CN206640862U - Printed substrate and electronic equipment - Google Patents
Printed substrate and electronic equipment Download PDFInfo
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- CN206640862U CN206640862U CN201720273992.4U CN201720273992U CN206640862U CN 206640862 U CN206640862 U CN 206640862U CN 201720273992 U CN201720273992 U CN 201720273992U CN 206640862 U CN206640862 U CN 206640862U
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- angle
- printed substrate
- mark
- insulating barrier
- component module
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Abstract
It the utility model is related to a kind of printed substrate and electronic equipment.The printed substrate includes conductor layer and insulating barrier, the insulating barrier is covered in the conductor layer, the conductor layer includes component module, and the identification piece of the position for identifying the component module and/or the identification information of the component module is additionally provided with the inside of the insulating barrier.A technical problem to be solved in the utility model is that existing printed substrate generally sets silk-screen to identify angle in outer surface, causes poor flatness.One purposes of utility model is to be used for electronic equipment.
Description
Technical field
Electronic circuit technology field is the utility model is related to, more specifically, the utility model is related to a kind of printed substrate
And apply the electronic equipment of the printed substrate.
Background technology
In designing printed circuit board, silk-screen typically can be all added to mark position of components or other information, to facilitate system
Make process visual inspection and repair in the future.Silk-screen is generally arranged at the surface of ink layer.Because silk-screen has certain altitude (such as 20um),
Therefore the integral smoothness of circuit board can be influenceed, so as to be printed to SMT (Surface Mount Technology, surface mount) tin cream
Brushed with having a negative impact.With chip Pin (stitch) compactedness more and more higher, Pin pitch (pin spacing) are increasingly
Small, deficient manufacturing procedure is also increasingly severe caused by silk-screen.
Utility model content
A purpose of the present utility model is the new solution of printed substrate.
According to one side of the present utility model, there is provided a kind of printed substrate.The printed substrate include conductor layer and
Insulating barrier, the insulating barrier are covered in the conductor layer, and the conductor layer includes component module, in the inner side of the insulating barrier
It is additionally provided with the identification piece of the position for identifying the component module and/or the identification information of the component module.
The insulating barrier is ink layer, and the ink layer includes the vacancy section relative with the identification piece；Either, it is described
Insulating barrier is cover layer.
Alternatively, the identification piece includes mark angle.
Alternatively, the mark angle is included in upper left mark angle, lower-left mark angle, upper right mark angle and lower right indicia angle
At least two.
Alternatively, the mark angle is located at the outside of the component module.
Alternatively, the component module has middle part clear area, and the mark angle is arranged on the middle part clear area.
Alternatively, the mark angle is multiple that one in multiple mark angles is angle of chamfer.
Alternatively, the mark angle is dotted line shape.
Alternatively, the conductor layer by material be copper, aluminium, gold, silver or tin.
Alternatively, the identification piece is integrally formed with the component module.
According to other side of the present utility model, there is provided a kind of electronic equipment.It is new that the electronic equipment includes this practicality
The printed substrate that type provides.
One of the present utility model has technical effect that identification piece is arranged on the inner side of insulating barrier by the printed substrate,
Rather than outer surface, therefore identification piece will not protrude from outer surface.The printed substrate has good flatness, will not be to follow-up
Processing adversely affect.Substantially increase the yields of electronic product.
It is of the present utility model other by referring to the drawings to the detailed description of exemplary embodiment of the present utility model
Feature and its advantage will be made apparent from.
Brief description of the drawings
The accompanying drawing of a part for constitution instruction describes embodiment of the present utility model, and uses together with the description
In explanation principle of the present utility model.
Fig. 1 is the sectional view according to the printed substrate of the utility model embodiment.
Fig. 2-6 is the front view according to the printed substrate of the utility model embodiment.
Description of reference numerals：
11：Layers of copper；12：Component module；13：Pad；14：Upper left identifies angle；15：Upper right identifies angle；16：Lower-left identifies
Angle；17：Lower right indicia angle；18：Ink layer；19：Base material；20：Inner side；21：Vacancy section.
Embodiment
Various exemplary embodiments of the present utility model are described in detail now with reference to accompanying drawing.It should be noted that：It is unless another
Illustrate outside, the part and the positioned opposite of step, numerical expression and numerical value otherwise illustrated in these embodiments is unlimited
The scope of the utility model processed.
The description only actually at least one exemplary embodiment is illustrative to be never used as to this practicality below
New and its application or any restrictions used.
It may be not discussed in detail for technology and equipment known to person of ordinary skill in the relevant, but in appropriate situation
Under, the technology and equipment should be considered as part for specification.
In shown here and discussion all examples, any occurrence should be construed as merely exemplary, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined, then it need not be further discussed in subsequent accompanying drawing in individual accompanying drawing.
According to embodiment of the present utility model, there is provided a kind of printed substrate.The printed substrate can be hardboard, example
Such as, television set, computer, mobile phone, the mainboard of wearable device or power circuit plate etc.；Can also be soft board, for example, linearly shaking
Move FPCB of motor, loudspeaker module etc.；Rigid Flex is can also be, for example, the wiring board of camera module.
The printed substrate includes conductor layer and insulating barrier.Insulating barrier is covered in conductor layer.Conductor layer includes element mould
Block 12.The position for marker elements module 12 and/or the identification letter of component module 12 are additionally provided with the inner side 20 of insulating barrier
The identification piece of breath.Inner side 20 is the side relative with the outer surface of insulating barrier.For example, close to the side of conductor layer.
The material of conductor layer can be, but not limited to, copper, aluminium, gold, silver or tin.In the utility model embodiment, lead
Body layer is layers of copper 11.The wide material sources of copper, and good in oxidation resistance.Component module 12 includes various electronic components, for example, electric
Appearance, resistance etc..Various electronic components and wire, which link together, forms circuit layout, to meet difference in functionality demand.This reality
Also include multiple pads 13 with the printed substrate of new embodiment, pad 13 is electrically connected for electronic component with external circuit
Connect.
In the utility model embodiment, identification piece can be for the position of marker elements module 12 frame-shaped construction or
Person identifies angle；It can also be the identification pattern for the identification information of marker elements module 12.
In the utility model embodiment, as shown in figure 1, printed substrate also includes base material 19.Conductor layer is disposed in
On base material 19.Insulating barrier is ink layer 18, and ink layer 18 includes the vacancy section 21 relative with identification piece.Ink layer 18 is generally by hiding
Lid printing ink to manufacture forms, and this ink is opaque, therefore to set vacancy section 21.The shape of vacancy section 21 matches with identification piece.
So, user can be from external observation to identification piece.Ink layer 18 is generally used in PCB hardboards.
In another embodiment of the present utility model, insulating barrier is cover layer.Cover layer is formed by plastic production, generally
For transparent material.User can be directed through cover layer and observe identification piece.So, without setting vacancy section.Cover layer
It is generally used for FPCB (FPC).
Those skilled in the art according to actual conditions, can select material and thickness of insulating barrier etc..
Identification piece is arranged on the inner side of insulating barrier, rather than outer surface by the printed substrate of the utility model embodiment,
Therefore identification piece will not protrude from outer surface.The printed substrate has good flatness, and follow-up processing will not be caused not
Profit influences.Substantially increase the yields of electronic product.
In the utility model embodiment, mark angle is located at the outside of component module 12.So, the position at angle is identified more
Substantially, it is easy to user to position.For example, mark angle includes upper left mark angle 14, lower-left mark angle 16, upper right mark angle 15 and the right side
At least two in lower mark angle 17.
Preferably, identification piece is integrally formed with component module 12.For example, identification piece includes mark angle.It is straight to identify angle
Angle.Two right-angle side is parallel with the direction of setting respectively, in order to position.For example, two right-angle sides edge with whole plate respectively
It is parallel.Lead to overetched method, mark angle is integrally etched with component module 12.This mode simplifies manufacturing procedure,
And make the globality of printed substrate more preferable.
It is of course also possible to be to make mark angle using copper cash, then mark angle is placed into the outside of component module 12.
In one example, as shown in Fig. 2 mark angle includes upper left mark angle 14, lower-left mark angle 16, upper right mark angle
15 and lower right indicia angle 17.Four mark angles are independently arranged, and the extended line at four mark angles forms approximate rectangular shape.Use
Person is by observing mark angle come setting element module 12, in order to be matched with equipment to be installed.
Preferably, one in multiple mark angles is angle of chamfer.Angle of chamfer does chamfering process in corner, to become apparent from
Orientation is identified.For example, the lower left corner is arranged to angle of chamfer, remaining three angle is right angle.In this way, make
User positions the lower left corner, so as to the phase with equipment to be installed when installing printed substrate by observing the position of angle of chamfer
Position is answered to be matched.
Certainly, angle of chamfer can be arranged in any one in four angles.
In one example, as shown in figure 3, mark angle includes upper left mark angle 14, lower-left mark angle 16 and lower right indicia
Angle 17.Three mark angles are independently arranged, with the position of marker elements module 12.The extended line of three forms approximate rectangular shape
Shape.User is by observing mark angle come setting element module 12, in order to be matched with equipment to be installed.
Similarly, the lower left corner is arranged to angle of chamfer.Remaining 2 angle is right angle.In this way, user is pacifying
When filling printed substrate, the lower left corner is positioned by observing the position of angle of chamfer, to enter with the relevant position of equipment to be installed
Row matching.
In one example, as shown in figure 4, mark angle includes lower-left mark angle 16 and upper right mark angle 15.The two prolongs
Long line forms approximate rectangular shape.2 mark angles are independently arranged, with the position of marker elements module 12.User passes through sight
Examine mark angle and carry out setting element module 12, in order to be matched with equipment to be installed.
Similarly, the lower left corner is arranged to angle of chamfer.Upper right mark angle 15 is right angle.In this way, user is pacifying
When filling printed substrate, the lower left corner is positioned by observing the position of angle of chamfer, to enter with the relevant position of equipment to be installed
Row matching.
In one example, as shown in figure 5, mark angle includes upper left mark angle 14, lower-left mark angle 16, upper right mark angle
15 and lower right indicia angle 17.The side at four mark angles links together, to form approximate rectangular frame-shaped construction.User passes through
Setting element module 12 is carried out at observation mark angle, in order to be matched with equipment to be installed.
For example, the lower left corner is arranged to angle of chamfer, remaining three angle is right angle.In this way, user is pacifying
When filling the printed substrate, the lower left corner is positioned by observing the position of angle of chamfer, so as to the relevant position with equipment to be installed
Matched.
In one embodiment of the present utility model, mark angle is dotted line shape.So, printed substrate can pass through dotted line
In discontinuities, to enter walking line.Mark angle will not impact to the cabling of printed substrate, reduce design difficulty.
Fig. 6 shows another embodiment of the present utility model.In this example embodiment, component module 12 has middle part blank
Area, mark angle are arranged on middle part clear area.In this way, mark angle is not take up the space of outside, takes full advantage of
Space inside component module 12.
For example, there is middle part clear area at the middle part surrounded of multiple pads 13.Identifying angle includes upper left mark angle 14, a left side
Lower mark angle 16, upper right mark angle 15 and lower right indicia angle 17, four mark angles are arranged on middle part clear area.Four marks
Angle is independently arranged, with the position of marker elements module 12.User by observing mark angle come setting element module 12, in order to
Matched with equipment to be installed.
Preferably, one in multiple mark angles is angle of chamfer.For example, the lower left corner is arranged to angle of chamfer, remaining three
Individual angle is right angle.In this way, user is positioned when installing printed substrate by observing the position of angle of chamfer
The lower left corner, to be matched with the relevant position of equipment to be installed.
Certainly, mark angle can also select any 2 or 3 in four mark angles, be designed with simplifying.
According to another embodiment of the present utility model, there is provided a kind of electronic equipment.The electronic equipment can be but not
It is confined to mobile phone, computer, display device, wearable device, AR, game machine, intercom, micro-electromechanical device etc..The electronic equipment
Including printed substrate provided by the utility model.
Although some specific embodiments of the present utility model are described in detail by example, this area
It is to be understood by the skilled artisans that above example merely to illustrate, rather than in order to limit the scope of the utility model.This
Field it is to be understood by the skilled artisans that can not depart from the scope of the utility model and spirit in the case of, to above example
Modify.The scope of the utility model is defined by the following claims.
Claims (10)
1. a kind of printed substrate, it is characterised in that including conductor layer and insulating barrier, the insulating barrier is covered in the conductor layer
On, the conductor layer includes component module (12), is additionally provided with the inner side of the insulating barrier (20) for identifying the element
The position of module (12) and/or the identification piece of the identification information of the component module (12).
2. printed substrate according to claim 1, it is characterised in that the insulating barrier is ink layer, the ink layer
Including the vacancy section relative with the identification piece；
Either,
The insulating barrier is cover layer.
3. printed substrate according to claim 1, it is characterised in that the identification piece includes mark angle.
4. printed substrate according to claim 3, it is characterised in that it is described mark angle include upper left mark angle (14),
At least two in lower-left mark angle (16), upper right mark angle (15) and lower right indicia angle (17).
5. printed substrate according to claim 4, it is characterised in that the mark angle is located at the component module (12)
Outside.
6. printed substrate according to claim 4, it is characterised in that the component module (12) has middle part blank
Area, the mark angle are arranged on the middle part clear area.
7. printed substrate according to claim 3, it is characterised in that the mark angle is multiple, multiple marks
One in angle is angle of chamfer.
8. printed substrate according to claim 3, it is characterised in that the mark angle is dotted line shape.
9. the printed substrate described in any one in claim 1-8, it is characterised in that the identification piece with it is described
Component module (12) is integrally formed.
10. a kind of electronic equipment, it is characterised in that including the printed substrate as described in any one in claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720273992.4U CN206640862U (en) | 2017-03-20 | 2017-03-20 | Printed substrate and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720273992.4U CN206640862U (en) | 2017-03-20 | 2017-03-20 | Printed substrate and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206640862U true CN206640862U (en) | 2017-11-14 |
Family
ID=60249451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720273992.4U Active CN206640862U (en) | 2017-03-20 | 2017-03-20 | Printed substrate and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206640862U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111642075A (en) * | 2020-07-03 | 2020-09-08 | 广东兴达鸿业电子有限公司 | Manufacturing method of single-sided resistor circuit board and manufacturing method of multilayer PCB |
-
2017
- 2017-03-20 CN CN201720273992.4U patent/CN206640862U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111642075A (en) * | 2020-07-03 | 2020-09-08 | 广东兴达鸿业电子有限公司 | Manufacturing method of single-sided resistor circuit board and manufacturing method of multilayer PCB |
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201021 Address after: 261031 north of Yuqing street, east of Dongming Road, high tech Zone, Weifang City, Shandong Province (Room 502, Geer electronic office building) Patentee after: GoerTek Optical Technology Co.,Ltd. Address before: 266104 Laoshan Qingdao District North House Street investment service center room, Room 308, Shandong Patentee before: GOERTEK TECHNOLOGY Co.,Ltd. |