquid cooling server; the hard disk (1) is arranged at the rear end of the front liquid-cooled air cooling device (12), the mainboard (3) is arranged at the rear end of the hard disk (1), the mainboard (3) is provided with a memory bank (5) and a CPU, and the CPU is provided with a water-cooled plate; the switching power supply (4) is arranged at the position, close to the mainboard (3), of the rear end of the liquid cooling server, a water inlet pipe connector (10) and a water outlet pipe connector (11) are further arranged at the rear end of the liquid cooling server, the water inlet pipe connector (10) is connected with a water inlet pipe (9), and the water outlet pipe connector (11) is connected with a water outlet pipe (8);
the water cooling plate is connected with the water cooling coil pipe (13), one of the water cooling plate and the water cooling coil pipe (13) is connected with the water inlet pipe (9), and the other one is connected with the water outlet pipe (8); or,
the water cooling plate is connected with the water inlet pipe (9) and the water outlet pipe (8), and the water cooling coil pipe (13) is connected with the water inlet pipe (9) and the water outlet pipe (8).
2. The liquid cooling server with the front liquid cooling type air cooling device according to claim 1, wherein the number of the CPUs is several, the number of the water cooling plates is several, and one water cooling plate is arranged on each CPU;
the water cooling plates are connected in series to form a water cooling plate group, the water cooling plate group is connected with the water cooling coil pipe, one of the water cooling plate group and the water cooling coil pipe is connected with the water inlet pipe, and the other water cooling plate group is connected with the water outlet pipe; or,
the water cooling plate group is connected with the water inlet pipe and the water outlet pipe, and the water cooling coil pipe is connected with the water inlet pipe and the water outlet pipe.
3. The liquid cooling server with the front liquid cooling type air cooling device according to claim 1, wherein the number of the CPUs is several, the number of the water cooling plates is several, and one water cooling plate is arranged on each CPU;
the water cooling plates are connected in parallel to form a water cooling plate group, the water cooling plate group is connected with the water cooling coil pipe, one of the water cooling plate group and the water cooling coil pipe is connected with the water inlet pipe, and the other water cooling plate group is connected with the water outlet pipe; or,
the water cooling plate group is connected with the water inlet pipe and the water outlet pipe, and the water cooling coil pipe is connected with the water inlet pipe and the water outlet pipe.
4. The liquid cooling server with the front liquid cooling type air cooling device as claimed in claim 1, wherein a plurality of water cooling plates are combined in series and in parallel to form a water cooling plate group, the water cooling plate group is connected with the water cooling coil, one of the water cooling plate group and the water cooling coil is connected with a water inlet pipe, and the other one of the water cooling plate group and the water cooling coil is connected with a water outlet pipe; or,
the water cooling plate group is connected with the water inlet pipe and the water outlet pipe, and the water cooling coil pipe is connected with the water inlet pipe and the water outlet pipe.
5. The liquid cooling server with a front liquid cooling air cooling device according to claim 1, wherein the number of the memory banks is several.
6. The liquid cooled server with a front mounted liquid cooled air chiller as claimed in claim 1 wherein the liquid circulating in the water cooled plates, water cooled coils and water inlet and outlet pipes is water.
7. The liquid cooling server with the front liquid cooling air cooling device as claimed in claim 1, wherein the front liquid cooling air cooling device is movably disposed at a front end of the liquid cooling server.
8. The liquid cooling server with a front liquid cooling air cooling device as claimed in claim 7, wherein the front liquid cooling air cooling device is connected to the liquid cooling server at one end and can be opened, and the front liquid cooling air cooling device is rotated around the liquid cooling server at the other end.
9. The liquid cooling server with the front liquid cooling air cooling device according to claim 7, wherein the front liquid cooling air cooling device is detachably arranged at the front end of the liquid cooling server.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721376651.6U CN207301958U (en) | 2017-10-24 | 2017-10-24 | A kind of liquid-cooled suit business device containing preposition liquid-cooled air-cooling apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721376651.6U CN207301958U (en) | 2017-10-24 | 2017-10-24 | A kind of liquid-cooled suit business device containing preposition liquid-cooled air-cooling apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207301958U true CN207301958U (en) | 2018-05-01 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721376651.6U Expired - Fee Related CN207301958U (en) | 2017-10-24 | 2017-10-24 | A kind of liquid-cooled suit business device containing preposition liquid-cooled air-cooling apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207301958U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107515657A (en) * | 2017-10-24 | 2017-12-26 | 郑州云海信息技术有限公司 | A kind of liquid-cooled suit business device containing preposition liquid-cooled air-cooling apparatus |
| CN113056160A (en) * | 2019-12-27 | 2021-06-29 | 百度（美国）有限责任公司 | Cooling device for electronic device and data processing system including the same |
-
2017
- 2017-10-24 CN CN201721376651.6U patent/CN207301958U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107515657A (en) * | 2017-10-24 | 2017-12-26 | 郑州云海信息技术有限公司 | A kind of liquid-cooled suit business device containing preposition liquid-cooled air-cooling apparatus |
| CN113056160A (en) * | 2019-12-27 | 2021-06-29 | 百度（美国）有限责任公司 | Cooling device for electronic device and data processing system including the same |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180501 Termination date: 20181024 |
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| CF01 | Termination of patent right due to non-payment of annual fee |