CN205380975U - Novel bonded is separated to substrate device - Google Patents
Novel bonded is separated to substrate device Download PDFInfo
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- CN205380975U CN205380975U CN201620038288.6U CN201620038288U CN205380975U CN 205380975 U CN205380975 U CN 205380975U CN 201620038288 U CN201620038288 U CN 201620038288U CN 205380975 U CN205380975 U CN 205380975U
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- fixed
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- base plate
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Abstract
The utility model relates to the micro nanotechnology field especially relates to a novel bonded is separated to substrate device. This novel bonded is separated to substrate device, including bottom plate, preceding limit stop, back limit stop, guide rail, handle, cylinder and stand, preceding limit stop and back limit stop fix on the bottom plate. The utility model relates to a two substrates are separated that novel bonded is separated to substrate device can be in the same place the bonded to can not cause the damage to substrate itself. In addition, this novel bonded is separated to substrate device structural design is reasonable, and is high -efficient to the separation safety of substrate, is fit for using widely.
Description
Technical field
This utility model relates to nanometer technique field, particularly relates to a kind of Novel substrate solution bonding apparatus.
Background technology
In nanometer technique field, the use of substrate is very common.Between two pieces of substrates, the material such as majority epoxy resin is bonded together, owing to substrate self is very thin, in the process that the two pieces of substrates being bonded together carry out Xie Jian separation, it is easy to cause that substrate is broken or produces scar, thus causing damage to substrate.
In order to solve above-mentioned technical problem, this utility model devises a kind of Novel substrate solution bonding apparatus, and be bonded together two pieces of substrates can be separated by this Novel substrate solution bonding apparatus, and substrate itself will not be caused damage.Additionally, this Novel substrate solution bonding apparatus reasonable in design, the separation of substrate is safe and efficient, it is suitable for promoting the use of.
Utility model content
In order to overcome the defect existed in background technology, this utility model solves its technical problem and be the technical scheme is that a kind of Novel substrate solution bonding apparatus, including base plate, front limit stop block, rear positive stop, guide rail, handle, cylinder and column, described front limit stop block and rear positive stop are fixed on base plate, described guide rail is fixed on the base plate between front limit stop block and rear positive stop, described handle is fixed on carriage, described carriage can at slide on rails, described cylinder is fixed on carriage, described cylinder is fixed with down and adds hot plate, described column is fixed on base plate, the top of described column is provided with crossbeam, described crossbeam adds hot plate under correspondence and is fixed with upper heating disk, add hot plate under described and upper heating disk is provided with vacuum adapter and vacuum channels, it is provided with vacuum interface in described vacuum channels.
A kind of Novel substrate solution bonding apparatus involved by this utility model, be bonded together two pieces of substrates can be separated by this Novel substrate solution bonding apparatus, and substrate itself will not be caused damage.Additionally, this Novel substrate solution bonding apparatus reasonable in design, the separation of substrate is safe and efficient, it is suitable for promoting the use of.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, this utility model is further illustrated.
Fig. 1 is the structural representation one of a kind of Novel substrate solution bonding apparatus of this utility model；
Fig. 2 is the structural representation two of a kind of Novel substrate solution bonding apparatus of this utility model；
Fig. 3 is the partial enlarged drawing at A place in Fig. 2；
Wherein: 1, base plate；2, front limit stop block；3, rear positive stop；4, guide rail；5, carriage；6, handle；7, cylinder；8, upper heating disk；9, hot plate is added under；10, column；11, crossbeam；12, vacuum adapter；13, vacuum channels；14, vacuum interface.
Detailed description of the invention
Presently in connection with accompanying drawing, this utility model is described in further detail.Accompanying drawing is the schematic diagram simplified, and basic structure of the present utility model is only described in a schematic way, and therefore it only shows the composition relevant with this utility model.
nullSpecific embodiment，Refer to Fig. 1、Fig. 2 and Fig. 3，A kind of Novel substrate solution bonding apparatus，Including base plate 1、Front limit stop block 2、Rear positive stop 3、Guide rail 4、Handle 6、Cylinder 7 and column 10，Described front limit stop block 2 and rear positive stop 3 are fixed on base plate 1，Described guide rail 4 is fixed on the base plate 1 between front limit stop block 2 and rear positive stop 3，Described handle 6 is fixed on carriage 5，Described carriage 5 can slide on guide rail 4，Described cylinder 7 is fixed on carriage 5，Described cylinder 7 is fixed with down and adds hot plate 9，Described column 10 is fixed on base plate 1，The top of described column 10 is provided with crossbeam 11，Described crossbeam 11 adds hot plate 9 under correspondence and is fixed with upper heating disk 8，Add hot plate 9 under described and upper heating disk 8 is provided with vacuum adapter 12 and vacuum channels 13，It is provided with vacuum interface 14 in described vacuum channels 13.
A kind of Novel substrate solution bonding apparatus involved by this utility model, this Novel substrate solution bonding apparatus is in use, first being placed on down by the two pieces of substrates up and down being bonded together adds in hot plate 9, and by under add vacuum channels 13 evacuation in hot plate 9 and the lower piece of substrate being bonded together is fixed on down adds in hot plate 9, then slip carriage 5 makes down to add hot plate 9 and is directed at upper heating disk 8, hot plate 9 is added under cylinder 7 jack-up, being fixed on down by the substrate being bonded together adds between hot plate 9 and upper heating disk 8, and by the upper piece substrate being bonded together is fixed on upper heating disk 8 by vacuum channels 13 evacuation in upper heating disk 8, then add down hot plate 9 and upper heating disk 8 heats, the agent of pasting between upper and lower two pieces of substrates is made to melt, the most upper and lower two pieces of complete separating of substrate.In a word, be bonded together two pieces of substrates can be separated by this Novel substrate solution bonding apparatus, and substrate itself will not be caused damage.Additionally, this Novel substrate solution bonding apparatus reasonable in design, the separation of substrate is safe and efficient, it is suitable for promoting the use of.
Obviously, above-described embodiment is only for clearly demonstrating example, and is not the restriction to embodiment.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here without also cannot all of embodiment be given exhaustive.And the apparent change thus extended out or variation are still among the protection domain of the invention.
Claims (1)
- null1. a Novel substrate solution bonding apparatus，Including base plate (1)、Front limit stop block (2)、Rear positive stop (3)、Guide rail (4)、Handle (6)、Cylinder (7) and column (10)，It is characterized in that: described front limit stop block (2) and rear positive stop (3) are fixed on base plate (1)，Described guide rail (4) is fixed on the base plate (1) between front limit stop block (2) and rear positive stop (3)，Described handle (6) is fixed on carriage (5)，Described carriage (5) can in the upper slip of guide rail (4)，Described cylinder (7) is fixed on carriage (5)，Described cylinder (7) is fixed with down and adds hot plate (9)，Described column (10) is fixed on base plate (1)，The top of described column (10) is provided with crossbeam (11)，Add hot plate (9) under the upper correspondence of described crossbeam (11) and be fixed with upper heating disk (8)，Add hot plate (9) under described and upper heating disk (8) is provided with vacuum adapter (12) and vacuum channels (13)，Vacuum interface (14) it is provided with in described vacuum channels (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620038288.6U CN205380975U (en) | 2016-01-15 | 2016-01-15 | Novel bonded is separated to substrate device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620038288.6U CN205380975U (en) | 2016-01-15 | 2016-01-15 | Novel bonded is separated to substrate device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205380975U true CN205380975U (en) | 2016-07-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620038288.6U Active CN205380975U (en) | 2016-01-15 | 2016-01-15 | Novel bonded is separated to substrate device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205380975U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018019276A1 (en) * | 2016-07-29 | 2018-02-01 | 上海微电子装备（集团）股份有限公司 | De-bonding leveling device and de-bonding method |
| CN108346597A (en) * | 2017-12-28 | 2018-07-31 | 大族激光科技产业集团股份有限公司 | A kind of vacuum heating system, chip stripping off device and method |
-
2016
- 2016-01-15 CN CN201620038288.6U patent/CN205380975U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018019276A1 (en) * | 2016-07-29 | 2018-02-01 | 上海微电子装备（集团）股份有限公司 | De-bonding leveling device and de-bonding method |
| US10971380B2 (en) | 2016-07-29 | 2021-04-06 | Shanghai Micro Electronics Equipment (Group) Co., Ltd. | De-bonding leveling device and de-bonding method |
| CN108346597A (en) * | 2017-12-28 | 2018-07-31 | 大族激光科技产业集团股份有限公司 | A kind of vacuum heating system, chip stripping off device and method |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |