CN206686438U - A kind of multi-layer H DI wiring boards of internal layer interconnection - Google Patents
A kind of multi-layer H DI wiring boards of internal layer interconnection Download PDFInfo
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- CN206686438U CN206686438U CN201720370108.9U CN201720370108U CN206686438U CN 206686438 U CN206686438 U CN 206686438U CN 201720370108 U CN201720370108 U CN 201720370108U CN 206686438 U CN206686438 U CN 206686438U
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- wiring board
- plate
- heat sink
- radiating tube
- layer
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Abstract
It the utility model is related to a kind of multi-layer H DI wiring boards of internal layer interconnection,Heat sink both sides are provided with heat emission hole,Heat sink inner chamber is provided with some insulation connection straps,Insulation connection strap extends through the heat sink top and first line plate and the second wiring board is connected with bottom,Tertiary circuit plate and the 5th wiring board are provided with the outside of first line plate,First line plate,Top radiating tube is provided between tertiary circuit plate and the 5th wiring board,Top radiating tube bottom connects the heat sink top,The 4th wiring board and the 6th wiring board are provided with the outside of second wiring board,Second wiring board,Bottom radiating tube is provided between 4th wiring board and the 6th wiring board,Tin cream overcoat is provided with the outside of insulating barrier,Pass through heat sink,The design of top radiating tube and bottom radiating tube,So that the heat transfer between wiring board is accelerated,Improve the radiating effect of wiring board,Pass through blind hole and the design through through hole,So that run through connection in the middle part of multiple wiring board interconnecteds,So that connection is more fixed.
Description
Technical field
A kind of multi-layer H DI wiring boards of internal layer interconnection are the utility model is related to, belong to wiring board manufacturing technology field.
Background technology
The title of circuit board has:Wiring board, pcb board, aluminium base, high frequency plate, thick copper coin, impedance plate, PCB, ultra-thin circuit
Plate, ultrathin circuit board, printing (copper lithographic technique) circuit board etc., circuit board makes circuit miniaturization, directly perceivedization, for permanent circuit
Batch production and optimization electrical appliance layout play an important role, at present multi-layer H DI (high density interconnection) wiring board exist radiate not
Well, the problems such as internal layer interconnectivity difference, therefore, we provide a kind of multi-layer H DI wiring boards of internal layer interconnection.
Utility model content
The technical problems to be solved in the utility model overcomes the defects of existing, there is provided a kind of multi-layer H DI lines of internal layer interconnection
Road plate, pass through the design of heat sink, top radiating tube and bottom radiating tube so that the heat transfer between wiring board is accelerated, and improves
The radiating effect of wiring board, pass through blind hole and the design through through hole so that run through company in the middle part of multiple wiring board interconnecteds
Connect so that connection is more fixed, and effectively can be solved the problems, such as in background technology.
In order to solve the above-mentioned technical problem, the utility model provides following technical scheme：
A kind of multi-layer H DI wiring boards of internal layer interconnection, including heat sink, the heat sink both sides are provided with heat emission hole, described
Heat sink inner chamber is provided with some insulation connection straps, and the insulation connection strap extends through the heat sink top and the is connected with bottom
One wiring board and the second wiring board, the first line plate outside are provided with tertiary circuit plate and the 5th wiring board, the First Line
Top radiating tube is provided between road plate, tertiary circuit plate and the 5th wiring board, the top radiating tube bottom connects the radiating
Plate top, the second wiring board outside are provided with the 4th wiring board and the 6th wiring board, second wiring board, the 4th wiring board
It is provided with bottom radiating tube between the 6th wiring board, the bottom radiating tube top connects the heat sink bottom, and described first
It is provided with the middle part of wiring board, the second wiring board, tertiary circuit plate, the 4th wiring board, the 5th wiring board and the 6th wiring board through logical
Hole, the 5th wiring board and the 6th the wiring board outside are equipped with soft insulating layer, and being provided with tin cream on the outside of the insulating barrier protects
Layer.
Furthermore, insulating barrier is respectively equipped between the first line plate, tertiary circuit plate and the 5th wiring board, institute
State and be respectively equipped with insulating barrier between the second wiring board, the 4th wiring board and the 6th wiring board.
Furthermore, the first line plate, the second wiring board, tertiary circuit plate, the 4th wiring board, the 5th wiring board
It is polyimide copper clad lamination with the 6th wiring board.
Furthermore, the insulation connection strap is in be equally spaced, at least four.
Furthermore, it is equipped with blind hole between the first line plate, tertiary circuit plate and the 5th wiring board, described
Blind hole is equipped between two wiring boards, the 4th wiring board and the 6th wiring board.
The utility model beneficial effect：The utility model by the design of heat sink, top radiating tube and bottom radiating tube,
So that the heat transfer between wiring board is accelerated, the radiating effect of wiring board is improved, by blind hole and the design through through hole, is made
Obtain and run through connection in the middle part of multiple wiring board interconnecteds so that connection is more fixed.
Brief description of the drawings
Accompanying drawing is used for providing further understanding to of the present utility model, and a part for constitution instruction, with this practicality
New embodiment is used to explain the utility model together, does not form to limitation of the present utility model.
Fig. 1 is a kind of multi-layer H DI circuit board structure figures of internal layer interconnection of the utility model.
Fig. 2 is a kind of multi-layer H DI wiring board top views of internal layer interconnection of the utility model.
Label in figure：1st, heat sink；2nd, heat emission hole；3rd, insulate connection strap；4th, first line plate；5th, the second wiring board；6、
Tertiary circuit plate；7th, the 5th wiring board；8th, top radiating tube；9th, the 4th wiring board；10th, the 6th wiring board；11st, bottom is radiated
Pipe；12nd, through through hole；13rd, soft insulating layer；14th, blind hole；15th, tin cream overcoat.
Embodiment
Preferred embodiment of the present utility model is illustrated below in conjunction with accompanying drawing, it will be appreciated that described herein excellent
Select embodiment to be merely to illustrate and explain the utility model, be not used to limit the utility model.
As shown in Figure 1-2, including heat sink 1, it is described to dissipate as to wiring board, caused heat is evacuated at work
The both sides of hot plate 1 are provided with heat emission hole 2, and as the outlet of heat evacuation, the inner chamber of heat sink 1 is provided with some insulation connection straps 3, uses
In the work that is connected of the wiring board 5 of first line plate 4 and second, the insulation connection strap 3 is extended through on the heat sink 1
Portion is connected the wiring board 5 of first line plate 4 and second with bottom, and the outside of first line plate 4 is provided with tertiary circuit plate 6 and the 5th
Wiring board 7, top radiating tube 8 is provided between the first line plate 4, the wiring board 7 of tertiary circuit plate 6 and the 5th, for conveying
Heat between first line plate 4, the wiring board 7 of tertiary circuit plate 6 and the 5th connects to heat sink 1, the bottom of top radiating tube 8
The top of heat sink 1 is connect, the outside of the second wiring board 5 is provided with the 4th wiring board 9 and the 6th wiring board 10, second line
Bottom radiating tube 11 is provided between road plate 5, the 4th wiring board 9 and the 6th wiring board 10, for conveying the second wiring board the 5, the 4th
To in heat sink 1, the top of bottom radiating tube 11 connects the heat sink for heat between the wiring board 10 of wiring board 9 and the 6th
1 bottom, the first line plate 4, the second wiring board 5, tertiary circuit plate 6, the 4th wiring board 9, the 5th wiring board 7 and the 6th line
The middle part of road plate 10, which is provided with, runs through through hole 12, and the outside of the 5th wiring board 7 and the 6th wiring board 9 is equipped with soft insulating layer 13,
Prevent the wire of wiring board to tangle generation and produce interference to signal, wiring board normal work is influenceed, outside the soft insulating layer 13
Side is provided with tin cream overcoat 15, and protective action is played to wiring board.
Soft insulating layer 13 is respectively equipped between the first line plate 4, the wiring board 7 of tertiary circuit plate 6 and the 5th, it is described
Soft insulating layer 13, the first line plate are respectively equipped between second wiring board 5, the 4th wiring board 9 and the 6th wiring board 10
4th, the second wiring board 5, tertiary circuit plate 6, the 4th wiring board 9, the 5th wiring board 7 and the 6th wiring board 10 are polyimide copper-clad
Plate, the insulation connection strap 3 is in be equally spaced, at least four, reasonable in design, the first line plate 4, tertiary circuit
Be equipped with blind hole 14 between the wiring board 7 of plate 6 and the 5th, second wiring board 5, the 4th wiring board 9 and the 6th wiring board 10 it
Between be equipped with blind hole 14, for the work that is connected between wiring board.
The utility model when in use, passes through the design of heat sink 1, top radiating tube 8 and bottom radiating tube 11 so that line
Heat transfer between the plate of road is accelerated, and improves the radiating effect of wiring board, by blind hole 14, insulation connection strap 3 and runs through through hole
12 design so that run through connection in the middle part of multiple wiring board interconnecteds so that connection is more fixed.
