CN205427902U - Ring type smart card of absorption formula - Google Patents
Ring type smart card of absorption formula Download PDFInfo
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- CN205427902U CN205427902U CN201521061222.0U CN201521061222U CN205427902U CN 205427902 U CN205427902 U CN 205427902U CN 201521061222 U CN201521061222 U CN 201521061222U CN 205427902 U CN205427902 U CN 205427902U
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Abstract
The utility model relates to a ring type smart card of absorption formula is by the card base body carrier ring body, radio frequency circuit layer, shielding layer, adsorbed layer, wherein, data interchange is carried out with outside assorted readwrite device through wireless radio frequency identification in the radio frequency circuit layer, the adsorbed layer is located on the smart card the most inboardly, connects the surface at mobile terminal with the smart card to support to peel off and repeated pasting many times, the shielding layer more approaches mobile terminal than radio frequency circuit layer to suppress the influence of mobile terminal's electromagnetic interference signal to the radio frequency circuit layer, the setting can be rotated around the rotatable coupling point at the ring body of the external side of card base to form between ring body and the card base body and set for the angle, it is convenient handheld, as mobile terminal's support or supply user's finger to insert, promote the result of use. The utility model discloses can the exclusive use or connect mobile terminal and conveniently carry the use. Preferred metal crate structure increases the live time, and practical application's the condition is effectively extended to the framework that improves the connection of multiple part.
Description
Technical field
This utility model relates to field of intelligent cards, particularly to the ring-shape smart card of a kind of adsorption-type.
Background technology
Contact type intelligent card by extensively, be widely used in the payments such as urban transportation, finance, social security, information storage and the every field of identification.In order to living trip is more quick, people are urgently desirable to unite two into one various contact type intelligent cards with mobile phone or other mobile terminals, handy to carry about.
But, existing common contact type intelligent card do not possess integrated with modern digital electric equipment after the condition that uses in the complexity Electromagnetic Interference environment of high frequency light current field, the radiation of mobile phone signal can the data transmission of wireless signal between extreme influence contact type intelligent card read-write equipment corresponding to it.
Additionally, how contact type intelligent card is integrated with mobile phone, could not affect or promote Consumer's Experience effect, also be the problem needing solution badly.
Utility model content
The purpose of this utility model is to provide the ring-shape smart card of a kind of adsorption-type, simple in construction, conveniently independently uses or is adsorbed in the various mobile terminals such as mobile phone, enables this smart card normally to use in the environment of the complicated electromagnet source interference such as mobile phone signal；Further, utilize the setting of ring structure on this smart card, facilitate this smart card hand-held, or prevent its mobile terminal landing adsorbed, and Consumer's Experience effect can be improved as the support of mobile terminal.
In order to arrive above-mentioned purpose, the technical solution of the utility model is to provide the ring-shape smart card of a kind of adsorption-type, wherein comprises:
Card matrix, and by the ring body of described card matrix carrying, radio circuit layer, screen layer, adsorption layer；
Wherein, described radio circuit layer comprises one or more contactless chip and the induction antenna being connected with each contactless chip related circuit, and the read-write equipment making outside match carries out data exchange by radio frequency identification and contactless chip；
Described adsorption layer, is on smart card one layer of inner side so that described smart card can repeat on the surface of mobile terminal to paste；
Comparing radio circuit layer and arrange position on described card matrix, described screen layer arranges position closer to mobile terminal, to suppress the electromagnetic interference signal impact on radio circuit layer on card matrix；
Described ring body is a little arranged on the lateral surface of card matrix by being rotatably connected, and this ring body around a rotation that is rotatably connected, and can form set angle between ring body and card matrix.
Preferably, described radio circuit layer is connected to the medial surface of card matrix, and described screen layer is connected to the inner side of radio circuit layer, and described adsorption layer is connected to the inner side of screen layer；
Or, described radio circuit layer is connected to the lateral surface of card matrix, and described screen layer is connected to the medial surface of card matrix, and described adsorption layer is connected to the inner side of screen layer；
Or, described screen layer is connected to the lateral surface of card matrix, and described radio circuit layer is connected to the outside of screen layer, and described adsorption layer is connected to the medial surface of card matrix.
Preferably, described smart card by the lateral surface of card matrix directly represent word and/or pattern regarding reading information, or, described smart card by arrange the decorative layer of any one structure following represent word and/or pattern regarding reading information；
Wherein, described decorative layer is connected directly between the lateral surface of described card matrix；
Or, when described radio circuit layer is connected to the lateral surface of card matrix or is connected to the outside of screen layer, described decorative layer is connected to the outside of described radio circuit layer；
Or, described decorative layer forms laminated composite structures with radio circuit layer, and described laminated composite structures is connected to the lateral surface of card matrix or is connected to the outside of screen layer.
