CN205015147U - A integrated test system for semiconductor laser chamber face failure analysis - Google Patents
A integrated test system for semiconductor laser chamber face failure analysis Download PDFInfo
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- CN205015147U CN205015147U CN201520754206.3U CN201520754206U CN205015147U CN 205015147 U CN205015147 U CN 205015147U CN 201520754206 U CN201520754206 U CN 201520754206U CN 205015147 U CN205015147 U CN 205015147U
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Abstract
The utility model provides an integrated test system for semiconductor laser chamber face failure analysis can make semiconductor laser chamber face failure analysis more accurate, reliable, has industrial actual meaning. This integrated test system is very much including dividing optical assembly, temperature control module and a multiple light characteristic test module, and temperature control module is used for adjusting the semiconductor laser's that awaits measuring temperature, multiple light characteristic test module includes near field distribution test module, far -field distribution test module, power test module and spectral imaging module, divides the optical tapoff multichannel that the optical assembly will await measuring semiconductor laser output to be used for setting up different light characteristic test module, the computer receiving process the test data of temperature test module and the output of multiple light characteristic test module to be connected with temperature test module, temperature control module and multiple light characteristic test module.
Description
Technical field
The utility model belongs to optoelectronic laser device technology, relates to a kind of test macro for films on cavity surfaces of semiconductor lasers failure analysis.
Background technology
High-power optical-fiber coupling semiconductor laser has the advantages such as high power, high brightness, long-life, be widely used in the field such as solid state laser or pump source of optical fiber laser, materials processing, space communtication, medical and beauty treatment, security protection, along with the further raising of output power and brightness, face, chamber catastrophic optical damage damage (COMD) has become the Main Bottleneck of restriction fiber coupled laser diode output power and life-span upgrading.In semiconductor laser use procedure, films on cavity surfaces of semiconductor lasers COMD is due to the overheated failure mode causing high power semiconductor lasers to burn of face, chamber local temperature, is a kind of important form causing semiconductor laser to lose efficacy.Understanding chamber surface temperature distribution and changing is a kind of Main Means studying semiconductor laser inefficacy at present.
Have studied under high pulse current injectingt condition in the scientific paper that the people such as the JensW.Tomm of Germany deliver, the change of chamber surface temperature and the relation of inefficacy, and the change on inefficacy rear facet surface.But these schemes are only limitted to simple venation and leap high pulse current injectingt, and injection length is musec order, and the thermal infrared imager needed for test requires very high temporal resolution, industry is difficult to promote; And the parameter that the failure analysis of face, chamber relies on is single, accuracy and limited reliability.
Domestic Semiconductor institute, Chinese Academy of Sciences, Jilin University (Xia Tao, " quick LD comprehensive parameter measuring system ", Jilin University's master thesis, 2006.4), the Maritime Affairs University Of Dalian (Wan Junhua, " research of large power semiconductor laser array light distribution characteristic test system ", Maritime Affairs University Of Dalian's master thesis, 2008.5) Deng Jijia unit have developed semiconductor laser testing tool; The patent that the people such as the Liu Xingsheng of Ju Guang company deliver: 201010591449.1, adopts modular integrated system, have studied the LIV characteristic of semiconductor laser, spectral characteristic polarization characteristic, near field hot spot characteristic, far-field characteristic, spatial spectral characteristic etc.But these test macros and the failure analysis of face, chamber do not contact, and are only limited to the research of the output characteristics of noise spectra of semiconductor lasers.
In fact, in semiconductor laser use procedure, once there is COMD, face, chamber is burnt defect and cannot be repaired, and defect will spread along gain region to chip internal, causes the output power of semiconductor laser to reduce, and brightness reduces, and the life-span sharply reduces.Therefore, the failure procedure of films on cavity surfaces of semiconductor lasers is not only the change of output power, also along with the change of the distribution near field, and the change of far-field distribution, the change of chamber surface temperature and the change of spectrum.But, research semiconductor laser is had no in prior art when the use procedure lumen face of through engineering approaches generation COMD, the relation between chamber surface temperature and these parameters above-mentioned.
