CN204993102U - Power converters subassembly - Google Patents
Power converters subassembly Download PDFInfo
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- CN204993102U CN204993102U CN201520765316.XU CN201520765316U CN204993102U CN 204993102 U CN204993102 U CN 204993102U CN 201520765316 U CN201520765316 U CN 201520765316U CN 204993102 U CN204993102 U CN 204993102U
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Abstract
The utility model provides one kind power converters subassembly (10) are including at least one three -phase inverter (12, 14) that are used for becoming DC voltage conversion three -phase AC voltage, at least one galvanic isolation DC is to DC converter (16), have DC link (18) of at least one DC link condenser (40), wherein at least one three -phase inverter (12, 14) and at least one DC are to DC converter (16) parallel connection in DC link (18), first subunit spare unit (46), it bears at least one three -phase inverter (12, 14) and semiconductor (30) of at least one DC to DC converter (16), and second subunit spare unit (48), it bears at least one DC link condenser (40).
Description
Technical field
The present invention relates to the field of power electric device.Specifically, the present invention relates to power converter assembly.
Background technology
In traction application, power converter is used for becoming AC voltage to be supplied to the electric drive of rolling stock and/or to be supplied to other electrical equipment the voltage transitions of being supplied by catenary, as fan, heating/cooling, electric switch etc.In this case, AC or the DC voltage of a phase is can be from the supply voltage of catenary.Other possibility is that power converter is by the diesel motor supply driving generator, and phase AC voltage is provided to power converter by it.
Especially, in traction application, the power electrical equipment with small size and low weight is needed.This further promotes the needs that space and the weight saving of power electronic circuit are arranged.The realization of this requirement also should consider the following fact: when layout becomes compact, manufactures those complexity of arranging and improves.
Substantially, power converter assembly comprises multiple component: semi-conductor power module, and it typically comprises diode and IGBT; For the capacitor of DC link, buffer and filter, inductor and resistor; The transformer of current separation is provided; Make the busbar assembly of driving member and driven member interconnection; Electronic printing circuit board assembly, e.g., control board, door actuator and interconnection plate; The cooling device of heat is removed from driving member and driven member; And/or electric current, voltage and temperature measuring equipment.
The component of high power conversion device is usually quite huge, therefore they is integrated in compact package the task of can be changed into difficulty, and proposes technological challenge.
Such as, US6326761B1, DE10236525A1, EP1283589A2 and EP2463996A1 show dissimilar power converter, it illustrates back-to-back AC-AC transducer or single input-mono-output DC resonant vibration converter.
Summary of the invention
The object of the present invention is to provide the power converter assembly with small size and low weight, it makes manufacture, is arranged in electronic box, the task of test-run a machine and maintenance is easy.
This object is realized by the theme of independent claims.Other exemplary embodiment is from dependent claims and be described as significantly below.
The present invention relates to a kind of power converter assembly, it can be used for traction application.Power converter assembly can be located in case, and/or can be arranged in rolling stock inside and outside (below or top).It is to be understood that term " power " can relate to the transducer being applicable to process higher than 10A and/or the electric current higher than 1.000V.
According to embodiments of the invention, power converter assembly comprises: for DC voltage being converted at least one three-phase inverter of phase AC voltage; At least one electric current isolation DC to DC transducer; There is the DC link of at least one DC link. capacitor, wherein at least one three-phase inverter and at least one DC to DC transducer and the parallel connection of DC link; First sub-component unit, it carries the semiconductor of at least one three-phase inverter and at least one DC to DC transducer; And the second sub-component unit, it carries at least one DC link. capacitor.
Power converter assembly comprises two dissimilar sub-transducers, three-phase inverter and DC to DC transducers, and they are connected in parallel in identical DC link, and this component is also held by assembly.These components of assembly distribute between two sub-assembly units.First sub-component unit carries the power semiconductor of two sub-transducers.Second sub-component unit storage DC link. capacitor.
It is to be understood that sub-component unit is a part for power converter assembly, it mechanically can disconnect with as overall power converter assembly, that is, all component/portion being attachable of sub-component unit are in common framework, housing and/or base plate.
Power converter assembly can be used as whole electrical network source of supply, such as, airborne in rolling stock.Power converter assembly especially can be suitable for being arranged in large complicated power converter system or electrical equipment case, wherein auxiliary power needs to be provided to auxiliary equipment, as, fan, or the actuator based on induction motor of other type, and wherein, need DC controlled source, such as, for batteries charging.
According to embodiments of the invention, power converter assembly also comprises rectifier, and it is connected to DC link and AC power inputs for supplying AC voltage to rectifier.Rectifier can be passive rectifier, and this component (e.g., diode) is also carried by the first sub-component unit.In this type of mode, power converter assembly electrically can be supplied from a phase AC source.
According to embodiments of the invention, power converter assembly also comprises the DC power input being connected to DC link.In this type of mode, power converter assembly electrically can be supplied from DC source.
According to embodiments of the invention, at least one DC link. capacitor is contained in the housing of the second sub-component unit.Usually, DC link comprises multiple DC capacitor, and the plurality of DC capacitor can allly all hold and/or be encapsulated in a common housing, and it can regard the bearing structure of the second sub-component unit as.
According to embodiments of the invention, DC to DC transducer comprises the transformer in the housing being contained in the second sub-component unit.When transformer provides the current separation of DC to DC transducer, this transformer is also mechanically connected to housing, and/or is encapsulated in the housing of the second sub-component unit.
According to embodiments of the invention, DC to DC transducer comprises transformer, and it is installed on the base plate of the first sub-component unit.Also can be possible, the current separation transformer of DC to DC transformer is connected mechanically to the first sub-component unit.
According to embodiments of the invention, the first sub-component unit comprises at least one three phase converer base plate mounted thereto with at least power semiconductor modular of at least one DC to DC transducer.The sub-transducer of power converter assembly and their semiconductor switch of door actuator optional can be installed on power semiconductor modular, and such as, wherein each can comprise the base plate on himself.Power semiconductor modular can be installed (such as, the base plate with them) in public metal base plate, and it can regard the bearing structure of the first sub-component unit as.
Metal base plate can be served multiple component and be fixed for machinery: at least one power semiconductor modular and at least one current transducer can be arranged on base plate.
According to embodiments of the invention, base plate and at least one power semiconductor modular thermo-contact, and provide the relative cooling surface that cooling agent stream can be utilized to cool.The conduit transmitting cooling agent can be located at below base plate and/or on the side of cooling surface.In this type of mode, metal base plate can implement at least one conduit to transmit cooling agent in metal base plate lower face.Metal base plate can with the base plate thermo-contact of at least one semi-conductor power module, to dissipate from the heat of at least one power semiconductor modular.
According to embodiments of the invention, the first sub-component unit comprises the interface board assembly being installed on base plate, and at least one power model is contained between base plate and interface board assembly.Above power semiconductor modular, interface board assembly can be installed on the first sub-component unit, and it can attach to base plate via post or other immobilising device.Interface board assembly can be fixed on base plate in the over top of at least one power semiconductor modular.
The interface board assembly that can comprise one or more printed circuit board (PCB) (PCB) can be used for installing and/or electrical connection control board, its can with power semiconductor modular electric screen.
According to embodiments of the invention, the first sub-component unit comprises at least one control board, for controlling at least one three phase converer and/or at least one DC to DC transducer.Each the sub-transducer (e.g., three phase converer and/or DC to DC transducer) of power converter assembly can comprise controller, and it is provided by control board.These control boards can be installed on the first sub-component unit.Control board can be PCB, and IC and other control hardware are arranged on PCB.
According to embodiments of the invention, at least one control board and at least one power model are mounted opposite in interface board assembly.Interface board assembly can be electrically connected on power semiconductor modular, and can be provided for the interface of control board, and this control board can be connected to power semiconductor modular via interface board electrical component.
Substantially, interface board assembly can make one or more control board and at least one other component interconnect be arranged on metal base plate.
Control board can regard printed board assembly as, and it comprises power converter control piece and the door driving electronic circuit of embedding, and/or it is arranged on above at least one interface board assembly.
According to embodiments of the invention, interface board assembly comprises at least the first rigidity printed panel and the second rigidity printed panel that are interconnected by least one flexible printed board.First rigidity printed panel can be installed on base plate, and interconnects with board electrical.First rigidity printed panel can be provided for the interface of one or more control board.Second rigidity printed panel can be installed at least one power semiconductor modular, and can with at least one power semiconductor modular electric interconnection, that is, the electrical connection of sub-transducer can be provided to.
Substantially, interface board flexible and rigidity printed panel region capable of being combined.Device control board being connected to interface board is located at least one rigid plate region.The device component be arranged on metal base plate being connected to interface board can be located at least the second rigid region.Between two rigid regions, there is at least one flexible board region, it realizes the crooking ability to interconnection.
