CN207184658U - Camera module and its photosensory assembly - Google Patents
Camera module and its photosensory assembly Download PDFInfo
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- CN207184658U CN207184658U CN201721210565.8U CN201721210565U CN207184658U CN 207184658 U CN207184658 U CN 207184658U CN 201721210565 U CN201721210565 U CN 201721210565U CN 207184658 U CN207184658 U CN 207184658U
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- sensitive chip
- packaging body
- photosensory assembly
- wiring board
- photo
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Abstract
It the utility model is related to a kind of camera module and its photosensory assembly, photosensory assembly includes wiring board, sensitive chip and packaging body, sensitive chip is connected to wiring board, sensitive chip includes photosensitive area and around the non-photo-sensing area of photosensitive area, packaging body encapsulated moulding is in the part non-photo-sensing area of wiring board and sensitive chip, packaging body includes medial surface, and medial surface and the junction in non-photo-sensing area are cambered surface.Packaging body is extended in the non-photo-sensing area of sensitive chip, so that sensitive chip is fixed in the circuit board by way of molding, this not only strengthens the fastness connected between sensitive chip and wiring board, the package area of packaging body is also increased, improves the fastness connected between packaging body and wiring board and sensitive chip.
Description
Technical field
Camera module field is the utility model is related to, more particularly to a kind of camera module and its photosensory assembly.
Background technology
With the fast development of various smart machines, the smart machine for being integrated with camera module is improving the same of image quality
When, also increasingly develop to lightening direction.And improve image quality mean the specification of electronic component constantly increase, quantity
It is on the increase, largely influences the also constantly increase, therefore cause camera module of the area of the sensitive chip of image quality
Assembling difficulty constantly increase, its overall dimensions also constantly increases, therefore the lightening of camera module receives very big limitation, enters
And limit the volume of the smart machine provided with the camera module.
When making camera module using traditional handicraft, wiring board, sensitive chip etc. can be first respectively prepared, then by sensitive chip
It is gluing in the circuit board, then by the technique of injection molding formed with the spaced packaging body of sensitive chip, packaging body
Effect is to encapsulate the electronic components such as resistance, electric capacity in the circuit board, and finally lens assembly is overlapped on packaging body.Pass through
Camera module made of the traditional handicraft, during use, if lens assembly through colliding or rocking, easily causes envelope
Body is filled with wiring board to depart from.
Utility model content
The utility model aims to provide a kind of well-set camera module and its photosensory assembly.
A kind of photosensory assembly, including：
Wiring board；
Sensitive chip, is connected to the wiring board, and the sensitive chip includes photosensitive area and around the non-of the photosensitive area
Photosensitive area；And
Packaging body, encapsulated moulding is in the part non-photo-sensing area of the wiring board and the sensitive chip, the packaging body bag
Medial surface is included, the medial surface and the junction in the non-photo-sensing area are cambered surface.
Above-mentioned photosensory assembly, packaging body are extended in the non-photo-sensing area of sensitive chip so that sensitive chip passes through molding
Mode fix in the circuit board, this not only strengthens the fastness connected between sensitive chip and wiring board, also increases envelope
The package area of body is filled, improves the fastness connected between packaging body and wiring board and sensitive chip.
In one of the embodiments, the cambered surface is inner concave arc surface.With perpendicular to sensitive chip and by cambered surface it is remote
The medial surface of the one end in non-photo-sensing area is compared, and the arc surface of indent can further increase the package area of packaging body, so as to enter one
Step improves the fastness connected between packaging body and sensitive chip.
In one of the embodiments, the inner concave arc surface is arc surface, and the circular arc radius surface is 20~200 μm.On
The setting for stating interior concaved circular cambered surface radius has taken into account the fastness connected between packaging body and sensitive chip and package material dosage
Both sides considers.
In one of the embodiments, the circular arc radius surface is 50~150 μm.
In one of the embodiments, the circular arc radius surface is 80~120 μm.
In one of the embodiments, the packaging body also includes the top surface parallel with the upper surface of the sensitive chip,
The medial surface also includes connecting the cambered surface and the extended surface of the top surface.Above-mentioned extended surface plays connection cambered surface and top surface
Effect, the structural strength of packaging body can be strengthened.
In one of the embodiments, the extended surface and the top surface vertical connection；Or the extended surface with it is described
The angle of top surface is obtuse angle.
