CN1971853A - Semiconductor wafer processing device - Google Patents
Semiconductor wafer processing device Download PDFInfo
- Publication number
- CN1971853A CN1971853A CN 200610149359 CN200610149359A CN1971853A CN 1971853 A CN1971853 A CN 1971853A CN 200610149359 CN200610149359 CN 200610149359 CN 200610149359 A CN200610149359 A CN 200610149359A CN 1971853 A CN1971853 A CN 1971853A
- Authority
- CN
- China
- Prior art keywords
- semiconductor wafer
- box
- ultraviolet irradiation
- mentioned
- irradiation unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 125
- 238000012545 processing Methods 0.000 title claims abstract description 36
- 230000007246 mechanism Effects 0.000 claims abstract description 108
- 230000005855 radiation Effects 0.000 claims description 12
- 238000003754 machining Methods 0.000 claims description 9
- 230000008093 supporting effect Effects 0.000 abstract description 31
- 230000032258 transport Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 2
- 230000008569 process Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 122
- 238000005520 cutting process Methods 0.000 description 22
- 230000009471 action Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 230000003028 elevating effect Effects 0.000 description 6
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 208000034189 Sclerosis Diseases 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002775 capsule Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Abstract
The invention provides a semiconductor wafer processing device in which an ultraviolet irradiation unit can be easily mounted. The semiconductor wafer processing device of the invention comprises a box carrier platform (35), a processing mechanism (7), a transportation mechanism; the box carrier platform (35) carries a box (10) for accepting a semiconductor wafer (W) which is held on a supporting frame (12) by a protection band (11); the processing mechanism (7) processes the semiconductor wafer (W) transported to a processing region; the transportation mechanism transports the semiconductor wafer (W) between the box (10) and the processing region (7). The invention has characteristics that: a wafer transporting out/in mechanism (40) and the ultraviolet irradiation unit (45) is configured in a selective and detachable manner; the wafer transporting out/in mechanism (40) carries the semiconductor wafer (W) and transports the carried semiconductor wafer (W) out of/into the transportation mechanism; the ultraviolet irradiation unit (45) carries the semiconductor wafer (W) transported from the transportation mechanism and irradiates an ultraviolet on the protection band (11) adhered with the semiconductor wafer (W).
Description
Technical field
The present invention relates to a kind of processing unit (plant) of semiconductor wafer, say in more detail, relate to the processing unit (plant) of semiconductor wafer with ultraviolet irradiation unit.
Background technology
For example, in semiconductor device manufacturing process, arrange a plurality of zones on the surface of the semiconductor wafer of circular plate shape roughly with clathrate, at these a plurality of circuit such as cancellate zone formation IC, LSI that are arranged in, cut off along each zone that predetermined line (ス ト リ one ト) (cut-out line) will form this circuit by topping machanism, thus manufacturing the semiconductor chip here.Like this, by the topping machanism cutting semiconductor chip time, in advance semiconductor wafer is supported on the bearing support, becomes messy to prevent divided semiconductor chip by splicing tape.Bearing support forms has peristome of accommodating semiconductor wafer and the annular of pasting the band paste section of splicing tape, semiconductor wafer is pasted on the splicing tape that is positioned at peristome support.Like this, be supported on the semiconductor wafer of bearing support by splicing tape, be divided into shaped like chips, and, under the state that supports by splicing tape by bearing support, be transported to bonding die operation as subsequent processing, pick up one by one from splicing tape by die Bonder, be installed to the precalculated position of lead frame, capsule (パ Star ケ one ジ).
For make the semiconductor chip that undertaken by die Bonder to pick up operation easy, as splicing tape, the general UV band that bonding force is descended by irradiation ultraviolet radiation that uses.After semiconductor chip was divided into a plurality of chips, irradiation ultraviolet radiation on splicing tape was peeled off splicing tape from semiconductor wafer.For this reason, the occasion using the UV band as splicing tape after the bonding die operation of being undertaken by topping machanism, needs the ultraviolet irradiation operation, can not begin the cutting action of following semiconductor wafer, so, the problem that exists productivity to descend.
In order to solve such problem, the applicant proposes to dispose at the downside of box platform (カ セ Star ト テ one Block Le) topping machanism (TOHKEMY 2003-203887 communique) of ultraviolet irradiation unit.In this topping machanism, during being transported to ultraviolet irradiation unit at the semiconductor wafer that will cut, ultraviolet irradiation being with to the UV of bonding semiconductor wafer, can begin the cutting action of next semiconductor wafer.
