CN206915022U - A kind of multilayer gas column buffer packing structure of membrane becket chip - Google Patents
A kind of multilayer gas column buffer packing structure of membrane becket chip Download PDFInfo
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- CN206915022U CN206915022U CN201720650181.1U CN201720650181U CN206915022U CN 206915022 U CN206915022 U CN 206915022U CN 201720650181 U CN201720650181 U CN 201720650181U CN 206915022 U CN206915022 U CN 206915022U
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- gas column
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- column pad
- bending part
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Abstract
The utility model discloses a kind of multilayer gas column buffer packing structure of membrane becket chip;It is of the present utility model simple in construction, it is cheap, it is and practical, A1 and gas column pad B1 are padded including gas column, the gas column pad A1 sides are connected with bending part A1, the bending part A1 is connected with gas column pad A2, the gas column pad A2 sides are connected with bending part A2, the bending part A2 sides are connected with gas column pad A3, the gas column pad A3 sides are connected with bending A3, the bending A3 sides are connected with gas column pad A4, the gas column pad B1 sides are connected with bending part B1, the bending part B1 is connected with gas column pad B2, the gas column pad B2 sides are connected with bending part B2, the bending part B2 sides are connected with gas column pad B3, the gas column pad B3 sides are connected with bending B3, the bending B3 sides are connected with gas column pad B4;A kind of multilayer gas column buffer packing structure of this kind of membrane becket chip is easy to use, has good economic benefit and social benefit, is adapted to promote the use of.
Description
Technical field
It the utility model is related to a kind of packaging structure, the multilayer gas column buffers packet of more particularly to a kind of membrane becket chip
Assembling structure, belong to packaging applications technical field.
Background technology
Multilayer gas column buffer packing structure belongs to a kind of packaging material of new invention, using air column, with two centimetre-four
Centimetre air column system be made fit buffering kit, because air column inflate 65 percent self-assembling formation buffering, link
Independent gas column is played, forms the optimal buffering package around object.It is combined using high-tech technology and environment-friendly materials, not
Packaging bag is substantially flat before inflation, and the huge space of occupancy is reduced in transportation, reduces the loss during transporting, and reduces
Cost of transportation, warehouse cost is reduced, reduce human cost.Such a packing inside bag, substitute existing inner packaging material extensively, such as protect
The inner packaging materials such as sharp dragon, EPE, corrugated paper, paper pulp injection molding, not only environmental protection, saving cost, improve production line efficiency and provide
The most perfect antidetonation protection of product.With Special machine for producing tool equipment, using automatic production line:Computer-aided manufacturing is automatic
Control, easily production, easily modification, it is fast and simple, reduce hardware mould die sinking, die trial, repair a die, the puzzlement of more mold exchange up and down.Section
Die cost is saved, shortens exploitation time to volume.The multilayer gas column buffer packing structure of unaerated fully planarizes, light volume
It is small and the smaller volume of timber can be used to provide product identical antidetonation protect, significantly save goods, materials and equipments and commodities storage and transport distribution cost.
Current multilayer gas column buffer packing structure needs to be pinioned with adhesive tape just can be with, therefore, a kind of multilayer of membrane becket chip
Gas column buffer packing structure will have good market prospects.
Utility model content
The technical problems to be solved in the utility model is the defects of overcoming prior art, there is provided substantial amounts of cost has been saved,
It is easy to use.
In order to solve the above-mentioned technical problem, the utility model provides following technical scheme:
The utility model provides a kind of multilayer gas column buffer packing structure of membrane becket chip, including gas column pad A1 and
Gas column pads B1, and the gas column pad A1 sides are connected with bending part A1, the bending part A1 and are connected with gas column pad A2, the gas column pad
A2 sides are connected with bending part A2, and the bending part A2 sides are connected with gas column pad A3, and the gas column pad A3 sides are connected with folding
Curved A3, the bending A3 sides are connected with gas column pad A4, and the gas column pad B1 sides are connected with bending part B1, the bending part B1
Gas column pad B2 is connected with, the gas column pad B2 sides are connected with bending part B2, and the bending part B2 sides are connected with gas column pad B3,
The gas column pad B3 sides are connected with bending B3, and the bending B3 sides are connected with gas column pad B4, and described gas column pad is with warm
Envelope line is divided into one section one section, and every section of size is identical, and the gas column pad A1, the gas column pads A2, the gas column pads A3, described
Gas column pads A4 and gas column pad B1, gas column pad B2, gas column pad B3, gas column pad B4 and forms a cavity volume.
