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CN206313866U - Array camera module and its molding photosensory assembly and the electronic equipment with array camera module - Google Patents

Array camera module and its molding photosensory assembly and the electronic equipment with array camera module Download PDF

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Publication number
CN206313866U
CN206313866U CN201620875781.3U CN201620875781U CN206313866U CN 206313866 U CN206313866 U CN 206313866U CN 201620875781 U CN201620875781 U CN 201620875781U CN 206313866 U CN206313866 U CN 206313866U
Authority
CN
China
Prior art keywords
wiring board
main body
photo
lead
supporting main
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201620875781.3U
Other languages
Chinese (zh)
Inventor
王明珠
郭楠
陈振宇
田中武彦
赵波杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
Original Assignee
Ningbo Sunny Opotech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN201620875781.3U priority Critical patent/CN206313866U/en
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority to KR1020187031125A priority patent/KR102152516B1/en
Priority to JP2018550699A priority patent/JP7025345B2/en
Priority to PCT/CN2016/103247 priority patent/WO2017166798A1/en
Priority to EP23176877.1A priority patent/EP4231653A3/en
Priority to US16/088,435 priority patent/US11289521B2/en
Priority to EP16896568.9A priority patent/EP3468165B1/en
Priority to KR1020207036129A priority patent/KR102335306B1/en
Priority to EP16894174.8A priority patent/EP3429181B1/en
Priority to PCT/CN2016/103736 priority patent/WO2017157015A1/en
Priority to US15/317,117 priority patent/US10908324B2/en
Priority to JP2018547880A priority patent/JP2019519087A/en
Priority to KR1020187029337A priority patent/KR102193819B1/en
Priority to TW106203473U priority patent/TWM565451U/en
Priority to TW106108124A priority patent/TWI703715B/en
Priority to TW106110048A priority patent/TWI661258B/en
Priority to TW108117228A priority patent/TWI706212B/en
Priority to TW108117229A priority patent/TWI706213B/en
Priority to TW106204228U priority patent/TWM555960U/en
Priority to US15/473,573 priority patent/US9781325B1/en
Priority to US15/473,607 priority patent/US9826132B2/en
Priority to US15/473,609 priority patent/US9906700B2/en
Priority to US15/473,605 priority patent/US10033913B2/en
Priority to JP2018556877A priority patent/JP6865232B2/en
Priority to KR1020187034256A priority patent/KR102147896B1/en
Priority to PCT/CN2017/082000 priority patent/WO2017186120A2/en
Priority to KR1020207019834A priority patent/KR102281383B1/en
Priority to EP17788772.6A priority patent/EP3481046A4/en
Priority to KR1020217022035A priority patent/KR20210091363A/en
Application granted granted Critical
Publication of CN206313866U publication Critical patent/CN206313866U/en
Priority to US15/679,146 priority patent/US10274694B2/en
Priority to US15/705,225 priority patent/US10175447B2/en
Priority to US15/705,232 priority patent/US10126519B2/en
Priority to US15/784,167 priority patent/US10578837B2/en
Priority to US16/737,863 priority patent/US20200218034A1/en
Priority to US17/114,466 priority patent/US11822099B2/en
Priority to JP2021060338A priority patent/JP7344924B2/en
Priority to US17/678,347 priority patent/US11824071B2/en
Priority to US17/740,887 priority patent/US20220268968A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model provides an array camera module and its molding photosensory assembly and the electronic equipment with array camera module, wherein the molding photosensory assembly includes an at least wiring board, at least two photo-sensitive cells, at least two groups leads, at least two supporting members and a molded bases.Each described photo-sensitive cell is mounted on the chip attachment region of each wiring board respectively, the two ends of lead described in every group are connected to the chip terminal pad of each photo-sensitive cell and the wiring board terminal pad of each wiring board respectively, the supporting main body of each supporting member is respectively coated by a part for the fringe region of each wiring board, the module pedestal includes a molded body and with least two optical windows, a part of the wherein described molded body at least with another part of the fringe region of wiring board each described and the supporting main body is integratedly combined, and the photosensitive region of each photo-sensitive cell corresponds respectively to each described optical window.

Description

Array camera module and its molding photosensory assembly and the electricity with array camera module Sub- equipment
Technical field
The utility model is related to optical imaging field, more particularly to an array camera module and its molding photosensory assembly and Electronic equipment with array camera module.
Background technology
In recent years, become increasingly popular to be applied to such as personal electric product, vapour for obtaining the camera module of image Car field, medical field etc., such as camera module have become the portable electric appts such as smart mobile phone, panel computer One of standard fitting.Being applied to the camera module of portable electric appts can not only obtain image, but also can help Portable electric appts realize the functions such as instant video call.With the increasingly lightening development trend of portable electric appts Size requirement to camera module is increasingly stricter, and especially the height dimension requirement to camera module is harsher.In addition, quilt The function and user for configuring the portable electric appts of camera module are also got over for the requirement of the image quality of camera module Come higher, in this case, array camera module starts appearance.Array camera module includes at least two sets imaging systems, often Set imaging system includes a photo-sensitive cell and the optical lens in the photosensitive path for being arranged at photo-sensitive cell respectively, with tool The single-lens camera module for having identical image quality is compared, and array camera module can have smaller height dimension, therefore, Configuration array camera module is electronic equipment in development trend important from now on lightening portable electric appts.
Similar with single-lens camera module, the raising of the imaging capability of array camera module is equally built upon being taken the photograph for array As basis of the module configuration with the passive electronic component such as the more photo-sensitive cell of big imaging area and more driving resistance, electric capacity On, just because of array camera module needs to be configured with the more photo-sensitive cell of big imaging area and greater number of passive electronics Component, it is desirable to which array camera module is merely able to by way of improving packaging technology further reduce array shooting mould The size of group.The encapsulation of present array camera module generally uses COB (Chip On Board) packaging technology, that is to say, that battle array The wiring board of row camera module, photo-sensitive cell, microscope base, optical lens, driver or microscope base etc. are respectively prepared, and then successively will Optical lens in the circuit board, is assembled in driver or microscope base by passive electronic component, photo-sensitive cell and microscope base encapsulation, and And driver or mirror seat set are loaded on microscope base, so that optical lens is maintained on the photosensitive path of photo-sensitive cell, so that Form array camera module.In order to ensure the image quality of array camera module, it is necessary to fill glue between each two part, For example need the filling glue between microscope base and wiring board to be encapsulated in the circuit board with by microscope base, and microscope base is realized by glue With the leveling of wiring board.This also causes the size of the array camera module encapsulated by COB packaging technologies effectively to be subtracted It is few, and using COB packaging technologies array camera module packaging efficiency than relatively low.
In order to solve this problem, moulding technology is introduced into the manufacture field of camera module, and moulding technology allows array to take the photograph Make microscope base integrally formed in the circuit board during being produced as module, by such mode, can not only be effective Ground reduces the size of array camera module, but also can reduce the assembly error of array camera module, so as to improve the battle array The image quality of row camera module.Even so, the manufacture field that moulding technology is introduced directly into camera module is remained Many defects.
First, each photo-sensitive cell of array camera module is mounted on wiring board and electrically connects photo-sensitive cell by lead And wiring board, in the case of, lead two ends can be respectively welded in the non-photo-sensing region and the marginal zone of wiring board of photo-sensitive cell Domain, and be limited to routing technique and lead attribute in itself, the two ends of lead after photo-sensitive cell and wiring board is welded in, It is upwardly being higher by the upper surface of photo-sensitive cell.When molding process is carried out to array camera module by moulding technology, The stitching surface of the mold of mould can contact with the ledge of lead and cause lead to be pressurized and the situation of deformation occur, And occur deformation when moulding technology is carried out once lead, after the mold of removal mould, lead also is difficult to recover To original state.Secondly, it is added into the molding space of mould and in shaping when used for the moulding material for forming microscope base When solidifying to form microscope base in space, the lead of deformation is covered by the inside of microscope base and keeps state after deformation, and deforms Lead the ability of electric signal is transmitted between photo-sensitive cell and wiring board can significantly reduce so as to camera module Imaging capability and imaging efficiency cause to compare large effect.What is more important, when lead is subject to squeezing for the stitching surface of mold When pressing and being deformed, the deformation direction and deformation extent of lead are uncontrollable, therefore, adjacent lead after deformation may Occur and contact with each other and cause short circuit, and then cause the product fraction defective of camera module to increase.In addition, being pasted in photo-sensitive cell After loaded on wiring board, gap, in moulding process, the moulding material of flow-like can be produced between photo-sensitive cell and wiring board The gap being formed between photo-sensitive cell and wiring board can be entered, so that causing the attaching relation quilt of photo-sensitive cell and wiring board Change, and necessarily cause the inclination of photo-sensitive cell if the attaching relation of photo-sensitive cell and wiring board is changed, so that shadow Ring the image quality of array camera module.
Utility model content
A purpose of the present utility model is to provide an array camera module and its molding photosensory assembly and with battle array The electronic equipment of row camera module, wherein the molding photosensory assembly provides a supporting member, with when moulding technology is carried out, institute State stitching surface of the supporting member for preventing the mould and apply pressure to the lead of the molding photosensory assembly, it is described to prevent Lead deformation.
A purpose of the present utility model is to provide an array camera module and its molding photosensory assembly and with battle array The electronic equipment of row camera module, wherein when moulding technology is carried out, the mold of the mould and lower mould matched moulds and The stitching surface of the mold is set to be contacted with the top surface of the supporting member, now, support is described upwards for the supporting member Mold, the lead is directly applied pressure to the stitching surface for avoiding the mold, is deformed so as to prevent the lead to be pressurized.
A purpose of the present utility model is to provide an array camera module and its molding photosensory assembly and with battle array The electronic equipment of row camera module, wherein when moulding technology is carried out, the mold of the mould and lower mould matched moulds and The stitching surface of the mold is set to be contacted with the top surface of the supporting member, now, support is described upwards for the supporting member Mold, to reserve safe distance between the stitching surface of the lead and the mold, so as to avoid the mold Lead described in stitching surface directly contact.
A purpose of the present utility model is to provide an array camera module and its molding photosensory assembly and with battle array The electronic equipment of row camera module, wherein the supporting member is formed by having resilient material, so that the supporting member energy The stitching surface for enough absorbing the mold contacts the impulsive force produced during the top surface of the supporting member, so as to avoid it is described into Photo-sensitive cell, wiring board, the electricity of the molding photosensory assembly are damaged when the mold and the lower mould matched moulds of pattern tool Sub- component and the lead.
A purpose of the present utility model is to provide an array camera module and its molding photosensory assembly and with battle array The electronic equipment of row camera module, wherein the supporting member is formed by having resilient material, with the pressure of the mold Conjunction face apply pressure to the supporting member top surface when, the top surface of the supporting member can be kept away by way of producing deformation Exempt to produce gap between the top surface of the supporting member and the stitching surface of the mold, so as in photosensitive group of the molding When one molded base of part is molded, it is to avoid the phenomenon of " overlap " occur in a smooth window position of the molded base, and then favorably In the image quality for ensureing yield and the guarantee array camera module of the array camera module when packed.
A purpose of the present utility model is to provide an array camera module and its molding photosensory assembly and with battle array The electronic equipment of row camera module, wherein the supporting member is formed by having resilient material, with the pressure of the mold Conjunction face apply pressure to the supporting member top surface when, the top surface of the supporting member can be kept away by way of producing deformation Exempt to produce gap between the top surface of the supporting member and the stitching surface of the mold, so that the sense of the photo-sensitive cell Light region is in a sealed environment, so as to avoid for the moulding material for forming the molded base into the sealed environment Pollute the photosensitive region of the photo-sensitive cell.
A purpose of the present utility model is to provide an array camera module and its molding photosensory assembly and with battle array The electronic equipment of row camera module, wherein the supporting member coats at least of the non-photo-sensing region of the photo-sensitive cell Point, with when moulding technology is carried out, the supporting member can prevent the moulding material from passing through the supporting member and described The contact position in the non-photo-sensing region of photo-sensitive cell pollutes the photosensitive region of the photo-sensitive cell into the sealed environment.
A purpose of the present utility model is to provide an array camera module and its molding photosensory assembly and with battle array The electronic equipment of row camera module, wherein the supporting member coats the chip contacts and the lead of the photo-sensitive cell The link position of the wiring board connector and the lead of link position and the wiring board, so that when moulding technology is carried out, The supporting member isolates each link position and the moulding material, so that each link position is more reliable.
A purpose of the present utility model is to provide an array camera module and its molding photosensory assembly and with battle array The electronic equipment of row camera module, wherein the supporting member coats a part for the fringe region of the wiring board, so that When carrying out moulding technology, the supporting member can stop that the moulding material of flow-like impacts the lead.
A purpose of the present utility model is to provide an array camera module and its molding photosensory assembly and with battle array The electronic equipment of row camera module, wherein the supporting member coats a part for the fringe region of the wiring board, so that institute Photosensitive region of the supporting member away from the photo-sensitive cell is stated, during being molded in the supporting member, for being formed The material of the supporting member will not pollute the photosensitive region of the photo-sensitive cell, dirty bad point occur to avoid the photo-sensitive cell Situation.
A purpose of the present utility model is to provide an array camera module and its molding photosensory assembly and with battle array The electronic equipment of row camera module, wherein the supporting member coats a part and the institute of the fringe region of the wiring board simultaneously At least a portion in the non-photo-sensing region of photo-sensitive cell is stated, with the fixed wiring board and the photo-sensitive cell, so as to described When mold and the lower mould matched moulds and the moulding material be added into be formed in the mold and the lower mould it Between a molding space when, the supporting member can coat the photo-sensitive cell and the wiring board is not shifted.