Yet, in order to carry out the sampling check of semiconductor wafer, or the semiconductor wafer of other kind of cutting processing, sometimes at the downside configuration inspection box (for example TOHKEMY 2005-45134 communique) of box platform.For this reason, use the occasion of ultraviolet irradiation unit, for example can consider checking the downside configuration ultraviolet irradiation unit of box, but having the apparatus structure complicated problems that becomes.Perhaps, also can pull down and check box, reinstall ultraviolet irradiation unit, but exist the structure modify of device to need the problem of time.
Summary of the invention
The present invention makes in view of the above problems, and its purpose is to provide a kind of can easily install ultraviolet irradiation unit, novel and through the processing unit (plant) of the semiconductor wafer improved.
In order to address the above problem, according to a certain viewpoint of the present invention, provide a kind of processing unit (plant) of semiconductor wafer, the processing unit (plant) of this semiconductor wafer has box mounting table, organisation of working, conveying mechanism; This box mounting table is carried out mounting to box, and this box is used to accommodate by boundary belt and is supported on semiconductor wafer on the bearing support; This organisation of working is processed the semiconductor wafer that is transported to machining area; This conveying mechanism is transport semiconductor wafers between box and machining area.Has such feature here: can select in the inside of box mounting table and configuration wafer in detachable ground is sent and sent into mechanism and ultraviolet irradiation unit; This wafer is sent and is sent into mechanism's mounting semiconductor wafer is arranged, and the semiconductor wafer of mounting is sent be sent to the conveying mechanism side; The semiconductor wafer that this ultraviolet irradiation unit mounting is sent into from the conveying mechanism side, with ultraviolet irradiation to the boundary belt of having pasted semiconductor wafer.
Ultraviolet irradiation unit of the present invention is owing to be formed in the inner space of box mounting table removably, thus can with operation accordingly in the inner space of box mounting table the exchange wafer send and send into mechanism or ultraviolet irradiation unit.Like this, do not need to have wafer and send the box mounting table of sending into mechanism and dispose ultraviolet irradiation unit dividually, or change box mounting table self with inner, so, but the structure of cancellation element complexity, modifier needs the problem of time.
The radiation source of ultraviolet irradiation unit for example can use light-emitting diode.Like this, can reduce the size of ultraviolet irradiation unit, can be inserted in the inner space of box mounting table no problemly.In addition, ultraviolet irradiation unit also can be from the boundary belt that is inserted into the semiconductor wafer in the ultraviolet irradiation unit to the boundary belt irradiation ultraviolet radiation.
As described above such, according to the present invention, can provide the processing unit (plant) that the semiconductor wafer of ultraviolet irradiation unit can easily be installed.
Description of drawings
Fig. 1 is the general perspective that the topping machanism of the 1st execution mode of the present invention is shown.
Fig. 2 is the key diagram that the box driving mechanism of this execution mode is shown.
Fig. 3 is that the wafer that this execution mode is shown is sent the perspective view of sending into mechanism.
Fig. 4 illustrates the key diagram that the wafer that Fig. 3 has been installed is sent the box driving mechanism of sending into mechanism.
Sectional view when Fig. 5 (a) vertically cuts off the ultraviolet irradiation unit of this execution mode for relative Y direction, the sectional view when (b) vertically cutting off the ultraviolet irradiation unit of this execution mode for relative X-direction.
Fig. 6 is the key diagram that the box driving mechanism of the ultraviolet irradiation unit that Fig. 5 has been installed is shown.
Embodiment
Below, the preferred implementation that present invention will be described in detail with reference to the accompanying.In this specification and accompanying drawing,,, omit repeat specification by adopting identical symbol for the structural element that has same functional structure in fact.
(the 1st execution mode)
At first, according to Fig. 1 and Fig. 2, the topping machanism as the processing unit (plant) of semiconductor wafer of the 1st execution mode of the present invention is described.Here, Fig. 1 is the perspective view that the topping machanism 1 of present embodiment is shown.In addition, Fig. 2 is the key diagram of structure that the box driving mechanism 3 of this execution mode is shown.