Utility model content
The utility model proposes a kind of integrated test system for films on cavity surfaces of semiconductor lasers failure analysis, films on cavity surfaces of semiconductor lasers failure analysis can be made more accurate, reliable, there is industry practical significance.
Scheme of the present utility model is as follows:
For the integrated test system of films on cavity surfaces of semiconductor lasers failure analysis, comprise supply module, temperature test module and computing machine, wherein temperature test module adopts thermal infrared imager to obtain the chamber surface temperature of semiconductor laser to be measured; Unlike the prior art, this integrated test system also comprises spectrum groupware, temperature control modules and multiple light characteristic test module, described temperature control modules is for regulating the temperature of semiconductor laser to be measured, described multiple light characteristic test module comprises near field distribution test module, far-field distribution test module, power test module and light spectrum image-forming module, and the light that semiconductor laser to be measured exports is separated multichannel in order to arrange different light characteristic test modules by spectrum groupware; Computing machine receives the test data of the described temperature test module of process and the output of multiple light characteristic test module, and is connected with temperature test module, temperature control modules and multiple light characteristic test module.
On the basis of above scheme, the utility model has also made following concrete structure design and optimization:
The light that semiconductor laser to be measured exports is separated four tunnels by spectrum groupware, and a road corresponds to temperature test module, and a road corresponds to power test module and light spectrum image-forming module, and a road corresponds near field distribution test module, and a road corresponds to far-field distribution test module.
Along the output light path of semiconductor laser to be measured, described spectrum groupware comprises the infrared filter, the first optical splitter and the second optical splitter that set gradually; The infrared light that films on cavity surfaces of semiconductor lasers heat radiation produces reflexes to thermal infrared imager through infrared filter, the laser-transmitting infrared filter that semiconductor laser exports, at the first optical splitter place part laser reflection to integrating sphere, lead to power test module and light spectrum image-forming module through integrating sphere, another part laser-transmitting to the second optical splitter, in the light splitting again of the second optical splitter place, part laser reflection is to described near field distribution test module, another part laser-transmitting is to diffraction screen, and diffraction screen rear arranges described far-field distribution test module.
Light path between described infrared filter and thermal infrared imager is also provided with filter plate, this filter plate produces total transmissivity effect to infrared light, the laser that semiconductor laser exports has reflex, causes interference to prevent the part light through infrared filter transmission to thermal infrared imager.
Light path between described infrared filter and filter plate is also provided with preposition camera lens, and this preposition camera lens produces total transmissivity effect to infrared light, regulates the position of this preposition camera lens, can realize face, noise spectra of semiconductor lasers chamber and amplify.
The lens of convergence effect have been provided with between the first optical splitter and integrating sphere.
Near field distribution test module adopts ccd detector, being also provided with lens, by regulating the position of these lens, can producing amplification to laser cavity surface between this ccd detector and the second optical splitter.
Diffraction screen adopts frosted glass to make.
Temperature control modules is to semiconductor laser heat transfer by heat conduction to be measured.
The utility model has following beneficial effect:
1, the parameter test system that comprehensive sign films on cavity surfaces of semiconductor lasers lost efficacy is established, measuring semiconductor laser cavity surface is in the change of failure procedure lumen surface temperature, the change of the distribution near field, the change of far-field distribution, the change of output power and the change of spectrum; And the mutual relationship between above-mentioned parameter in the failure procedure of semiconductor cavity face can be drawn, provided multiple analysis means for films on cavity surfaces of semiconductor lasers loses efficacy.
2, the multiple semiconductor laser output parameters provided may be used for the quality and the serviceable life that characterize films on cavity surfaces of semiconductor lasers, thus improve precision of analysis and reliability.
3, test macro response is fast, tests easy.
4, the utility model can still adopt single-pulse current to inject, but thermal infrared imager is less demanding to temporal resolution.
Accompanying drawing explanation
Fig. 1 is system architecture schematic diagram of the present utility model.
Embodiment
1 is temperature control console, can pass through computing machine control temperature, but be not limited to only computerized control temperature.
2 is tested semiconductor laser, when impressed current from end face bright dipping.
L1 is thermal infrared imager camera lens, and by regulating the position of this camera lens, can realize face, noise spectra of semiconductor lasers chamber and amplify, this camera lens does not absorb the thermal-radiating infrared light of laser cavity surface.
3 is the surperficial optical splitter being coated with filter membrane, is totally reflected, has transmission effect to the light that laser instrument exports after the infrared light that laser cavity surface heat radiation produces incides surface.
L2 is lens, and do not absorb the light that laser instrument exports, the light playing noise spectra of semiconductor lasers outgoing has the effect converging in integrating sphere 9, makes material and is generally SiO
2, but be not limited to SiO
2.
4 and 5 are all a kind of optical splitter, play half reflection effect, a part of transmission to the light inciding surface, part reflection.
L3 is lens, to the Transmission light of laser emitting, by adjusting position, has amplification to laser cavity surface, makes material and is generally SiO for making material
2, but be not limited to SiO
2.
6 is diffraction screen, and have scattering process to the light inciding surface, but do not have absorption, be a kind of translucent medium, material can be frosted glass, also can be other translucent mediums.
7 is CCD, can the output light of probing semiconductor laser instrument, and can test the optical field distribution on diffraction screen 6 surface, CCD7 tests the optical field distribution computing machine 14 obtained and characterizes.
8 is CCD, can the output light of probing semiconductor laser instrument, and in conjunction with lens L3, can test the optical field distribution obtaining tested semiconductor laser 2 exiting surface, test result is characterized by computing machine 14.
9 is the effect of integrating sphere, scioptics L2, collects the part light of tested semiconductor laser 2 outgoing.
10 is power meter, can the luminous energy of measuring semiconductor laser emitting, and test result obtains the real power that semiconductor laser exports after carrying out computing by computing machine 14.
11 is spectrometer, can measuring semiconductor laser instrument export spectrum, test result is characterized by computing machine 14.
12 is thermal imaging system, can measuring semiconductor laser cavity surface Temperature Distribution, test result is characterized by computing machine 14.
13 is filter plate, total transmissivity is there is after surface is incided to the infrared light of laser cavity surface heat radiation generation, to the light that laser instrument exports, there is reflex, containing the laser that section laser sends in the infrared light preventing optical splitter 3 from reflecting, interference is caused to thermal imaging system 12.
14 is computing machine, not only has sign effect to the test result of 7,8,10,11,12, also plays the effect controlled 7,8,10,11,12, and controls the temperature of temperature control system 1.Test result comprises the numerical value of each measurement result in different time, such as every 5 seconds records test result, and timing node corresponding when automatically can identify and find above-mentioned parameter to change, be convenient to analyze accordingly.
Test macro of the present utility model mainly for semiconductor laser in long use procedure, catastrophe occurs face, chamber and catastrophe region becomes in large process gradually, the change of the following parameter of measuring semiconductor laser instrument: the change of chamber surface temperature distribution, the change of near field distribution, the change of far-field distribution, the change of output power and the change of spectrum.The utility model, on the basis of research above-mentioned parameter relation, show that the catastrophe of face, chamber and chamber surface temperature distribute, near field distribution, far-field distribution, the relation between output power and spectrum.Thus when analyzing the catastrophe of face, chamber, not only can be judged by the distribution of chamber surface temperature, near field distribution can also be passed through, far-field distribution, output power and spectrum judge, for the quality of analyzing semiconductor laser cavity surface and serviceable life and then judge that the reliability of semiconductor laser provides the support of multiple parameter.
We are semiconductor laser 2 to be measured for 980nm semiconductor laser below, elaborate to test process of the present utility model.
1) power.Open computing machine and each test module, after each test module is normally worked under the control of computing machine, under the control of the computer working current is applied to tested semiconductor laser 2, tested semiconductor laser 2 sends the laser of 980nm, tested semiconductor laser 2 chamber surface temperature rises, and the heat radiation in face, chamber produces infrared light.Now, temperature control console 1 refrigeration, makes the temperature of worktable be in room temperature, and the dissipated power reducing tested semiconductor laser 2 impacts test.After a period of time, each output characteristics of laser instrument tends towards stability.