As a kind of optimal technical scheme of the present utility model, the gas column pad A1, gas column pad A2, the gas column pad
A3, gas column pad A4 are identical with gas column pad B1, gas column pad B2, gas column pad B3, gas column pad B4 sizes.
As a kind of optimal technical scheme of the present utility model, in addition to velcro, the velcro passes through glue
It is connected with gas column pad B1, gas column pad B4.
The beneficial effect that the utility model is reached is:It is of the present utility model simple in construction, it is cheap, and practicality
By force, A1 is padded by gas column, gas column pads A2, gas column pads A3, gas column pads A4 and gas column pads B1, gas column pads B2, gas column pads B3, gas column pad
One square cavity volume of B4 compositions, required object to be protected is put into wherein, then velcro is closed, and need not thus be made
Several circles are wound with adhesive plaster, only velcro need to be closed, after transport, velcro of tearing, secondary can also use,
The security effectiveness that object is protected during transport is improved, has saved substantial amounts of cost, it is easy to use, there is good economic benefit
And social benefit, it is adapted to promote the use of.
Brief description of the drawings
Accompanying drawing is used for providing further understanding to of the present utility model, and a part for constitution instruction, with this practicality
New embodiment is used to explain the utility model together, does not form to limitation of the present utility model.In the accompanying drawings:
Fig. 1 is expansion overall structure diagram of the present utility model;
Fig. 2 is of the present utility model to close modular construction schematic diagram;
Fig. 3 is overlooking the structure diagram of the present utility model;
Fig. 4 is overall structure diagram of the present utility model;
In figure:1st, gas column pad A1;2nd, gas column pad A2;3rd, gas column pad A3;4th, gas column pad A4;5th, bending A1;6th, bending A2;7、
Bending A3;8th, gas column pad B1;9th, gas column pad B2;10th, gas column pad B3;11st, gas column pad B4;12nd, bending B1;13 bending B2;14th, roll over
Curved B3;15th, velcro.
Embodiment
Preferred embodiment of the present utility model is illustrated below in conjunction with accompanying drawing, it will be appreciated that described herein excellent
Select embodiment to be merely to illustrate and explain the utility model, be not used to limit the utility model.
Embodiment:As Figure 1-3, the utility model provides a kind of multilayer gas column buffering package of membrane becket chip
Structure, including gas column pad A11 and gas column pad B18, the gas column pad A11 sides are connected with bending part A15, the bending part A15
Gas column pad A22 is connected with, the gas column pad A22 sides are connected with bending part A26, and the bending part A26 sides are connected with gas column
A33 is padded, the gas column pad A33 sides are connected with bending A37, and the bending A37 sides are connected with gas column pad A44, the gas column
Pad B18 sides are connected with bending part B112, the bending part B112 and are connected with gas column pad B29, the gas column pad B29 sides connection
There is bending part B213, the bending part B213 sides are connected with gas column pad B310, and the gas column pad B310 sides are connected with bending
B314, the bending B314 sides are connected with gas column pad B411, and described gas column pad is divided into one section one section with hot-sealing line, and often
The size of section is identical, the gas column pad A11, gas column pad A22, gas column pad A33, gas column pad A44 and the gas
Post pad B18, gas column pad B29, gas column pad B310, gas column pad B411 form a cavity volume.;
In order that a kind of multilayer gas column buffer packing structure of this kind of membrane becket chip, easy to use, operating efficiency
Height, the gas column pad A11, gas column pad A22, gas column pad A33, gas column pad A44 and gas column pad B18, institute
It is identical to state gas column pad B29, gas column pad B310, gas column pad B411 sizes, in addition to velcro 15, the nylon are taken
Button 15 pads B18 by glue with the gas column, the gas column pads B411 and is connected.