The topping machanism 1 of present embodiment has pedestal 2, box driving mechanism the 3, the 1st conveying mechanism 5, fixture 6, cutting mechanism 7, wiper mechanism 8 and the 2nd conveying mechanism 9.
Box mounting table 35 is with the box 10 mountings platform of face 35a thereon, by supporting base 34 supportings.Therefore, by supporting base 34 liftings, thereby make the box mounting table 35 also lifting of mounting on supporting base 34.On a pair of side relative of box mounting table 35, form peristome 371,372, cover 36 on the peristome 372 of machining area opposition side opening, being provided with Y direction.Be provided for disposing wafer described later in the inside of box mounting table 35 and send the space 37 of sending into mechanism 40 or ultraviolet irradiation unit 45.
The 1st conveying mechanism 5 will be for being housed in semiconductor wafers in the box 10 and sending or semiconductor wafer being sent to unit in the box 10, these box 10 mountings 35a above box mounting table 35.In addition, the 1st conveying mechanism 5 is also sent and is sent into mechanism 40 or ultraviolet irradiation unit 45 is sent into the mechanism that sends semiconductor wafer for being used for wafer described later relatively.The 1st conveying mechanism 5 for example comprise the hand supporting member 52 of the hand 51 that keeps semiconductor wafer, supporting hand 51 and make the hand 51 that is supported on the hand supporting member 52 towards Y-axis to the hand travel mechanism 53 that moves.
The semiconductor wafer that grain-clamping table 62 is for example sent by the 1st conveying mechanism 5 for mounting, the platform that the semiconductor wafer of mounting is kept are for example by attracting the maintaining body (not shown) to attract to keep semiconductor wafer.Grain-clamping table travel mechanism 63 for example comprise be disposed at abreast 2 between the guide rail 61 male threaded stem 631, be installed on the grain-clamping table 62 and with the negative thread piece (not shown) of male threaded stem 631 screw engagement and be used to turn round the drive source (not shown) of the pulse motor that drives male threaded stem 631 etc.By utilizing pulse motor to make male threaded stem 631 revolution, thereby grain-clamping table 62 is moved towards X-direction.
Supporting base 71 is disposed on the pedestal 2 in the mode of the cutting zone that strides across the processing of carrying out machined object.Be provided with in the side of supporting base 71 along 2 guide rails 711 of Y direction configured in parallel and between 2 guide rails 711 2 male threaded stem 721a, 721b of configured in parallel.Can be on the 1st base portion 73a and the 2nd base portion 73b that Y direction disposes slidably, the driving negative thread piece (not shown) with male threaded stem 721a and 721b screw engagement be installed respectively along guide rail 711.Drive the revolution of negative thread piece by making, thereby the 1st base portion 73a and the 2nd base portion 73b are moved towards Y direction along guide rail 711,711 by for example pulse motor 722a, 722b.
On the 1st base portion 73a and the 2nd base portion 73b, be provided with pair of guide rails 731a and 731b along direction of feed (Z-direction) respectively, can dispose the 1st carriage 74a and the 2nd carriage 74b slidably respectively towards Z-direction along guide rail 731a and 731b.On the 1st base portion 73a and the 2nd base portion 73b, the respectively drive source of configuration using pulse motor 75a, 75b etc. and rotating male threaded stem (not shown), by utilizing pulse motor 75a, 75b to make male threaded stem revolution, thus along guide rail 731a with 731b, make the 1st carriage 74a keep the vertical Z-direction of face to move towards machined object relative to grain-clamping table 63 with the 2nd carriage 74b.
On the 1st carriage 74a and the 2nd carriage 74b, the 1st cutting mechanism 76a and the 2nd cutting mechanism 76b are installed as the mechanism of cutting machined object.Each cutting mechanism 76a, 76b for example have the main spindle box that is fixed in carriage, are supported on the main shaft of main spindle box and be installed on the cutting tip of main shaft pivotally respectively, make the axle center respectively on Y direction ground dead in line.
The 2nd conveying mechanism 9 maybe will remain in the mechanism that semiconductor wafer after the processing of grain-clamping table 62 is transported to wiper mechanism 8 for being transported to grain-clamping table 62 by the semiconductor wafer that the 1st conveying mechanism 5 is sent.The 2nd conveying mechanism 9, for example comprise attract semiconductor wafer above Bernoulli Jacob (the ベ Le ヌ one イ) pad 91, the supporting Bernoulli Jacob pad 91 that keep pad supports member 92 and make Bernoulli Jacob's pad 91 of being supported on pad supports member 92 towards pad travel mechanism 93 that Y direction moves.
