CN207083271U - A kind of FPC plates for covering photonasty coat - Google Patents
A kind of FPC plates for covering photonasty coat Download PDFInfo
- Publication number
- CN207083271U CN207083271U CN201720759803.4U CN201720759803U CN207083271U CN 207083271 U CN207083271 U CN 207083271U CN 201720759803 U CN201720759803 U CN 201720759803U CN 207083271 U CN207083271 U CN 207083271U
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- China
- Prior art keywords
- photonasty
- coat
- fpc plates
- covering
- insulated substrate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a kind of FPC plates for covering photonasty coat, including wiring board and photonasty coat, the photonasty coat sets assist side outer surface.It the utility model is related to wiring board manufacture technology field, a kind of FPC plates for covering photonasty coat, PCB surface is covered in using photonasty coat and makes FPC plates, compared with prior art, the thickness that copper foil need not be changed plays the effect of thinning, and without increasing photosensitive-ink and anti-solder ink, structure is simpler, it need not be closed using CVL moulds, low manufacture cost.
Description
Technical field
It the utility model is related to wiring board manufacture technology field, more particularly to a kind of FPB plates for covering photonasty coat.
Background technology
FPC is Flexible Printed Circuit abbreviation, also known as FPC, flexible printed circuit board.
Light-sensitive polyimide：Photosensitive Polyimide, abbreviation PSPI.
As electronic product develops to high density, miniaturization, high reliability direction, the printed substrate of electronic product is supported
Also gradually develop to light, thin, soft direction.Wherein, flexible print circuit board FPC is with its flexible, folding, three-dimensional wiring, three
The advantages that dimension space interconnects obtains more and more extensive application in electronic product.FPC plates are etched by copper foil material
After circuit, then the position meeting of device is pasted because covering on product two sides fitting CVL layers (attaching film shape cover layer), FPC plates
Film does not reach the fitting tolerance of patch device and selects photosensitive-ink to be covered, and in the bent area of FPC plates printing thermosetting oil
Ink is to reach the effect of welding resistance, then a series of flows such as processization gold can just make FPC products.Production process is cumbersome, complicated, system
The cost for making FPC plates is high.Existing FPC plates slimming design makes copper foil layer thinning mostly, reduces the use of copper, and using thin
CVL films, such design can increase the difficulty of FPC plates processing, and the easy gauffer of FPC plates made, yields is low, influence
The impedance behavior of FPC plates.
Utility model content
In order to solve the above-mentioned technical problem, the purpose of this utility model is to provide a kind of simple in construction, low manufacture cost
Cover the FPC plates of photonasty coat.
Technical scheme is used by the utility model：It is a kind of cover photonasty coat FPC plates, including wiring board and
Photonasty coat, the photonasty coat set assist side outer surface.
As the further improvement of such scheme, the wiring board includes insulated substrate and is arranged on insulated substrate side
Copper foil layer, the upper surface of the insulated substrate are disposed with copper foil layer and photonasty coat, the insulation base from bottom to top
The lower surface of plate is provided with photonasty coat.
As the further improvement of such scheme, the wiring board includes insulated substrate and is arranged on insulated substrate both sides
Copper foil layer, the insulated substrate outer surface are disposed with copper foil layer and photonasty coat from inside to outside.
As the further improvement of such scheme, the photonasty coat is made up of light-sensitive polyimide.
As the further improvement of such scheme, fixed and glued by adhesive between the insulated substrate and the copper foil layer
Close.
As the further improvement of such scheme, described adhesive is AD glue.
The beneficial effects of the utility model are：
A kind of FPC plates for covering photonasty coat, PCB surface is covered in using photonasty coat and makes FPC
Plate, compared with prior art, the thickness without changing copper foil play the effect of thinning, without increasing photosensitive-ink and anti-solder paste
Ink, structure is simpler, without being closed using CVL moulds, low manufacture cost.
Brief description of the drawings
Specific embodiment of the present utility model is described further below in conjunction with the accompanying drawings：
Fig. 1, which is that the utility model is a kind of, covers photonasty coat and the structural representation with double-deck copper foil layer FPC plates；
Fig. 2, which is that the utility model is a kind of, covers photonasty coat and the structural representation with individual layer copper foil layer FPC plates.
Embodiment
It should be noted that in the case where not conflicting, the feature in embodiment and embodiment in the application can phase
Mutually combination.
A kind of FPC plates for covering photonasty coat, including wiring board and photonasty coat, photonasty coat are set
Assist side outer surface.Photonasty coat insulate for FPC plate surfaces, the circuit on protection circuit plate, prevents that electric conductivity is different
Thing, which is fallen into, causes short circuit in circuit.
Preferably, the utility model photonasty coat is made up of light-sensitive polyimide.Made using light-sensitive polyimide
FPC plates, pliability is high, and bounce is small, is easy to the assembling of FPC plates to use, more for practicality.
Embodiment one：FPC plates with double-deck copper foil layer.
Fig. 1 is a kind of structural representation for the FPC plates for covering photonasty coat of the utility model, as shown in figure 1, a kind of
The FPC plates of photonasty coat, including wiring board and photonasty coat 1 are covered, photonasty coat 1 is set outside assist side
Surface.
