CN205464804U - Laser processing system's intelligence processing subassembly - Google Patents
Laser processing system's intelligence processing subassembly Download PDFInfo
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- CN205464804U CN205464804U CN201521018095.6U CN201521018095U CN205464804U CN 205464804 U CN205464804 U CN 205464804U CN 201521018095 U CN201521018095 U CN 201521018095U CN 205464804 U CN205464804 U CN 205464804U
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Abstract
The utility model provides a laser processing system's intelligence processing subassembly, including controlling means and with the one or more function element carrier device that controlling means connects, wherein, function element carrier device includes a plurality of load -bearing part, load -bearing part is used for bearing the function element, and every on the function element carrier device at least one load -bearing part is by immigration laser transmission route when processing at every turn, and controlling means is used for electric and/or the mechanical control of function element, and be used for with on the function element carrier device the load -bearing part immigration perhaps will in the laser transmission route load -bearing part follows laser transmission puts aside in the route. Above -mentioned intelligence processing subassembly can be realized the rapid continuous processing of the multistep of work piece and process a plurality of work pieces simultaneously, has greatly improved production efficiency.
Description
Technical field
This utility model relates to laser-processing system, relates more specifically to the Intelligent Machining assembly of laser-processing system.
Background technology
Laser processing technology has been widely used in commercial production and life due to its superior processing characteristics.Generally, laser-processing system use optical element 101 laser beam 102 is transmitted (such as focusing on) to workpiece 103 to be processed, as shown in Figure 1.Above-mentioned optical element can be condenser lens/battery of lens or the scanning focused mirror group combined with scanning galvanometer.Nowadays, laser is increasingly being used for the processed of multi-C stereo material, and owing to shape and the combination of materials of material to be processed tend to complicated, this also makes the difficulty of Laser Processing become much larger.Meanwhile, require to realize multi-functional and multi-processing step more and more on same workpiece to be processed, the such as cutting of fragile material periphery, chamfering, cut/hole, cut/drill flute etc..
Existing laser-processing system can only realize being processed a workpiece or procedure of processing same to multiple work piece operations simultaneously at a time point, and between different procedure of processings, often need to re-calibrate the position of workpiece, this just extends the process time of workpiece, and significantly reduces yield rate and production efficiency.
Such as international publication number is the PCT Patent Application of WO2011/158539A1, and wherein the optic 113 of laser processing device 101 includes: beam expander 171, galvanometer scanner 172a, 172b and lens 173 (seeing WO2011/158539A1 description 0046 section and accompanying drawing 7).One thin-film solar cell panel 102 can only be processed by this optic 113 at a time point.If next thin-film solar cell panel machine to be processed, then need first to be removed from pedestal by the solar panel of completion of processing.Or, if the solar panel of completion of processing to carry out other process operation, then need to change each optical element in optic 113.Visible, existing laser-processing system has been difficult to meet modern industry production and the neomorph and newly-designed higher demand proposing fragile material of living.
Utility model content
In order to overcome drawbacks described above of the prior art, the utility model proposes a kind of Intelligent Machining assembly, including controlling device and the one or more function element carrier arrangements being connected with described control device, wherein, described function element carrier arrangement includes multiple load bearing component, described load bearing component is moved into laser emission path at least one the described load bearing component on bearing function element, and each described function element carrier arrangement when each processed；And described control device for described function element electrically and/or Mechanical course, and for the described load bearing component on described function element carrier arrangement being moved into described laser emission path or described load bearing component being removed from described laser emission path.
In one embodiment, described load bearing component can not carry any described function element.Described function element can include one or more in optical element, electrical equipment and mechanical organ.Described optical element can be one or more in the following: filter plate, polarization wave plate, Polarization Modulation, reflecting mirror, refracting telescope, prism, light barrier, lens, diffraction plate, optical modulator, optical shaping element and optical switch；Described electrical equipment can be one or more in the following: electric modulator, electricity trigger and electricity display；And described mechanical organ can be one or more in the following: mechanical switch, mechanical shutter.
In another embodiment, if only including a described function element carrier arrangement, then the described function element that the plurality of load bearing component is carried is moved into described laser emission path when each processed.
Wherein, before processed, described control device requires to determine required described function element according to processing technique, controls described function element carrier arrangement and moves corresponding described load bearing component moves into described laser emission path, and starts or open required described function element.Further, after processed, described control device disables or closes the described function element used, and is removed from described laser emission path by corresponding described load bearing component.
In one embodiment, described function element carrier arrangement is presented as rotating disk, and described load bearing component on described rotating disk in uniform or symmetrical.Wherein, described function element carrier arrangement can move into described laser emission path by making the described load bearing component of correspondence clockwise or counterclockwise or remove from described laser emission path.
Accompanying drawing explanation
It is for providing, present disclosure to be further understood from including accompanying drawing.Accompanying drawing shows the embodiment of present disclosure, and plays the effect explaining present disclosure principle together with this specification.After combining accompanying drawing and having read the following embodiment to specific non-limiting present disclosure, technical scheme and the advantage thereof of present disclosure will become clear from.Wherein:
Fig. 1 shows the schematic diagram that in prior art, workpiece is processed by laser by optical element.
Fig. 2 shows the structural representation of the Intelligent Machining assembly according to an embodiment of the present utility model.
Fig. 3 shows the schematic diagram of the kind of the function element according to an embodiment of the present utility model.
Fig. 4 shows the schematic diagram of the effect of the function element according to an embodiment of the present utility model.
Fig. 5 shows the schematic diagram of the kind of the optical element according to an embodiment of the present utility model.
Fig. 6 shows the schematic diagram of function element operation principle in an embodiment of the present utility model.
Fig. 7 shows the schematic diagram of the Intelligent Machining assembly according to an embodiment of the present utility model.
Fig. 8-1 shows the schematic diagram of the Intelligent Machining assembly according to another embodiment of the present utility model.
Fig. 8-2 shows the schematic diagram of the processed flow process simultaneously carried out two workpieces.
Fig. 8-3 shows the schematic diagram of the function element carrier arrangement for the processed flow process shown in Fig. 8-2.
Fig. 8-4 shows the schematic diagram that two workpieces carry out different processed flow processs.
Fig. 8-5 shows the schematic diagram of the function element carrier arrangement for the processed flow process shown in Fig. 8-4.
Fig. 9 shows that the function element according to an embodiment of the present utility model includes the schematic diagram of optical element and the combination of electrical equipment.
Figure 10 shows that the function element according to another embodiment of the present utility model only includes the schematic diagram of optical element.
Figure 11 shows the schematic diagram of the processed flow process according to an embodiment of the present utility model.
Figure 12 shows the schematic diagram of the function element carrier arrangement according to an embodiment of the present utility model.
Figure 13 shows the schematic diagram of the function element carrier arrangement according to another embodiment of the present utility model.
Detailed description of the invention
With reference to non-limiting example that is shown in the drawings and that describe in detail in the following description, more completely multiple technical characteristics of present disclosure and Advantageous details.Further, below description have ignored the description to known original material, treatment technology, assembly and equipment, in order to avoid unnecessarily obscuring the technical essential of present disclosure.But, skilled artisans appreciate that, when being described below the embodiment of present disclosure, describe and particular example is only used as way of illustration and not by way of limitation and is given.
In the case of any possible, identical labelling will be used to represent same or analogous part in all of the figs.In addition, although the term used in present disclosure is to select from public term, but some terms mentioned in the description of present disclosure are probably what disclosure people was selected by his or her judgement, its detailed meanings explanation in the relevant portion of description herein.Additionally, require not only by the actual terms used, and it is also to the meaning by each term is contained and understands present disclosure.
Fig. 2 shows the structural representation of the Intelligent Machining assembly according to an embodiment of the present utility model.Wherein, Intelligent Machining assembly 200 includes controlling device 204 and multiple function element carrier arrangement 205.This function element carrier arrangement 205 includes one or more load bearing component, this load bearing component is used for carrying one or more function element 201, this control device 204 for controlling the movement of this function element carrier arrangement 205, and for each function element 201 of being positioned on this function element carrier arrangement 205 electrically and/or Mechanical course and driving.
Function element 201 includes but not limited to optical element, electrical equipment and mechanical organ, as shown in Figure 3.Individual feature element can also be the combination of optical element, electrical equipment and mechanical organ.Wherein, optical element is mainly used in control and the modulation of laser beam, and electrical equipment is mainly used in other assemblies or the electrical control of system of laser-processing system, and mechanical organ is mainly used in other assemblies or the Mechanical course of system of laser-processing system.The function of function element includes but not limited to modulation, shaping and control, as shown in Figure 4.
When function element is optical element, it may include but be not limited to filter plate, polarization wave plate, Polarization Modulation, reflecting mirror, refracting telescope, prism, light barrier, lens, diffraction plate, optical modulator, optical shaping element etc., as shown in Figure 5.Optical element can be some wavelength, it is also possible to be two or more wavelength.Optical functional element can the most sequentially be arranged in laser emission path, it is also possible to is arranged in the most side by side in laser emission path, and this point can be described in detail in each embodiment herein below.Optical functional element can accept to control the single control of device, it is possible to is controlled the synchronized Coordinative Control of device together with other optical functional element.
Electric function element in Intelligent Machining assembly of the present utility model includes but not limited to electric modulator, electricity trigger, electricity display and other electronic building brick or system control component etc..Similar with optical functional element, electric function element individually can control with controlled device, it is also possible to the synchronized Coordinative Control of controlled device common with other electric function elements.
Mechanical functional elements in Intelligent Machining assembly of the present utility model includes but not limited to mechanical shutter switch, mechanical shutter etc..Similar with optical functional element, mechanical functional elements individually can control with controlled device, it is also possible to the synchronized Coordinative Control of controlled device common with other mechanical functional elements.
Fig. 9 shows that the function element according to an embodiment of the present utility model includes the schematic diagram of optical element and the combination of electrical equipment, and fragile material specifically carries out the schematic diagram of the function element composition of cutting process 900.Wherein mechanical switch, electric modulator, optical attenuator element, optical shaping element, condenser lens, scanning galvanometer and diffraction plate broadly fall into function element 901.First, mechanical switch is removed from laser emission path, so that laser beam 902 is by (i.e. this time Laser Processing processes and need not mechanical organ).It follows that electric modulator to be moved into laser emission path, the laser beam frequency of modulation process requirement and/or laser pulse train；Optical attenuator element is moved into laser emission path, the laser beam power of adjusting process requirement or energy；Optical shaping element is moved into laser emission path, the laser beam space shape that adjusting process requires；Condenser lens is moved into laser emission path, laser beam to be converged to workpiece 903；Scanning galvanometer is removed from laser emission path, because fragile material cutting is not usually required to scanning galvanometer；Further, diffraction plate is moved into laser emission path, to control and to optimize laser focusing.As can be seen here, the function element 901 comprised in Intelligent Machining assembly can be the combination of optical element and electrical equipment.It will be understood by those skilled in the art that function element also can include this three of optical element, electrical equipment and mechanical organ or optical element and mechanical organ and the combination of electrical equipment simultaneously.Certainly, the kind of optical element, electrical equipment and mechanical organ is not limited to shown in Fig. 9.
Figure 10 shows that the function element according to another embodiment of the present utility model only includes the schematic diagram of optical element, is specifically related to carry out fragile material the schematic diagram of the function element composition that chamfering/boring processes 1000.Specifically, owing to the processing technique of fragile material chamfering/boring is without using mechanical switch, electric modulator, optical attenuator element, optical shaping element, condenser lens and diffraction plate, therefore they are removed from laser emission path, but need to move in laser emission path scanning galvanometer.As can be seen here, the function element 1001 in this utility model can only comprise optical element.It will be appreciated to those of skill in the art that and can include multiple optical element, and be not limited to shown in Figure 10.
Fig. 6 shows the schematic diagram of function element working method in an embodiment of the present utility model.Wherein, when the corresponding function element of needs 601 plays its effect in laser-processing system, then it is made to move in the laser emission path of correspondence；When need not this function element 601 to when such as laser beam 602 processes or controls, then it is made to remove from laser emission path.Using an advantage of this working method is laser beam and the position of workpiece does not changes, between different procedure of processings, need not re-calibrate the position of workpiece, this just highly shortened the process time of workpiece, and improves yield rate and production efficiency.