Bernoulli Jacob's pad 91 is connected in air feed mechanism (not shown), by the inner face along conical pad air is flowed out and produces negative pressure, utilize this vacuum suction to keep as the semiconductor wafer of machined object.Pad supports member 92 for example can support Bernoulli Jacob's pad 91 towards upper and lower by cylinder to movably.Pad travel mechanism 93 comprises male threaded stem 931 and pulse motor 932, this male threaded stem 931 is extended setting in supporting base 71 upper edge Y directions, supported pivotally, this pulse motor 932 makes male threaded stem 931 revolutions, can rotate and reverse, by pulse motor 932 revolution is driven, thereby the Bernoulli Jacob's pad 91 by 92 supportings of pad supports member is moved towards Y direction.
The structure of the topping machanism 1 of present embodiment more than has been described.Below, illustrate that according to Fig. 1 the cut of above-mentioned topping machanism 1 is handled action.
At first, before the beginning cut, will box 10 mountings of the semiconductor wafer before the processing have been accommodated on box mounting table 35.At this moment, towards machined object mounting area side mounting, this machined object mounting zone is the zone of mobile machined object between the 1st conveying mechanism 5 and grain-clamping table 62 with the peristome 101 (with reference to Fig. 2) of box 10.
Then, make elevating mechanism 33 action of box driving mechanism 3, accommodated as the mode of the position of the semiconductor wafer of processing object, the position of the box 10 of alignment mounting on box mounting table 35 so that the 1st conveying mechanism 5 enters into.After the aligned in position of box 10, make 5 actions of the 1st conveying mechanism, make hand 51 enter into box 10 inside, keep semiconductor wafer as processing object.Then, make 5 actions of the 1st conveying mechanism, the semiconductor wafer that hand 51 is kept is transported to machined object mounting zone.
When semiconductor wafer being transported to machined object mounting zone, the attraction of removing by 51 pairs of semiconductor wafers of hand keeps.Then, Bernoulli Jacob's pad 91 of the 2nd conveying mechanism 9 of the semiconductor wafer top by being positioned to be transported to machined object mounting zone, semiconductor wafer is attracted to keep.After this, make the 1st conveying mechanism 5 keep out of the way the position that disposes wiper mechanism 8, then, make the cylinder action of the 2nd conveying mechanism 9, Bernoulli Jacob's pad 91 that semiconductor wafer is attracted to keep is descended, with the semiconductor wafer mounting on grain-clamping table 62.Then, the attraction of removing 91 pairs of semiconductor wafers of Bernoulli Jacob's pad keeps, and by the attraction maintaining body of being located at fixture 6 semiconductor wafer on the grain-clamping table 62 is attracted to keep.
After this, grain-clamping table 62 is moved towards the X-axis negative direction, semiconductor wafer is moved to the machining area that is provided with the 1st cutting mechanism 76a and the 2nd cutting mechanism 76b.Move to the semiconductor wafer of machining area, carry out cut, be divided into shaped like chips by the 1st cutting mechanism 76a and the 2nd cutting mechanism 76b.When cut finishes, grain-clamping table 62 is moved towards the X-axis positive direction, once more semiconductor wafer is transported to machined object mounting zone.
When grain-clamping table 62 moved to machined object mounting zone, the attraction that attracts maintaining body to remove semiconductor wafer kept.Then, the 2nd conveying mechanism 9 attracts to keep by 91 pairs of semiconductor wafers of Bernoulli Jacob's pad, is transported on the rotating platform 81 of wiper mechanism 8.During this period, the hand 51 of the 1st conveying mechanism 5 moves to machined object mounting zone.Be transported to that semiconductor wafer after the processing on the rotating platform 81 is cleaned and dry.
Clean and dry semiconductor wafer is attracted to keep by Bernoulli Jacob's pad 91 of the 2nd conveying mechanism 9, move to the upside of the hand 51 of the 1st conveying mechanism 5 that is positioned machined object mounting zone.Then, Bernoulli Jacob's pad 91 is descended, on hand 51, the attraction of removing 91 pairs of semiconductor wafers of Bernoulli Jacob's pad keeps with the semiconductor wafer mounting, and simultaneously, 51 pairs of mountings of hand semiconductor wafer of face thereon attract to keep.After this, will remain in the precalculated position that semiconductor wafer after the processing on the hand 51 is contained in box 10 by the 1st conveying mechanism 5.