Preferably, the medial surface of described card matrix is provided with the first mounting groove, is used for placing the combination of radio circuit layer, screen layer, adsorption layer, or places screen layer, the combination of adsorption layer, or places adsorption layer；
The lateral surface of described card matrix is provided with the second mounting groove, is used for placing decorative layer, or the combination of decorative layer and radio circuit layer, or decorative layer, radio circuit layer, the combination of screen layer, or laminated composite structures, or the combination of laminated composite structures and screen layer.
Preferably, described card matrix entirety is made up of nonmetal organic or inorganic material；
Or, described card matrix is that following any one becomes the frame structure of the non-closed-loop structure of circuit, and described frame structure comprises metallic framing portions, and offers the through hole penetrating into lateral surface from card matrix medial surface；
Wherein, described frame structure entirety is a metallic framing portions, and offer centre be the air gap let out ripple seam, described in let out ripple seam and be communicated to described through hole from any one lateral edges of this metallic framing portions；
Or, described frame structure comprises multiple metallic framing portions, and the multiple ripples of letting out offering central filler insulation union body stitch；Each is let out the ripple seam edge respectively from any side of this frame structure and is communicated to described through hole；Multiple metallic framing portions are interconnected to form complete frame structure by letting out the insulation union body in ripple seam；
Or, described frame structure comprises several metallic framing portions and several Insulating frame parts, metallic framing portions and Insulating frame part interval and arranges；Adjacent metallic framing portions and Insulating frame part are interconnected to form complete frame structure.
Preferably, described decorative layer is made up of nonmetal organic or inorganic material thin slice or thin film；Or, thin film or the thin slice letting out ripple seam is made up and is offered to described decorative layer of metal material, so that this decorative layer becomes the non-closed-loop structure of circuit；
Open loop that described ring body is made up of nonmetal organic or inorganic material or closed loop；Or, described ring body is made up of metal material and is offered and lets out ripple seam, makes this ring body become the non-closed-loop structure of circuit.
Preferably, described card matrix offers through hole, comprises:
First through hole, for installation connecting element, makes being rotatably connected of described ring body be a little attached with card matrix by this connector；
Second through hole, when radio circuit layer is connected to the second bore periphery so that the contactless chip of projection can correspondence be positioned in the second through hole；Or, when radio circuit layer forms individual packages module, make in this individual packages Module-embedding extremely described second through hole.
Preferably, described card matrix offers the first limited impression and/or the second limited impression not penetrating through this card matrix；Described first limited impression is positioned at the periphery of the first through hole, is used for arranging described connector；Described second limited impression is corresponding with the position of the contactless chip in radio circuit layer so that the contactless chip of projection can correspondence be positioned in the second limited impression.
Preferably, described adsorption layer passes through to move glue thin film or double faced adhesive tape thin film is connected to mobile terminal, and can repeatedly peel off copy/paste of laying equal stress on from mobile terminal.
Preferably, described screen layer is made up of nickel-zinc-ferrite material thin slice or thin film.
In sum, the smart card architecture that this utility model provides is simple, can be used alone, or connection mobile phone or other any mobile terminals are convenient for carrying；The screen layer made with nickel-zinc-ferrite material can effectively suppress to disturb signal (being mainly derived from the device of interior of mobile phone), improve sensitivity and the data reading/writing distance of smart card, it is achieved normal use smart card carries out the function such as identification, consumption and payment in the environment of complicated electromagnet source interference.
The contactless chip of smart card and radio-frequency antenna can also be integrated in whole or in part in the frame structure of metal by this utility model；Stitch by offering the ripple of letting out of at least one the air gap or insulation union body filling or stitch using Insulating frame part as letting out ripple, avoid the metal part of frame structure that transmission of wireless signals is impacted；The metal part of frame structure, can be effectively improved that smart card is wear-resistant, the ability of high-low temperature resistant, improves its service life.
This utility model is decorated by the complete lateral surface of card matrix, or embeds decorative layer by card matrix lateral surface fluting.Radio circuit layer can be connected to card matrix medial surface, or embeds after forming laminated composite structures with decorative layer in the fluting of card matrix lateral surface.
This utility model connects ring body on card matrix, facilitates this smart card hand-held, or prevents its mobile terminal landing adsorbed, and ring body can be made to rotate and with smart card angulation as the support of mobile terminal, improve Consumer's Experience effect.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of smart card lateral surface in this utility model first embodiment；
Fig. 2 is the schematic diagram of card matrix medial surface in this utility model first embodiment；
Fig. 3 is card matrix sectional view in one example in this utility model；
Fig. 4 is the three-dimensional view of card matrix in this utility model first embodiment；
Fig. 5 is this utility model radio circuit layer schematic diagram in one example；
Fig. 6 is the parts annexation schematic diagram in this utility model first embodiment；
Fig. 7 is card matrix sectional view in another example in this utility model；
Fig. 8 is the schematic diagram of smart card lateral surface in this utility model the second embodiment；
Fig. 9 is the schematic diagram of card matrix medial surface in this utility model the second embodiment；
Figure 10 is the sectional view of card matrix in this utility model the second embodiment；
Figure 11 is the three-dimensional view of card matrix in this utility model the second embodiment；
Figure 12 ~ Figure 16 is this utility model parts annexation schematic diagram in different examples；
Figure 17, Figure 18 are the schematic diagrams of two examples of card matrix in this utility model the 4th embodiment；
Figure 19 is the schematic diagram of card matrix in this utility model the 5th embodiment；
Figure 20 is the schematic diagram of card matrix in this utility model sixth embodiment；
Figure 21 ~ Figure 23 is the annexation schematic diagram of each parts in different example of the present utility model；
Figure 24, Figure 25 are the rotation situation schematic diagrams of ring body in this utility model.
Detailed description of the invention
Below in conjunction with accompanying drawing, multiple detailed description of the invention of the present utility model is described.
This utility model provides the ring-shape smart card of a kind of adsorption-type, mainly comprises: card matrix, and carried by card matrix ring body 20, radio circuit layer 60, screen layer 70, adsorption layer 80.
Wherein, as it is shown in figure 5, radio circuit layer 60 comprises contactless chip 61, and the induction antenna 62 forming loop inductance it is connected with the electrode of contactless chip 61.Described smart card can carry out wireless data exchange based on radio RF recognition technology (RFID) with outside read-write equipment by this radio circuit layer 60, it is achieved to the read-write operation of data content in contactless chip 61.In this example, described contactless chip 61 and the induction antenna 62 being looped around its periphery, can be arranged on thin insulation diaphragm.Or, in other examples, it is also possible to contactless chip 61 is formed independent module with the direct molded packages of induction antenna 62 in insulation card body.
Described contactless chip 61 can be ID chip, IC chip, cpu chip, or the compound chip of a kind of 2 sub-chips being simultaneously equipped with different frequency or different agreement.Described induction antenna 62 can be printed antenna, etching antenna, or implants enamel-covered wire coiled antenna automatic, manual, etc..Described radio circuit layer 60 can comprise one or more contactless chip 61；When there is multiple contactless chip 61, the multiple induction antennas 62 matched with chip radio frequency frequency can be respectively provided with.
Thin slice that described screen layer 70 is made up of electromagnetism interference material or thin film.Preferably electromagnetism interference material is nickel-zinc ferrite (Ni-Znferrite), also known as magnetic ferrites or ferrite, is a kind of nonmetal magnetic material.Described screen layer 70 is positioned at the first side of radio circuit layer 60, and in different examples, screen layer 70 and radio circuit layer 60 can fit tightly or be additionally provided with between the miscellaneous part (some of them example is described hereinafter) in smart card.Radio circuit layer 60 is by not having the second side of screen layer 70 to carry out data interaction with corresponding read-write equipment.When combining with mobile terminal, screen layer 70 should be positioned between smart card and mobile terminal (the most all illustrating as a example by mobile phone), to suppress the electromagnetic interference signal impact on smart card of mobile terminal.That is, in this example, the first side of radio circuit layer 60 is inside it, and the second side is outside it.Herein, each parts are inner side near smart card side of link position on mobile phone, in contrast, are outside away from its side of link position on mobile phone.
Described adsorption layer 80 is arranged on the inner surface of smart card, it is possible to this smart card is connected to mobile phone.In a preferred exemplary, adsorption layer 80 comprise one can move glue thin film (be commonly referred to as moving glue, n times glue, without cull etc.), there is good bond properties, releasable energy, the metastasis performance of glue-line and bin stability energy.Can move the formation of glue thin film, be by a kind of emulsion-type pressure-sensitive adhesive having and repeating to paste performance, smeared drying after forming by machine net roll-type gluing or wire mesh machine screen type gluing mode or dried, slight pressure i.e. can reach functional viscosity.Can move glue thin film one side to be connected with the corresponding component in smart card by arranging double faced adhesive tape thin film or other similar fashion, another side is connected with mobile phone and makes smart card realize repeatedly peeling off stickup (repeating to paste).The colloid that can move glue thin film will not shift, and also will not leave any vestige on mobile phone after peeling off smart card on mobile phone.Or, in another example, described adsorption layer 80 can be only a kind of double faced adhesive tape thin film, and its two sides connects the corresponding component in mobile phone and smart card respectively；The performance that double faced adhesive tape thin film is pasted repeatedly is the most weak, but can be solved by the double faced adhesive tape thin film more renewed.