Fig. 7 shows the schematic diagram of a kind of implementation of function element carrier arrangement of the present utility model.Wherein, function element carrier arrangement 701 is a rotating disk in regular polygon, and it includes 6 load bearing component 7021-7026, and this load bearing component is used for bearing function element, and can be clockwise or counterclockwise, naturally it is also possible to horizontal or vertically mobile.It will be appreciated by persons skilled in the art that it is only exemplary shown in Fig. 7, function element carrier arrangement is not necessarily in regular polygon, it is also possible to be other shapes, such as circular, rectangle or other are irregularly shaped.On function element carrier arrangement, the number of load bearing component is also not necessarily six, but can be set to more than 6 (such as 8,10 or more) or less than 6 (such as 3-5) according to the needs of processing technique.And the distribution that load bearing component is on function element carrier arrangement also needs not to be uniform or symmetrical.
Each Laser Processing is processed, the function element that laser beam is carried by a load bearing component on function element carrier arrangement.In the figure 7, the load bearing component that solid line circle represents represents the load bearing component (i.e. load bearing component 7021) having light beam to pass through, and the load bearing component that dashed circle represents represents the load bearing component (i.e. load bearing component 7022-7026) that light beam does not passes through.It should be noted that, load bearing component can not also carry any function element (being sky), so that laser beam directly passes through.In one embodiment, different types of function element can be set on each load bearing component of function element carrier arrangement, and function element is all required for laser processing technology.Such as, procedure of processing 1 needs to use and is positioned at the function element on load bearing component 7021, and procedure of processing 2 needs to use and is positioned at the function element on load bearing component 7022, and procedure of processing 3 needs to use and is positioned at the function element on load bearing component 7023, by that analogy.
So, when being processed step 1, the load bearing component 7021 on function element carrier arrangement 701 is made to be directed at (or immigration) laser emission path；When being processed step 2, the function element that turns clockwise carrier arrangement 701, so that the load bearing component 7022 on function element carrier arrangement 701 is directed at (or immigration) laser emission path；By that analogy.It will be understood by those skilled in the art that, owing to Laser Processing processing procedure often needs to use multiple different types of function element in a procedure of processing, therefore laser-processing system needs to include multiple function element carrier arrangement, thus the function element number less (such as 1-2) required for being possible that wherein certain procedure of processing, then only need to make on other function element carrier arrangements in addition to the function element carrier arrangement that correlation function element is provided for empty load bearing component immigration laser emission path.Using an advantage of this working method is laser beam and the position of workpiece does not changes, and need not re-calibrate the position of workpiece between different procedure of processings.So, can realize being continuously finished multiple procedure of processing to workpiece, drastically increase production efficiency, and shorten process time.
As a example by Figure 11, the process of chamfering/boring after now needing fragile material is first cut.nullSo，In the embodiment shown in Fig. 9 and 10，The Intelligent Machining assembly that the utility model proposes can include that 6 function element carrier arrangements are (owing to Fig. 9 and 10 does not all use mechanical switch，Therefore the function element carrier arrangement of carrying mechanical switch is omitted)，Load bearing component thereon is disposed with function element 901，I.e. electric modulator、Optical attenuator element、Optical shaping element、Condenser lens、Scanning galvanometer and diffraction plate，I.e. according to order from top to bottom，It is provided with electric modulator on one load bearing component of the 1st function element carrier arrangement，It is provided with optical attenuator element on one load bearing component of the 2nd function element carrier arrangement，It is provided with optical shaping element on one load bearing component of the 3rd function element carrier arrangement，It is provided with condenser lens on one load bearing component of the 4th function element carrier arrangement，It is provided with scanning galvanometer on one load bearing component of the 5th function element carrier arrangement，It is provided with diffraction plate on one load bearing component of the 6th function element carrier arrangement.It addition, each function element carrier arrangement is additionally provided with the load bearing component into room, the function element carrier arrangement controlling device record function element and correspondence thereof in Intelligent Machining assembly and corresponding load bearing component.
When fragility workpiece is carried out cutting process, control device according to processing process and to require to make each function element carrier arrangement move to the position specified, even the electric modulator of carrying moves into laser emission path on the 1st function element carrier arrangement, the optical attenuator element of carrying on the 2nd function element carrier arrangement is made to move into laser emission path, by that analogy.Wherein, owing to need not use scanning galvanometer in cutting process, therefore control device and make to be arranged on the 5th function element carrier arrangement the load bearing component immigration laser emission path in room, so that light beam directly passes through.
After cutting process is complete, control device and carry out chamfered according to processing process, i.e. need from laser emission path, remove electric modulator, optical attenuator element, optical shaping element, condenser lens and diffraction plate, and the room load bearing component on the function element carrier arrangement at function element place is moved into laser emission path, the scanning galvanometer of carrying on 5th function element carrier arrangement is moved into laser emission path, to carry out chamfered simultaneously.Using an advantage of this working method is laser beam and the position of workpiece does not changes, between different procedure of processings, and such as cutting and chamfering, it is not necessary to re-calibrate the position of workpiece.So, can realize being continuously finished multiple procedure of processing to workpiece, drastically increase production efficiency, and shorten process time.
It is understood that required function element putting in order on function element carrier arrangement need not be the most corresponding with laser processing technology flow process.I.e., function element can arrange according to the order corresponding with technological process on function element carrier arrangement the most clockwise or counterclockwise, can also be arbitrarily set on each load bearing component, as long as the device that controls in Intelligent Machining assembly of the present utility model records each function element on each function element carrier arrangement and the load bearing component of correspondence thereof, just can determine the function element required for each step according to this processing process performed, and each function element on corresponding load bearing component is moved into laser emission path.
Fig. 8-1 shows the schematic diagram of the another kind of implementation of function element carrier arrangement of the present utility model.Wherein, the difference of Fig. 8-1 and Fig. 7 is in the figure 7, and a function element carrier arrangement 701 only load bearing component 7021 allows light beam to pass through；And in Fig. 8-1, function element carrier arrangement 801 allows two load bearing components 8021,8025 to be simultaneously in laser emission path.It will be appreciated to those of skill in the art that can also allow for two or more load bearing component is simultaneously in laser emission path.Certainly, the number of load bearing component can be more or less than 6.Additionally, can there be one or more load bearing component being arranged to room on function element carrier arrangement.Function element carrier arrangement shown in Fig. 8-1 can also be supported to be processed multiple workpieces simultaneously.
Fig. 8-2 shows the schematic diagram of the processed flow process simultaneously carried out two workpieces.Fig. 8-3 shows the schematic diagram of the function element carrier arrangement for the processed flow process shown in Fig. 8-2.As shown in Fig. 8-2, identical with the processed flow process of 2 to workpiece 1, it is all first to carry out cutting process to carry out chamfered again.As shown in the left figure of Fig. 8-3, the load bearing component 8021 and 8025 of function element carrier arrangement 801 is provided that identical cutting function element 8031, load bearing component 8022 and 8026 is provided that identical chamfering function element 8032.
When carrying out cutting process (shown in figure as left in Fig. 8-3) so that the cutting function element 8031 on load bearing component 8021 and 8025 is in laser emission path, thus workpiece 1 and 2 is carried out cutting process simultaneously.After cutting process is complete (shown in figure as right in Fig. 8-3), function element carrier arrangement 801 can be by turning clockwise so that the cutting function element 8031 on load bearing component 8021 and 8025 is removed from laser emission path, and the chamfering function element 8032 on load bearing component 8022 and 8026 is in laser emission path, thus continues workpiece 1 and 2 to be carried out chamfered simultaneously.Skilled artisans appreciate that is, more than 2 workpieces can also be processed by the above-mentioned course of processing simultaneously, and processing process is also not necessarily limited to two operating procedures, can support the technological process of two or more procedure of processing, those skilled in the art only need to arrange corresponding function element according to the needs of actual process flow process on the load bearing component of function element carrier arrangement.So, can be achieved with multiple workpieces being processed by controlling a function element carrier arrangement simultaneously, therefore drastically increase production efficiency.
Fig. 8-4 shows the schematic diagram of the processed flow process differing two workpieces.Fig. 8-5 shows that the function element for the processed flow process shown in Fig. 8-4 cuts the schematic diagram of body device.As shown in fig. 8-4, workpiece 1 is first carried out cutting process A and carries out chamfered A again, workpiece 2 is first carried out cutting process B and carries out chamfered B again.Although it should be noted that to two workpieces be all first to cut chamfering again, but two shown in Fig. 8-4 cutting process A and B can differing, same above-mentioned two chamfered A and B can also differ.