The utility model when in use, first, by gas column pad A11, gas column pad A22, gas column pad A33, gas column pad A44 with
Gas column pads B18, gas column pad B29, gas column pad B310, a square cavity volume of gas column pad B411 compositions, the thing to be protected by needed for
Part is put into wherein, then velcro 15 is closed, and thus need not be wound several circles using adhesive plaster, only need to close velcro
15, after transport, velcro 15 of tearing, secondary it can also use.
Finally it should be noted that:Preferred embodiment of the present utility model is the foregoing is only, is not limited to this
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it can still modify to the technical scheme described in foregoing embodiments, or to which part technical characteristic
Carry out equivalent substitution.All any modification, equivalent substitution and improvements within the spirit and principles of the utility model, made etc.,
It should be included within the scope of protection of the utility model.
Claims (3)
1. a kind of multilayer gas column buffer packing structure of membrane becket chip, including gas column pad A1 (1) and gas column pad B1 (8),
Characterized in that, described gas column pad A1 (1) side is connected with bending part A1 (5), the bending part A1 (5) is connected with gas column pad A2
(2), described gas column pad A2 (2) side is connected with bending part A2 (6), and bending part A2 (6) side is connected with gas column pad A3
(3), described gas column pad A3 (3) side is connected with bending A3 (7), and bending A3 (7) side is connected with gas column pad A4 (4), institute
State gas column pad B1 (8) side and be connected with bending part B1 (12), the bending part B1 (12) is connected with gas column pad B2 (9), the gas
Post pad B2 (9) side is connected with bending part B2 (13), and bending part B2 (13) side is connected with gas column pad B3 (10), the gas
Post pad B3 (10) side is connected with bending B3 (14), and bending B3 (14) side is connected with gas column pad B4 (11), described gas
Post pad is divided into one section one section with hot-sealing line, and every section of size is identical, the gas column pads A1 (1), the gas column pads A2 (2),
The gas column pad A3 (3), gas column pad A4 (4) and gas column pad B1 (8), gas column pad B2 (9), gas column pad B3
(10), the gas column pad B4 (11) forms a cavity volume.
A kind of 2. multilayer gas column buffer packing structure of membrane becket chip according to claim 1, it is characterised in that
The gas column pad A1 (1), gas column pad A2 (2), gas column pad A3 (3), gas column pad A4 (4) and gas column pad B1
(8), the gas column pad B2 (9), gas column pad B3 (10), gas column pad B4 (11) size are identical.
A kind of 3. multilayer gas column buffer packing structure of membrane becket chip according to claim 1, it is characterised in that
Also include velcro (15), the velcro (15) pads B1 (8) by glue and the gas column, the gas column pads B4 (11)
It is connected.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720650181.1U CN206915022U (en) | 2017-06-06 | 2017-06-06 | A kind of multilayer gas column buffer packing structure of membrane becket chip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720650181.1U CN206915022U (en) | 2017-06-06 | 2017-06-06 | A kind of multilayer gas column buffer packing structure of membrane becket chip |
Publications (1)
Publication Number | Publication Date |
---|---|
CN206915022U true CN206915022U (en) | 2018-01-23 |
Family
ID=61314239
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201720650181.1U Active CN206915022U (en) | 2017-06-06 | 2017-06-06 | A kind of multilayer gas column buffer packing structure of membrane becket chip |
Country Status (1)
Country | Link |
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CN (1) | CN206915022U (en) |
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2017
- 2017-06-06 CN CN201720650181.1U patent/CN206915022U/en active Active
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190301 Address after: Room S203, 2310 Yangshupu Road, Yangpu District, Shanghai 200090 Patentee after: SHANGHAI SHAOJIA INDUSTRIAL CO., LTD. Address before: Room 120, Building 7, Zhifu Road, Caojing Town, Jinshan District, Shanghai, 201500 Patentee before: SHANGHAI JINGSONG INDUSTRY CO., LTD. |
|
TR01 | Transfer of patent right |