The cut that the topping machanism 1 of present embodiment more than has been described is handled action.Here, the topping machanism 1 of present embodiment suitably is formed with cutting slot in order whether to check the semiconductor wafer after the processing relatively, has wafer and send and send into mechanism 40 on box mounting table 35.Below, illustrate according to Fig. 3 and Fig. 4 that the wafer of present embodiment is sent and send into mechanism 40.Here, Fig. 3 is that the wafer that present embodiment is shown is sent the perspective view of sending into mechanism 40.In addition, Fig. 4 illustrates the key diagram that the wafer that Fig. 3 has been installed is sent the box driving mechanism 3 of sending into mechanism 40.
Wafer is sent and is sent into mechanism 40 as shown in Figure 3, comprises a pair of ways 41 and holding plate 42; This a pair of ways 41 extends ground towards Y direction and installs in box mounting table 35 volume inside 37; These holding plate 42 mounting semiconductor wafers are used for taking out.Holding plate 42 for example has wafer mounting portion 421 and notch 422; This wafer mounting portion 421 reduces the thickness ground formation of the part of holding plate 42 corresponding to the shape of machined object; This notch 422 is formed in the wafer mounting portion 421 for fear of the interference of hand 51 with the holding plate 42 of transport semiconductor wafers.In addition, also can on holding plate 42, form handle part 423, make the user send the holding plate 42 of packing into easily.
This holding plate 42 making handle part 423 under the state of lid 36 sides, is inserted into along ways 41 in the inner space 37 of box mounting table 35 of box driving mechanism 3 as shown in Figure 4.For example, in order to send the semiconductor wafer W of sending into after mechanism 40 takes out processing from wafer, at first, elevating mechanism 33 is driven, adjusts the position of box mounting table 35, make the hand 51 that the semiconductor wafer W that is supported on bearing support 12 is kept be positioned at the top of the wafer mounting portion 421 of box mounting table 35 inside.When adjusting the position of box mounting table 35, make hand 51 enter into box mounting table 35 inside.When hand 51 moves to the top of wafer mounting portion 421, by elevating mechanism 33 box mounting table 35 is risen, will be supported on semiconductor wafer W mounting on the bearing support 12 in wafer mounting portion 421.In addition, hand 51 is passed through from the notch 422 of holding plate 42, semiconductor wafer W is separated with hand 51, then, drive hand travel mechanism 53, hand 51 is kept out of the way towards the Y-axis negative direction.
Semiconductor wafer W mounting on being supported on bearing support 12 is on holding plate 42 time, and the user is controlling handle part 423 and going out holding plate 42 towards lid 36 laybacks.Like this, can take out semiconductor wafer W after the processing, machining state is checked.Wafer is sent the semiconductor wafer W of sending into mechanism 40 after taking out processing, for example also can be at the semiconductor wafer of other kind of cutting, add and use man-hour.In this occasion, the semiconductor wafer mounting of user before will processing on holding plate 42, be inserted into box mounting table 35 inside, be transported to the setting of machining area ground by hand 51 and get final product.
Here, the semiconductor wafer W of present embodiment is supported on the bearing support 12 by the boundary belt 11 with cementability as described above.As boundary belt 11, generally use for example UV band, this UV band is when irradiation ultraviolet radiation, and cementability descends.Therefore, in order easily to pick up the semiconductor wafer W that is divided into shaped like chips from boundary belt 11 in the bonding die operation afterwards, the topping machanism 1 of present embodiment also has the ultraviolet irradiation unit 45 that makes boundary belt 11 sclerosis.The ultraviolet irradiation unit 45 of present embodiment is characterised in that ultraviolet irradiation unit 45 replacement holding plates 42 are inserted in box mounting table 35 volume inside 37 and use.
Below, describe the structure of ultraviolet irradiation unit 45 in detail according to Fig. 5 and Fig. 6.Here, the sectional view when Fig. 5 (a) vertically cuts off the ultraviolet irradiation unit 45 of this execution mode for relative Y direction, the sectional view when (b) vertically cutting off the ultraviolet irradiation unit 45 of this execution mode for relative X-direction.In addition, Fig. 6 illustrates the key diagram of state that ultraviolet irradiation unit 45 is installed on box mounting table 35 inside of present embodiment.