According to embodiments of the invention, interface board comprises the stratum providing the EMC between at least one power semiconductor modular and control board to shield.Stratum or ground level can be placed between semi-conductor power module and one or more control board.Device stratum being connected to ground connection return path can be located between interface board and metal base plate.
According to embodiments of the invention, the first sub-component unit and the second sub-component unit and at least one laminated bus assembly interconnect, this at least one laminated bus assembly makes DC link. capacitor and semi-conductor power module electric interconnection.Laminated bus assembly can comprise the layer of some non-conductive and conduction, it contacts DC link. capacitor (simultaneously making them be connected in parallel) on the side of the second sub-component unit, and/or contact is installed on base plate and the contact interconnected with at least one power semiconductor modular on the side of the first sub-component unit.
These and other aspect of the present invention is by apparent and illustrate with reference to it from the embodiment hereinafter described.
Accompanying drawing explanation
Theme of the present invention will be explained more in detail with reference to exemplary embodiment illustrated in the accompanying drawings in following text.
Fig. 1 shows the schematic circuit of power converter assembly according to an embodiment of the invention.
Fig. 2 shows the perspective disassembled view of power converter assembly according to an embodiment of the invention.
Fig. 3 shows the perspective view of the power converter assembly of Fig. 2.
Fig. 4 shows the schematic cross-sectional of power converter assembly according to an embodiment of the invention.
The reference number used in accompanying drawing and their meaning are listed in schematic form in list of reference characters.In principle, identical part is provided with identical reference number in the accompanying drawings.
List of parts
10 power converter assemblies
12 first three-phase inverters
14 second three-phase inverters
16DC to DC transducer
18DC link
20 rectifiers
22 1 phase AC inputs
24DC inputs
26 three-phase AC export
28 half-bridges
30 power semiconductors
32DC exports
34 two-phase inverters
36 transformers
38 rectifiers
40DC link. capacitor
42 controllers
The controller of 42a first three-phase inverter
The controller of 42b second three-phase inverter
The controller of 42cDC to DC transducer
44 current transducer
46 first sub-component unit
48 second sub-component unit
50 power semiconductor modulars
52 base plates
54 housings
56 laminated bus assemblies
57 contact elements
58 interface board assemblies
60 main rigidity printed panels
62 connector rigidity printed panels
64 flexible printed boards
66 bars
68 control boards
70 stratum
72 conductivity devices.
Embodiment
Fig. 1 shows the power converter assembly 10 for a phase ac input voltage and/or DC input voltage being converted to two three-phase AC output voltages and DC output voltage.
Substantially, power converter assembly 10 comprises two three-phase inverters, 12,14 and one DC to DC transducers 16.Sub-transducer 12,14,16 is connected in parallel in DC link 18, DC link 18 and can supplies via rectifier 20.Rectifier 20 for passive diode rectifier inputs 22 with a phase AC and is connected.Power converter assembly also comprises DC input 24, and it is directly connected with DC link 18.
There is provided the three-phase of power converter assembly 10 to export the three-phase inverter 12 of 26, each in 14 comprises three half-bridges 28 of power semiconductor 30 (as IGBT and diode), and wherein each provides the phase of AC output voltage.Half-bridge 28 is connected in parallel in DC link 18.
DC to DC transducer 16 provides the DC of power converter assembly 10 to export 32.DC to DC transducer 16 comprises the two-phase inverter 34 be made up of two half-bridges being connected in parallel in DC link 18.Two-phase inverter 34 is for the transformer 36 being applied to electric current isolation, and it is interconnected to rectifier 38, provides DC output voltage.In this case, rectifier 38 is step-down and/or boost converter.
As shown in fig. 1, DC link 18 is for having the shunting DC link of at least two DC link. capacitor 40.
Sub-transducer 12,14, each in 16 is controlled by controller 42, and such as, controller 42 provides gate signal for active switchable power semiconductor 30, e.g., corresponding sub-transducer 12,14, the IGBT of 16.Controller 42a is for controlling the first three-phase inverter 12, and controller 42b is for controlling the second three-phase inverter 14, and controller 42c is for control DC to DC transducer 16.
Controller 42a, each and current transducer 44 in 42b interconnect, and current transducer 44 is measured respective three-phase and exported electric current in 26.
Although Fig. 1 shows the electric composition of power converter 10, Fig. 2 shows the mechanical structure of power converter 10 to 3.
In order to simplify manufacture, install and/or safeguard, power converter assembly 10 comprises two sub-assembly units 46,48.
First sub-component unit 46 comprises at least one semi-conductor power module 50, one or more current transducer 44, and optional one or more resistor, they are installed on metal base plate 52, and metal base plate 52 provides machinery to fix and is used as cartridge element.The semiconductor switch 30 of at least one semiconductor module 50 carrier transducer 12,14,16.
Second sub-component 48 comprises capacitor 40, and it can be connected in series or in parallel, or for series and parallel connections connect layout.Second sub-component unit 48 comprises housing 54, and it surrounds and carrying capacitor 40.
In an embodiment, for DC to DC transducer 16 transformer 36 and export the driven member be associated of (as filter inductance and/or electric capacity) for DC and also can be enclosed in housing 54.In yet another embodiment, these Components installation are in base plate 52.
First sub-component unit 46 and the second sub-component unit 48 are interconnected by laminated bus assembly 56, and assembly 56 comprises the layer of some non-conductive and conduction, and it provides the electric interconnection of DC link 18, and DC link 18 is electrically connected with power semiconductor modular 50.First sub-component unit 46 provides contact element 57 to bus, for contact laminating busbar assembly 56.
Also as shown in Figure 4, the first sub-component unit 46 comprises interface board assembly 58, and it comprises the some rigidity printed panels 60,62 interconnected by flexible printed board 64.
One or more control board 68 is arranged on the main rigidity printed panel 60 of the interface board assembly 58 be connected with base plate 52 via bar 66, one or more control board 68 can comprise control and the gate drive circuit of embedding, and/or sub-transducer 12 can be provided, 14, the controller 42a of 16,42b, 42c.Interface board assembly is suitable for the door drive terminal of (multiple) control board 68 is interconnected with the gate control terminal of (multiple) semi-conductor power module 50.In addition, current transducer 44, temperature sensor and/or the power supply for (multiple) control board 68 are connected with (multiple) control board 68 by interface board assembly 58.
Each in these connections can be provided with the connector rigidity printed panel 62 being installed on respective members, and this connector rigidity printed panel 62 interconnects via flexible printed board 64 and main rigidity printed panel 60.Such as, can guide in like fashion from control board 68 to the gate control signal of the gate control terminal of power semiconductor modular 50.In addition, the terminal of current transducer 44 can be connected to control board 68 in like fashion.Between main rigidity printed panel 60 and connector rigid plate 62, flexible printed board 64 provides crooking ability to connection.
Main rigidity printed panel 60 and other printed panel 62,64 can be multi-layer sheet.The EMC that main printing rigid plate additionally provides by means of the stratum 70 between one or more power semiconductor modular 50 and (multiple) control board 60 shields.Stratum 70 can be connected to the ground connection return path on base plate 52 via conductivity device 72.
Base plate 52 is also applicable to cooling (multiple) semiconductor module 50.Such as, the conduit 74 for transmitting cooling agent can be located at the side of the base plate 52 relative with (multiple) semiconductor die 50.Metal base plate 52 can with semiconductor 30 thermo-contact on (multiple) semiconductor die 50 and its, and can by the dissipation of heat that generates in cooling agent.
Although be shown specifically in accompanying drawing and aforementioned description and described the present invention, this type of diagram and description will be recognized as exemplary or illustrative, and not restrictive; The invention is not restricted to disclosed embodiment.Other modification of disclosed embodiment can be appreciated by those skilled in the art and realize, and the present invention of research practice prescription from accompanying drawing, open and claims.In the claims, word " comprises " does not get rid of other element or step, and indefinite article " " or " one " do not get rid of multiple.Single processor or controller or other unit can realize the function of the some projects described in claim.The fact that some measure describes in mutually different dependent claims does not indicate, and the combination of these measures can not favourablely use.Any reference number in claim should not regard limited field as.
Claims (10)
1. a power converter assembly (10), comprising:
For DC voltage being converted at least one three-phase inverter (12,14) of phase AC voltage;
At least one electric current isolation DC to DC transducer (16);
There is the DC link (18) of at least one DC link. capacitor (40), at least one three-phase inverter wherein said (12,14) and at least one DC to DC transducer (16) described are connected in parallel in described DC link (18);
First sub-component unit (46), the semiconductor (30) of described at least one three-phase inverter (12,14) of its carrying and at least one DC to DC transducer (16) described; And
Second sub-component unit (48), its carrying at least one DC link. capacitor (40) described.