Further, in the present embodiment, wiring board includes insulated substrate 2 and is arranged on the copper foil layer of the both sides of insulated substrate 2
3, the outer surface of insulated substrate 2 is disposed with copper foil layer 3 and photonasty coat 1 from inside to outside.
Further, fixed and bonded by adhesive 4 between the insulated substrate 2 and copper foil layer 3.The present embodiment is preferred
, adhesive 4 uses AD glue.
Further, in the present embodiment, photonasty coat 1 is made up of light-sensitive polyimide.
Further, in the present embodiment, the side of the outer surface of photonasty coat 1 is also fitted with stiffening plate 5.
The lower surface of insulated substrate 2 is provided with photonasty coat 1.
Embodiment two：FPC plates with individual layer copper foil layer.
Fig. 2, which is that the utility model is a kind of, covers photonasty coat and the structural representation with individual layer copper foil layer FPC plates,
One kind covering photonasty coat FPC plates, including wiring board and photonasty coat 01, photonasty coat 01 are arranged on circuit
Plate outer surface.
Further, in the present embodiment, wiring board includes insulated substrate 02 and is arranged on the copper foil of the upside of insulated substrate 02
Layer 03, the upper surface of insulated substrate 02 are disposed with copper foil layer 03 and photonasty coat 01 from bottom to top, under insulated substrate 02
Surface is coated with photonasty coat 01.
Further, fixed and bonded by adhesive 04 between the insulated substrate 02 and copper foil layer 03.The present embodiment is excellent
Choosing, adhesive 04 uses AD glue.
Further, in the present embodiment, photonasty coat 01 is made up of light-sensitive polyimide.
Further, in the present embodiment, the side of the outer surface of photonasty coat 01 is also fitted with stiffening plate 05, stiffening plate
05 hardness for increasing FPC plates, the intensity of FPC plate plugging positions is improved, facilitates user's plug, facilitates overall group of product
Dress.
Obvious, the copper foil layer in FPC plates is not limited to individual layer and double-deck or multilayer.
A kind of FPC plates for covering photonasty coat, PCB surface is covered in using photonasty coat and makes FPC
Plate, compared with prior art, the thickness without changing copper foil play the effect of thinning, without increasing photosensitive-ink and anti-solder paste
Ink, structure is simpler, without being closed using CVL moulds, low manufacture cost.
Above is preferably implement to be illustrated to of the present utility model, but the utility model is created and is not limited to institute
Embodiment is stated, those skilled in the art can also make a variety of be equal on the premise of without prejudice to the utility model spirit
Deformation is replaced, and these equivalent deformations or replacement are all contained in the application claim limited range.
Claims (6)
1. a kind of FPC plates for covering photonasty coat, it is characterised in that it includes wiring board and photonasty coat, described
Photonasty coat sets assist side outer surface.
A kind of 2. FPC plates for covering photonasty coat according to claim 1, it is characterised in that the wiring board bag
Include insulated substrate and be arranged on the copper foil layer of insulated substrate side, the upper surface of the insulated substrate is disposed with from bottom to top
Copper foil layer and photonasty coat, the lower surface of the insulated substrate are provided with photonasty coat.
A kind of 3. FPC plates for covering photonasty coat according to claim 1, it is characterised in that the wiring board bag
Include insulated substrate and be arranged on the copper foil layer of insulated substrate both sides, the insulated substrate outer surface is disposed with copper from inside to outside
Layers of foil and photonasty coat.
4. the FPC plates of a kind of covering photonasty coat according to any one of claims 1 to 3, it is characterised in that described
Photonasty coat is made up of light-sensitive polyimide.
A kind of 5. FPC plates of covering photonasty coat according to Claims 2 or 3, it is characterised in that the insulation base
Fixed and bonded by adhesive between plate and the copper foil layer.
6. a kind of FPC plates for covering photonasty coat according to claim 5, it is characterised in that described adhesive is AD glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720759803.4U CN207083271U (en) | 2017-06-27 | 2017-06-27 | A kind of FPC plates for covering photonasty coat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720759803.4U CN207083271U (en) | 2017-06-27 | 2017-06-27 | A kind of FPC plates for covering photonasty coat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207083271U true CN207083271U (en) | 2018-03-09 |
Family
ID=61426626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720759803.4U Active CN207083271U (en) | 2017-06-27 | 2017-06-27 | A kind of FPC plates for covering photonasty coat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207083271U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107197591A (en) * | 2017-06-27 | 2017-09-22 | 上达电子（深圳）股份有限公司 | A kind of FPC plates for covering photonasty coat and preparation method thereof |
-
2017
- 2017-06-27 CN CN201720759803.4U patent/CN207083271U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107197591A (en) * | 2017-06-27 | 2017-09-22 | 上达电子（深圳）股份有限公司 | A kind of FPC plates for covering photonasty coat and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210916 Address after: 435000 No.91 Sike Avenue East, Jinshan street, Huangshi economic and Technological Development Zone, Hubei Province Patentee after: LEADER-TECH (HUANGSHI) Inc. Address before: 518104 floors 1-4, 2-3, building a, Huangpu Runhe Industrial Park, South Ring Road, Huangpu Community, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: LEADER-TECH ELECTRONICS (SHENZHEN) Inc. |