Ring body 20 can be arranged on described card matrix the optional position not being connected with mobile phone.Ring body 20 is arranged on by this example the front (lateral surface) of card matrix, as shown in Figure 1.User is by grasping ring body 20, can take smart card or the mobile phone being connected with smart card of taking；Or, after smart card with cellular phone combination, the finger of user can penetrate in ring body 20, thus prevents mobile phone landing, and can realize antitheft.Seeing shown in Figure 24, Figure 25, described ring body 20 around its multi-faceted rotation of junction point with card matrix, can also regulate angle a(such as 0 ~ 180 ° etc. of this ring body 20 and card matrix the most within the specific limits)；Or, when maintaining with certain angle of card matrix, it is also possible to make junction point self random rotational angle b(such as 0 ~ 360 ° etc.), in order to using ring body 20 as the support of mobile phone, or enable finger to penetrate more easily in ring body 20.Concrete material and the structure of described ring body 20 do not limit, and can be insulant, such as plastics, it is also possible to be metal material.When making with metal material, it should on ring body 20, breach is set so that it is closed-loop path will not be formed, thus avoid radio circuit layer 60 is produced Radio frequency interference.In some other example, in addition to using the structure of similar finger ring, ring body 20 can also is that bracelet shape, the fake being even coiled into by lanyard, etc..If additionally, there is no ring body 20, or in the case of ring body 20 drops, it is also possible to the smart card that the miscellaneous part of card matrix and carrying thereof is adsorbed onto on mobile phone as being easily carried is used.
In some instances, described card matrix can use various nonmetal organic or inorganic material to make, such as, card matrix uses the plastic material of various insulation to make, e.g. PVC(polrvinyl chloride), PET(polyethylene terephthalate), ABS(acrylonitrile-butadiene-styrene (ABS) copolymerization) or epoxy resin etc.；Or, it is also possible to it is glass, leather, wooden, stone material, natural or synthetic cut stone etc..
Or, in other examples, described card matrix can also is that the frame structure being made up of metal material, to improve its abrasion resistance properties, extends the use time.Need by punching, fluting or other modes (hereafter can specifically describe some of them example) on the card matrix of metal framework structure so that it is the closed-loop path of circuit will not be formed, thus avoid radio circuit layer 60 is produced Radio frequency interference.Metal material e.g. contains chromium, nickel, molybdenum or the rustless steel of other alloys or aluminum or the pyrite of electrodepositable, red copper etc..
Embodiment 1
As shown in Fig. 1 ~ Fig. 6, the lateral surface of described card matrix 11, is smooth or curved (as parabola shaped, Fig. 4, Fig. 6), or is other arbitrary shapes.The lateral surface of this card matrix 11 as the front of smart card, can by printing, printing, laser, electroplate, the various modes such as spray paint carry out surface process, it is possible to form various the regarding such as word, pattern and read decoration information.Herein and in each accompanying drawing, all illustrating as a example by the card matrix 11 as rectangle of the horizontal cross-section, during actual application, the shape of described card matrix 11 horizontal cross-section, size do not limit.Card matrix described in this example 11 is made up of any one insulant above-mentioned, e.g. plastics.
Any one ring body 20 above-described, is arranged at the lateral surface of card matrix 11 by connector.On card matrix 11, the link position of corresponding ring body 20 is provided with the first through hole 41, to install the connector of ring body 20.Such as, being rotatably connected of ring body 20 is a little riveted with card matrix 11 by rivet；In some instances, it is also possible to the medial surface at card matrix 11 is provided with, at the first through hole 41, the first shallow limited impression 51 not penetrated through, in order to arrange rivet (Fig. 3).In other examples, it is also possible to use such as ultrasonic bonding, other any-modes bonding etc., being rotatably connected of ring body 20 is a little connected with card matrix 11；Then, described first through hole the 41, first limited impression 51 is the option example of the card matrix 11 ' not having the first limited impression 51 (Fig. 7 be).
Any one radio circuit layer 60(such as Fig. 5 by mentioned above), for example, thin film, thin slice or module shape, install by double-sided adhesive stickup, ultrasonic bonding, hot moulding, cold forming, displacement or in the way of other any appropriate, be connected to the medial surface of card matrix 11.It is alternatively possible to make the edge one of the medial surface of described card matrix 11 enclose projection further, at medial surface, form the first mounting groove 31, and radio circuit layer 60 is arranged in this first mounting groove 31 (Fig. 3, Fig. 6).Alternatively, make it when the protrusion of surface of radio circuit layer 60 if contactless chip 61 has certain thickness, then can offer second limited impression 52(Fig. 2, the Fig. 3 not penetrated through in the medial surface relevant position of card matrix 11), the jut making contactless chip 61 is located exactly in this second limited impression 52, so that other positions of radio circuit layer 60 and the connection more docile of card matrix 11.
As shown in Figure 6, connect screen layer 70 in the inner side of described radio circuit layer 60, then connect adsorption layer 80 in the inner side of screen layer 70.In other example, it is also possible to set up pad (not shown) between screen layer 70 and adsorption layer 80.Can be adjusted the thickness of smart card by pad, the chimb such as making adsorption layer 80 and the first mounting groove 31 can be substantially flush.Described screen layer 70 is preferably made up of nickel-zinc ferrite.In this example, the moved glue thin film of adsorption layer 80 is as one layer of smart card inner side, affixes to the back side of mobile phone, and repeatedly smart card stripping can be repeated stickup.Now, the screen layer 70 of this smart card than radio circuit layer 60 closer to mobile phone, it is thus able to stop mobile phone electromagnetic interference signal, the wireless signal that contactless chip 61 in radio circuit layer 60 is received and dispatched via induction antenna 62 is avoided to form shielding or crosstalk, in order to this wireless data signal can be smoothly through the lateral surface (through radio circuit layer 60 and card matrix 11) of smart card and externally transmit.
In addition, if the inner side of adsorption layer 80 is covered not have the thin layer of viscosity, or in the case of adsorption layer 80 comes off from smart card, though smart card of the present utility model cannot be connected with mobile phone, but still can be used alone, carry out data exchange with exterior read-write device.
Embodiment 2
As shown in Fig. 8 ~ Figure 12, this example makes the edge one of the lateral surface of described card matrix 12 enclose projection, form the second mounting groove 32 at this lateral surface, in order to decorative layer 90 is set wherein.Card matrix described in this example 12 is made up of any one insulant above-mentioned, e.g. plastics.
It is various regarding reading information that the outside of described decorative layer 90 is formed with word, pattern etc..This decorative layer 90, by the way of double-sided adhesive stickup, ultrasonic bonding or other any appropriate, is connected in the second mounting groove 32 of card matrix 12.The installing hole corresponding with the through hole of card matrix 12 can be formed, in order to being rotatably connected of ring body 20 is a little connected through decorative layer 90 with card matrix 12 on described decorative layer 90.
Attachment structure and each parts effect in card matrix described in this example 12 medial surface direction are essentially identical with embodiment 1, describe the most in detail.Wherein, as shown in figure 12, radio circuit layer 60 is connected to the medial surface of card matrix 12, such as, be positioned at the first mounting groove 31；Screen layer 70 is connected to inside radio circuit layer 60, stops electromagnetic interference signal；Adsorption layer 80 is connected to, inside screen layer 70, be connected with mobile phone by smart card, and supports repeatedly to peel off and repeat to paste.
In other examples, such as shown in Figure 13, radio circuit layer 60 first can be connected to the lateral surface of card matrix 12, then connect decorative layer 90 in the outside of radio circuit layer 60；And screen layer 70 and adsorption layer 80 are arranged on card matrix 12 medial surface.Or, such as, shown in Figure 14, screen layer 70 can be also provided with the lateral surface of card matrix 12, between radio circuit layer 60 and card matrix 12；Adsorption layer 80 is arranged on card matrix 12 medial surface.
In above-mentioned different examples, screen layer 70, adsorption layer 80 can directly cover the medial surface of card matrix 12 ', then the first mounting groove 31 can arrange (Figure 15, Figure 16)；Card matrix 12/12 ' medial surface does not reconnect radio circuit layer 60, then the second limited impression 52 of coupling bumped chip 61 can also be arranged.
Embodiment 3
In this example, it is formed with second mounting groove 32(Figure 10, Figure 11 described in similar embodiment 2 at the lateral surface of card matrix 12/12 '), and laminated composite structures 91(Figure 15, Figure 16 of decorative layer and radio circuit layer are set wherein).Card matrix described in this example 12/12 ' is made up of any one insulant above-mentioned, e.g. plastics.
Decorative layer is linked into an integrated entity by laminar manner with radio circuit layer, by the way of double-sided adhesive stickup, ultrasonic bonding or other any appropriate, laminated composite structures 91 is connected to the lateral surface of card matrix 12/12 ' so that radio circuit layer therein is positioned between decorative layer and card matrix 12/12 '；Word, pattern etc. is formed various regarding reading information outside decorative layer.The opening direction that can make the second limited impression 52 is contrary with previous embodiment 1, in order to make the contactless chip 61 of projection in radio circuit layer 60 can be positioned in the second limited impression 52 that lateral surface is offered.
In this example, laminated composite structures 91 itself is equivalent to a complete module that can realize intelligent card function, therefore, in certain embodiments, the old smart card of a kind of recycling can also be used, it is connected with decorative layer after it is carried out size adjusting or surface reconditioning, so can be greatly simplified production operation, save manufacturing cost, energy-conserving and environment-protective.
Described ring body 20 be rotatably connected a little, the contactless chip 61 through decorative layer and avoiding radio circuit layer and induction antenna 62 position, be connected with the lateral surface of card matrix 12/12 '.Described screen layer 70 is connected to the medial surface of card matrix 12/12 ', or is connected between the lateral surface of card matrix 12/12 ' and laminated composite structures 91, to stop electromagnetic interference signal；Adsorption layer 80 is arranged on card matrix 12/12 ' medial surface, smart card is connected with mobile phone, and support repeatedly to peel off and repeat to paste.
Embodiment 4
As shown in Figure 17, Figure 18, in this example on the basis of embodiment 1, card matrix 13 is replaced with a kind of metal framework structure.Offer first and let out ripple seam 411, from any one lateral edges of metal framework structure, be communicated to the first through hole 41 for installing ring body 20.Card matrix 13 offers the second through hole 42 further that penetrate into lateral surface from this card matrix 13 medial surface, and offers second and let out ripple seam 421, from any one lateral edges of metal framework structure, be communicated to this second through hole 42.Described first let out ripple seam 411, second let out ripple seam 421 in can be the air gap.Offering of ripple seam 411,421 is let out so that whole metal framework structure will not become the closed-loop structure of circuit, because of without smart card is formed shielding or crosstalk due to described.
This example can connect the associated components of smart card in the manner of example 1, i.e. ring body 20 is connected to the lateral surface of card matrix 13；Radio circuit layer 60 is connected to the medial surface of card matrix 13, and radio circuit layer 60 now can be made to cover the second through hole 42 so that it is contactless chip 61 correspondence of middle projection is positioned in the second through hole 42.Screen layer 70 is connected to the inner side of radio circuit layer 60, stops electromagnetic interference signal；Adsorption layer 80 is connected to the inner side of screen layer 70, is connected with mobile phone by smart card, and supports repeatedly to peel off and repeat to paste.
In one concrete example, as shown in figure 18, the second through hole 42 ' has large-area opening, and the edge in three directions of opening is located substantially near in the edge of card matrix 13 '；The edge in the surplus next direction of opening then generally within the first through hole 41 near.Now, radio circuit layer 60 can remain attached to the periphery of card matrix 13 ' medial surface the second through hole 42 '.Or, in some other example, the form of the individual packages module embedding the second through hole 42/42 ' can be used to arrange radio circuit layer 60.It is alternatively possible to the lateral surface at card matrix 13/13 ' arranges decorative layer 92 by opening covering (Figure 21) at the second through hole 42/42 ' place.
Embodiment 5
As shown in figure 19, in this example, card matrix is a kind of metal framework structure.Different from embodiment 4 being, the first quantity letting out ripple seam 412 can be one or more, and the second quantity letting out ripple seam 422 can also be one or more.Hereafter let out as a example by ripple stitches 422 by second and illustrate.
Multiple second lets out ripple seam 422, can be covered or be available for the form that radio circuit layer 60 embeds by radio circuit layer 60 by being communicated to the second through hole 42(from the edge of metal framework structure respectively), and the second the air gap let out in ripple seam 422 is filled by the union body of insulant injection formation, let out ripple by union body by second and stitch the frame part 14 and 14 ' fixed bonding on 422 both sides, form an overall frame structure.One or more the first of union body that is filled with can be offered by similar mode and let out ripple seam 412.Offering of ripple seam 412/422 is let out so that whole metal framework structure will not become the closed-loop structure of circuit, because of without smart card is formed shielding or crosstalk due to described.In smart card, the corresponding arrangement form of miscellaneous part, may refer to the various embodiments described above.
Embodiment 6
As shown in figure 20, in this example, card matrix comprises metallic framing portions.Different from embodiment 4,5 it is, this example is formed a frame structure by the split of multiple frame part 15 and 15 '.The Insulating frame part 15 ' that some metallic framing portions are formed by insulant injection substitutes, and with other the direct fixed bonding of metallic framing portions 15, the wide ripple of letting out that functions as of described Insulating frame part 15 ' stitches, and facilitates transmission of wireless signals.In this example, whole frame structure will not become the closed-loop structure of circuit, because of without smart card is formed shielding or crosstalk.In smart card, the corresponding arrangement form of miscellaneous part, may refer to the various embodiments described above.
Embodiment 7
In this example on the basis of embodiment 2 or 3, card matrix is replaced with a kind of metal framework structure as described in Figure 17 ~ Figure 20.Such as the second through hole on card matrix, the multiple mode of offering letting out ripple seam may refer to embodiment 4 ~ 6, and the deployment scenarios at other positions of card matrix may refer to embodiment 2 or 3, the example as shown in Figure 12 ~ Figure 16.
Wherein, such as shown in Figure 22, the second mounting groove 32 outside the metal framework structure of card matrix is used for placing decorative layer 90, ring body 20 is through decorative layer 90 Connection Card matrix, and inside metal framework structure, connect radio circuit layer 60, inside radio circuit layer 60, connect screen layer 70, inside screen layer 70, connect adsorption layer 80.The most such as, shown in Figure 23, the second mounting groove 32 outside metal framework structure is used for the laminated composite structures 91 placing decorative layer with radio circuit layer, ring body 20 is connected to card matrix through laminated composite structures 91, and inside metal framework structure, connect screen layer 70, then inside screen layer 70, connect adsorption layer 80.
In above-mentioned each example, if the decorative layer 90/91/92 used is made up of metal material, e.g. during a kind of foil, then should offer above and let out ripple seam so that it is closed-loop path will not be become.
In sum, the smart card architecture that this utility model provides is simple, can connect mobile phone or other any mobile terminals are convenient for carrying；The screen layer made with nickel-zinc-ferrite material can effectively suppress to disturb signal (being mainly derived from the device of interior of mobile phone), improve sensitivity and the data reading/writing distance of smart card, it is achieved normal use smart card carries out the function such as identification, consumption and payment in the environment of complicated electromagnet source interference.
The contactless chip of smart card and radio-frequency antenna can also be integrated in whole or in part in the frame structure of metal by this utility model；Stitch by offering the ripple of letting out of at least one the air gap or insulation union body filling or stitch using Insulating frame part as letting out ripple, avoid the metal part of frame structure that transmission of wireless signals is impacted；The metal part of frame structure, can be effectively improved that smart card is wear-resistant, the ability of high-low temperature resistant, improves its service life.
This utility model is decorated by the complete lateral surface of card matrix, or embeds decorative layer by card matrix lateral surface fluting.Radio circuit layer can be connected to card matrix medial surface, or embeds after forming laminated composite structures with decorative layer in the fluting of card matrix lateral surface.
This utility model connects ring body on card matrix, facilitates this smart card hand-held, or prevents its mobile terminal landing adsorbed, and ring body can be made to rotate and with smart card angulation as the support of mobile terminal, improve Consumer's Experience effect.
Although content of the present utility model has been made to be discussed in detail by above preferred embodiment, but it should be appreciated that the description above is not considered as restriction of the present utility model.After those skilled in the art have read foregoing, multiple amendment of the present utility model and replacement all be will be apparent from.Therefore, protection domain of the present utility model should be limited to the appended claims.
Claims (10)
1. the ring-shape smart card of an adsorption-type, it is characterised in that comprise:
Card matrix, and by the ring body of described card matrix carrying, radio circuit layer, screen layer, adsorption layer；
Wherein, described radio circuit layer comprises one or more contactless chip and the induction antenna being connected with each contactless chip related circuit, and the read-write equipment making outside match carries out data exchange by radio frequency identification and contactless chip；
Described adsorption layer, is on smart card one layer of inner side so that described smart card can repeat on the surface of mobile terminal to paste；
Comparing radio circuit layer and arrange position on described card matrix, described screen layer arranges position closer to mobile terminal, to suppress the electromagnetic interference signal impact on radio circuit layer on card matrix；
Described ring body is a little arranged on the lateral surface of card matrix by being rotatably connected, and this ring body around a rotation that is rotatably connected, and can form set angle between ring body and card matrix.
2. the ring-shape smart card of adsorption-type as claimed in claim 1, it is characterised in that
Described radio circuit layer is connected to the medial surface of card matrix, and described screen layer is connected to the inner side of radio circuit layer, and described adsorption layer is connected to the inner side of screen layer；
Or, described radio circuit layer is connected to the lateral surface of card matrix, and described screen layer is connected to the medial surface of card matrix, and described adsorption layer is connected to the inner side of screen layer；
Or, described screen layer is connected to the lateral surface of card matrix, and described radio circuit layer is connected to the outside of screen layer, and described adsorption layer is connected to the medial surface of card matrix.
3. the ring-shape smart card of adsorption-type as claimed in claim 2, it is characterised in that
Described smart card by the lateral surface of card matrix directly represent word and/or pattern regarding reading information, or, described smart card by arrange the decorative layer of any one structure following represent word and/or pattern regarding reading information；
Wherein, described decorative layer is connected directly between the lateral surface of described card matrix；
Or, when described radio circuit layer is connected to the lateral surface of card matrix or is connected to the outside of screen layer, described decorative layer is connected to the outside of described radio circuit layer；
Or, described decorative layer forms laminated composite structures with radio circuit layer, and described laminated composite structures is connected to the lateral surface of card matrix or is connected to the outside of screen layer.
4. the ring-shape smart card of adsorption-type as claimed in claim 3, it is characterised in that
The medial surface of described card matrix is provided with the first mounting groove, is used for placing the combination of radio circuit layer, screen layer, adsorption layer, or places screen layer, the combination of adsorption layer, or places adsorption layer；
The lateral surface of described card matrix is provided with the second mounting groove, is used for placing decorative layer, or the combination of decorative layer and radio circuit layer, or decorative layer, radio circuit layer, the combination of screen layer, or laminated composite structures, or the combination of laminated composite structures and screen layer.
5. the ring-shape smart card of the adsorption-type as described in any one in claim 1 ~ 4, it is characterised in that
Described card matrix entirety is made up of nonmetal organic or inorganic material；
Or, described card matrix is that following any one becomes the frame structure of the non-closed-loop structure of circuit, and described frame structure comprises metallic framing portions, and offers the through hole penetrating into lateral surface from card matrix medial surface；
Wherein, described frame structure entirety is a metallic framing portions, and offer centre be the air gap let out ripple seam, described in let out ripple seam and be communicated to described through hole from any one lateral edges of this metallic framing portions；
Or, described frame structure comprises multiple metallic framing portions, and the multiple ripples of letting out offering central filler insulation union body stitch；Each is let out the ripple seam edge respectively from any side of this frame structure and is communicated to described through hole；Multiple metallic framing portions are interconnected to form complete frame structure by letting out the insulation union body in ripple seam；
Or, described frame structure comprises several metallic framing portions and several Insulating frame parts, metallic framing portions and Insulating frame part interval and arranges；Adjacent metallic framing portions and Insulating frame part are interconnected to form complete frame structure.
6. the ring-shape smart card of the adsorption-type as described in claim 3 or 4, it is characterised in that
Thin slice that described decorative layer is made up of nonmetal organic or inorganic material or thin film；Or, thin film or the thin slice letting out ripple seam is made up and is offered to described decorative layer of metal material, so that this decorative layer becomes the non-closed-loop structure of circuit；
Open loop that described ring body is made up of nonmetal organic or inorganic material or closed loop；Or, described ring body is made up of metal material and is offered and lets out ripple seam, makes this ring body become the non-closed-loop structure of circuit.
7. the ring-shape smart card of adsorption-type as claimed in claim 5, it is characterised in that
Offer through hole on described card matrix, comprise:
First through hole, for installation connecting element, makes being rotatably connected of described ring body be a little attached with card matrix by this connector；
Second through hole, when radio circuit layer is connected to the second bore periphery so that the contactless chip of projection can correspondence be positioned in the second through hole；Or, when radio circuit layer forms individual packages module, make in this individual packages Module-embedding extremely described second through hole.
8. the ring-shape smart card of adsorption-type as claimed in claim 7, it is characterised in that
Described card matrix offers the first limited impression and/or the second limited impression not penetrating through this card matrix；Described first limited impression is positioned at the periphery of the first through hole, is used for arranging described connector；Described second limited impression is corresponding with the position of the contactless chip in radio circuit layer so that the contactless chip of projection can correspondence be positioned in the second limited impression.
9. the ring-shape smart card of adsorption-type as claimed in claim 1, it is characterised in that
Described adsorption layer passes through to move glue thin film or double faced adhesive tape thin film is connected to mobile terminal, and can repeatedly peel off copy/paste of laying equal stress on from mobile terminal.
10. the ring-shape smart card of adsorption-type as claimed in claim 1, it is characterised in that
Thin slice that described screen layer is made up of nickel-zinc-ferrite material or thin film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521061222.0U CN205427902U (en) | 2015-12-16 | 2015-12-16 | Ring type smart card of absorption formula |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521061222.0U CN205427902U (en) | 2015-12-16 | 2015-12-16 | Ring type smart card of absorption formula |
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| Publication Number | Publication Date |
|---|---|
| CN205427902U true CN205427902U (en) | 2016-08-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521061222.0U Expired - Fee Related CN205427902U (en) | 2015-12-16 | 2015-12-16 | Ring type smart card of absorption formula |
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| Country | Link |
|---|---|
| CN (1) | CN205427902U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108399446A (en) * | 2018-01-29 | 2018-08-14 | 上海卡美循环技术有限公司 | Mobile terminal and its telescoping shoring column type smart card of setting |
-
2015
- 2015-12-16 CN CN201521061222.0U patent/CN205427902U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108399446A (en) * | 2018-01-29 | 2018-08-14 | 上海卡美循环技术有限公司 | Mobile terminal and its telescoping shoring column type smart card of setting |
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