The ultraviolet irradiation unit 45 of present embodiment has a pair of supporting member 453 and LED455; This a pair of supporting member 453 supports bearing support 12 in the inside of casing, and this casing is accommodated the semiconductor wafer W that is supported on bearing support 12; This LED455 is used for ultraviolet irradiation to the semiconductor wafer W that is contained in the casing.
The casing of ultraviolet irradiation unit 45 comprises resettlement section 452 and upper plate 451 like that shown in Fig. 5 (b); This resettlement section 452 is towards the Y direction opening, is shaped as FangZi Zhuan when Y-axis is vertically cut off relatively; This upper plate 451 is used to close the top of resettlement section 452.
Bottom side in resettlement section 452 is provided with the flat board 454 that 452 sides, resettlement section are fixed at two ends like that shown in Fig. 5 (a), be provided as the LED455 of ultraviolet irradiation light source on dull and stereotyped 454.LED455 for example constitutes by the UV-400 that arranges about 1000 Keynes (キ one エ Application ス) corporate system, and with ultraviolet irradiation to boundary belt 11 on the whole, 11 pairs of this boundary belts are contained in the semiconductor wafer W of LED455 top and protect.Here, ultraviolet wavelength is about 365nm, and the illumination of each LED is about 26000mW/cm2.
As the ultraviolet irradiation light source of ultraviolet irradiation unit 45, for example also can as patent documentation 1 record, use ultraviolet radiator, but, can play the effect of the size that reduces ultraviolet irradiation unit 45 by as present embodiment, using LED455.
Above the flat board 454 that is provided with LED455, a pair of supporting member 453 that will be used for support semi-conductor wafers W is located at the side of resettlement section 452, and the cross section when for example relative Y-axis of this supporting member 453 is vertically cut off is the L word shape.Supported by 453 pairs of bearing support 12 parts of supporting member, the semiconductor wafer W after the processing that 12 pairs of this bearing supports are sent into by the hand 51 of the 1st conveying mechanism 5 supports.Therefore, in the stickup of boundary belt 11 on the part of semiconductor wafer W, direct irradiation is from the ultraviolet ray of LED455 radiation.
Like this,, be used to protect boundary belt 11 irradiation ultraviolet radiations of the semiconductor wafer W that is supported on supporting member 453 relatively, thereby make boundary belt 11 sclerosis, reduce bonding force with respect to semiconductor wafer W by ultraviolet irradiation unit 45.By from being inserted into relative boundary belt 11 irradiation ultraviolet radiations of boundary belt 11 sides of the semiconductor wafer W in the ultraviolet irradiation unit 45, with the bonding force of comparing easier reduction boundary belt 11 from semiconductor wafer W side irradiation ultraviolet radiation.
The ultraviolet irradiation unit 45 of said structure is characterised in that, and is dismantled and assembled in the inside of box mounting table 35.That is, after take out constituting the wafer of being located at box mounting table 35 inside and sending the holding plate 42 of sending into mechanism 40, can insert ultraviolet irradiation unit 45 along ways 41 and replace holding plates 42.As described above, in the ultraviolet irradiation unit 45 of present embodiment,,, for this reason, can be inserted into the inside of box mounting table 35 so can reduce the size of ultraviolet irradiation unit 45 owing to use LED455 as the ultraviolet irradiation light source no problemly.
Like this, the ultraviolet irradiation unit 45 of present embodiment can easily be installed on the inner space of box mounting table 35.Therefore, do not need other downside configuration ultraviolet irradiation unit 45 in box mounting table 35, or pull down and have wafer and send the box mounting table 35 that the box mounting table 35 of sending into mechanism 40, configuration have ultraviolet irradiation unit 45, so, but solving device is complicated or the change operation of apparatus structure needs the problem of time.
The topping machanism 1 of the 1st execution mode more than has been described.In this topping machanism 1, can easily exchange wafer corresponding to operation and send and send into mechanism 40 and ultraviolet irradiation unit 45 is installed.Therefore, apparatus structure is uncomplicated, can easily carry out the installation exercise of ultraviolet irradiation unit 45.
Above with reference to description of drawings preferred implementation of the present invention, but the present invention is not limited to this example certainly.Clearly, as be those skilled in the art, then can expect various modifications within the scope of the claims or revise example that they belong to technical scope of the present invention certainly.
For example, though the processing unit (plant) of semiconductor wafer has been described as topping machanism 1 in the above-described embodiment, the invention is not restricted to this example.As long as all applicable, for example, also can be grinding attachment for carrying out the device of treatment process of irradiation ultraviolet radiation with respect to the boundary belt 11 of having pasted semiconductor wafer W.
The present invention particularly is applicable to the processing unit (plant) of the semiconductor wafer with ultraviolet irradiation unit applicable to the processing unit (plant) of semiconductor wafer.
Claims (3)
1. the processing unit (plant) of a semiconductor wafer has box mounting table, organisation of working, conveying mechanism; This box mounting table is carried out mounting to box, and this box is used to accommodate by boundary belt and is supported on semiconductor wafer on the bearing support; This organisation of working is processed the above-mentioned semiconductor wafer that is transported to machining area; This conveying mechanism is carried above-mentioned semiconductor wafer between above-mentioned box and above-mentioned machining area; It is characterized in that:
Can select in the inside of above-mentioned box mounting table and detachable ground configuration wafer is sent and sent into mechanism and ultraviolet irradiation unit;
This wafer is sent and is sent into the above-mentioned semiconductor wafer of mechanism's mounting, the above-mentioned semiconductor wafer of mounting is sent be sent to above-mentioned conveying mechanism side;
The above-mentioned semiconductor wafer that this ultraviolet irradiation unit mounting is sent into from above-mentioned conveying mechanism side, with ultraviolet irradiation to the above-mentioned boundary belt of having pasted above-mentioned semiconductor wafer.
2. the processing unit (plant) of semiconductor wafer according to claim 1, it is characterized in that: the radiation source of above-mentioned ultraviolet irradiation unit is a light-emitting diode.
3. the processing unit (plant) of semiconductor wafer according to claim 1 and 2 is characterized in that: above-mentioned ultraviolet irradiation unit from the boundary belt side that is inserted into the above-mentioned semiconductor wafer in the above-mentioned ultraviolet irradiation unit to above-mentioned boundary belt irradiation ultraviolet radiation.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005337200 | 2005-11-22 | ||
| JP2005337200A JP4841939B2 (en) | 2005-11-22 | 2005-11-22 | Semiconductor wafer processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1971853A true CN1971853A (en) | 2007-05-30 |
Family
ID=38112580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610149359 Pending CN1971853A (en) | 2005-11-22 | 2006-11-21 | Semiconductor wafer processing device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4841939B2 (en) |
| CN (1) | CN1971853A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102861988A (en) * | 2011-07-08 | 2013-01-09 | 株式会社迪思科 | Machining apparatus |
| US9330898B2 (en) | 2010-08-23 | 2016-05-03 | Tokyo Electron Limited | Separation system, separation method, program and computer storage medium |
| CN106032036A (en) * | 2015-03-10 | 2016-10-19 | 株式会社迪思科 | A cutting device |
| CN114121744A (en) * | 2021-11-20 | 2022-03-01 | 江苏京创先进电子科技有限公司 | Loading and unloading device of dicing saw |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007329300A (en) * | 2006-06-08 | 2007-12-20 | Disco Abrasive Syst Ltd | Ultraviolet ray irradiation apparatus and cutter including the same |
| WO2008142975A1 (en) * | 2007-05-18 | 2008-11-27 | Tokyo Seimitsu Co., Ltd. | Dicing apparatus and dicing method |
| JP4934112B2 (en) * | 2008-07-10 | 2012-05-16 | リンテック株式会社 | Light irradiation device |