A purpose of the present utility model is to provide an array camera module and its molding photosensory assembly and with battle array The electronic equipment of row camera module, wherein the supporting member coats a part and the institute of the fringe region of the wiring board simultaneously At least a portion in the non-photo-sensing region of photo-sensitive cell is stated, so that when moulding technology is carried out, the supporting member can prevent institute Moulding material is stated to enter between the photo-sensitive cell and the wiring board.
A purpose of the present utility model is to provide an array camera module and its molding photosensory assembly and with battle array The electronic equipment of row camera module, wherein the supporting member coats at least a portion of the lead, to carry out molding work During skill, the supporting member makes the lead be maintained at optimum state, to ensure that it is good electrical that the lead has.
A purpose of the present utility model is to provide an array camera module and its molding photosensory assembly and with battle array The electronic equipment of row camera module, wherein the supporting member coats at least a portion of the lead, subsequently to use institute When stating array camera module, veiling glare can be avoided from being produced in the inside of the array camera module and influence the array to image The image quality of module.
A purpose of the present utility model is to provide an array camera module and its molding photosensory assembly and with battle array The electronic equipment of row camera module, wherein the supporting member have viscosity, with the molded base shaping before, the branch Holding element can stick to the pollutants such as the welding powder that the attachment electronic component is produced when the wiring board, to prevent these The photosensitive region of photo-sensitive cell described in contaminants and there is dirty bad point.
A purpose of the present utility model is to provide an array camera module and its molding photosensory assembly and with battle array The electronic equipment of row camera module, wherein chip contacts of the top surface of the supporting member higher than the photo-sensitive cell, with When moulding technology is carried out, the chip contacts of the photo-sensitive cell will not be damaged.
A purpose of the present utility model is to provide an array camera module and its molding photosensory assembly and with battle array The electronic equipment of row camera module, wherein the supporting member coats the chip contacts of the photo-sensitive cell, to carry out mould During modeling technique, it is to avoid the moulding material contacts the chip contacts of the photo-sensitive cell, so as to coat the photo-sensitive cell Chip contacts.Similarly, the supporting member can avoid the wiring board that the moulding material contacts the wiring board from connecting Part, so as to protect the wiring board connector of the wiring board.
A purpose of the present utility model is to provide an array camera module and its molding photosensory assembly and with battle array The electronic equipment of row camera module, wherein the supporting member is arranged on the outside of the chip contacts of the photo-sensitive cell, With when moulding technology is carried out, it is to avoid the moulding material contacts the chip contacts of the photo-sensitive cell, so as to coat described The chip contacts of photo-sensitive cell.Similarly, the supporting member can avoid the moulding material from contacting the wiring board Wiring board connector, so as to protect the wiring board connector of the wiring board.
A purpose of the present utility model is to provide an array camera module and its molding photosensory assembly and with battle array The electronic equipment of row camera module, wherein the array camera module provides a support, the support has at least two to install logical Road, each described installation that driver or microscope base for assembling the optical lens are assembled in the support respectively is led to Road, to keep the axiality of each optical lens by the support.
A purpose of the present utility model is to provide an array camera module and its molding photosensory assembly and with battle array The electronic equipment of row camera module, wherein the array camera module provides an at least filter element, the filter element is protected Hold between the photo-sensitive cell and the optical lens, the filter element is used to filter from the optical lens described in The veiling glare of the inside of array camera module, for improving the image quality of the array camera module.
According to one side of the present utility model, the utility model provides one and molds photosensory assembly, and it includes：
An at least wiring board, wherein each described wiring board have an at least chip attachment region respectively；
At least two photo-sensitive cells, wherein each described photo-sensitive cell are mounted on each institute of each wiring board respectively State chip attachment region；
At least two groups leads, wherein the two ends of lead are connected to the chip of each photo-sensitive cell respectively described in every group The wiring board connector of connector and each wiring board；
At least supporting member formed by first medium, wherein each described supporting member include the branch of a frame shape respectively Hold main body and with an at least through hole, each described supporting main body is respectively coated by a part for the fringe region of the wiring board, The photosensitive region of each photo-sensitive cell corresponds respectively to each described through hole；And
The molded base formed by second medium, wherein the molded base includes a molded body and with least two Optical window, wherein another part and the supporting main body of the fringe region of the molded body and each wiring board are at least A part is integratedly combined, and the photosensitive region of each photo-sensitive cell corresponds respectively to each described optical window.
According to one embodiment of the present utility model, the supporting main body has outside a top surface, a medial surface and Side, the top surface respectively inwards and stretches out to be connected to the medial surface and the lateral surface, the medial surface shape Into the through hole, wherein the molded body is integratedly combined with the lateral surface.
According to one embodiment of the present utility model, the supporting main body has outside a top surface, a medial surface and Side, the top surface respectively inwards and stretches out to be connected to the medial surface and the lateral surface, the medial surface shape Into the through hole, wherein the molded body is integratedly combined with least a portion of the lateral surface and the top surface.
According to one embodiment of the present utility model, the supporting main body has elasticity.
According to one embodiment of the present utility model, the fringe region of the wiring board includes a wiring board inside portion, one Wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at the wiring board connecting portion, described Wiring board inside portion and the wiring board outside portion are located at the both sides of the wiring board connecting portion respectively, wherein the supporting main body Coat at least a portion of the wiring board inside portion.
According to one embodiment of the present utility model, the fringe region of the wiring board includes a wiring board inside portion, one Wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at the wiring board connecting portion, described Wiring board inside portion and the wiring board outside portion are located at the both sides of the wiring board connecting portion respectively, wherein the supporting main body Coat at least a portion of the wiring board connecting portion.
According to one embodiment of the present utility model, the fringe region of the wiring board includes a wiring board inside portion, one Wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at the wiring board connecting portion, described Wiring board inside portion and the wiring board outside portion are located at the both sides of the wiring board connecting portion respectively, wherein the supporting main body Coat a part for the wiring board outside portion.
According to one embodiment of the present utility model, the fringe region of the wiring board includes a wiring board inside portion, one Wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at the wiring board connecting portion, described Wiring board inside portion and the wiring board outside portion are located at the both sides of the wiring board connecting portion respectively, wherein the supporting main body At least a portion of the wiring board inside portion and at least a portion of the wiring board connecting portion are coated,
According to one embodiment of the present utility model, the fringe region of the wiring board includes a wiring board inside portion, one Wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at the wiring board connecting portion, described Wiring board inside portion and the wiring board outside portion are located at the both sides of the wiring board connecting portion respectively, wherein the supporting main body Coat at least a portion of the wiring board connecting portion and a part for the wiring board outside portion.
According to one embodiment of the present utility model, the fringe region of the wiring board includes a wiring board inside portion, one Wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at the wiring board connecting portion, described Wiring board inside portion and the wiring board outside portion are located at the both sides of the wiring board connecting portion respectively, wherein the supporting main body Coat the part of at least a portion, the wiring board connecting portion and the wiring board outside portion of the wiring board inside portion.
According to other side of the present utility model, the utility model further provides for an array camera module, and it includes：
At least two optical lens；With
One molding photosensory assembly, wherein the molding photosensory assembly is further included：
An at least wiring board, wherein each described wiring board have an at least chip attachment region respectively；
At least two photo-sensitive cells, wherein each described photo-sensitive cell are mounted on each institute of each wiring board respectively State chip attachment region；
At least two groups leads, wherein the two ends of lead are connected to the chip of each photo-sensitive cell respectively described in every group The wiring board connector of connector and each wiring board；
At least supporting member formed by first medium, wherein each described supporting member include the branch of a frame shape respectively Hold main body and with an at least through hole, each described supporting main body is respectively coated by a part for the fringe region of the wiring board, The photosensitive region of each photo-sensitive cell corresponds respectively to each described through hole；And
The molded base formed by second medium, wherein the molded base includes a molded body and with least two Optical window, wherein another part and the supporting main body of the fringe region of the molded body and each wiring board are at least A part is integratedly combined, and the photosensitive region of each photo-sensitive cell corresponds respectively to each described optical window, wherein often The individual optical lens is arranged at the photosensitive path of each photo-sensitive cell respectively, so that the optical window is the optical frames Head and the photo-sensitive cell provide a passage of light.
According to one embodiment of the present utility model, the supporting main body has outside a top surface, a medial surface and Side, the top surface respectively inwards and stretches out to be connected to the medial surface and the lateral surface, the medial surface shape Into the through hole, wherein the molded body is integratedly combined with the lateral surface.
According to one embodiment of the present utility model, the supporting main body has outside a top surface, a medial surface and Side, the top surface respectively inwards and stretches out to be connected to the medial surface and the lateral surface, the medial surface shape Into the through hole, wherein the molded body is integratedly combined with least a portion of the lateral surface and the top surface.
According to one embodiment of the present utility model, the fringe region of the wiring board includes a wiring board inside portion, one Wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at the wiring board connecting portion, described Wiring board inside portion and the wiring board outside portion are located at the both sides of the wiring board connecting portion respectively, wherein the supporting main body Coat at least a portion of the wiring board inside portion.
According to one embodiment of the present utility model, the fringe region of the wiring board includes a wiring board inside portion, one Wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at the wiring board connecting portion, described Wiring board inside portion and the wiring board outside portion are located at the both sides of the wiring board connecting portion respectively, wherein the supporting main body Coat at least a portion of the wiring board connecting portion.
According to one embodiment of the present utility model, the fringe region of the wiring board includes a wiring board inside portion, one Wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at the wiring board connecting portion, described Wiring board inside portion and the wiring board outside portion are located at the both sides of the wiring board connecting portion respectively, wherein the supporting main body Coat a part for the wiring board outside portion.
According to one embodiment of the present utility model, the fringe region of the wiring board includes a wiring board inside portion, one Wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at the wiring board connecting portion, described Wiring board inside portion and the wiring board outside portion are located at the both sides of the wiring board connecting portion respectively, wherein the supporting main body At least a portion of the wiring board inside portion and at least a portion of the wiring board connecting portion are coated,
According to one embodiment of the present utility model, the fringe region of the wiring board includes a wiring board inside portion, one Wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at the wiring board connecting portion, described Wiring board inside portion and the wiring board outside portion are located at the both sides of the wiring board connecting portion respectively, wherein the supporting main body Coat at least a portion of the wiring board connecting portion and a part for the wiring board outside portion.
According to one embodiment of the present utility model, the fringe region of the wiring board includes a wiring board inside portion, one Wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at the wiring board connecting portion, described Wiring board inside portion and the wiring board outside portion are located at the both sides of the wiring board connecting portion respectively, wherein the supporting main body Coat the part of at least a portion, the wiring board connecting portion and the wiring board outside portion of the wiring board inside portion.
According to one embodiment of the present utility model, the array camera module further includes at least two drivers, its In each described optical lens be assembled in each described driver respectively, each described driver is assembled in the mould respectively Mould the top surface of main body.
According to one embodiment of the present utility model, the array camera module further includes at least two lens barrels, wherein Each described optical lens is assembled in each described lens barrel respectively, and each described lens barrel integratedly extends the molding respectively The top surface of main body；Or at least two lens barrels are further included, lens barrel described in wherein at least one is integrally formed in the mould The top surface of main body is moulded, the other lens barrel is mounted on the top surface of the molded body, each described optical lens point Each described lens barrel is not assembled in；Or the array camera module includes being mounted on the two of the top surface of the molded body Individual lens barrel, each described optical lens is assembled in each described lens barrel respectively.
According to one embodiment of the present utility model, the array camera module further includes an at least filter element, Wherein each described filter element is assembled in the top surface of the molded body respectively, so that the filter element is maintained at Between the optical lens and the photo-sensitive cell.
According to one embodiment of the present utility model, the top surface of the molded body includes at least two inner surfaces and Outer surface, each described filter element is assembled in each described inner surface of the molded body respectively, described in each Driver is assembled in the diverse location of the outer surface of the molded body respectively.
According to one embodiment of the present utility model, the plane where each described inner surface is less than the outer surface The plane at place, to form at least two grooves of the molded base, each described filter element is housed inside each institute respectively State groove.
According to one embodiment of the present utility model, the array camera module further includes an at least supporter and extremely A few filter element, wherein each described filter element is assembled in each described supporter, each described supporter respectively by Be assembled in the top surface of the molded body so that each described filter element be maintained at each described optical lens and each Between the photo-sensitive cell.
According to one embodiment of the present utility model, the array camera module further includes a support, wherein described Support has at least two installing spaces, and each described driver is housed inside each described installing space of the support respectively.
According to one embodiment of the present utility model, the array camera module further includes a support, wherein described Support has at least two installing spaces, and each described lens barrel is housed inside each described installing space of the support respectively.
According to other side of the present utility model, the utility model provides an electronic equipment, and it includes：
One electronic equipment body；With
Array camera module described in one, wherein the array camera module is arranged at the electronic equipment body, with In image is obtained, wherein the array camera module is further included：
At least two optical lens；With
One molding photosensory assembly, wherein the molding photosensory assembly is further included：
An at least wiring board, wherein each described wiring board have an at least chip attachment region respectively；
At least two photo-sensitive cells, wherein each described photo-sensitive cell are mounted on each institute of each wiring board respectively State chip attachment region；
At least two groups leads, wherein the two ends of lead are connected to the chip of each photo-sensitive cell respectively described in every group The wiring board connector of connector and each wiring board；
At least supporting member formed by first medium, wherein each described supporting member include the branch of a frame shape respectively Hold main body and with an at least through hole, each described supporting main body is respectively coated by a part for the fringe region of the wiring board, The photosensitive region of each photo-sensitive cell corresponds respectively to each described through hole；And
The molded base formed by second medium, wherein the molded base includes a molded body and with least two Optical window, wherein another part and the supporting main body of the fringe region of the molded body and each wiring board are at least A part is integratedly combined, and the photosensitive region of each photo-sensitive cell corresponds respectively to each described optical window, wherein often The individual optical lens is arranged at the photosensitive path of each photo-sensitive cell respectively, so that the optical window is the optical frames Head and the photo-sensitive cell provide a passage of light.
