CN204076897U - A kind of ladder hollow type miaow head pcb punching die structure - Google Patents
A kind of ladder hollow type miaow head pcb punching die structure Download PDFInfo
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- CN204076897U CN204076897U CN201420582915.3U CN201420582915U CN204076897U CN 204076897 U CN204076897 U CN 204076897U CN 201420582915 U CN201420582915 U CN 201420582915U CN 204076897 U CN204076897 U CN 204076897U
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- Prior art keywords
- drift
- hollow out
- punching press
- punch
- miaow head
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Abstract
The utility model discloses a kind of ladder hollow type miaow head pcb punching die structure, comprise upper die and lower die, described patrix is provided with standard punch and engraves low drift, described counterdie is provided with punch die material-dropping hole, described standard punch is provided with hollow out drift and non-hollow out drift, describedly engrave low drift and be also provided with hollow out drift and non-hollow out drift, described standard punch and engrave low drift in the random uniform balance distribution of patrix.When the utility model carries out punching press, standard punch first contacts punching press with miaow head pcb plate, punching press just completes, engrave low drift and namely contact punching press with miaow head pcb plate immediately, ram ratio is balanced, saving stamping press comparatively steadily, the defect such as to weigh, damaged surfaces, surface abnormalities, surface adhesion force are not enough after avoiding and decrease a large amount of punch dies wounded, significantly improve punching press yields and punching press economic benefit.
Description
Technical field
The utility model relates to circuit board punch forming field, is specifically related to a kind of ladder hollow type miaow head pcb punching die structure.
Background technology
In existing punch die manufacturing technology, it is completed by common flat plate mold that PCB is shaped, and its product quality can not get management and control, and disqualification rate is more, and after punching press, pcb product often occurs that product weighs wounded, damages, the bad phenomenon such as surface abnormalities.
Utility model content
The purpose of this utility model is the above problem overcoming prior art existence, a kind of ladder hollow type miaow head pcb punching die structure is provided, when the utility model carries out punching press, standard punch first contacts punching press with miaow head pcb plate, punching press just completes, engrave low drift and namely contact punching press with miaow head pcb plate immediately, ram ratio is balanced, saving stamping press comparatively steadily, the defect such as to weigh, damaged surfaces, surface abnormalities, surface adhesion force are not enough after avoiding and decrease a large amount of punch dies wounded, significantly improve punching press yields and punching press economic benefit.
For realizing above-mentioned technical purpose, reach above-mentioned technique effect, the utility model is achieved through the following technical solutions:
A kind of ladder hollow type miaow head pcb punching die structure, comprise upper die and lower die, described patrix is provided with standard punch and engraves low drift, described counterdie is provided with punch die material-dropping hole, described standard punch is provided with hollow out drift and non-hollow out drift, described hollow out drift is provided with hollow out cell body, described standard punch and engrave low drift in the distribution of patrix random uniform balance.
Further, engrave low drift described in and be also provided with hollow out drift and non-hollow out drift.
Further, it is high that described standard punch ratio engraves low drift, and difference in height is the thickness of a pcb plate, and difference is 0.5-1.6 mm.
Further, the described hollow out cell body hollow out degree of depth is 0.15-0.2 mm.
The beneficial effects of the utility model are:
When the utility model carries out punching press, standard punch first contacts punching press with miaow head pcb plate, punching press just completes, engrave low drift and namely contact punching press with miaow head pcb plate immediately, ram ratio is balanced, saving stamping press comparatively steadily, the defect such as to weigh, damaged surfaces, surface abnormalities, surface adhesion force are not enough after avoiding and decrease a large amount of punch dies wounded, significantly improve punching press yields and punching press economic benefit.
Above-mentioned explanation is only the general introduction of technical solutions of the utility model, in order to better understand technological means of the present utility model, and can be implemented according to the content of description, coordinates accompanying drawing to be described in detail as follows below with preferred embodiment of the present utility model.Detailed description of the invention of the present utility model is provided in detail by following examples and accompanying drawing thereof.
Accompanying drawing explanation
Accompanying drawing described herein is used to provide further understanding of the present utility model, and form a application's part, schematic description and description of the present utility model, for explaining the utility model, is not formed improper restriction of the present utility model.In the accompanying drawings:
Fig. 1 is overall structure schematic diagram of the present utility model.
Number in the figure illustrates: 1, patrix, 2, counterdie, 3, engrave low drift, 4, standard punch, 5, hollow out drift, 6, non-hollow out drift, 7, hollow out cell body, 8, punch die material-dropping hole.