It is above the preferable embodiment of the utility model, the utility model those skilled in the art can also be to upper
State embodiment to be changed and changed, therefore, the utility model is not limited to above-mentioned embodiment, every ability
Any conspicuously improved, replacement or modification that field technique personnel are made on the basis of the utility model belong to this practicality
New protection domain.
Claims (5)
1. a kind of multi-layer H DI wiring boards of internal layer interconnection, including heat sink (1), it is characterised in that heat sink (1) both sides
Provided with heat emission hole (2), heat sink (1) inner chamber is provided with some insulation connection straps (3), and the insulation connection strap (3) is passed through respectively
Wear the heat sink (1) top and first line plate (4) and the second wiring board (5) are connected with bottom, the first line plate (4) is outside
Side is provided with tertiary circuit plate (6) and the 5th wiring board (7), the first line plate (4), tertiary circuit plate (6) and the 5th circuit
It is provided with top radiating tube (8) between plate (7), top radiating tube (8) bottom connects heat sink (1) top, and described the
The 4th wiring board (9) and the 6th wiring board (10), second wiring board (5), the 4th wiring board are provided with the outside of two wiring boards (5)
(9) bottom radiating tube (11) is provided between the 6th wiring board (10), bottom radiating tube (11) top connects the radiating
Plate (1) bottom, the first line plate (4), the second wiring board (5), tertiary circuit plate (6), the 4th wiring board (9), the 5th line
Road plate (7) runs through through hole (12) with being provided with the middle part of the 6th wiring board (10), the 5th wiring board (7) and the 6th wiring board (9)
Outside is equipped with soft insulating layer (13), and tin cream overcoat (15) is provided with the outside of the soft insulating layer (13).
A kind of 2. multi-layer H DI wiring boards of internal layer interconnection according to claim 1, it is characterised in that：The first line plate
(4), it is respectively equipped with soft insulating layer (13) between tertiary circuit plate (6) and the 5th wiring board (7), second wiring board (5),
Soft insulating layer (13) is respectively equipped between 4th wiring board (9) and the 6th wiring board (10).
A kind of 3. multi-layer H DI wiring boards of internal layer interconnection according to claim 1, it is characterised in that：The first line plate
(4), the second wiring board (5), tertiary circuit plate (6), the 4th wiring board (9), the 5th wiring board (7) are with the 6th wiring board (10)
Polyimide copper clad lamination.
A kind of 4. multi-layer H DI wiring boards of internal layer interconnection according to claim 1, it is characterised in that：The insulation connection strap
(3) it is in be equally spaced, at least four.
A kind of 5. multi-layer H DI wiring boards of internal layer interconnection according to claim 1, it is characterised in that：The first line plate
(4) blind hole (14), second wiring board (5), the 4th circuit, are equipped between tertiary circuit plate (6) and the 5th wiring board (7)
Blind hole (14) is equipped between plate (9) and the 6th wiring board (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720370108.9U CN206686438U (en) | 2017-04-10 | 2017-04-10 | A kind of multi-layer H DI wiring boards of internal layer interconnection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720370108.9U CN206686438U (en) | 2017-04-10 | 2017-04-10 | A kind of multi-layer H DI wiring boards of internal layer interconnection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206686438U true CN206686438U (en) | 2017-11-28 |
Family
ID=60398758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720370108.9U Active CN206686438U (en) | 2017-04-10 | 2017-04-10 | A kind of multi-layer H DI wiring boards of internal layer interconnection |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206686438U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107864555A (en) * | 2017-12-09 | 2018-03-30 | 中国电子科技集团公司第四十三研究所 | A kind of flexible PCB |
-
2017
- 2017-04-10 CN CN201720370108.9U patent/CN206686438U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107864555A (en) * | 2017-12-09 | 2018-03-30 | 中国电子科技集团公司第四十三研究所 | A kind of flexible PCB |
| CN107864555B (en) * | 2017-12-09 | 2024-02-09 | 中国电子科技集团公司第四十三研究所 | Flexible circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180427 Address after: 341600 Jiangxi Ganzhou Xinfeng County Industrial Park electronic device industry base Patentee after: Ganzhou Chuang Chuang Circuit Technology Co., Ltd. Address before: 330031 302, room 179, No. 179, Xiang Ting 179, lake front road, Nanchang, Jiangxi. Patentee before: Nanchang Jinxuan Technology Co., Ltd. |
|
| TR01 | Transfer of patent right |