According to other side of the present utility model, the utility model provides one and molds photosensory assembly, and it includes：
An at least wiring board, wherein each described wiring board have an at least chip attachment region respectively；
At least two photo-sensitive cells, wherein each described photo-sensitive cell are mounted on each institute of each wiring board respectively State chip attachment region；
At least two groups leads, wherein the two ends of lead are connected to the chip of each photo-sensitive cell respectively described in every group The wiring board connector of connector and each wiring board；
At least supporting member formed by first medium, wherein each described supporting member include the branch of a frame shape respectively Hold main body and with an at least through hole, each supporting main body coats at least a portion of each lead, and each The height of the supporting main body is greater than each lead height upwardly, the sense of each photo-sensitive cell Light region corresponds respectively to each described through hole；And
The molded base formed by second medium, wherein the molded base includes a molded body and with least two Optical window, wherein the molded body at least with the fringe region of wiring board each described and the part one of the supporting main body Ground is combined, and the photosensitive region of each photo-sensitive cell corresponds respectively to each described optical window.
According to one embodiment of the present utility model, there is each described lead a chip connection end and a wiring board to connect End, and each described lead extends deviously in the chip connection end and the wiring board connection end respectively, described in each The chip connection end of lead is connected to each described chip contacts of the photo-sensitive cell, the institute of each lead Stating wiring board connection end can respectively be connected to each described wiring board connector of the wiring board, wherein the supporting main body Coat the chip connection end of each lead.
According to one embodiment of the present utility model, there is each described lead a chip connection end and a wiring board to connect End, and each described lead extends deviously in the chip connection end and the wiring board connection end respectively, described in each The chip connection end of lead is connected to each described chip contacts of the photo-sensitive cell, the institute of each lead Stating wiring board connection end can respectively be connected to each described wiring board connector of the wiring board, wherein the supporting main body Coat the wiring board connection end of each lead.
According to one embodiment of the present utility model, there is each described lead a chip connection end and a wiring board to connect End, and each described lead extends deviously in the chip connection end and the wiring board connection end respectively, described in each The chip connection end of lead is connected to each described chip contacts of the photo-sensitive cell, the institute of each lead Stating wiring board connection end can respectively be connected to each described wiring board connector of the wiring board, wherein the supporting main body Coat the middle part of each lead.
According to other side of the present utility model, the utility model provides an array camera module, and it includes：
At least two optical lens；With
One molding photosensory assembly, wherein the molding photosensory assembly is further included：
An at least wiring board, wherein each described wiring board have an at least chip attachment region respectively；
At least two photo-sensitive cells, wherein each described photo-sensitive cell are mounted on each institute of each wiring board respectively State chip attachment region；
At least two groups leads, wherein the two ends of lead are connected to the chip of each photo-sensitive cell respectively described in every group The wiring board connector of connector and each wiring board；
At least supporting member formed by first medium, wherein each described supporting member include the branch of a frame shape respectively Hold main body and with an at least through hole, each supporting main body coats at least a portion of each lead, and each The height of the supporting main body is greater than each lead height upwardly, the sense of each photo-sensitive cell Light region corresponds respectively to each described through hole；And
The molded base formed by second medium, wherein the molded base includes a molded body and with least two Optical window, wherein the molded body at least with the fringe region of wiring board each described and the part one of the supporting main body Ground is combined, and the photosensitive region of each photo-sensitive cell corresponds respectively to each described optical window, wherein each described optics Camera lens is arranged at the photosensitive path of each photo-sensitive cell respectively, so that the optical window is the optical lens and the sense Optical element provides a passage of light.
Brief description of the drawings
Fig. 1 is that the solid of one of the manufacturing step of an array camera module according to a preferred embodiment of the present utility model is cutd open Depending on schematic diagram, wherein the photo-sensitive cell of the array camera module is mounted on the chip attachment region of wiring board, and the sense The wiring board connector of the chip contacts of optical element and the wiring board is connected by one group of lead, wherein the wiring board is Integral type wiring board.
Fig. 2 is the vertical of two of the manufacturing step according to the array camera module of above-mentioned preferred embodiment of the present utility model Body schematic cross-sectional view, wherein a supporting main body of the array camera module is set the non-photo-sensing area for coating the photo-sensitive cell At least a portion in domain, to form a molding photosensory assembly semi-finished product.
Fig. 3 is the vertical of three of the manufacturing step according to the array camera module of above-mentioned preferred embodiment of the present utility model Body schematic cross-sectional view, wherein the molding photosensory assembly semi-finished product are placed on a mold and once mould of a molding tool Between, and the stitching surface of the mold with it is described supporting main body top surface contact.
Fig. 4 is the vertical of four of the manufacturing step according to the array camera module of above-mentioned preferred embodiment of the present utility model Body schematic cross-sectional view, wherein moulding material are added into the molding space being formed between the mold and the lower mould.
Fig. 5 is the vertical of five of the manufacturing step according to the array camera module of above-mentioned preferred embodiment of the present utility model Body schematic cross-sectional view, wherein forming a molding photosensory assembly of the array camera module after the mold material cures.
Fig. 6 is the vertical of six of the manufacturing step according to the array camera module of above-mentioned preferred embodiment of the present utility model Body schematic cross-sectional view a, wherein filter element of the array camera module is assembled in the top surface of the molded base.
Fig. 7 is the vertical of seven of the manufacturing step according to the array camera module of above-mentioned preferred embodiment of the present utility model Body schematic cross-sectional view, wherein an optical lens of the array camera module is assembled in a driver, the driver is by group Top surface loaded on the module pedestal.
Fig. 8 is the vertical of eight of the manufacturing step according to the array camera module of above-mentioned preferred embodiment of the present utility model Body schematic cross-sectional view, wherein each described driver are installed in each installation of a support of the array camera module respectively Space, to form the array camera module.
Fig. 9 is the schematic perspective view according to the array camera module of above-mentioned preferred embodiment of the present utility model.
Figure 10 is first deformation implementation according to the array camera module of above-mentioned preferred embodiment of the present utility model The schematic perspective view of mode.
Figure 11 is second deformation implementation according to the array camera module of above-mentioned preferred embodiment of the present utility model The perspective cross-sectional schematic diagram of mode.
Figure 12 is according to the 3rd deformation implementation of the array camera module of above-mentioned preferred embodiment of the present utility model The perspective cross-sectional schematic diagram of mode.
Figure 13 A are according to the 4th deformation implementation of the array camera module of above-mentioned preferred embodiment of the present utility model The perspective cross-sectional schematic diagram of mode.
Figure 13 B are according to the 5th deformation implementation of the array camera module of above-mentioned preferred embodiment of the present utility model The perspective cross-sectional schematic diagram of mode.
Figure 14 A are photosensitive group of the moldings according to the array camera module of above-mentioned preferred embodiment of the present utility model First schematic perspective view of variant embodiment of part semi-finished product, wherein the supporting main body coats the edge of the wiring board The chip outside portion in the non-photo-sensing region of at least a portion in region and the photo-sensitive cell, chip connecting portion and chip inner side At least a portion in portion.
Figure 14 B are photosensitive group of the moldings according to the array camera module of above-mentioned preferred embodiment of the present utility model Second schematic perspective view of variant embodiment of part semi-finished product, wherein the supporting main body coats the edge of the wiring board The chip outside portion in the non-photo-sensing region of at least a portion in region and the photo-sensitive cell and at least the one of chip connecting portion Part.
Figure 14 C are photosensitive group of the moldings according to the array camera module of above-mentioned preferred embodiment of the present utility model 3rd schematic perspective view of variant embodiment of part semi-finished product, wherein the supporting main body coats the edge of the wiring board At least a portion of the chip outside portion in the non-photo-sensing region of at least a portion in region and the photo-sensitive cell.
Figure 14 D are photosensitive group of the moldings according to the array camera module of above-mentioned preferred embodiment of the present utility model 4th schematic perspective view of variant embodiment of part semi-finished product, wherein the supporting main body coats the edge of the wiring board At least a portion in region.
Figure 14 E are photosensitive group of the moldings according to the array camera module of above-mentioned preferred embodiment of the present utility model 5th schematic perspective view of variant embodiment of part semi-finished product, wherein the supporting main body coats the edge of the wiring board At least a portion in region.
Figure 15 is photosensitive group of the molding according to the array camera module of above-mentioned preferred embodiment of the present utility model One sectional view of variant embodiment of part, wherein the lateral surface of the molded base cladding supporting main body.
Figure 16 is the perspective cross-sectional schematic diagram of an array camera module according to another preferred embodiment of the present utility model.
Figure 17 is the perspective cross-sectional schematic diagram of an array camera module according to another preferred embodiment of the present utility model.
Figure 18 is the perspective cross-sectional schematic diagram of an array camera module according to another preferred embodiment of the present utility model.
Figure 19 is showing for the electronic equipment of the array camera module with above-mentioned preferred embodiment of the present utility model It is intended to.
Specific embodiment
Hereinafter describe for disclosing the utility model so that those skilled in the art can realize the utility model.Hereinafter retouch Preferred embodiment in stating is only used as citing, it may occur to persons skilled in the art that other obvious modifications.Retouched following The general principle of the present utility model defined in stating can apply to other embodiments, deformation program, improvement project, etc. Tongfang Case and the other technologies scheme without departing from spirit and scope of the present utility model.
It will be understood by those skilled in the art that in exposure of the present utility model, term " longitudinal direction ", " transverse direction ", " on ", The orientation of the instruction such as D score, "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", " outward " or position are closed System is that, based on orientation shown in the drawings or position relationship, it is for only for ease of description the utility model and simplifies and describes, without Be indicate or imply meaning device or element must have specific orientation, with specific azimuth configuration and operation, therefore on Term is stated it is not intended that to limitation of the present utility model.
It is understood that term " " is interpreted as " at least one " or " one or more ", i.e., in one embodiment, One quantity of element can be one, and in a further embodiment, the quantity of the element can be multiple, and term " " is no It is understood that to be limitation to quantity.
With reference to Fig. 1 to Fig. 9 of Figure of description of the present utility model, according to the array of a preferred embodiment of the present utility model Camera module is elucidated with, wherein the array camera module includes at least two optical lens 10 and a molding photosensory assembly 20, its Described in molding photosensory assembly 20 further include at least two photo-sensitive cells 21, a wiring board 22, a molded base 23 and extremely Few two groups of leads 24.
Each described photo-sensitive cell 21 includes one group of chip contacts 211, a photosensitive region 212 and non-photo-sensing respectively Region 213, wherein the photosensitive region 212 and the non-photo-sensing region 213 are integrally formed, and the photosensitive region 212 Positioned at the middle part of the photo-sensitive cell 21, the non-photo-sensing region 213 is located at the outside of the photo-sensitive cell 21, and described non- Around the photosensitive region 212 1 weeks, the chip contacts 211 were arranged at the non-photo-sensing region to photosensitive region 213 213。
Correspondingly, the wiring board 22 includes at least two groups wiring board connectors 221, at least two smooth chip attachment areas The fringe region 223 of domain 222 and, wherein the fringe region 223 and each described chip attachment region 222 integratedly into Type, and the fringe region 223 is around each described chip attachment region 222, the quilt of wiring board connector 221 It is arranged at the fringe region 223.
Each described lead 24 has a chip connection end 241 and a wiring board connection end 242 respectively, wherein the lead 24 extend deviously between the chip connection end 241 and the wiring board connection end 242.
Each described photo-sensitive cell 21 is mounted on each described chip attachment region 222 of the wiring board 22 respectively, The chip connection end 241 of wherein described lead 24 is connected to the chip contacts 211 of the photo-sensitive cell 21, institute The wiring board connection end 242 for stating lead 24 is connected to the wiring board connector 221 of the wiring board 22, the mould Modeling pedestal 23 is at least integratedly combined with the fringe region 223 of the wiring board 22, to form the molding photosensory assembly 20, wherein each described optical lens 10 is arranged at each photo-sensitive cell 21 of the molding photosensory assembly 20 respectively Photosensitive path.The light being reflected by the object from optical lens each described 10 enter the array camera module inside, with Photoelectric conversion is subsequently received and carries out by the photosensitive region 222 of photo-sensitive cell each described 21, so as to obtain and object phase The image of association.
In an example of the array camera module of the present utility model, the chip of the photo-sensitive cell 21 connects The wiring board connector 221 of fitting 211 and the wiring board 22 can be respectively terminal pad, i.e. the photo-sensitive cell 21 The chip contacts 211 and the wiring board connector 221 of the wiring board 22 can be described for making with disc-shaped The chip connection end 241 of lead 24 is connected to the chip contacts 211 of the photo-sensitive cell 21 and makes described drawing The wiring board connector 221 that the wiring board connection end 242 of line 24 is connected to the wiring board 22 is new in this practicality In another example of the array camera module of type, the chip contacts 211 and the line of the photo-sensitive cell 21 The wiring board connector 221 of road plate 22 can respectively in spherical, for example by tin cream or other welding material points described The non-photo-sensing region 213 of photo-sensitive cell 21 and the fringe region 223 of the wiring board 22, to form the sense respectively The chip contacts 211 of optical element 21 and the wiring board connector 221 of the wiring board 22.Even so, ability The technical staff in domain is it should be understood that the chip contacts 211 and the wiring board 22 of the photo-sensitive cell 21 The wiring board connector 221 do not constitute limitation to content of the present utility model and scope, i.e. in other examples In, the chip contacts 211 of the photo-sensitive cell 21 and the wiring board connector 221 of the wiring board 22 can also With other above-mentioned shapes not enumerated.