Detailed description of the invention
Below with reference to the accompanying drawings and in conjunction with the embodiments, describe the utility model in detail.
With reference to shown in Fig. 1, a kind of ladder hollow type miaow head pcb punching die structure, comprise patrix 1 and counterdie 2, described patrix 1 is provided with standard punch 4 and engraves low drift 3, described counterdie 2 is provided with punch die material-dropping hole 8, described standard punch 4 is provided with hollow out drift 5 and non-hollow out drift 6, and described hollow out drift 5 is provided with hollow out cell body 7, described standard punch 4 and engrave low drift 3 in the random uniform balance distribution of patrix 1.
Describedly engrave low drift 3 and be also provided with hollow out drift 5 and non-hollow out drift 6.
Described standard punch 4 is higher than engraving low drift 3, and difference in height is the thickness of a pcb plate, and difference is 0.5-1.6 mm.
The hollow out cell body 7 hollow out degree of depth that described hollow out drift 5 is arranged is 0.15-0.2 mm.
The operation principle of the present embodiment is as follows:
When making patrix of the present utility model, all unifications arrange standard punch 4, by being uniformly distributed, spaced apart, take into account the principle of balance, the wherein standard punch 4 of nearly half quantity is engraved low one-tenth and engraves low drift 3, engrave the thickness that the low degree of depth is a pcb plate, thickness difference according to concrete pcb plate carries out flexible modulation, the hollow out degree of depth is generally between 0.5-1.6 mm, again by being uniformly distributed, spaced apart, take into account the principle of balance, again wherein remaining nearly half quantity standard punch 4 and engrave and low drift 3 carries out hollow out add groove, the degree of depth of hollow out is between 0.15-0.2 mm.
Counterdie 2 of the present utility model is identical with the structure of common diel, when punching press, standard punch 4 first contacts punching press with miaow head pcb plate, punching press just completes, engrave low drift 3 and namely contact punching press with miaow head pcb plate immediately, ram ratio comparatively steadily balanced, save stamping press, the defect such as to weigh, damaged surfaces, surface abnormalities, surface adhesion force are not enough after avoiding and decrease a large amount of punch dies wounded, significantly improve punching press yields and punching press economic benefit.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection domain of the present utility model.
Claims (4)
1. a ladder hollow type miaow head pcb punching die structure, it is characterized in that: comprise upper die and lower die, described patrix is provided with standard punch and engraves low drift, described counterdie is provided with punch die material-dropping hole, described standard punch is provided with hollow out drift and non-hollow out drift, described hollow out drift is provided with hollow out cell body, described standard punch and engrave low drift in the distribution of patrix random uniform balance.
2. a kind of ladder hollow type miaow head pcb punching die structure according to claim 1, is characterized in that: described in engrave low drift and be also provided with hollow out drift and non-hollow out drift.
3. a kind of ladder hollow type miaow head pcb punching die structure according to claim 1, is characterized in that: it is high that described standard punch ratio engraves low drift, and difference in height is the thickness of a pcb plate, and difference is 0.5-1.6 mm.
4. a kind of ladder hollow type miaow head pcb punching die structure according to claim 1, is characterized in that: the described hollow out cell body hollow out degree of depth is 0.15-0.2 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420582915.3U CN204076897U (en) | 2014-10-10 | 2014-10-10 | A kind of ladder hollow type miaow head pcb punching die structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420582915.3U CN204076897U (en) | 2014-10-10 | 2014-10-10 | A kind of ladder hollow type miaow head pcb punching die structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204076897U true CN204076897U (en) | 2015-01-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420582915.3U Expired - Fee Related CN204076897U (en) | 2014-10-10 | 2014-10-10 | A kind of ladder hollow type miaow head pcb punching die structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204076897U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104607541A (en) * | 2014-12-31 | 2015-05-13 | 苏州征之魂专利技术服务有限公司 | Step type punch hollow thin plate stamping die structure |
| CN105563876A (en) * | 2014-10-10 | 2016-05-11 | 苏州市三生电子有限公司 | Stepped hollow type die punching structure for microphone pcb (printed circuit board) |
-
2014
- 2014-10-10 CN CN201420582915.3U patent/CN204076897U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105563876A (en) * | 2014-10-10 | 2016-05-11 | 苏州市三生电子有限公司 | Stepped hollow type die punching structure for microphone pcb (printed circuit board) |
| CN104607541A (en) * | 2014-12-31 | 2015-05-13 | 苏州征之魂专利技术服务有限公司 | Step type punch hollow thin plate stamping die structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150107 Termination date: 20171010 |