CN205726813U - A kind of electronic equipment - Google Patents
A kind of electronic equipment Download PDFInfo
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- CN205726813U CN205726813U CN201620130545.9U CN201620130545U CN205726813U CN 205726813 U CN205726813 U CN 205726813U CN 201620130545 U CN201620130545 U CN 201620130545U CN 205726813 U CN205726813 U CN 205726813U
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- heat
- electronic equipment
- power device
- circuit board
- conductive part
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Abstract
This utility model provides a kind of electronic equipment.This electronic equipment includes power device, circuit board, metal heat-conducting piece and insulating heat-conductive part, it is provided with pad on the first surface of circuit board, the main weld part of power device is welded on pad, it is provided with the thermally conductive pathways corresponding with power device between the first surface and the second surface relative with first surface of circuit board, insulating heat-conductive part is arranged on position corresponding with thermally conductive pathways on the second surface of circuit board, and be connected with power device formation heat conduction by thermally conductive pathways, metal heat-conducting piece contacts with insulating heat-conductive part to form heat conduction connection.By the way, this utility model makes electronic equipment have the excellent heat dispersion performance to power device.
Description
Technical field
This utility model relates to electronic technology field, particularly relates to a kind of electronic equipment with excellent heat dispersion performance.
Background technology
Electronic equipment of the prior art, the power device arranged on its circuit board heating when work runs is bigger, if the heat that power device produces can not well be spread out by electronic equipment, not only can reduce the heat dispersion of power device self, and easily affect the properly functioning of electronic equipment, reduce the service behaviour of electronic equipment.
Utility model content
In view of this, this utility model embodiment technical problem to be solved is to provide a kind of electronic equipment, has the excellent heat dispersion performance to power device.
For solving above-mentioned technical problem, the technical scheme that this utility model uses is: provide a kind of electronic equipment, including power device, circuit board, metal heat-conducting piece and insulating heat-conductive part, it is provided with pad on the first surface of circuit board, the main weld part of power device is welded on pad, it is provided with the thermally conductive pathways corresponding with power device between the first surface and the second surface relative with first surface of circuit board, insulating heat-conductive part is arranged on position corresponding with thermally conductive pathways on the second surface of circuit board, and be connected with power device formation heat conduction by thermally conductive pathways, metal heat-conducting piece contacts with insulating heat-conductive part to form heat conduction connection.
Wherein, the main weld part of power device is welded on pad by solder, and position corresponding with power device on first surface is provided with through hole, is provided with solder contact insulating heat-conductive part and power device, and then forms thermally conductive pathways in through hole.
Wherein, power device, circuit board, metal heat-conducting piece and insulating heat-conductive part stacked arrangement successively.
Wherein, the quantity of through hole is at least 1.
Wherein, electronic equipment also includes shell, contacts with metal heat-conducting piece to form heat conduction connection.
Wherein, the contact surface of metal heat-conducting piece and shell is positioned opposite to each other with the contact surface of metal heat-conducting piece and insulating heat-conductive part.
Wherein, between insulating heat-conductive part and thermally conductive pathways, between insulating heat-conductive part and metal heat-conducting piece and between metal heat-conducting piece and shell, it is provided with heat-conducting glue.
Wherein, electronic equipment also includes fixture, and circuit board, insulating heat-conductive part and metal heat-conducting piece are fixed on shell by fixture.
Wherein, fixture is screw and stud, and circuit board, insulating heat-conductive part and metal heat-conducting piece are respectively arranged with through hole, and stud is fixed on shell, and is placed through in the through hole of metal heat-conducting piece, and screw is locked on stud through the through hole of circuit board and insulating heat-conductive part.
Wherein, insulating heat-conductive part is insulating heat-conductive silica gel piece.
Pass through technique scheme, provide the benefit that produced by this utility model embodiment: by position corresponding with power device on the first surface of circuit board, through hole is set, thus it is provided with the thermally conductive pathways corresponding with power device between the first surface and second surface of circuit board, the heat that can be directly operationally produced by thermally conductive pathways diffusion power device so that electronic equipment has the excellent heat dispersion performance to power device.
Accompanying drawing explanation
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in describing below is embodiments more of the present utility model, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the sectional view of the preferred embodiment of this utility model electronic equipment；
Fig. 2 is the enlarged schematic partial view of electronic equipment shown in Fig. 1；
Fig. 3 is the bottom schematic view of the preferred embodiment of the circuit board of electronic equipment shown in Fig. 1；
Fig. 4 is the schematical top view of the preferred embodiment of the circuit board of electronic equipment shown in Fig. 1.
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model embodiment, technical scheme in this utility model embodiment is clearly and completely described, obviously, this utility model embodiments described below is only a part of embodiment of the present utility model rather than whole embodiments.Based on the embodiment in this utility model, all other embodiments that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into the scope of this utility model protection.
Fig. 1 is the sectional view of the preferred embodiment of this utility model electronic equipment, and Fig. 2 is the enlarged schematic partial view of electronic equipment shown in Fig. 1.Referring to shown in Fig. 1 and Fig. 2, the electronic equipment of the present embodiment includes power device 11, circuit board 12, metal heat-conducting piece 13, insulating heat-conductive part 14, shell 15, fixture 16 and thermally conductive pathways O.
In the present embodiment, circuit board 12, insulating heat-conductive part 14 and metal heat-conducting piece 13 are fixed on shell 15, and power device 11, circuit board 12, metal heat-conducting piece 13 and insulating heat-conductive part 14 stacked arrangement successively.
Circuit board 12, insulating heat-conductive part 14 and metal heat-conducting piece 13 lamination successively are preferably fixed on the shell 15 of electronic equipment by the present embodiment by fixture 16.Specifically, preferably fixture 16 is screw and stud, and accordingly, circuit board 12, insulating heat-conductive part 14 and metal heat-conducting piece 13 are respectively arranged with through hole 17.Wherein, stud is fixed on shell 15, and is placed through in the through hole 17 of metal heat-conducting piece 13, and screw is locked on stud through the through hole 17 of circuit board 12 and insulating heat-conductive part 14.Should be understood that circuit board 12, insulating heat-conductive part 14 and metal heat-conducting piece 13 can be fixed on shell 15 by other embodiments by other means.
Fig. 3 is the bottom schematic view of the preferred embodiment of the circuit board 12 of electronic equipment shown in Fig. 1, and Fig. 4 is the schematical top view of the preferred embodiment of the circuit board 12 of electronic equipment shown in Fig. 1.Refer to Fig. 3 and Fig. 4, pad 111,112,113 it is provided with on the first surface A of circuit board 12, the main weld part of power device 11, the weld part that i.e. power device 11 area in addition to metal pins is bigger, being welded on pad 111 by solder, the pin of power device 11 is welded on pad 112,113 by solder.Being provided with through hole 18 on position corresponding with power device 11 on the first surface A of circuit board 12, through hole 18 is not only provided on the region of pad 111 correspondence, is also disposed on other positions that power device 11 bottom surface is relative with circuit board 12.Further, being provided with solder, thus form thermally conductive pathways O in through hole 18, this thermally conductive pathways O contacts with insulating heat-conductive part 14 and power device 11 respectively, thus dispels the heat power device 11.Wherein, the quantity of through hole 18 is at least 1, and specifically, in the embodiment that Fig. 3 with Fig. 4 is corresponding, the quantity of through hole 18 is 56.
Insulating heat-conductive part 14 is arranged on position corresponding with thermally conductive pathways O on the second surface B of circuit board 12, and forms heat conduction by thermally conductive pathways O with power device 11 and be connected, and metal heat-conducting piece 13 contacts with insulating heat-conductive part 14 to form heat conduction connection.
Metal heat-conducting piece 13 contacts with shell 15, to form heat conduction connection.Further, metal heat-conducting piece 13 and the contact surface of shell 15, positioned opposite to each other with the contact surface of metal heat-conducting piece 13 and insulating heat-conductive part 14.The preferred metal heat-conducting piece of the present embodiment 13 is strip aluminium block, and preferably insulating heat-conductive part 14 is insulating heat-conductive silica gel piece.
Further, between insulating heat-conductive part 14 and thermally conductive pathways O, heat-conducting glue (not shown) between insulating heat-conductive part 14 and metal heat-conducting piece 13 and between metal heat-conducting piece 13 and shell 15, it is provided with.Certainly, in other embodiments, between insulating heat-conductive part 14 and thermally conductive pathways O, between insulating heat-conductive part 14 and metal heat-conducting piece 13 and between metal heat-conducting piece 13 and shell 15, it is also provided with other Heat Conduction Materials, such as the combination in any of heat-conducting metal etc..
In sum, understand the present embodiment by arranging through hole 18, and in through hole 18, add solder, thus between the first surface A and second surface B of circuit board 12, it is provided with the thermally conductive pathways O corresponding with power device 11, the heat that can be directly operationally produced by thermally conductive pathways O diffusion power device 11 so that electronic equipment has the excellent heat dispersion performance to power device 11.
Power device 11 mentioned by this utility model embodiment full text is SMT (Surface Mount Technology, surface mounting technology) power device, as a example by metal-oxide-semiconductor, certainly it is not limited to metal-oxide-semiconductor, can be any electronic device needing heat radiation.
Referring again to Fig. 4, in the technique that surface mount elements carries out Reflow Soldering, when the main weld part of power device is welded in pad 111, solder can automatically flow into the through hole 18 and other adjacent through holes 18 arranged on pad 111, thus forms thermally conductive pathways.
Therefore, this utility model is particularly suited for reflow soldering process, and by arranging multiple through hole on main pad and adjacent area thereof, when carrying out Reflow Soldering, solder, while welding main weld part and pad, can be filled in through hole, form multiple thermally conductive pathways.Owing to the position that the second surface at circuit board is corresponding with thermally conductive pathways is provided with insulating heat-conductive part, form heat conduction by thermally conductive pathways with power device to be connected, therefore metal heat-conducting piece contacts with insulating heat-conductive part to form heat conduction connection, it is thus possible to the heat directly operationally produced by thermally conductive pathways diffusion power device so that electronic equipment has the excellent heat dispersion performance to power device.
It should be noted that about the direction term arrived mentioned by embodiment of the present utility model, the most upper and lower, relative or corresponding etc., it is only the direction with reference to annexed drawings, described direction term is merely illustrative not for limiting this utility model.
Again illustrate; the foregoing is only embodiment of the present utility model; not thereby the scope of the claims of the present utility model is limited; every equivalent structure utilizing this utility model description and accompanying drawing content to be made or equivalence flow process conversion; between the most each embodiment, technical characteristic be combined with each other; or directly or indirectly it is used in other relevant technical fields, the most in like manner it is included in scope of patent protection of the present utility model.
Claims (10)
1. an electronic equipment, it is characterized in that, including power device, circuit board, metal heat-conducting piece and insulating heat-conductive part, it is provided with pad on the first surface of described circuit board, the main weld part of described power device is welded on described pad, it is provided with the thermally conductive pathways corresponding with described power device between the first surface and the second surface relative with first surface of described circuit board, described insulating heat-conductive part is arranged on position corresponding with described thermally conductive pathways on the second surface of described circuit board, and be connected with the formation heat conduction of described power device by described thermally conductive pathways, described metal heat-conducting piece contacts with described insulating heat-conductive part to form heat conduction connection.
Electronic equipment the most according to claim 1, it is characterized in that, the main weld part of described power device is welded on described pad by solder, it is provided with through hole on position corresponding with described power device on described first surface, it is provided with insulating heat-conductive part described in solder contact and described power device in described through hole, and then forms described thermally conductive pathways.
Electronic equipment the most according to claim 2, it is characterised in that described power device, described circuit board, described metal heat-conducting piece and insulating heat-conductive part stacked arrangement successively.
Electronic equipment the most according to claim 2, it is characterised in that the quantity of described through hole is at least 1.
Electronic equipment the most according to claim 1, it is characterised in that described electronic equipment also includes shell, described shell contacts with described metal heat-conducting piece to form heat conduction connection.
Electronic equipment the most according to claim 5, it is characterised in that the contact surface of described metal heat-conducting piece and described shell is positioned opposite to each other with the contact surface of described metal heat-conducting piece and described insulating heat-conductive part.
Electronic equipment the most according to claim 5, it is characterised in that be provided with heat-conducting glue between described insulating heat-conductive part and described thermally conductive pathways, between described insulating heat-conductive part and described metal heat-conducting piece and between described metal heat-conducting piece and described shell.
Electronic equipment the most according to claim 5, it is characterised in that described electronic equipment also includes fixture, described circuit board, described insulating heat-conductive part and described metal heat-conducting piece are fixed on the housing by described fixture.
Electronic equipment the most according to claim 8, described fixture is screw and stud, described circuit board, described insulating heat-conductive part and described metal heat-conducting piece are respectively arranged with through hole, described stud is fixed on described shell, and be placed through in the through hole of described metal heat-conducting piece, described screw is locked on described stud through the through hole of described circuit board and described insulating heat-conductive part.
Electronic equipment the most according to claim 1, it is characterised in that described insulating heat-conductive part is insulating heat-conductive silica gel piece.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521135644 | 2015-12-31 | ||
| CN2015211356448 | 2015-12-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205726813U true CN205726813U (en) | 2016-11-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620130545.9U Active CN205726813U (en) | 2015-12-31 | 2016-02-19 | A kind of electronic equipment |
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| Country | Link |
|---|---|
| CN (1) | CN205726813U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105636344A (en) * | 2015-12-31 | 2016-06-01 | 福建睿能科技股份有限公司 | Electronic device |
| CN109496462A (en) * | 2017-12-29 | 2019-03-19 | 深圳市大疆创新科技有限公司 | Center plate unit and unmanned vehicle |
-
2016
- 2016-02-19 CN CN201620130545.9U patent/CN205726813U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105636344A (en) * | 2015-12-31 | 2016-06-01 | 福建睿能科技股份有限公司 | Electronic device |
| CN109496462A (en) * | 2017-12-29 | 2019-03-19 | 深圳市大疆创新科技有限公司 | Center plate unit and unmanned vehicle |
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| C14 | Grant of patent or utility model | ||
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