As shown in the left figure of Fig. 8-5, cutting function element A (8031) it is provided with on the load bearing component 8021 of function element carrier arrangement 801, chamfering function element A (8032) it is provided with on load bearing component 8022, it is provided with cutting function element B (8033) on load bearing component 8025, load bearing component 8026 is provided with chamfering function element B (8034).Wherein cutting function element A (8031) and B (8033) can differ, and chamfering function element A (8032) and B (8034) can also differ.When carrying out cutting process, cutting function element A (8031) on load bearing component 8021 and cutting function element B (8033) on load bearing component 8025 are in laser emission path, two workpieces can be carried out different cutting operations simultaneously.
After cutting operation terminates (shown in figure as right in Fig. 8-5), function element carrier arrangement 801 is by turning clockwise so that cutting function element A (8031) on load bearing component 8021 and cutting function element B (8033) on load bearing component 8025 are removed from laser emission path, make chamfering function element A (8032) on load bearing component 8022 and chamfering function element B (8034) on load bearing component 8026 move into laser emission path simultaneously, can realize two workpieces carry out different chamfering operations simultaneously.Identical with Fig. 8-2,8-3, the unlimited number of workpiece, in 2, can be more than 2；Processing process is also not necessarily limited to two operating procedures, can support the technological process of two or more procedure of processing, those skilled in the art only need to arrange corresponding function element according to the needs of actual process flow process on the load bearing component of function element carrier arrangement.
Figure 12 shows the schematic diagram of the function element carrier arrangement according to an embodiment of the present utility model.As shown in figure 12, the load bearing component of the 1st function element carrier arrangement 1201 arranges one or more electric modulator 1203.When being provided with multiple electric modulator, these multiple electric modulators have different technical parameters, in order to process different workpieces.Can there is 0 on 1st function element carrier arrangement 1201 or 1 load bearing component is sky, depending on this can be according to processing process.Similarly, the load bearing component of the 2nd function element carrier arrangement 1201 arranges one or more optical attenuator element 1204.When being provided with multiple optical attenuator element, these multiple optical attenuator elements have different technical parameters, in order to process different workpieces.Can also there is 0 on 2nd function element carrier arrangement 1201 or 1 load bearing component is sky.One or more diffraction plate 1205 is set on the load bearing component of the 3rd function element carrier arrangement 1201.When being provided with multiple diffraction plate, these multiple diffraction plates have different technical parameters, in order to process different workpieces.According to technological process, 0 or 1 load bearing component can also be set to sky on 3rd function element carrier arrangement.
In one embodiment, each load bearing component of each function element carrier arrangement 1201 arranges required function element, and makes control device record the function element carrier arrangement of each function element and correspondence and corresponding load bearing component.When processed starts, control device, according to this technological requirement, the load bearing component carrying required function element on each function element carrier arrangement 1201 is moved into laser emission path, as shown in figure 12, the load bearing component 1 of 3 function element carrier arrangements 1201 will move into laser emission path (other load bearing components all do not have light beam 1202 to pass through), then start processed.
After the operation of this workpiece processed is terminated, control device and relevant function element is carried out electric and/or Mechanical course and driving, such as to corresponding function element power-off (or closedown).It follows that next workpiece (can have the material different from previous workpiece, thickness etc.) is processed by Intelligent Machining assembly.Control device according to (or can also being one or two in this three to the technological requirement of this next workpiece selection electric modulator 1203 of relevant art parameter, optical attenuator element 1204 and diffraction plate 1205, for the function element carrier arrangement without providing respective functional elements, the load bearing component being empty moves into laser emission path), and the load bearing component carrying above-mentioned required function element is moved into laser emission path.Then relevant function element is carried out electric and/or Mechanical course and driving, such as, starts (or opening) corresponding function element.
In the above-described embodiments, only need to once load the function element on multiple function element carrier arrangement, can be achieved with the processed of continuous several times to multiple workpieces, and the parameter of the function element needed for will manually changing required function element without processing every time and/or manually regulate, it is greatly saved process time, improves production efficiency.
Figure 13 shows the schematic diagram of the function element carrier arrangement according to another embodiment of the present utility model.The difference of Figure 13 with Figure 12 is, a workpiece is the most only processed by Figure 12, and multiple workpieces can be processed by Figure 13 simultaneously.With Figure 12 similarly, it is respectively arranged with the electric modulator 1303 of different technologies parameter, optical attenuator element 1304 and diffraction plate 1305 on 3 function element carrier arrangements 1301 in Figure 13, and each function element carrier arrangement 1301 can be provided with the load bearing component that 0 or 1 is sky.
As shown in figure 13, in one embodiment, control device record and there is the function element of different technologies parameter and the function element carrier arrangement 1301 of correspondence thereof and corresponding load bearing component and the position of multiple workpiece, and before each processed, control the device technological requirement according to these multiple workpieces to be processed (being likely to be of different material, thickness etc. each other) and required function element is moved into respectively the laser emission path of correspondence, i.e. in Figure 13 corresponding to load bearing component 1,3.Then relevant function element carrying out electric and/or Mechanical course and driving, such as, starts (or opening) corresponding function element, processed starts.
It will be appreciated by persons skilled in the art that the unlimited number of workpiece, can be with more than two in 2；The number of function element carrier arrangement also needs not to be 3, can be more or less than 3；Meanwhile, what the kind of function element was also not necessarily limited to shown in Figure 13 is several, it is also possible to be one or more in optical element described previously herein, electrical equipment and mechanical organ or function element not mentioned but the most commonly used in the art.
Embodiment shown in Figure 13 compares the embodiment shown in Figure 12, can be while the multiple workpiece of single treatment, it is achieved the process to the continuous several times of more workpieces, further increases production efficiency, shortens the production time.
Although embodiments more of the present utility model are described by present specification, but it will be apparent for a person skilled in the art that these embodiments are merely possible to shown in example.It may occur to persons skilled in the art that numerous flexible program, replacement scheme and improvement projects and without departing from scope of the present utility model.Appended claims is intended to limit scope of the present utility model, and thereby contains the method and structure in the range of these claim itself and equivalents thereof.
Claims (9)
1. an Intelligent Machining assembly for laser-processing system, including controlling device and the one or more function element carrier arrangements being connected with described control device, wherein,
Described function element carrier arrangement includes multiple load bearing component, and described load bearing component is moved into laser emission path at least one the described load bearing component on bearing function element, and each described function element carrier arrangement when each processed；And
Described control device is for the electric of described function element and/or Mechanical course, and is used for the described load bearing component on described function element carrier arrangement being moved into described laser emission path or being removed from described laser emission path by described load bearing component.
2. Intelligent Machining assembly as claimed in claim 1, wherein said load bearing component can not carry any described function element.
3. Intelligent Machining assembly as claimed in claim 1, wherein said function element includes one or more in optical element, electrical equipment and mechanical organ.
4. Intelligent Machining assembly as claimed in claim 3, wherein said optical element is one or more in the following: filter plate, polarization wave plate, Polarization Modulation, reflecting mirror, refracting telescope, prism, light barrier, lens, diffraction plate, optical modulator, optical shaping element and optical switch.
5. Intelligent Machining assembly as claimed in claim 3, wherein said electrical equipment is one or more in the following: electric modulator, electricity trigger and electricity display.
6. Intelligent Machining assembly as claimed in claim 3, wherein said mechanical organ is one or more in the following: mechanical switch, mechanical shutter.
7. Intelligent Machining assembly as claimed in claim 1, if wherein only including a described function element carrier arrangement, then the described function element that the plurality of load bearing component is carried is moved into described laser emission path when each processed.
8. Intelligent Machining assembly as claimed in claim 1, wherein said function element carrier arrangement is presented as rotating disk, and described load bearing component on described rotating disk in uniform or symmetrical.
9. Intelligent Machining assembly as claimed in claim 8, wherein said function element carrier arrangement moves into described laser emission path by making the described load bearing component of correspondence clockwise or counterclockwise or removes from described laser emission path.
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| CN201521018095.6U CN205464804U (en) | 2015-12-10 | 2015-12-10 | Laser processing system's intelligence processing subassembly |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106881527A (en) * | 2015-12-10 | 2017-06-23 | 彭翔 | The Intelligent Machining component of laser-processing system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106881527A (en) * | 2015-12-10 | 2017-06-23 | 彭翔 | The Intelligent Machining component of laser-processing system |
| CN106881527B (en) * | 2015-12-10 | 2020-07-03 | 彭翔 | Intelligent processing assembly of laser processing system |
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