2) infrared light that the light of the 980nm of tested semiconductor laser 2 outgoing and face, the chamber heat radiation of output produce arrives optical splitter 3 surface that surface is coated with filter membrane together, this optical splitter makes 980nm laser light, the infrared light that heat radiation produces then is entered the lens L1 with amplification by reflection, enter thermal imaging system in order to prevent the light of 980nm wavelength remaining after optical splitter 3 reflects along thermal imaging system 12 light path and affect thermal imaging system to the thermal-radiating detection accuracy in face, chamber, a filter plate 13 is increased between lens L1 and thermal imaging system 12, the infrared light that this filter plate can stop the light of 980nm to pass through and allow heat radiation to produce enters thermal imaging system 12.The chamber surface temperature of sample is obtained by the computing machine 14 be connected on thermal imaging system.
3) light being coated with the 980nm of the optical splitter 3 of filter membrane through surface arrives optical splitter 4 surperficial rear section and transmission occurs, and part reflects.The light that reflection occurs focuses on through lens L2, enter integrating sphere 9, power meter 10 and spectrometer 11 symbolize laser energy in integrating sphere and spectral distribution respectively, and then by the analysis of computing machine 14, obtain actual output energy and the spectrum of tested semiconductor laser 2.
4) light through optical splitter 4 arrives optical splitter 5 surface, the transmittance and reflectance of same generating portion, the light of reflection, after the convex lens with amplification, is arrived CCD8 surface, is symbolized face, the chamber optical field distribution of tested semiconductor laser 2 by the computing machine be connected on CCD8.
5) form hot spot through behind light arrival diffraction screen 6 surface of optical splitter 5, obtained spot size and the optical field distribution on diffraction screen 6 surface by CCD7 test, and characterized the far-field distribution exporting light by computing machine 14.
In laser instrument used, the distribution of chamber surface temperature, output power, output spectrum, face, chamber optical field distribution and far-field distribution were all exist simultaneously, had corresponding relation.Occur in the process of catastrophe in face, chamber, chamber surface temperature changes in distribution, output power changes, and output spectrum changes, and face, chamber optical field distribution changes, and far-field distribution change is also all change simultaneously, and the above-mentioned parameter after change has corresponding relation equally.The catastrophe of face, chamber be a progressive formation, this system is by the change of above-mentioned parameter in the Catastrophe Process of test chamber face, and then according to the change of above-mentioned parameter, sum up the relation (such as funtcional relationship, typical curve etc.) between above-mentioned parameter, thus analyze the quality and serviceable life that judge films on cavity surfaces of semiconductor lasers.
Claims (9)
1. for the integrated test system of films on cavity surfaces of semiconductor lasers failure analysis, comprise supply module, temperature test module and computing machine, wherein temperature test module adopts thermal infrared imager to obtain the chamber surface temperature of semiconductor laser to be measured; It is characterized in that: this integrated test system also comprises spectrum groupware, temperature control modules and multiple light characteristic test module, described temperature control modules is for regulating the temperature of semiconductor laser to be measured, described multiple light characteristic test module comprises near field distribution test module, far-field distribution test module, power test module and light spectrum image-forming module, and the light that semiconductor laser to be measured exports is separated multichannel in order to arrange different light characteristic test modules by spectrum groupware; Computing machine receives the test data of the described temperature test module of process and the output of multiple light characteristic test module, and sets up the control linkage had temperature test module, temperature control modules and multiple light characteristic test module.
2. according to the integrated test system for films on cavity surfaces of semiconductor lasers failure analysis according to claim 1, it is characterized in that: the light that semiconductor laser to be measured exports is separated four tunnels by spectrum groupware, one tunnel corresponds to temperature test module, one tunnel corresponds to power test module and light spectrum image-forming module, one tunnel corresponds near field distribution test module, and a road corresponds to far-field distribution test module.