| JP2011035281A (en) * | 2009-08-05 | 2011-02-17 | Disco Abrasive Syst Ltd | Workpiece storage mechanism and grinding device |
| JP5985166B2 (en) * | 2011-09-22 | 2016-09-06 | 株式会社日立国際電気 | Substrate transport jig and substrate transport method |
| JP5234866B2 (en) * | 2012-02-17 | 2013-07-10 | リンテック株式会社 | Light irradiation device |
| CN103377965A (en) * | 2012-04-27 | 2013-10-30 | 立晔科技股份有限公司 | Substrate storage device |
| JP6685865B2 (en) * | 2016-08-29 | 2020-04-22 | 京セラ株式会社 | Thin plate storage system, thin plate processing system and thin plate storage method |
| KR101987822B1 (en) * | 2017-07-05 | 2019-06-12 | (주)소닉스 | In-line inspection system for inspecting object related to display module |
| JP6957108B2 (en) * | 2017-12-07 | 2021-11-02 | 株式会社ディスコ | Processing equipment |
| KR102098085B1 (en) * | 2018-11-02 | 2020-05-29 | (주)가온코리아 | wafer loading apparatus |
| JP7358014B2 (en) * | 2019-10-29 | 2023-10-10 | 株式会社ディスコ | processing equipment |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03206643A (en) * | 1990-01-08 | 1991-09-10 | Nec Corp | Method for separation of semiconductor element |
| JPH042144A (en) * | 1990-04-19 | 1992-01-07 | Sumitomo Electric Ind Ltd | Apparatus for picking up chip component |
| JP2003098677A (en) * | 2001-09-25 | 2003-04-04 | Pentax Corp | Aligner system |
| JP2003203887A (en) * | 2002-01-10 | 2003-07-18 | Disco Abrasive Syst Ltd | Cutter |
| CH695872A5 (en) * | 2002-07-29 | 2006-09-29 | Brooks Pri Automation Switzerl | Reticle handling device. |
| JP2005045134A (en) * | 2003-07-25 | 2005-02-17 | Disco Abrasive Syst Ltd | Processing device of semiconductor wafer |
-
2005
- 2005-11-22 JP JP2005337200A patent/JP4841939B2/en active Active
-
2006
- 2006-11-21 CN CN 200610149359 patent/CN1971853A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9330898B2 (en) | 2010-08-23 | 2016-05-03 | Tokyo Electron Limited | Separation system, separation method, program and computer storage medium |
| CN102861988A (en) * | 2011-07-08 | 2013-01-09 | 株式会社迪思科 | Machining apparatus |
| CN102861988B (en) * | 2011-07-08 | 2015-10-14 | 株式会社迪思科 | Processing unit (plant) |
| CN106032036A (en) * | 2015-03-10 | 2016-10-19 | 株式会社迪思科 | A cutting device |
| CN106032036B (en) * | 2015-03-10 | 2019-09-06 | 株式会社迪思科 | Cutting apparatus |
| CN114121744A (en) * | 2021-11-20 | 2022-03-01 | 江苏京创先进电子科技有限公司 | Loading and unloading device of dicing saw |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007142327A (en) | 2007-06-07 |
| JP4841939B2 (en) | 2011-12-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1971853A (en) | Semiconductor wafer processing device | |
| CN110014336B (en) | Wafer generation device and transfer tray | |
| CN105895569B (en) | Wafer processing system | |
| US20070238264A1 (en) | Method and apparatus for supporting wafer | |
| TWI445067B (en) | The method of expansion of the workpiece | |
| JP5580066B2 (en) | Cutting equipment | |
| JP2004088109A (en) | Wafer table and semiconductor package manufacturing apparatus using it | |
| CN107104079B (en) | Processing method | |
| KR20160021030A (en) | Conveyance device | |
| CN105633017B (en) | Method for dividing package substrate | |
| JP5348976B2 (en) | Wafer processing method and wafer processing apparatus for processing wafer on which bumps are formed | |
| JP6785735B2 (en) | Cutting device and semiconductor package transport method | |
| JP2015115418A (en) | Vacuum chuck device and vertical precision machine including vacuum chuck device and dicing device | |
| JP6211884B2 (en) | Wafer processing method | |
| KR100849589B1 (en) | Cutting machine | |
| JP2017028157A (en) | Method for manufacturing chuck table and processing device | |
| KR101011890B1 (en) | Ultraviolet irradiating method and an apparatus using the same | |
| JP2010099733A (en) | Laser beam machining apparatus | |
| JP6879807B2 (en) | Processing equipment | |
| CN106032036B (en) | Cutting apparatus | |
| CN105374708A (en) | Breaking device | |
| JP6579929B2 (en) | Processing equipment | |
| CN112440166A (en) | Flange end face correction device and method, cutting device and cutting method | |
| JP2017175055A (en) | Handling method for package wafer | |
| CN111261504A (en) | Cutting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |