CN205179505U - Novel eight layers of PCB board - Google Patents
Novel eight layers of PCB board Download PDFInfo
- Publication number
- CN205179505U CN205179505U CN201520979875.0U CN201520979875U CN205179505U CN 205179505 U CN205179505 U CN 205179505U CN 201520979875 U CN201520979875 U CN 201520979875U CN 205179505 U CN205179505 U CN 205179505U
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- China
- Prior art keywords
- copper foil
- glue
- line
- layers
- pcb board
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201520979875.0U CN205179505U (en) | 2015-12-01 | 2015-12-01 | Novel eight layers of PCB board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201520979875.0U CN205179505U (en) | 2015-12-01 | 2015-12-01 | Novel eight layers of PCB board |
Publications (1)
Publication Number | Publication Date |
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CN205179505U true CN205179505U (en) | 2016-04-20 |
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Family Applications (1)
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CN201520979875.0U Active CN205179505U (en) | 2015-12-01 | 2015-12-01 | Novel eight layers of PCB board |
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CN (1) | CN205179505U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107949171A (en) * | 2017-11-15 | 2018-04-20 | 奥士康科技股份有限公司 | A kind of printed circuit board (PCB) and manufacture method |
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2015
- 2015-12-01 CN CN201520979875.0U patent/CN205179505U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107949171A (en) * | 2017-11-15 | 2018-04-20 | 奥士康科技股份有限公司 | A kind of printed circuit board (PCB) and manufacture method |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 518000 Tianxin Building 503, 46 Meiling Community Meilin Road, Meilin Street, Futian District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Huaqiu Electronics Co., Ltd. Address before: 518000 Huaqiangyun Industrial Park, No. 1-1 Meixiu Road, Meilin Industrial Zone, Futian District, Shenzhen City, Guangdong Province, 3 301 Patentee before: SHENZHEN HUAQIANGJUFENG ELECTRONIC TECHNOLOGY CO., LTD. |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A new type of eight layer PCB Effective date of registration: 20201202 Granted publication date: 20160420 Pledgee: Shenzhen small and medium sized small loan Co., Ltd Pledgor: Shenzhen Huaqiu Electronics Co.,Ltd. Registration number: Y2020980008734 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20211227 Granted publication date: 20160420 Pledgee: Shenzhen small and medium sized small loan Co., Ltd Pledgor: Shenzhen Huaqiu Electronics Co.,Ltd. Registration number: Y2020980008734 |