Extended surface so sets the structure that can increase packaging body perpendicular to top surface, namely extended surface perpendicular to sensitive chip
Intensity.
The angle of extended surface and top surface is obtuse angle, so not only be more conducive to encapsulation forming die the demoulding, moreover it is possible to reduce into
The reflection light quantity that light reflexes to sensitive chip photosensitive area through extended surface is penetrated, avoids disturbing imaging effect, improves image quality.
In one of the embodiments, the distance between the top surface and the sensitive chip upper surface are 200~300 μ
m.Above-mentioned height design can meet that encapsulation requires the Miniaturization Design with photosensory assembly simultaneously.
In one of the embodiments, the wire of the connection sensitive chip and the wiring board, the encapsulation are included
Body coats the wire.Wire is packaged body parcel, can prevent wire from moving, meanwhile, wire is in sealed environment, can be with
Reduce wire and the moisture in air, the service life of extension lead.
A kind of camera module, including：
Above-mentioned any photosensory assembly；And
Lens assembly, it is arranged on the photosensory assembly, and on the photosensitive path of the sensitive chip.
Because photosensory assembly is more firm, so as to which the fastness of the camera module including the photosensory assembly is also enhanced.
Brief description of the drawings
Fig. 1 is the structural representation of the first embodiment of photosensory assembly in the utility model；
Fig. 2 is the partial enlarged drawing at A in the photosensory assembly shown in Fig. 1；
Fig. 3 is the structural representation of the second embodiment of photosensory assembly in the utility model；
Fig. 4 is the partial enlarged drawing at B in the photosensory assembly shown in Fig. 3；
Fig. 5 is the structural representation of the 3rd embodiment of photosensory assembly in the utility model；
Fig. 6 is the partial enlarged drawing at C in the photosensory assembly shown in Fig. 5.
Embodiment
Below in conjunction with the accompanying drawings and specific embodiment is described further to camera module and its photosensory assembly.
As shown in Figures 1 and 2, the photosensory assembly 102 of an embodiment includes wiring board 200, sensitive chip 300 and encapsulation
Body 400.Wherein, wiring board 200 can be the hard circuit board such as ceramic circuit-board, or Rigid Flex or soft board.When
When wiring board 200 is soft board, can side of the assist side 200 away from sensitive chip 300 stiffening plate (not shown) is set, to improve
The intensity of wiring board 200, so as to improve the overall construction intensity of the photosensory assembly 102.
Sensitive chip 300 is connected to wiring board 200, and sensitive chip 300 includes photosensitive area 310 and around photosensitive area 310
Non-photo-sensing area 320.Photosensitive area 310 is mainly made up of the semi-conducting material with light sensitive characteristic, can generation under the irradiation of light
Change is learned, and then changes into electric signal, the transformation of photosignal is achieved in, is finally completed imaging.Even if rather than photosensitive area 320
Chemical change will not be also produced under the irradiation of light.
The encapsulated moulding of packaging body 400 is in the part non-photo-sensing area 320 of wiring board 200 and sensitive chip 300, packaging body 400
Including medial surface 412, medial surface 412 and the junction in non-photo-sensing area 320 are cambered surface 4122.
In the present embodiment, the part of non-photo-sensing area 320 is embedded in packaging body 400, is extended internally and is covered with packaging body 400
The whole non-photo-sensing area 320 of lid compares, and can not only reduce the volume of packaging body 400, moreover it is possible to reserve a part of non-photo-sensing area
320 receive the foreign matters such as potting resin, influence to be imaged to avoid in encapsulation process the foreign matter such as potting resin from flowing into photosensitive area 310
The risk of quality.
For the photosensory assembly 102 of present embodiment, first, packaging body 400 is extended on sensitive chip 300, is made
Obtain sensitive chip 300 to fix by way of molding in assist side 200, while packaging body 400 are formed, complete photosensitive
The connection of chip 300 and wiring board 200, strengthens the fastness connected between sensitive chip 300 and wiring board 200.
Secondly, with traditional compared with the spaced packaging body of sensitive chip, packaging body 400 extends to sensitive chip
On 300, the package area of packaging body 400 is increased, improves and connects between packaging body 400 and wiring board 200 and sensitive chip 300
The fastness connect.
Furthermore the non-photo-sensing area 320 that packaging body 400 is extended on sensitive chip 300 so that whole photosensitive area 310 can
For photosensitive, it ensure that photosensory assembly 102 has maximum photosensitive area.
It is noted that packaging body 400 is formed at wiring board 200 and sensitive chip 300 by molded mode
On.For example, using injection machine, wiring board 200 and sensitive chip 300 are carried out by molding by insert molding technique and form packaging body
400.Packaging body 400 after shaping is firmly connected with wiring board 200 and sensitive chip 300, passes through the Nian Jie side of glue-line with tradition
Formula is compared, and the bonding force between packaging body 400 and wiring board 200 and sensitive chip 300 is much greater.Specifically, using injection
The material that technique forms packaging body 400 can be nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer)
Or PP (Polypropylene, polypropylene) etc..It will be apparent to a skilled person that the foregoing manufacturer that can be selected
Formula and the material that can be selected, the mode of the present utility model that can implement is illustrative only, is not that this practicality is new
The limitation of type.
In the present embodiment, cambered surface 4122 is interior concaved circular cambered surface.That is, cambered surface 4122 by medial surface 412 towards encapsulation
The depression of lateral surface 414 of body 400 is formed.
With the medial surface 412a of the one end being connected perpendicular to sensitive chip 300 and by cambered surface 4122 with non-photo-sensing area 320
(imaginary medial surface) is compared, and the arc surface of indent can reduce the material usage of packaging body 400.With perpendicular to sensitive chip 300
And compared by the medial surface 412b (imaginary medial surface) of the one end of cambered surface 4122 away from non-photo-sensing area 320, the circular arc of indent
Face can further increase the package area of packaging body 400, connect so as to further improve between packaging body 400 and sensitive chip 300
The fastness connect.
In one embodiment, the radius R1 of interior concaved circular cambered surface is 20~200 μm.
In one embodiment, the radius R1 of interior concaved circular cambered surface is 50~150 μm.
In one embodiment, the radius R1 of interior concaved circular cambered surface is 80~120 μm.
The radius R1 of interior concaved circular cambered surface setting has taken into account the fastness connected between packaging body 400 and sensitive chip 300
Consider with the material usage of packaging body 400 both sides.If R1 is excessive, cambered surface 4122 is almost with sensitive chip 300 away from wiring board
200 side superimposed, the difficulty of the injection molding of packaging body 400, and cambered surface 4122 and the photosensitive area of sensitive chip 300 can be increased
The distance between 310 very littles.If R1 is too small, cambered surface 4122 is approximately perpendicular to sensitive chip 300, is not reduced packaging body
400 material usage.
As shown in Figures 3 to 6, packaging body 400 also includes the top surface 416 parallel with the upper surface of sensitive chip 300, top surface
416 connection medial surfaces 412 and lateral surface 414.Medial surface 412 also includes connection cambered surface 4122 and the extended surface 4124 of top surface 416.
Extended surface 4124 can strengthen the structural strength of packaging body 400.
In one embodiment, as shown in Figures 3 and 4, extended surface 4124 and the vertical connection of top surface 416, that is, extended surface 4124
Perpendicular to sensitive chip 300, the structural strength that can increase packaging body 400 is so set.
In one embodiment, as shown in Figures 5 and 6, the angle of extended surface 4124 and top surface 416 is obtuse angle.That is, extended surface
4124 tilt towards lateral surface 414.So not only it is more conducive to the demoulding of the mould of packaging body 400, moreover it is possible to reduce incident ray warp
Extended surface 4124 reflexes to the reflection light quantity of the photosensitive area 310 of sensitive chip 300, avoids disturbing imaging effect, improves image quality.
Further, either in the embodiment shown in fig. 3, still in the embodiment shown in fig. 5, extended surface 4124 is all
It is tangent with cambered surface 4122.That is, extended surface 4124 and cambered surface 4122 are in smoothing junction, be easy to the mould of packaging body 400 be stripped and
Prevent mould from damaging packaging body 400 during demoulding.
In addition, in order to further be beneficial to the demoulding of the mould of packaging body 400, can also be in extended surface 4124 and top surface
416 junction sets outwardly cambered surface so that outwardly cambered surface smoothly connects with extended surface 4124 and top surface 416
Connect.
In one embodiment, top surface 416 is parallel to sensitive chip 300, between top surface 416 and the upper surface of sensitive chip 300
Vertical range H (height) is 200~300 μm.Packaging body 400 should consider relative to the height H of the upper surface of sensitive chip 300 can
To form encapsulation to other electronic components on sensitive chip 300 or wiring board 200, consider in short transverse to increase again
The volume of camera module.Above-mentioned height H designs can meet encapsulation requirement and Miniaturization Design simultaneously.
In one embodiment, photosensory assembly 102 also includes the wire 500 of connection sensitive chip 300 and wiring board 200, encapsulation
The coated wire 500 of body 400.That is, wire 500 is contained in packaging body 400 completely.Wherein, wire 500 can be gold thread, copper
Line, aluminum steel or silver wire etc..Wire 500 is packaged body 400 and wrapped up, and can prevent wire 500 from moving, meanwhile, wire 500 is in
In sealed environment, it is possible to reduce wire 500 and the moisture in air, the service life of extension lead 500.
Present embodiment additionally provides a kind of camera module, and camera module includes foregoing photosensory assembly 102, in addition to mirror
Head assembly.Lens assembly is arranged on photosensory assembly 102, and is right against sensitive chip 300.
When that need to use tight shot, lens assembly includes camera lens, and camera lens is located on top surface 416；When varifocal mirror need to be used
During head, lens assembly includes camera lens and the voice coil motor being set on camera lens, voice coil motor are located on top surface 416.Light is from mirror
Head is incident to the photosensitive area 310 of sensitive chip 300, and sensitive chip 300 converts optical signals into electric signal.
The camera module is because the photosensory assembly 102 that it includes is more firm, therefore the fastness of the camera module also obtains
To strengthen.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent scope.It should be pointed out that the common skill for this area
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
- A kind of 1. photosensory assembly, it is characterised in that including：Wiring board；Sensitive chip, is connected to the wiring board, and the sensitive chip includes photosensitive area and the non-photo-sensing around the photosensitive area Area；AndPackaging body, encapsulated moulding include interior in the part non-photo-sensing area of the wiring board and the sensitive chip, the packaging body Side, the medial surface and the junction in the non-photo-sensing area are cambered surface.
- 2. photosensory assembly according to claim 1, it is characterised in that the cambered surface is inner concave arc surface.
- 3. photosensory assembly according to claim 2, it is characterised in that the inner concave arc surface is arc surface, the arc surface Radius is 20~200 μm.
- 4. photosensory assembly according to claim 3, it is characterised in that the circular arc radius surface is 50~150 μm.
- 5. photosensory assembly according to claim 3, it is characterised in that the circular arc radius surface is 80~120 μm.
- 6. photosensory assembly according to claim 1, it is characterised in that the packaging body also includes and the sensitive chip The parallel top surface in upper surface, the medial surface also include connecting the cambered surface and the extended surface of the top surface.
- 7. photosensory assembly according to claim 6, it is characterised in that the extended surface and the top surface vertical connection；Or The angle of extended surface described in person and the top surface is obtuse angle.
- 8. photosensory assembly according to claim 6, it is characterised in that between the top surface and the sensitive chip upper surface Height be 200~300 μm.
- 9. according to the photosensory assembly described in claim any one of 1-8, it is characterised in that also include connecting the sensitive chip with The wire of the wiring board, wire described in the packaging body coats.
- A kind of 10. camera module, it is characterised in that including：Photosensory assembly as described in claim any one of 1-9；AndLens assembly, it is arranged on the photosensory assembly, and on the photosensitive path of the sensitive chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721210565.8U CN207184658U (en) | 2017-09-15 | 2017-09-15 | Camera module and its photosensory assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721210565.8U CN207184658U (en) | 2017-09-15 | 2017-09-15 | Camera module and its photosensory assembly |
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| Publication Number | Publication Date |
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| CN207184658U true CN207184658U (en) | 2018-04-03 |
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| CN201721210565.8U Active CN207184658U (en) | 2017-09-15 | 2017-09-15 | Camera module and its photosensory assembly |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109510922A (en) * | 2017-09-15 | 2019-03-22 | 南昌欧菲光电技术有限公司 | Camera module and its photosensory assembly |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109510922A (en) * | 2017-09-15 | 2019-03-22 | 南昌欧菲光电技术有限公司 | Camera module and its photosensory assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210622 Address after: 330096 no.1404, Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi Jinghao optics Co.,Ltd. Address before: 330013 Nanchang, Jiangxi economic and Technological Development Zone, east of lilac Road, north of Longtan canal. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. |
|
| TR01 | Transfer of patent right |