3. the integrated test system for films on cavity surfaces of semiconductor lasers failure analysis according to claim 2, it is characterized in that: along the output light path of semiconductor laser to be measured, described spectrum groupware comprises the infrared filter, the first optical splitter and the second optical splitter that set gradually; The infrared light that films on cavity surfaces of semiconductor lasers heat radiation produces reflexes to thermal infrared imager through infrared filter, the laser-transmitting infrared filter that semiconductor laser exports, at the first optical splitter place part laser reflection to integrating sphere, lead to power test module and light spectrum image-forming module through integrating sphere, another part laser-transmitting to the second optical splitter, in the light splitting again of the second optical splitter place, part laser reflection is to described near field distribution test module, another part laser-transmitting to diffraction screen, diffraction screen rear arranges described far-field distribution test module.
4. the integrated test system for films on cavity surfaces of semiconductor lasers failure analysis according to claim 3, it is characterized in that: the light path between described infrared filter and thermal infrared imager is also provided with filter plate, this filter plate produces total transmissivity effect to infrared light, the laser that semiconductor laser exports has reflex, to prevent from causing interference to it after the part light of infrared filter reflection incides thermal infrared imager.
5. the integrated test system for films on cavity surfaces of semiconductor lasers failure analysis according to claim 4, it is characterized in that: the light path between described infrared filter and filter plate is also provided with preposition camera lens, this preposition camera lens produces total transmissivity effect to infrared light, regulate the position of this preposition camera lens, face, noise spectra of semiconductor lasers chamber can be realized and amplify.
6. the integrated test system for films on cavity surfaces of semiconductor lasers failure analysis according to claim 3, is characterized in that: the lens being provided with convergence effect between the first optical splitter and integrating sphere.
7. the integrated test system for films on cavity surfaces of semiconductor lasers failure analysis according to claim 3, it is characterized in that: described near field distribution test module adopts ccd detector, also lens are provided with between this ccd detector and the second optical splitter, by regulating the focal length of these lens, amplification can be produced to laser cavity surface.
8. the integrated test system for films on cavity surfaces of semiconductor lasers failure analysis according to claim 3, is characterized in that: described diffraction screen adopts frosted glass to make.
9. the integrated test system for films on cavity surfaces of semiconductor lasers failure analysis according to claim 1, is characterized in that: described temperature control modules is to semiconductor laser heat transfer by heat conduction to be measured.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105115698A (en) * | 2015-09-25 | 2015-12-02 | 西安立芯光电科技有限公司 | Comprehensive testing system for semiconductor laser cavity surface failure analysis |
| CN107144423A (en) * | 2017-06-23 | 2017-09-08 | 中国科学院光电研究院 | A kind of laser diode folds single bar bar power and stability measurement device and method in battle array |
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| CN111934186A (en) * | 2020-08-06 | 2020-11-13 | 西安立芯光电科技有限公司 | Method for judging optical catastrophe type of semiconductor laser chip |
| CN113686548A (en) * | 2020-05-13 | 2021-11-23 | 格芯(美国)集成电路科技有限公司 | Wafer level testing of lasers attached to photonic chips |
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- 2015-09-25 CN CN201520754206.3U patent/CN205015147U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105115698A (en) * | 2015-09-25 | 2015-12-02 | 西安立芯光电科技有限公司 | Comprehensive testing system for semiconductor laser cavity surface failure analysis |
| CN107144423A (en) * | 2017-06-23 | 2017-09-08 | 中国科学院光电研究院 | A kind of laser diode folds single bar bar power and stability measurement device and method in battle array |
| CN109211524A (en) * | 2018-12-10 | 2019-01-15 | 中国人民解放军国防科技大学 | High-power fiber laser parameter integrated synchronization test device |
| CN113686548A (en) * | 2020-05-13 | 2021-11-23 | 格芯(美国)集成电路科技有限公司 | Wafer level testing of lasers attached to photonic chips |
| CN111934186A (en) * | 2020-08-06 | 2020-11-13 | 西安立芯光电科技有限公司 | Method for judging optical catastrophe type of semiconductor laser chip |
| CN111934186B (en) * | 2020-08-06 | 2021-06-15 | 西安立芯光电科技有限公司 | Method for judging optical catastrophe type of semiconductor laser chip |
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