Further there is a chip inside portion 2131, a chip to connect in the non-photo-sensing region 213 of the photo-sensitive cell 21 The chip outside portion 2133 of socket part 2132 and, wherein the chip contacts 211 are arranged at the chip connecting portion 2132, Around the photosensitive region 212 1 weeks, the both sides of the chip connecting portion 2132 each extended over simultaneously for the chip inside portion 2131 It is connected to the chip inside portion 2131 and the chip outside portion 2132.That is, in the utility model, will be described non- Photosensitive region 213 from the position to the region of the marginal position of the photosensitive region 212 that the chip contacts 211 are set The chip inside portion 2131 is defined as, the region that the chip contacts 211 are set in the non-photo-sensing region 213 is determined Justice is the chip connecting portion 2132, by the non-photo-sensing region 213 from be set the position of the chip contacts 211 to The region of the outer edge of the photo-sensitive cell 21 is defined as the chip outside portion 2133.In other words, from the photo-sensitive cell 21 Depression angle from the point of view of, the photo-sensitive cell 21 is successively from inside to outside the photosensitive region 212, the chip inside portion 2131st, the chip connecting portion 2132 and the chip outside portion 2133.
Similarly, the fringe region 223 of the wiring board 22 further has a wiring board inside portion 2231, a line Road plate connecting portion 2232 and a wiring board outside portion 2233, wherein the wiring board connector 221 is arranged at the circuit Plate connecting portion 2232, the wiring board inside portion 2231 is around the chip attachment region 222 1 weeks, the wiring board connecting portion 2232 both sides each extend over and are connected to the wiring board inside portion 2231 and the wiring board outside portion 2233.Namely Say, in the utility model, by the fringe region 223 from the position of the wiring board connector 221 is set to described The marginal position in chip attachment region 222 is defined as the wiring board inside portion 2231, by being set for the fringe region 223 The region of the wiring board connector 221 is defined as the wiring board connecting portion 2232, by the fringe region 223 from being set The region for putting outer edge of the position of the wiring board connector 221 to the wiring board 22 is defined as the wiring board outside portion 2233.It is noted that in this embodiment of the array camera module of the present utility model, the wiring board 22 is Integral type wiring board, it is preferable that each described chip attachment region 222 is arranged at the two of the wiring board 22 with being respectively symmetrically End, so that the wiring board 22 forms symmetrical structure.
In addition, the type of the lead 24 is unrestricted in the array camera module of the present utility model, for example, exist In one specific example, the lead 24 may be implemented as gold thread, i.e. can be by the photosensitive unit by way of beating gold thread Part 21 and the wiring board 22 link together, so as to believe the light in the photosensitive region 212 of the photo-sensitive cell 21 After number conversion after electric signal, the electric signal can be further transmitted to the wiring board 22 by the lead 24.Ability The technical staff in domain it is understood that in other examples of the array camera module of the present utility model, the lead 24 can also be implemented as that silver wire, copper cash etc. are any can to realize the electric signal in the photo-sensitive cell 21 and the wiring board The material transmitted between 22 is made.
The array camera module can be one and focus camera module, or a zoom camera module, for example The array camera module can possess the ability of optical zoom on the premise of by control height dimension, to improve the array The image quality of camera module.Specifically, in this example of the array camera module shown in Figure 7, the battle array Row camera module further includes at least two drivers 30, and wherein each described optical lens 10 is assembled in each institute respectively Driver 30 is stated, each driver 30 is assembled in the top surface of the molded base 23 respectively, so that each described light Camera lens 10 is learned to be respectively held on the photosensitive path of each photo-sensitive cell 21 of the molding photosensory assembly 20.Each institute State driver 30 and be electrically connected to the wiring board 22 respectively, transmit to every electric energy and control signal with the wiring board 22 After the individual driver 30, each described driver 30 can distinguish each described optical lens 10 of ancestral east along sense each described The photosensitive path of optical element 21 moves back and forth, so as to adjust the focal length of the array camera module.That is, the optical frames First 10 can be drivingly disposed in the driver 30.
It is noted that the type of the driver 30 is unrestricted in the array camera module of the present utility model System, such as in a specific example, the driver 30 may be implemented as that voice coil motor etc. is any can to drive institute The driver that optical lens 10 produces displacement along the photosensitive path of the photo-sensitive cell 21 is stated, wherein the driver 30 can Electric energy and control signal are received with running order.
With further reference to accompanying drawing 7, the array camera module further includes an at least filter element 40.For example in this reality With in a new illustrative example, the array camera module can include a filter element 40, wherein institute The top surface that filter element 40 is assembled in the molded base 23 is stated, so that the diverse location of the filter element 40 is right respectively Should be in the photosensitive path of each photo-sensitive cell 21.In another illustrative example, the array camera module can be with Including filter element 40 described at least two, wherein each described filter element 40 is assembled in the module pedestal 23 respectively Top surface, so that each described filter element 40 corresponds respectively to the photosensitive path of each photo-sensitive cell 21, i.e. the battle array Each described photo-sensitive cell 21 of row camera module, each described filter element 40 and each described optical lens 10 are respectively one One-to-one correspondence.
When the array camera module is used, the light being reflected by the object enters the battle array from the optical lens 10 The inside of row camera module, and by the filter element 40 filter after can receive and carry out light by the photo-sensitive cell 21 Electricity conversion.That is, the filter element 40 can be filtered from the optical lens 10 enters the array camera module Veiling glare in the internal light being reflected by the object, such as described infrared part, by such mode, can improve described The image quality of array camera module.
In addition, the filter element 40 can be by direct-assembling in the top surface of the molded base 23, it is also possible to pass through The filter element 40 is first assembled in a small microscope base, then again by top of the small mirror seat set loaded on the molded base 23 Surface, by such mode, can reduce the size of the filter element 40, to reduce the manufacture of the array camera module Cost.
It will be appreciated by those skilled in the art that, in the different examples of the array camera module, the optical filtering Element 40 can be implemented as different types, such as described filter element 40 can be implemented as cutoff filter, complete The combination of saturating spectral filter and other optical filters or multiple optical filters, such as described filter element 40 can be carried out Be the combination of cutoff filter and full impregnated spectral filter, i.e., described cutoff filter and the full impregnated spectral filtering Piece can be switched to be optionally situated on the photosensitive path of the photo-sensitive cell 21, such as more sufficient in light such as daytimes In the environment of using the array camera module when, the cutoff filter can be switched to the photo-sensitive cell 21 Photosensitive path, filters into the light being reflected by the object of the array camera module with by the cutoff filter Infrared ray, when in the environment of the darks such as night use the array camera module when, the full impregnated spectrum can be filtered Mating plate switches to the photosensitive path of the photo-sensitive cell 21, to allow access into the light being reflected by the object of the array camera module Infrared part in line is passed through.
Refer to the attached drawing 8 and Fig. 9, the array camera module further include a support 50, wherein the support 50 has At least two installing spaces 51, and each described installing space 51 is respectively communicated with two sidepieces in the support 50, i.e. each The installing space 51 can respectively form a passage.Each described driver 30 is installed in the every of the support 50 respectively The individual installing space 51, makes each described driver 30 be maintained at the state of stabilization, so as to protect with by the support 50 Card is assembled in the axiality of each optical lens 10 of each driver 30 and improves the array camera module Intensity, further to improve the image quality of the array camera module.
Preferably, it is installed in each described installing space 51 of the support 50 respectively in each described driver 30 Afterwards, some fillers are filled between the inwall of support 50 described in the shell in each driver 30, so that each described drive Dynamic device 30 is not in situation about rocking after each described installing space 51 of the support 50 is installed in.It is highly preferred that It can be glue to be filled in the filler between the inwall of the shell of each driver 30 and the support 50.
The molding photosensory assembly 20 further includes an at least supporting member 25, with when moulding technology is carried out, by institute State supporting member 25 and protect the lead 24 and the photo-sensitive cell 21.In this example of the present utility model, the supporting The quantity of element 25 is implemented as minimum two.Preferably, the number of the quantity of the supporting member 25 and the photo-sensitive cell 21 Amount is consistent, and before the shaping of the molded base 23, each described supporting member 25 is set and coats each described photo-sensitive cell The 21 non-photo-sensing region 213, so that after the shaping of the molded base 23, the module pedestal 23 coats the wiring board 22 The fringe region 223, the part in the non-photo-sensing region 213 of the photo-sensitive cell 21 and the supporting member 25 A part, to form the molding photosensory assembly 20.The supporting member 25 can effectively improve the array camera module Product yield, and improve the image quality of the array camera module.In other examples of the present utility model, the supporting The quantity of element 25 can also be implemented as one, and it is further described in rear extended meeting.
Each described supporting main body 251 includes the supporting main body 251 of a frame shape and with a through hole 252, wherein institute respectively At least a portion that supporting main body 251 is set the non-photo-sensing region 213 for coating the photo-sensitive cell 21 is stated, it is described photosensitive The photosensitive region 212 of element 21 corresponds to the through hole 252 of the supporting main body 25.Preferably, the supporting main body It is at least a portion of the chip inside portion 2131 in the non-photo-sensing regions 213 of the 251 cladding photo-sensitive cells 21, described Chip connecting portion 2132 and at least a portion of the chip outside portion 2133.Further, the supporting main body 251 has one Top surface 2501, a medial surface 2502 and a lateral surface 2503, wherein the both sides of the top surface 2501 respectively inwards and to It is outer to extend to be connected to the medial surface 2502 and the lateral surface 2503.In the utility model, by the supporting main body 251 The direction photosensitive region 212 side be defined as it is described supporting main body 251 the medial surface 2502, by it is described supporting lead The side of the fringe region 223 of the direction wiring board 22 of body 251 is defined as the outside of the supporting main body 251 Face 2503.In this embodiment, the molded base 23 coats the lateral surface of the supporting main body 251 after shaping 2503 and at least a portion of the top surface 2501.
In addition, the molding photosensory assembly 20 of the array camera module further includes multiple electronic components 26, Wherein each described electronic component 26 can be mounted on by such as SMT (Surface Mount Technology) technique The fringe region 223 of the wiring board 22.Preferably, each described electronic component 26 is mounted on the fringe region The 223 wiring board outside portion 2233.The photo-sensitive cell 21 and each described electronic component 26 can be mounted on institute State the same side or opposition side of wiring board 22, such as in a specific example, the photo-sensitive cell 21 and each described electricity Sub- component 26 is mounted on the same side of the wiring board 22, and the photo-sensitive cell 21 is mounted on the wiring board 22 The chip attachment region 222, each described electronic component 26 is mounted on the fringe region of the wiring board 22 223.Integrally formed in after the fringe region 223 of the wiring board 22, the molded base in the molded base 23 23 coat each described electronic component 26, with by the molded base 23 isolate the adjacent electronic component 26 and every From the electronic component 26 and the photo-sensitive cell 21, so that, in the array camera module of the present utility model, even if Be the adjacent electronic component 26 it is closer to the distance when, the molded base 23 can also avoid the adjacent electronic component 26 contact with each other or disturb, and the molded base 23 coat the electronic component 26 mode can also avoid produce The photosensitive region 212 of photo-sensitive cell 21 described in the contaminants in the surface of the electronic component 26, and then reduce The volume of the array camera module and the image quality of the raising array camera module.That is, of the present utility model The array camera module makes the line of small area by way of the molded base 23 coats the electronic component 26 Road plate 22 can be by the more electronic components 26 of attachment.It is noted that the type bag of the electronic component 26 Include but be not limited to resistance, electric capacity, driving element etc..
With reference to figures 1 through Fig. 9, although being carried out with the array camera module in the utility model following description As a example by for twin-lens camera module, the feature and advantage of the array camera module of the present utility model, ability are further elucidated The technical staff in domain is it is understood that in a deformation of the of the present utility model described array camera module shown in accompanying drawing 10 In implementation method, the array camera module can also include more optical lens 10.
The molding photosensory assembly 20 of the array camera module is described in accompanying drawing 1 to the example shown in Fig. 5 Manufacturing process, and the battle array with the molding photosensory assembly 20 is further described in accompanying drawing 6 to the example shown in Fig. 8 The manufacturing process of row camera module.
Two photo-sensitive cells 21 are mounted on two of the wiring board 22 by refer to the attached drawing 1 correspondingly respectively The chip attachment region 222, chip contacts 211 and the wiring board wherein described in the one of each photo-sensitive cell 21 group Wiring board connector 222 described in two groups of 22 is connected by lead 24 described in a group respectively.By each electronic component 26 fringe regions 233 for being mounted on the wiring board 22 respectively.Preferably, each described electronic component 26 is pasted respectively The wiring board outside portion 2233 loaded on the fringe region 223.It is highly preferred that each described electronic component 26 is mutual Interval, after the completion of being produced in the array camera module, each described electronic component 26 is not in interfere Situation.
The routing technique and the lead 24 characteristic of itself of the lead 24 are limited to, in the core of the lead 24 Piece connection end 241 and the wiring board connection end 242 are connected to the chip contacts 211 of the photo-sensitive cell 21 respectively After the wiring board connector 221 of the wiring board 22, the lead 24 upwardly, to be higher by the photo-sensitive cell 21 Upper surface.It will be appreciated by those skilled in the art that, during the array camera module is by manufacture and made During, each described lead 24 is maintained at original state and advantageously ensure that the good electrical of the lead 24 and ensure The image quality of the array camera module.
Refer to the attached drawing 2, each described supporting main body 251 is set the non-photo-sensing for coating each photo-sensitive cell 21 The photosensitive region 212 of at least a portion in region 213, wherein each photo-sensitive cell 21 is corresponded respectively to described in each The through hole 252 of supporting member 25, with by supporting member each described 25, each described photo-sensitive cell 21, the circuit Plate 22 and lead 24 described in every group form one and mold photosensory assembly semi-finished product.In the array camera module of the present utility model In this example, it is described supporting main body 251 coat the photo-sensitive cell 21 the chip outside portion 2131 at least a portion, The chip connecting portion 2132 and at least a portion of the chip inside portion 2133.That is, the supporting energy of main body 251 Enough coat the connection of the chip contacts 211 of the chip connection end 241 and the photo-sensitive cell 21 of the lead 24 Position, so that when moulding technology is carried out, the supporting main body 251 can avoid the chip connection end 241 of the lead 24 With the link position and the forming material for forming the molded base 23 of the chip contacts 211 of the photo-sensitive cell 21 Material contact, so as to avoid the chip connection end 241 of the lead 24 from the chip contacts of the photo-sensitive cell 21 211 come off.
It is understood that the supporting main body 251 coats the chip connection end 241 of the lead 24 and the sense The link position of the chip contacts 211 of optical element 21, so that the supporting main body 251 can isolate the lead 24 The chip contacts 211 of the chip connection end 241 and the photo-sensitive cell 21 and the moulding material, so as to carry out During moulding technology, it is to avoid the moulding material causes the chip connection end 241 of the lead 24 to deform or the lead 24 The chip connection end 241 come off from the chip contacts 211.
In addition, the supporting main body 251 coats a part for each lead 24, so as to by the supporting main body 251 with pre-fix each described lead 24, with when moulding technology is carried out, prevent each described lead 24 occur deformation, it is described Supporting main body 251 enables in particular to prevent the adjacent lead 24 and occurs because of deformation to contact with each other the short circuit of initiation, so as to protect Demonstrate,prove yield of the array camera module after the completion of by manufacture.
In one embodiment, the supporting main body 251 can be by the way that glue to be arranged on the institute of the photo-sensitive cell 21 State non-photo-sensing region 213 and formed after glue curing, so that the supporting main body 251 has elasticity, wherein in the branch After holding the formation of main body 251, the medial surface 2502 of the supporting main body 251 forms the through hole of the supporting member 25 252, the photosensitive region 212 of the photo-sensitive cell 21 corresponds to the through hole 252.In addition, the branch formed by glue Holding main body 251 has viscosity, for pollutants such as adhesion adhesion dusts, so as to prevent feeling described in these contaminants , there is dirty bad point with the photosensitive region 212 for avoiding the photo-sensitive cell 21 in the photosensitive region 212 of optical element 21, from And further ensure that the image quality of the array camera module.For example, the supporting main body 251 is located at the electronics in shaping Between component 26 and the photosensitive region 212 of the photo-sensitive cell 21, so as to mount the electronic component 26 in institute Stating the pollutants such as the welding powder that is produced during wiring board 22 can be adhered to by the supporting main body 251, to prevent the pollutants such as these welding powders Pollute the photosensitive region 212 of the photo-sensitive cell 21.
Preferably, the supporting main body 251 can be by will be coated in the photo-sensitive cell 21 in the glue of deadlocked state The non-photo-sensing region 213 and the formation after glue curing, to avoid glue from being applied to the institute of the photo-sensitive cell 21 The situation for flowing occur and polluting the photosensitive region 212 of the photo-sensitive cell 21 behind non-photo-sensing region 213 is stated to occur.Change speech It, glue had good plasticity before the supporting main body 251 is solidify to form, with avoid glue be applied to it is described The non-photo-sensing region 213 of photo-sensitive cell 21 and it is deformed during solidification.Those skilled in the art can be with Understand, the chip for being connected to the photo-sensitive cell 21 is set in the chip connection end 241 of the lead 24 After connector 211, in the glue of deadlocked state after the non-photo-sensing region 213 for being coated on the photo-sensitive cell 21, The chip connection end 241 of the lead 24 can be coated, and the institute of the cladding lead 24 is formed after glue curing Supporting main body 251 is stated, so as to avoid damaging the lead 24 during the supporting main body 251 is molded.
Refer to the attached drawing 3, when moulding technology is carried out, having 100 by a molding makes moulding material shape after hardening Into the molded base 23, by such mode, the size of the array camera module can be reduced and the array is reduced The assembly error of camera module, so that the structure of the array camera module is compacter and improves the array camera module Image quality.
Specifically, the mould 100 includes a mold 101 and once mould 102, wherein the mold At least one of 101 and the lower mould 102 mould can be moved, so that the mold 101 and the lower mould 102 Die closing operation can be carried out, and interconnected at least two are formed between the mold 101 and the lower mould 102 Molding space 103, wherein the molded base 23 is added into the molding space 103 and after hardening by the moulding material Formed.
For example in one embodiment, the lower mould 102 can be fixed, and the mold 101 can be along guide pillar The movement relative to the lower mould 102 is done, is closed with when the mold 101 is moved towards the direction of lower mould 102 Mould, and the withdrawing pattern when the mold 101 is moved away from the lower mould 102, when the mold 101 and the lower mould 102 when being carried out die closing operation, and each described molding space is formed between the mold 101 and the lower mould 102 103.In another embodiment, the mold 101 can be fixed, and the lower mould 102 can do relatively along guide pillar In the movement of the mold 101, with the matched moulds when the lower mould 102 is moved towards the direction of the mold 101, and Withdrawing pattern when the lower mould 101 is moved away from the mold 101.
After the molding photosensory assembly semi-finished product are placed on into the mold 101 and/or the lower mould 102, operation The mold 101 and the lower mould 102 carry out matched moulds, so that the molding photosensory assembly semi-finished product are described positioned at being formed in Each described molding space 103 of mold 101 and the lower mould 102, wherein the stitching surface 1011 of the mold 101 is applied The top surface 2501 of the supporting main body 251 is pressed on, the mold is supported upwards with by the supporting main body 251 101, so as to the stitching surface 1011 for avoiding the mold 101 directly applies pressure to the lead 24, to carry out molding work Protect the lead 24 to be not damaged by during skill, wherein it is described molding photosensory assembly semi-finished product at least described wiring board 22 it is described Fringe region 223 corresponds to the molding space 103.
It is noted that each described molding space 103 is annular in shape respectively, and the adjacent phase of the molding space 103 It is intercommunicated, in the moulding material to be added into the molding space 103 and form after the mold material cures mould Modeling pedestal 23.
Preferably, the supporting main body 251 has elasticity, so that when the mould 100 is carried out Mould operation, The stitching surface 1011 of the mold 101 is applying pressure to the top surface 2501 for supporting main body 251 in a flash The impulsive force of generation is absorbed by the supporting main body 251 and prevents the impulsive force from being further transferred to the photo-sensitive cell 21, So as to avoid the photo-sensitive cell 21 from being damaged or avoid the photo-sensitive cell 21 from being produced because of stress relative to the line The displacement of road plate 22.It will be appreciated by those skilled in the art that, the impulsive force is absorbed by the supporting main body 251 and is hindered Only the impulsive force is further communicated to the mode of the photo-sensitive cell 21, additionally it is possible to ensure that the photo-sensitive cell 21 is mounted on The flatness of the wiring board 22 does not receive image, so as to improve the product yield of the array camera module.It is noted that The scope of the shore hardness of the supporting main body 251 is A50-A80, and elastic modelling quantity scope is 0.1Gpa-1Gpa.
Preferably, in one example, it is described supporting main body 251 height may be implemented as higher than the lead 24 to The height of upper process, with when the mould 100 is carried out die closing operation, the stitching surface of the mold 101 1011 can directly apply pressure to it is described supporting main body 251 the top surface 2501, with by it is described supporting main body 251 described in Top surface 2501 support the mold 101 upwards and prevent the mold 101 the stitching surface 1011 apply pressure to it is described Lead 24.That is, be reserved between the lead 24 and the stitching surface 1011 of the mold 101 safety away from From.In another example, the height of the supporting main body 251 is equal to the height upwardly of the lead 24, with described When mould 100 is carried out matched moulds, although the stitching surface 1011 of the mold 101 can connect with the lead 24 Touch, but the stitching surface 1011 for breathing out root door play 101 can not apply pressure to the lead 24.
In addition, it is described supporting main body 251 have elasticity, after the mould 101 is carried out die closing operation, it is described on The stitching surface 1011 of mould 101 apply pressure to it is described supporting main body 251 the top surface 2501 so that the supporting main body 251 top surface 2501 produces slight deformation, for preventing the He of the stitching surface 1011 in the mold 101 Gap is produced between the top surface 2501 of the supporting main body 251.That is, the pressing of the mold 101 The top surface 2501 of face 1011 and the supporting main body 251 is brought into close contact, so that corresponding to the institute of the supporting member 25 The photosensitive region 212 for stating the photo-sensitive cell 21 of through hole 252 is in a sealed environment, so as to carry out moulding technology When, the moulding material will not enter the sealed environment, to prevent the moulding material from polluting the institute of the photo-sensitive cell 21 State photosensitive region 212.
In addition, when moulding technology is carried out, the stitching surface 1011 of the mold 101 and the supporting main body 251 The top surface 2501 be brought into close contact, to prevent the moulding material from entering the sealed environment, so as in the molding base The phenomenon of " overlap " can be avoided the occurrence of after the shaping of seat 23, to ensure the product yield of the array camera module.
Refer to the attached drawing 4, the moulding material of flow-like is added each described molding space of the mould 100 After 103, the moulding material can fill the Zone Full of each molding space 103, wherein being formed in the photo-sensitive cell At least one of described supporting main body 251 in the 21 non-photo-sensing region 213 can prevent the moulding material from entering institute State sealed environment.Specifically, the supporting main body 251 can prevent the moulding material from supporting main body 251 and the institute The contact position for stating the non-photo-sensing region 213 of photo-sensitive cell 21 enters the sealed environment, but also can prevent described Moulding material connects from the stitching surface 1011 of the top surface 2501 for supporting main body 251 and the mold 101 Touch position and enter the sealed environment.
It is noted that the moulding material of flow-like that the utility model is related to can be fluent material or solid Body granular materials or liquid and solid particle mixing material, it is to be understood that no matter the moulding material is implemented as liquid Body material is also implemented as solid particulate materials or is implemented as liquid and solid particle mixing material, and it is being added into After stating the molding space 103 of mould 100, the molded base 23 can be cured to form.For example in this practicality In this new specific example, the moulding material of flow-like is implemented as the thermoplastic of such as liquid, wherein institute Moulding material is stated in the solidify afterwards of the molding space 103 for being added into the mould 100 to form the molded base 23. It is noted that after the moulding material of flow-like is added into the molding space 103 of the mould 100, The curing mode of the moulding material of flow-like does not limit content of the present utility model and scope.
Refer to the attached drawing 5, when the moulding material is added into the molding space 103, the supporting main body 251 prevents institute Moulding material into the photosensitive region 212 of the photo-sensitive cell 21 is stated, so that in the mold material cures to be formed After stating molded base 23, the molded base 23 further forms at least two optical windows 231, and each described optical window 231 is corresponded to respectively It is institute with by the optical window 231 in the photosensitive region 212 and each described optical lens 10 of each photo-sensitive cell 21 State optical lens 10 and the photo-sensitive cell 21 provides a passage of light.The moulding material forms the molding base after hardening One molded body 232 of seat 23, in this embodiment, the molded body 232 coats the edge of the wiring board 22 At least a portion of the lateral surface 2503 and the top surface 2501 of region 223 and the supporting main body 251, to be formed The molding photosensory assembly 20.In other words, the molded base 23 includes a molded body 232 and with least two The optical window 231, the filter element 40 and the driver 30 are subsequently being assembled in the top of the molded body 232 respectively Surface, so that the optical lens 10 for being assembled in the driver 30 is maintained at the photosensitive road of the photo-sensitive cell 21 Footpath.
It is noted that the molded body 232 joined integrally with the fringe region 223 of the wiring board 22 Each described electronic component 26 is further coated, so as to isolate the adjacent electronic component by the molded body 232 26 and isolate the electronic component 26 and the photo-sensitive cell 21 by the molded body 232, by such mode, i.e., Be the adjacent electronic component 26 it is closer to the distance when, the molded body 232 can also prevent adjacent electronics unit Device 26 contacts with each other or disturbs, and the molded body 232 can also prevent the dirt that the electronic component 26 is produced Dye thing pollutes the photosensitive region 212 of the photo-sensitive cell 21, further to improve the image quality of the camera module.
In addition, the utility model is by the cladding of the molded body 232, and each described electronic component 26 is adjacent to avoid The mode that the electronic component 26 is interfered so that the distance of the adjacent electronic component 26 can further reduce, So as to can also be attached the greater number of electronic component 26 even on the less wiring board 22 of area, with The image quality of the array camera module is improved on the premise of the size of the array camera module is reduced as far as possible.And And, the utility model is by way of the molded body 232 coats each described electronic component 26 to isolate the electronics Component 26 and the photo-sensitive cell 21, so that even described photo-sensitive cell 21 is closer to the distance with the electronic component 26 When, the photo-sensitive cell 21 and the electronic component 26 are also not in the phenomenon for interfering, so as to less in area The photo-sensitive cell 21 with the bigger photosensitive region 212 can be attached on the wiring board 22, to improve the battle array The image quality of row camera module.
Preferably, the molded body 232 has good thermal insulation, so as to what is used in the array camera module During, the heat of generation when photoelectric conversion is carried out of the photo-sensitive cell 21 is not transferred to the electronic component 26, with Ensure array camera module reliability when in use.
Refer to the attached drawing 6 and Fig. 7, the filter element 40 are assembled in the top surface of the molded base 23, so that described Filter element 40 closes the optical window 231 of the molded base 23, so as to subsequently enter described from the optical lens 10 The light of the inside of array camera module further can be filtered to improve the array camera module by the filter element 40 Image quality.As introducing as discussed above, although new to this practicality by taking two filter elements 40 as an example in figure 6 The feature and advantage of the array camera module of type are illustrated, it will be appreciated by those skilled in the art that, the battle array Row camera module can also include a filter element 40, and the molded base 23 is assembled in the filter element 40 Top surface after, by a filter element 40 simultaneously close each described optical window 231 so that each described photosensitive unit The photosensitive region 212 of part 21 corresponds respectively to the diverse location of the filter element 40.
Further, the top surface of the molded base 23 includes at least two inner surfaces 233 and an outer surface 234, Wherein in one example, each described inner surface 233 and the outer surface 234 are in approximately the same plane, so that institute The top surface for stating molded base 23 forms a complete plane, and wherein each described filter element 40 is assembled in described respectively Each described inner surface 233 of module pedestal 23, each described optical window is closed off with by filter element each described 40 231, each described driver 40 is assembled in the diverse location of the outer surface 234 of the module pedestal 23 respectively, with The filter element 40 is set to be located at the institute of the optical lens 10 and the photo-sensitive cell 21 that are assembled in the driver 30 State between photosensitive region 212.In another example, the plane where each described inner surface 233 is less than the outside table Plane where face 234, to form at least two grooves 235 of the molded base 23, i.e. the top surface of the molded base 23 In step-like, wherein being assembled in the filter element 40 of the inner surface 233 of the molded base 23 positioned at described In the groove 235 of molded base 23.
Refer to the attached drawing 8, each described driver 30 of the array camera module is installed in the support 50 respectively Each described installing space 51, is then filled in the shell and the support of each driver 30 by fillers such as glue Between 50 inwall, to ensure that each described driver 30 will not when the array camera module is mounted or is used Appearance is rocked, so as to ensure to be assembled in each described optical lens of each driver 30 respectively by the support 50 10 axiality, and the support 50 can also strengthen the structure of the array camera module, be imaged with improving the array The stability of module.It is noted that in one embodiment, the driver 30 only can be arranged at into the support 50 The installing space 51 so that the support 50 coats at least a portion of the driver 30, in another embodiment, The support 50 can also be made further to coat at least a portion of the molded base 23, the present invention is not limited in this respect System.
Accompanying drawing 11 shows second variant embodiment of the array camera module, with it is of the present utility model it is above-mentioned compared with The implementation method of good embodiment is different, and the array camera module includes two wiring boards 22, wherein each described circuit Plate 22 includes a chip attachment region 222 and a fringe region 223, wherein each described photo-sensitive cell respectively 21 are mounted on the chip attachment region 222 of each wiring board 22 respectively, wherein carrying out moulding technology to be formed During the molded base 23, the molded body 232 of the molded base 23 and the edge of each wiring board 22 At least a portion in region 223 is joined integrally.That is, in this implementation of the array camera module of the present utility model In example, the wiring board 22 is split type wiring board.
Accompanying drawing 12 shows the 3rd variant embodiment of the array camera module, wherein the array camera module Including driver 30 at least described in a lens barrel 60 and at least one, wherein the lens barrel 60 integratedly extends the molded base 23 top surface, the driver 30 is assembled in the top surface of the molded base 23, and the lens barrel 60 and the drive Dynamic device 30 is respectively used to assemble the optical lens 10, it is preferable that the lens barrel 60 and the molded base 23 are by molding Technique is integratedly molded.For example when the array camera module is implemented as twin-lens camera module, the array is taken the photograph As module includes a driver 30 and a lens barrel 60.
Accompanying drawing 13A shows the 4th variant embodiment of the array camera module, wherein array shooting mould Group includes lens barrel 60 described at least two, and wherein each described lens barrel 60 integratedly extends the top of the pedestal pedestal 23 respectively Surface, each described optical lens 10 is assembled in each described lens barrel 60 respectively, it is preferable that each described lens barrel 60 respectively and The molded base 23 is integratedly molded by moulding technology.
Accompanying drawing 13B shows the 5th variant embodiment of the array camera module, wherein array shooting mould Group includes lens barrel 60 described at least two, wherein after the molding photosensory assembly 20 is molded, each described lens barrel 60 is distinguished The diverse location of the top surface of the molded base 23 is assembled in, each described optical lens 10 is assembled in each institute respectively Lens barrel 60 is stated, so that each described optical lens 10 is respectively held in the photosensitive path of each photo-sensitive cell 10.It is worth One is mentioned that, the lens barrel 60 can be threaded lens barrel, or non-threaded lens barrel, and the utility model is convenient not at this It is restricted.
In addition, two being only for example property of embodiment of the array camera module that accompanying drawing 13A and accompanying drawing 13B are shown respectively Description, in other examples, lens barrel 60 described at least one can with the molded base 23 by moulding technology integrally Ground shaping, the other lens barrel 60 can be assembled in the top surface of the molded base 23.For example when the array is imaged When module is implemented as twin-lens camera module, a lens barrel 60 can pass through moulding technology one with the molded base 23 The shaping of body ground, another lens barrel 60 can be assembled in the top surface of the molded base 23, in order to be focused.
Accompanying drawing 14A shows first deformation implementation side of the molding photosensory assembly 20 of the array camera module Formula, wherein it is described supporting main body 251 coat the wiring board 22 the fringe region 223 a part every and it is described photosensitive In the chip outside portion 2133 in the non-photo-sensing region 213 of element 21, the chip connecting portion 2132 and the chip At least a portion of sidepiece 2131, with the molded base 23 shaping after, the molded body bag of the molded base 23 Cover a part for the fringe region 223 of the wiring board 22 and the lateral surface 2503 and the institute of the supporting main body 251 State at least a portion of top surface 2501.
It is noted that the supporting main body 251 can coat the whole of the lead 24, with the molded base Before 23 form, the fixation of each lead 24 is realized, so that during moulding technology is carried out, the supporting main body 251 can prevent the lead 24 from being contacted with the moulding material, so as to avoid being added into the molding space 103 it is described into The impulsive force that section bar material is produced causes the lead 24 to be deformed.In addition, it is described supporting main body 251 can also have it is good Heat-proof quality, it is hot during the mold material cures with after the moulding material is added into the molding space 103 Amount will not be delivered to the lead 24 by the supporting main body 251, to be further ensured that the good electrical of the lead 24.
In addition, it is described supporting main body 251 simultaneously be formed in the wiring board 22 the fringe region 223 a part and At least a portion in the non-photo-sensing region 213 of the photo-sensitive cell 21, to realize the photo-sensitive cell 21 and the circuit The fixation of plate 22, so as to during moulding technology is carried out, the supporting main body 251 can be prevented in the mould There is displacement in the photo-sensitive cell 21 and the wiring board 22 during 100 matched moulds, to ensure the flat of the photo-sensitive cell 21 Whole degree.
In addition, it is described supporting main body 251 simultaneously be formed in the wiring board 22 the fringe region 223 a part and At least a portion in the non-photo-sensing region 213 of the photo-sensitive cell 21, prevents described with by the supporting main body 251 Gap is produced between the mounting position of photo-sensitive cell 21 and the wiring board 22, so that during moulding technology is carried out, institute Stating supporting main body 251 can prevent the moulding material from entering between the photo-sensitive cell 21 and the wiring board 22, to ensure The flatness that the photo-sensitive cell 21 is mounted, so as to further improve the image quality of the array camera module.
Accompanying drawing 14B shows second of the molding photosensory assembly 20 of the array camera module of the present utility model Variant embodiment, wherein it is described supporting main body 251 coat the wiring board 22 the fringe region 223 a part and The chip outside portion 2133 in the non-photo-sensing region 213 of the photo-sensitive cell 21 and the chip connecting portion 2132 are extremely A few part, so that after the shaping of the molded base 23, the molded body 232 of the molded base 23 coats the circuit The lateral surface 2503 and the top surface of a part for the fringe region 223 of plate 22 and the supporting main body 251 2501 at least a portion.
Similarly, accompanying drawing 14C shows the molding photosensory assembly 20 of the array camera module of the present utility model The 3rd variant embodiment, wherein it is described supporting main body 251 coat the wiring board 22 the fringe region 223 one At least a portion of the chip outside portion 2133 in the non-photo-sensing region 213 of part and the photo-sensitive cell 21, with After the shaping of the molded base 23, the molded body 232 of the molded base 23 coats the described of the wiring board 22 At least the one of the lateral surface 2503 and the top surface 2501 of a part for fringe region 223 and the supporting main body 251 Part.
It will be appreciated by those skilled in the art that, in the molding photosensory assembly shown in accompanying drawing 14B and accompanying drawing 14C In 20 the two embodiments, the supporting main body 251 can not coat the non-photo-sensing region 213 of the photo-sensitive cell 21 The chip inside portion 2131 so that what the size of the chip inside portion 2131 of the photo-sensitive cell 21 can be done It is smaller, so that the photo-sensitive cell 21 of same size can have the bigger photosensitive region 212, by such side Formula, on the premise of the size of the array camera module is controlled, can improve the image quality of the array camera module.
In addition, the supporting main body 251 can not coat the chip inside portion 2131 of the photo-sensitive cell 21, so that Tu is applied in the part in the non-photo-sensing region 213 of the photo-sensitive cell 21 in glue, and is formed institute in glue curing State supporting main body 251 before, glue because away from the photo-sensitive cell 21 the photosensitive region 212 so that even in glue In the case that flowing occurs in water, glue also can only flow to the chip inside portion 2131 of the photo-sensitive cell 21, without The photosensitive region 212 of the photo-sensitive cell 21 is flow to, so as to prevent the photosensitive region 212 of the photo-sensitive cell 21 It is contaminated.That is, the chip inside portion 2131 can be described in the supporting main body 251 and the photo-sensitive cell 21 Safe distance is reserved between photosensitive region 212.
Accompanying drawing 14D shows the 4th of the molding photosensory assembly 20 of the array camera module of the present utility model Variant embodiment, wherein the supporting main body 251 coats a part for the fringe region 223 of the wiring board 22, with After the shaping of the molded base 23, the molded body 232 of the molded base 23 coats the described of the wiring board 22 The lateral surface 2503 and the top surface 2501 of another part of fringe region 223 and the supporting main body 251 are at least A part.
Accompanying drawing 14E shows the 5th of the molding photosensory assembly 20 of the array camera module of the present utility model Variant embodiment, wherein the quantity of the supporting member 25 can be one, and the supporting member 25 the supporting Main body 251 coats a part for the fringe region 223 of the wiring board 22, so that each photo-sensitive cell 21 is described Photosensitive region 212 simultaneously correspond to the supporting member 25 the through hole 252, with the molded base 23 shaping after, institute State molded base 23 the molded body 232 coat the wiring board 22 the fringe region 223 another part and institute State the lateral surface 2503 of supporting main body 251 and at least a portion of the top surface 2501.
In the molding photosensory assembly of the of the present utility model described array camera module shown in accompanying drawing 14D and Figure 14 E In 20 the two embodiments, the supporting main body 251 can be without the non-photo-sensing region of the cladding photo-sensitive cell 21 213 any position, so that the photosensitive region 212 of the supporting main body 251 away from the photo-sensitive cell 21, so that The supporting main body 251 avoids being polluted for forming the glue or other materials of the supporting main body 251 during being molded The photosensitive region 212 of the photo-sensitive cell 21.Preferably, of the present utility model described shown in accompanying drawing 14D and Figure 14 E In the two embodiments of the molding photosensory assembly 20 of array camera module, the supporting main body 251 can coat described The link position of the wiring board connector 221 of lead 24 and the wiring board 22, it is described so as to when moulding technology is carried out Supporting main body 251 can avoid the moulding material from contacting the wiring board connector of the lead 24 and the wiring board 22 221 link position, to prevent the lead 24 from occurring deforming and dropping off.
It will be appreciated by those skilled in the art that, although in the array shooting shown in accompanying drawing 14A to accompanying drawing 14E The numerous embodiments of the molding photosensory assembly 20 of module, but it only illustrates feature of the present utility model as an example And advantage, as needed, the supporting main body 251 can coat the wiring board outside portion 2233, the institute of the wiring board 22 State the chip outside portion of wiring board connecting portion 2232 and the wiring board inside portion 2231 and the photo-sensitive cell 21 2133rd, at least a portion of at least one of the chip connecting portion 2132 and the chip inside portion 2131.For example it is described Supporting main body 251 can coat a part for the wiring board connecting portion 2232 of the wiring board 22, it is also possible to which cladding is described The whole of wiring board connecting portion 2232.Therefore, although repeating no more the supporting in following description of the present utility model Main body 251 is set the position of cladding, it will be appreciated by those skilled in the art that, the array shooting of the present utility model The scope of module can be set the fringe region 223 and institute for coating the wiring board 22 comprising the supporting main body 251 State the combination of any position and any position in the non-photo-sensing region 213 of photo-sensitive cell 21.
In addition, accompanying drawing 15 shows the another of the molding photosensory assembly 20 of the array camera module of the present utility model One variant embodiment, wherein the stitching surface 1011 of the mold 101 and the top table for supporting main body 251 At least a portion in face 2501 is released, so that after the shaping of the molded base 23, the molded body 232 can be coated further At least a portion of the top surface 2501 of the supporting main body 251.
It is noted that according to one embodiment of the present utility model, the array camera module includes at least two institutes Optical lens 10 and a molding photosensory assembly 20 are stated, wherein each described optical lens 10 is arranged at the mould respectively On the photosensitive path of each photo-sensitive cell 21 for moulding photosensory assembly 20, as the utility model is in foregoing described that Sample.And in another embodiment, shown in refer to the attached drawing 16, the array camera module can also include at least two optical frames First 10, the molding additional photo-sensitive cell 21A of photosensory assembly 20 and at least one, each described additional photo-sensitive cell 21A The wiring board 22 of the molding photosensory assembly 20 is assembled in, each described optical lens 10 is arranged at the mould respectively Each described photo-sensitive cell 21 of photosensory assembly 20 and the photosensitive path of each additional photo-sensitive cell 21A are moulded, to be formed State array camera module.In addition, the array camera module further includes an at least additional body 27 and at least one additional drive Dynamic device 30A or at least one additional lens barrel 60A, wherein each described additional body 27 are assembled in photosensitive group of the molding respectively The wiring board 22 of part 20, each described additional actuators 30A or each described additional lens barrel 60A are assembled in institute respectively Wiring board 22 is stated, each described optical lens 10 is assembled in the driver 30 or the lens barrel 60 or described attached respectively Plus the driver 30A or additional lens barrel 60A so that each described optical lens 10 be respectively held in it is described molding it is photosensitive The photosensitive path of each described photo-sensitive cell 21 of component 20 and each additional photo-sensitive cell 21A.In addition, the additional sense Optical element 21A can also not be mounted on the wiring board 22 of the molding photosensory assembly 20, but be taken the photograph by the array As module provides an extension wire plate 22A, for being mounted on each described additional photo-sensitive cell 21A.
Accompanying drawing 17 shows another variant embodiment of the array camera module, wherein the filter element 40 does not have By direct-assembling in the molded body 232 of the molded base 23, but further provided for by the array camera module An at least supporter 70, each described filter element 40 can respectively be assembled in each described supporter 70, then by each The supporter 70 is assembled in the top surface of the molded body 232 respectively, so that each described filter element 40 is maintained at Between each described optical lens 10 and each described photo-sensitive cell 21, by such mode, the unit that filters can be reduced The size of part 40, to reduce the cost of manufacture of the array camera module.
It is noted that in one embodiment, the number of the quantity of the supporter 70 and the filter element 40 Amount is consistent, i.e. the supporter 70 and the filter element 40 are matched one by one.For example when the quantity of the filter element 40 is one When individual, the quantity of the supporter 70 is also one.In another embodiment, the quantity of the supporter 70, the optical filtering The quantity of element 40 is consistent with the quantity of the optical lens 10, such as in this example shown in accompanying drawing 7, the supporter The quantity of 70 quantity, the quantity of the filter element 40 and the optical lens 10 is two.
In another embodiment, the quantity of the supporter 70 can also differ with the quantity of the filter element 40 Cause, such as the quantity of described supporter 70 can only have one, and the quantity of the filter element 40 can have more than one, wherein Each filter element 40 can be assembled in the diverse location of the supporter 70.
With further reference to accompanying drawing 17, the top surface of the molded body 232 of the molded base 23 is a plane, from And after the shaping of the molded base 23, the supporter 70 is first assembled in the top surface of the molded body 232, Ran Houzai The driver 30 or the lens barrel 60 are assembled in the supporter 70.That is, the driver 30 or described Lens barrel 60 not by direct-assembling in the top surface of the molded body 232, but can be assembled on the supporter 70.
Accompanying drawing 18 shows another variant embodiment of the array camera module, wherein the molded body 232 Groove 235 described in top surface formation at least one, is assembled in the quilt of the supporter 70 of the top surface of the molded base 232 It is contained in the groove 235, further to reduce the height dimension of the array camera module, now, the driver 30 Or the lens barrel 60 can be by direct-assembling in the top surface of the molded body 232.
Even so, it will be appreciated by those skilled in the art that, in the array camera module of the present utility model Other examples in, the optical lens 10 can also be by direct-assembling in the top surface or straight of the molded body 232 Connect the top surface for being assembled in the supporter 70.
According to other side of the present utility model, refer to the attached drawing 19, the utility model further provides for one and is taken the photograph with array As the electronic equipment of module, wherein the electronic equipment with array camera module is including an electronic equipment body 200 and extremely Few an array camera module, wherein each described array camera module is arranged at the electronic equipment body 200 respectively, with In acquisition figure.
It will be understood by those skilled in the art that the embodiment of the present utility model shown in foregoing description and accompanying drawing is only used as lifting Example and be not intended to limit the utility model.
The purpose of this utility model completely and is effectively realized.Function of the present utility model and structural principle are in reality Displaying and explanation in example are applied, under without departing from the principle, implementation method of the present utility model there can be any deformation or repair Change.

Claims (51)

1. one photosensory assembly is molded, it is characterised in that including：
An at least wiring board, wherein each described wiring board have an at least chip attachment region respectively；
At least two photo-sensitive cells, wherein each described photo-sensitive cell are mounted on each described core of each wiring board respectively Piece pasting area；
At least two groups leads, wherein the two ends of lead described in every group are connected to the chip connection of each photo-sensitive cell respectively The wiring board connector of part and each wiring board；
At least supporting member formed by first medium, wherein each described supporting member include the supporting master of a frame shape respectively Body and with an at least through hole, each described supporting main body is respectively coated by a part for the fringe region of the wiring board, each The photosensitive region of the photo-sensitive cell corresponds respectively to each described through hole；And
The molded base formed by second medium, wherein the molded base includes a molded body and with least two light Window, wherein at least the one of another part of the fringe region of the molded body and each wiring board and the supporting main body Part integratedly combines, and the photosensitive region of each photo-sensitive cell corresponds respectively to each described optical window.
2. molding photosensory assembly according to claim 1, wherein the supporting main body have a top surface, a medial surface with And a lateral surface, the top surface respectively inwards and stretches out to be connected to the medial surface and the lateral surface, it is described in Side forms the through hole, wherein the molded body is at least integratedly combined with the lateral surface.
3. molding photosensory assembly according to claim 1, wherein the supporting main body have a top surface, a medial surface with And a lateral surface, the top surface respectively inwards and stretches out to be connected to the medial surface and the lateral surface, it is described in Side forms the through hole, wherein the molded body is integratedly tied with least a portion of the lateral surface and the top surface Close.
4. molding photosensory assembly according to claim 1, wherein the supporting main body has elasticity.
5. according to any described molding photosensory assembly in Claims 1-4, wherein the fringe region of the wiring board includes one Wiring board inside portion, a wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at the line Road plate connecting portion, the wiring board inside portion and the wiring board outside portion are located at the both sides of the wiring board connecting portion respectively, Wherein described supporting main body coats at least a portion of the wiring board inside portion.
6. according to any described molding photosensory assembly in Claims 1-4, wherein the fringe region of the wiring board includes one Wiring board inside portion, a wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at the line Road plate connecting portion, the wiring board inside portion and the wiring board outside portion are located at the both sides of the wiring board connecting portion respectively, Wherein described supporting main body coats at least a portion of the wiring board connecting portion.
7. according to any described molding photosensory assembly in Claims 1-4, wherein the fringe region of the wiring board includes one Wiring board inside portion, a wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at the line Road plate connecting portion, the wiring board inside portion and the wiring board outside portion are located at the both sides of the wiring board connecting portion respectively, Wherein described supporting main body coats a part for the wiring board outside portion.
8. according to any described molding photosensory assembly in Claims 1-4, wherein the fringe region of the wiring board includes one Wiring board inside portion, a wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at the line Road plate connecting portion, the wiring board inside portion and the wiring board outside portion are located at the both sides of the wiring board connecting portion respectively, At least one of wherein described at least a portion for supporting the main body cladding wiring board inside portion and the wiring board connecting portion Point.
9. according to any described molding photosensory assembly in Claims 1-4, wherein the fringe region of the wiring board includes one Wiring board inside portion, a wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at the line Road plate connecting portion, the wiring board inside portion and the wiring board outside portion are located at the both sides of the wiring board connecting portion respectively, Wherein described supporting main body coats at least a portion of the wiring board connecting portion and a part for the wiring board outside portion.
10. according to any described molding photosensory assembly in Claims 1-4, wherein the fringe region of the wiring board includes One wiring board inside portion, a wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at described Wiring board connecting portion, the wiring board inside portion and the wiring board outside portion are respectively positioned at the two of the wiring board connecting portion Side, wherein the supporting main body coats at least a portion, the wiring board connecting portion and the line of the wiring board inside portion A part for road plate outside portion.
11. molding photosensory assemblies according to claim 4, wherein the scope of the shore hardness of the supporting member is A50- A80, elastic modelling quantity scope is 0.1Gpa-1Gpa.
12. according to any described molding photosensory assembly in Claims 1-4, wherein the height of the supporting main body be higher than or Person is equal to lead height upwardly.
13. molding photosensory assemblies according to claim 5, wherein the height of the supporting main body is greater than described Lead height upwardly.
14. molding photosensory assemblies according to claim 6, wherein the height of the supporting main body is greater than described Lead height upwardly.
15. molding photosensory assemblies according to claim 7, wherein the height of the supporting main body is greater than described Lead height upwardly.
16. molding photosensory assemblies according to claim 8, wherein the height of the supporting main body is greater than described Lead height upwardly.
17. molding photosensory assemblies according to claim 9, wherein the height of the supporting main body is greater than described Lead height upwardly.
18. molding photosensory assemblies according to claim 10, wherein the height of the supporting main body is greater than institute State lead height upwardly.
19. molding photosensory assemblies according to claim 11, wherein the height of the supporting main body is greater than institute State lead height upwardly.
20. according to any described molding photosensory assembly in Claims 1-4, wherein the height of the supporting main body is less than institute State lead height upwardly.
21. molding photosensory assemblies according to claim 5, wherein the height of the supporting main body is upward less than the lead The height of projection.
22. molding photosensory assemblies according to claim 6, wherein the height of the supporting main body is upward less than the lead The height of projection.
23. molding photosensory assemblies according to claim 7, wherein the height of the supporting main body is upward less than the lead The height of projection.
24. molding photosensory assemblies according to claim 8, wherein the height of the supporting main body is upward less than the lead The height of projection.
25. molding photosensory assemblies according to claim 9, wherein the height of the supporting main body is upward less than the lead The height of projection.
26. molding photosensory assemblies according to claim 10, wherein it is described supporting main body height less than the lead to The height of upper process.
27. molding photosensory assemblies according to claim 11, wherein it is described supporting main body height less than the lead to The height of upper process.
28. an array camera modules, it is characterised in that including：
At least two optical lens；With
One molding photosensory assembly, wherein the molding photosensory assembly is further included：
An at least wiring board, wherein each described wiring board have an at least chip attachment region respectively；
At least two photo-sensitive cells, wherein each described photo-sensitive cell are mounted on each described core of each wiring board respectively Piece pasting area；
At least two groups leads, wherein the two ends of lead described in every group are connected to the chip connection of each photo-sensitive cell respectively The wiring board connector of part and each wiring board；
At least supporting member formed by first medium, wherein each described supporting member include the supporting master of a frame shape respectively Body and with an at least through hole, each described supporting main body is respectively coated by a part for the fringe region of the wiring board, each The photosensitive region of the photo-sensitive cell corresponds respectively to each described through hole；And
The molded base formed by second medium, wherein the molded base includes a molded body and with least two light Window, wherein at least the one of another part of the fringe region of the molded body and each wiring board and the supporting main body Part integratedly combines, and the photosensitive region of each photo-sensitive cell corresponds respectively to each described optical window, wherein each The optical lens is arranged at the photosensitive path of each photo-sensitive cell respectively, so that the optical window is the optical lens A passage of light is provided with the photo-sensitive cell.
29. array camera modules according to claim 28, wherein the supporting main body has a top surface, a medial surface And a lateral surface, the top surface respectively inwards and stretches out to be connected to the medial surface and the lateral surface, described Medial surface forms the through hole, wherein the molded body is integratedly combined with the lateral surface.
30. array camera modules according to claim 28, wherein the supporting main body has a top surface, a medial surface And a lateral surface, the top surface respectively inwards and stretches out to be connected to the medial surface and the lateral surface, described Medial surface forms the through hole, wherein at least a portion of the molded body and the lateral surface and the top surface is integratedly With reference to.
31. array camera modules according to claim 30, wherein the fringe region of the wiring board includes a wiring board Inside portion, a wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at the wiring board and connect Socket part, the wiring board inside portion and the wiring board outside portion are respectively positioned at the both sides of the wiring board connecting portion, wherein institute State at least a portion that supporting main body coats the wiring board inside portion.
32. array camera modules according to claim 30, wherein the fringe region of the wiring board includes a wiring board Inside portion, a wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at the wiring board and connect Socket part, the wiring board inside portion and the wiring board outside portion are respectively positioned at the both sides of the wiring board connecting portion, wherein institute State at least a portion that supporting main body coats the wiring board connecting portion.
33. array camera modules according to claim 30, wherein the fringe region of the wiring board includes a wiring board Inside portion, a wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at the wiring board and connect Socket part, the wiring board inside portion and the wiring board outside portion are respectively positioned at the both sides of the wiring board connecting portion, wherein institute State the part that supporting main body coats the wiring board outside portion.
34. array camera modules according to claim 30, wherein the fringe region of the wiring board includes a wiring board Inside portion, a wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at the wiring board and connect Socket part, the wiring board inside portion and the wiring board outside portion are respectively positioned at the both sides of the wiring board connecting portion, wherein institute State supporting main body and coat at least a portion of the wiring board inside portion and at least a portion of the wiring board connecting portion.
35. array camera modules according to claim 30, wherein the fringe region of the wiring board includes a wiring board Inside portion, a wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at the wiring board and connect Socket part, the wiring board inside portion and the wiring board outside portion are respectively positioned at the both sides of the wiring board connecting portion, wherein institute State supporting main body and coat at least a portion of the wiring board connecting portion and a part for the wiring board outside portion.
36. array camera modules according to claim 30, wherein the fringe region of the wiring board includes a wiring board Inside portion, a wiring board connecting portion and a wiring board outside portion, the wiring board connector are arranged at the wiring board and connect Socket part, the wiring board inside portion and the wiring board outside portion are respectively positioned at the both sides of the wiring board connecting portion, wherein institute State at least a portion, the wiring board connecting portion and the wiring board outside portion that supporting main body coats the wiring board inside portion A part.
37., according to any described array camera module in claim 28 to 36, further include at least two drivers, wherein Each described optical lens is assembled in each described driver respectively, and each described driver is assembled in the molding respectively The top surface of main body.
38., according to any described array camera module in claim 28 to 36, further include at least two lens barrels, wherein often The individual optical lens is assembled in each described lens barrel respectively, and each described lens barrel integratedly extends the molding master respectively The top surface of body；Or at least two lens barrels are further included, lens barrel described in wherein at least one is integrally formed in the molding The top surface of main body, the other lens barrel is mounted on the top surface of the molded body, each described optical lens difference It is assembled in each described lens barrel；Or the array camera module includes being mounted on two of the top surface of the molded body Lens barrel, each described optical lens is assembled in each described lens barrel respectively.
The 39. array camera module according to claim 37, further includes an at least filter element, wherein described in each Filter element is assembled in the top surface of the molded body respectively, so that the filter element is maintained at the optical lens And the photo-sensitive cell between.
The 40. array camera module according to claim 39, wherein the top surface of the molded body is included at least two Side surface and an outer surface, each described filter element are assembled in each described inner side table of the molded body respectively Face, each described driver is assembled in the diverse location of the outer surface of the molded body respectively.
41. array camera modules according to claim 40, the wherein plane where each described inner surface are less than institute Plane where stating outer surface, to form at least two grooves of the molded base, each described filter element is held respectively It is contained in each described groove.
42. array camera modules according to claim 28, further include an at least supporter and at least one optical filtering unit Part, wherein each described filter element are assembled in each described supporter, and each described supporter is assembled in described respectively The top surface of molded body, so that each described filter element is maintained at each described optical lens and each described photosensitive unit Between part.
The 43. array camera module according to claim 37, further includes a support, wherein the support has at least Two installing spaces, each described driver is housed inside each described installing space of the support respectively.
The 44. array camera module according to claim 38, further includes a support, wherein the support has at least Two installing spaces, each described lens barrel is housed inside each described installing space of the support respectively.
45. 1 electronic equipments, it is characterised in that including：
One electronic equipment body；With
According to any described array camera module in claim 28 to 44, wherein the array camera module quilt The electronic equipment body is arranged at, for obtaining image.
46. 1 molding photosensory assemblies, it is characterised in that including：
An at least wiring board, wherein each described wiring board have an at least chip attachment region respectively；
At least two photo-sensitive cells, wherein each described photo-sensitive cell are mounted on each described core of each wiring board respectively Piece pasting area；
At least two groups leads, wherein the two ends of lead described in every group are connected to the chip connection of each photo-sensitive cell respectively The wiring board connector of part and each wiring board；
At least supporting member formed by first medium, wherein each described supporting member include the supporting master of a frame shape respectively Body and with an at least through hole, at least a portion of each supporting main body cladding each lead, and described in each The height for supporting main body is greater than each lead height upwardly, the photosensitive area of each photo-sensitive cell Domain corresponds respectively to each described through hole；And
The molded base formed by second medium, wherein the molded base includes a molded body and with least two light Window, wherein the molded body at least with the part of the fringe region of wiring board each described and the supporting main body integratedly With reference to, and the photosensitive region of each photo-sensitive cell corresponds respectively to each described optical window.
47. molding photosensory assemblies according to claim 46, wherein each described lead have a chip connection end and one Wiring board connection end, and each described lead prolongs deviously in the chip connection end and the wiring board connection end respectively Stretch, the chip connection end of each lead is connected to each described chip contacts of the photo-sensitive cell, each The wiring board connection end of the lead can respectively be connected to each described wiring board connector of the wiring board, wherein The supporting main body coats the chip connection end of each lead.
48. molding photosensory assemblies according to claim 46, wherein each described lead have a chip connection end and one Wiring board connection end, and each described lead prolongs deviously in the chip connection end and the wiring board connection end respectively Stretch, the chip connection end of each lead is connected to each described chip contacts of the photo-sensitive cell, each The wiring board connection end of the lead can respectively be connected to each described wiring board connector of the wiring board, wherein The supporting main body coats the wiring board connection end of each lead.
49. molding photosensory assemblies according to claim 46, wherein each described lead have a chip connection end and one Wiring board connection end, and each described lead prolongs deviously in the chip connection end and the wiring board connection end respectively Stretch, the chip connection end of each lead is connected to each described chip contacts of the photo-sensitive cell, each The wiring board connection end of the lead can respectively be connected to each described wiring board connector of the wiring board, wherein The supporting main body coats the middle part of each lead.
50. an array camera modules, it is characterised in that including：
At least two optical lens；With
One molding photosensory assembly, wherein the molding photosensory assembly is further included：
An at least wiring board, wherein each described wiring board have an at least chip attachment region respectively；
At least two photo-sensitive cells, wherein each described photo-sensitive cell are mounted on each described core of each wiring board respectively Piece pasting area；
At least two groups leads, wherein the two ends of lead described in every group are connected to the chip connection of each photo-sensitive cell respectively The wiring board connector of part and each wiring board；
At least supporting member formed by first medium, wherein each described supporting member include the supporting master of a frame shape respectively Body and with an at least through hole, at least a portion of each supporting main body cladding each lead, and described in each The height for supporting main body is greater than each lead height upwardly, the photosensitive area of each photo-sensitive cell Domain corresponds respectively to each described through hole；And
The molded base formed by second medium, wherein the molded base includes a molded body and with least two light Window, wherein the molded body at least with the part of the fringe region of wiring board each described and the supporting main body integratedly With reference to and the photosensitive region of each photo-sensitive cell corresponds respectively to each described optical window, wherein each described optical frames Head is arranged at the photosensitive path of each photo-sensitive cell respectively, so that the optical window is the optical lens and described photosensitive Element provides a passage of light.
51. 1 electronic equipments, it is characterised in that including：
One electronic equipment body；With
The array camera module according to claim 50, wherein the array camera module is arranged at the electronic equipment sheet Body, for obtaining image.
CN201620875781.3U 2016-03-12 2016-08-12 Array camera module and its molding photosensory assembly and the electronic equipment with array camera module Active CN206313866U (en)

Priority Applications (38)

Application Number Priority Date Filing Date Title
CN201620875781.3U CN206313866U (en) 2016-08-12 2016-08-12 Array camera module and its molding photosensory assembly and the electronic equipment with array camera module
JP2018550699A JP7025345B2 (en) 2016-03-28 2016-10-25 Camera modules and molded photosensitive assemblies and their manufacturing methods, and electronic devices
PCT/CN2016/103247 WO2017166798A1 (en) 2016-03-28 2016-10-25 Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device
EP23176877.1A EP4231653A3 (en) 2016-03-28 2016-10-25 Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device
US16/088,435 US11289521B2 (en) 2016-03-28 2016-10-25 Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device
EP16896568.9A EP3468165B1 (en) 2016-03-28 2016-10-25 Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device
KR1020187031125A KR102152516B1 (en) 2016-03-28 2016-10-25 Camera module and molded photosensitive assembly, manufacturing method thereof, and electronic device
EP16894174.8A EP3429181B1 (en) 2016-03-12 2016-10-28 Array camera module, moulded photosensitive assembly and manufacturing method therefor, and electronic device
PCT/CN2016/103736 WO2017157015A1 (en) 2016-03-12 2016-10-28 Array camera module, moulded photosensitive assembly and manufacturing method therefor, and electronic device
KR1020207036129A KR102335306B1 (en) 2016-03-12 2016-10-28 Array Imaging Module and Molded Photensitive Assembly and Manufacturing Method Thereof for Electronic Device
US15/317,117 US10908324B2 (en) 2016-03-12 2016-10-28 Molded photosensitive assembly of array imaging module
JP2018547880A JP2019519087A (en) 2016-03-12 2016-10-28 Array imaging module and molded photosensitive assembly, and method of manufacturing the same for electronic devices
KR1020187029337A KR102193819B1 (en) 2016-03-12 2016-10-28 Array imaging module, molded photosensitive assembly and manufacturing method thereof, and electronic device
TW106203473U TWM565451U (en) 2016-03-12 2017-03-13 Array camera module and its molded photosensitive element and electronic device
TW106108124A TWI703715B (en) 2016-03-12 2017-03-13 Array camera module, molded photosensitive element and manufacturing method thereof, and electronic equipment
TW108117228A TWI706212B (en) 2016-03-28 2017-03-25 Camera module and manufacturing method of moulded photosensitive component
TW108117229A TWI706213B (en) 2016-03-28 2017-03-25 Camera module and its molded photosensitive component
TW106110048A TWI661258B (en) 2016-03-28 2017-03-25 Camera module and its molded photosensitive component
TW106204228U TWM555960U (en) 2016-03-28 2017-03-26 Photographing module and its molded photosensitive component and electronic equipment
US15/473,573 US9781325B1 (en) 2016-03-12 2017-03-29 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US15/473,609 US9906700B2 (en) 2016-03-12 2017-03-30 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US15/473,605 US10033913B2 (en) 2016-03-12 2017-03-30 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US15/473,607 US9826132B2 (en) 2016-03-12 2017-03-30 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
KR1020187034256A KR102147896B1 (en) 2016-04-28 2017-04-26 Photographic module and molding photosensitive assembly thereof, semi-finished product of molding photosensitive assembly and manufacturing method and electronic device
PCT/CN2017/082000 WO2017186120A2 (en) 2016-04-28 2017-04-26 Image capturing module and molded photosensitive assembly therefor, molded photosensitive assembly semi-finished product and manufacturing method, and electronic device
KR1020207019834A KR102281383B1 (en) 2016-04-28 2017-04-26 Image capturing module and molded photosensitive assembly therefor, molded photosensitive assembly semi-finished product and manufacturing method, and electronic device
EP17788772.6A EP3481046A4 (en) 2016-04-28 2017-04-26 Image capturing module and molded photosensitive assembly therefor, molded photosensitive assembly semi-finished product and manufacturing method, and electronic device
KR1020217022035A KR20210091363A (en) 2016-04-28 2017-04-26 Image capturing module and molded photosensitive assembly therefor, molded photosensitive assembly semi-finished product and manufacturing method, and electronic device
JP2018556877A JP6865232B2 (en) 2016-04-28 2017-04-26 Imaging modules, their molding photosensitive assemblies, semi-finished products of molding photosensitive assemblies, their manufacturing methods, and electronic devices.
US15/679,146 US10274694B2 (en) 2016-03-12 2017-08-16 Manufacturing method of a molded photosensitive assembly of an array imaging module
US15/705,232 US10126519B2 (en) 2016-03-12 2017-09-14 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US15/705,225 US10175447B2 (en) 2016-03-12 2017-09-14 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US15/784,167 US10578837B2 (en) 2016-03-12 2017-10-15 Molded photosensitive assembly for array imaging module for electronic device
US16/737,863 US20200218034A1 (en) 2016-03-12 2020-01-08 Molded Photosensitive Assembly for Array Imaging Module for Electronic Device and Manufacturing Method Thereof
US17/114,466 US11822099B2 (en) 2016-03-12 2020-12-07 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
JP2021060338A JP7344924B2 (en) 2016-04-28 2021-03-31 Imaging module manufacturing method
US17/678,347 US11824071B2 (en) 2016-03-28 2022-02-23 Camera module and molded photosensitive assembly and manufacturing method thereof, and electronic device
US17/740,887 US20220268968A1 (en) 2016-03-12 2022-05-10 Molded photosensitive assembly for array imaging module for electronic device and manufacturing method thereof

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CN109683434A (en) * 2017-10-18 2019-04-26 宁波舜宇光电信息有限公司 Camera module array
CN110278427A (en) * 2018-03-18 2019-09-24 宁波舜宇光电信息有限公司 Depth information camera module and its base assembly, electronic equipment and preparation method
CN110634960A (en) * 2018-06-21 2019-12-31 宁波舜宇光电信息有限公司 Photosensitive assembly, camera module, corresponding terminal equipment and manufacturing method

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Publication number Priority date Publication date Assignee Title
CN109683434A (en) * 2017-10-18 2019-04-26 宁波舜宇光电信息有限公司 Camera module array
CN109688303A (en) * 2017-10-18 2019-04-26 宁波舜宇光电信息有限公司 Photosensory assembly jigsaw, photosensory assembly, camera module and production method
CN109688299A (en) * 2017-10-18 2019-04-26 宁波舜宇光电信息有限公司 Camera module array and corresponding unitary substrate
CN109688298A (en) * 2017-10-18 2019-04-26 宁波舜宇光电信息有限公司 Camera module array and corresponding unitary substrate
CN109688303B (en) * 2017-10-18 2024-02-02 宁波舜宇光电信息有限公司 Photosensitive assembly jointed board, photosensitive assembly, camera shooting module and manufacturing method
CN109688298B (en) * 2017-10-18 2024-03-22 宁波舜宇光电信息有限公司 Camera module array and corresponding integrated substrate
CN109688299B (en) * 2017-10-18 2024-04-09 宁波舜宇光电信息有限公司 Camera module array and corresponding integrated substrate
CN109683434B (en) * 2017-10-18 2024-05-28 宁波舜宇光电信息有限公司 Camera module array
CN110278427A (en) * 2018-03-18 2019-09-24 宁波舜宇光电信息有限公司 Depth information camera module and its base assembly, electronic equipment and preparation method
CN110278427B (en) * 2018-03-18 2024-02-20 宁波舜宇光电信息有限公司 Depth information camera module, base assembly thereof, electronic equipment and preparation method
CN110634960A (en) * 2018-06-21 2019-12-31 宁波舜宇光电信息有限公司 Photosensitive assembly, camera module, corresponding terminal equipment and manufacturing method
CN110634960B (en) * 2018-06-21 2024-02-02 宁波舜宇光电信息有限公司 Photosensitive assembly, camera module, corresponding terminal equipment and manufacturing method

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