2. power converter assembly according to claim 1 (10), is characterized in that, described power converter assembly (10) also comprises:
Be connected to the rectifier (20) of described DC link (18);
For AC power input (22) to described rectifier (20) supply AC voltage.
3. power converter assembly according to claim 1 (10), is characterized in that, described power converter assembly (10) also comprises:
Be connected to DC power input (24) of described DC link (18).
4. power converter according to claim 1 (10),
It is characterized in that, at least one DC link. capacitor (40) described is contained in the housing (54) of described second sub-component unit (48), and described DC to DC transducer (16) comprises the transformer (36) in the housing (54) being contained in described second sub-component unit (48); And/or
Wherein said DC to DC transducer (16) comprises transformer (36), and it is installed on the base plate (52) of described first sub-component unit (46).
5. power converter according to claim 1 (10),
It is characterized in that, the base plate (52) that described in described first sub-component unit (46) comprises, at least one power semiconductor modular (50) of at least one three-phase inverter (12,14) and at least one DC to DC transducer (16) described is mounted thereto.
6. power converter assembly according to claim 5 (10),
It is characterized in that, described base plate (52) and the thermo-contact of described at least one power semiconductor modular (50), and the relative cooling surface that cooling agent stream can be utilized to cool is provided.
7. power converter assembly according to claim 5 (10),
It is characterized in that, described first sub-component unit (46) comprises the interface board assembly (58) being installed on described base plate (52), makes described at least one power semiconductor modular (50) be contained between described base plate (52) and described interface board assembly (58);
Wherein said first sub-component unit (46) comprises at least one control board (68) for controlling described at least one three-phase inverter (12,14) and/or at least one DC to DC transducer (16) described;
Wherein said at least one control board (68) and described at least one power model (50) are mounted opposite in described interface board assembly (58).
8. power converter assembly according to claim 7 (10),
It is characterized in that, described interface board assembly (58) comprises at least the first rigidity printed panel (60) and the second rigidity printed panel (62) that are interconnected by least one flexible printed board (64);
Wherein said first rigidity printed panel (60) be installed on described base plate (52) and with described base plate (52) electric interconnection;
Wherein said second rigidity printed panel (62) is installed on described at least one power semiconductor modular (50), and with described at least one power semiconductor modular (50) electric interconnection.
9. power converter assembly according to claim 7 (10),
It is characterized in that, described interface board assembly (58) comprises the stratum (70) providing described EMC shielding between at least one power semiconductor modular (50) and described control board (68).
10. power converter assembly according to claim 1 (10),
It is characterized in that, described first sub-component unit (46) and described second sub-component unit (48) interconnect with at least one laminated bus assembly (56), and at least one laminated bus assembly (56) described makes described DC link. capacitor (40) and described semi-conductor power module (50) electric interconnection.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP15181090 | 2015-08-14 | ||
| EP15181090.0 | 2015-08-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204993102U true CN204993102U (en) | 2016-01-20 |
Family
ID=53836003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520765316.XU Active CN204993102U (en) | 2015-08-14 | 2015-09-30 | Power converters subassembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204993102U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107092281A (en) * | 2016-02-18 | 2017-08-25 | Ls 产电株式会社 | Cooling system for two-dimensional array power converter |
| CN112910321A (en) * | 2019-12-02 | 2021-06-04 | 奥迪股份公司 | Circuit arrangement comprising a drive circuit and an inverter circuit, and motor vehicle |
-
2015
- 2015-09-30 CN CN201520765316.XU patent/CN204993102U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107092281A (en) * | 2016-02-18 | 2017-08-25 | Ls 产电株式会社 | Cooling system for two-dimensional array power converter |
| CN112910321A (en) * | 2019-12-02 | 2021-06-04 | 奥迪股份公司 | Circuit arrangement comprising a drive circuit and an inverter circuit, and motor vehicle |
| CN112910321B (en) * | 2019-12-02 | 2024-10-01 | 奥迪股份公司 | Circuit arrangement comprising an excitation circuit and an inverter circuit, and motor vehicle |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180710 Address after: Baden, Switzerland Patentee after: ABB TECHNOLOGY LTD. Address before: Zurich Patentee before: ABB T & D Technology Ltd. |