CN1808287A - Position aligning system for projection exposure apparatus and position aligning method thereof - Google Patents
Position aligning system for projection exposure apparatus and position aligning method thereof Download PDFInfo
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- CN1808287A CN1808287A CN 200610023683 CN200610023683A CN1808287A CN 1808287 A CN1808287 A CN 1808287A CN 200610023683 CN200610023683 CN 200610023683 CN 200610023683 A CN200610023683 A CN 200610023683A CN 1808287 A CN1808287 A CN 1808287A
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Abstract
The invention discloses a position aligning system for projecting exposure device and a align method thereof. The invention is characterized in that: a light window is provided on the mask, the light reflected by the position align device entering the optical projecting system via the light window; the aligning process includes making the mark of video device and the mark of carrier base align; aligning the mask mark and video device mark; aligning exposure object mark and the video device mark; establishing corresponding position relationship. Also, the above position aligning devices are placed on the carrier platform for testing and being integrated with other sub systems.
Description
Technical field
The invention belongs to the technique of alignment in the manufacturing of integrated circuit or printed circuit board (PCB), relate in particular to a kind of position aligning system and alignment methods that is applied in the projection aligner.
Background technology
With the circuit pattern that is depicted on the mask, on the surface of the exposure object that scribbles photosensitive materials such as photoresist, on exposure object, form circuit pattern by road, back etching technics afterwards by the optical projection system projection imaging.It can be widely used in various fields, as the manufacturing of integrated circuit and printed circuit board (PCB).
When doing exposure with projection aligner, mask must be aimed at the position of exposure object, usually all dispose the mark that aligned position is used on mask and the exposure object,, set up the relative position relation between mask and the exposure object by certain position aligning system and position alignment method.
The position aligning system and the position alignment method that are used for projection aligner at present are a lot, but because it needs many cover position aligning system, and illuminator wherein and imaging system can not be shared a cover optical system, therefore the complicacy of its structure has not only increased Design of device cost and dress school difficulty, and make the position alignment process become complicated, increase the error link of position alignment, finally influence alignment precision.
Summary of the invention
One of technical issues that need to address of the present invention are to provide a kind of position aligning system that is used for projection aligner, aim to realize the exact position between mask and the exposure object.
Technical scheme at above-mentioned technical matters is: comprise
The position alignment device is used to set up accurate relative position relation between mask and the exposure object, comprises lighting unit, mark camera, mark illumination image formation optical unit;
Exposure light source is used to provide the exposure light source of projection aligner;
The marking image processing unit is used for that mask mark, wafer-supporting platform reference mark and exposure object are marked at mark camera imaging and handles;
Mask is described the masterplate of circuit pattern;
Hold bed, be used to support mask;
Exposure object, the circuit pattern that is used to receive on the mask passes through the optical projection system imaging;
Wafer-supporting platform is used to support exposure object;
The mask mark is located on the mask, is used for the position alignment of mask;
The wafer-supporting platform reference mark is used to establish the relative position relation between mask and the wafer-supporting platform, and the relative position relation between exposure object and the wafer-supporting platform.
The exposure object mark is located on the described exposure object, is used for the position alignment of exposure object;
Hold bed and wafer-supporting platform motion control device, in the process of setting up mask mark and exposure object mark relative position, the motion of holding bed and wafer-supporting platform by control makes mask aim at exposure object;
Optical projection system, utilize exposure light source with the circuit pattern described on the mask with certain amplification or the multiplying power projection imaging dwindled on exposure object;
The overhead control device is used for marking image processing unit, position alignment device, exposure light source, optical projection system, holds bed motion control device and the unified control of wafer-supporting platform motion control device do;
It is characterized in that also being provided with logical light window on mask, be positioned at mask mark one side, the light that the position alignment device is reflected can enter optical projection system by this logical light window; Described position alignment device only is provided with a cover.
The lighting source of described position alignment device, lighting fiber, the shared same set of optical system of mark illumination image formation optical unit form coaxial-illuminating; Described mark illumination image formation optical unit can be divided into mark illumination optics unit and mark image formation optical unit from function.
Described lighting unit comprises lighting source and the lighting fiber that connects in turn.Wherein lighting source is used for the illumination of mask mark, wafer-supporting platform reference mark and exposure object, and the optical band of lighting source is away from the ultraviolet light wave band of projection aligner exposure light source, in order to avoid make photoresist generation sensitization in exposure object markers align process.And lighting fiber is used for the emergent light of lighting source is imported to the mark illuminator, can make lighting source away from optical projection system like this, in order to avoid lighting source heating causing optical projection system generation thermal drift.
Above-mentioned position alignment device specifically comprises lighting source, lighting fiber, two lens combination, Amici prism and catoptrons, wherein the mark illumination optics unit is connected in turn by a lens combination, Amici prism, another lens combination and catoptron, and the imaging unit is connected in turn by catoptron, another lens combination and Amici prism, and promptly Amici prism is lighting unit and image-generating unit common optical elements.The light uniform irradiation that above-mentioned mark illumination optics unit is used for lighting source is produced is to mask mark, wafer-supporting platform reference mark or exposure object mark; The mark image formation optical unit is used for mask mark, wafer-supporting platform reference mark or exposure object mark are imaged onto the mark camera.
Described mark camera is used to receive the picture of alignment mark, is provided with sensor, and its sensor is CCD or CMOS;
As improvement of the present invention, described exposure object mark quantity can be selected a plurality of according to exposure object position alignment precision demand.
As improvement of the present invention, the described bed that holds can surface level moves in a big way, so only need can finish the aligning of a plurality of mask marks, not only can improve the mask position alignment precision once the cover position aligning system, and cost-saved, raising device integration.
Two of the technical issues that need to address of the present invention are to provide a kind of alignment methods at above-mentioned alignment system.
Appropriate technical solution may further comprise the steps:
(1), the mark camera aims at the wafer-supporting platform reference mark, sets up the relative position relation between mark camera and the wafer-supporting platform reference mark;
(2), the mask mark aims at the mark camera, sets up the relative position relation between mask mark and the mark camera;
(3), the exposure object mark aims at the mark camera, sets up the relative position relation between exposure object mark and the mark camera;
(4) the overhead control device goes out exposure object by algorithm computation and aims at wafer-supporting platform required amount of movement, mask and exposure object to holding the required amount of movement of bed and wafer-supporting platform on time, thereby carries out the aligning of corresponding mask and exposure object.Required amount of movement moved mask to aligned position when described respective aligned specifically referred to hold the bed motion control device according to mask registration, the wafer-supporting platform motion control device according to exposure object to punctual required amount of movement moving exposure object to aligned position, finish the aligning of mask and exposure object.
The concrete steps of above-mentioned position alignment process:
Move and hold bed and wafer-supporting platform, logical light window of mask and wafer-supporting platform reference mark are in the field range of mark camera, and by the logical light window illumination wafer-supporting platform reference mark on the mask, take the wafer-supporting platform reference mark by the mark camera, and store the positional information of this picture centre on mark camera target surface, write down the positional information of holding bed and wafer-supporting platform this moment respectively by holding bed motion control device and wafer-supporting platform motion control device simultaneously.
Move and to hold bed the mask mark is in the mark camera field range, evenly behind the illumination mask mark, by the mark image formation optical unit mask mark is imaged onto on the mark camera target surface, and the positional information of center on target surface of record mask marker image, hold the bed positional information of this moment by holding bed motion control device record simultaneously.
The mobile bed that holds is in the mark camera field range the logical light window of mask, and by holding the positional information that bed motion control device record holds bed at this moment; Mobile then wafer-supporting platform is in the mark camera field range exposure object, and the positional information of center on target surface of record exposure object marker image, simultaneously by the wafer-supporting platform motion control device record wafer-supporting platform positional information of this moment.
Required amount of movement moves mask to aligned position when holding the bed motion control device according to mask registration, the wafer-supporting platform motion control device according to exposure object to punctual required amount of movement moving exposure object to aligned position, finish the aligning of mask and exposure object.
The invention has the beneficial effects as follows, from textural, the setting of logical light window, mask markers align, wafer-supporting platform reference mark are aimed at and the exposure object markers align adopts same set of position alignment device, the shared cover alignment system of mask markers align system and exposure object alignment system, simplified so greatly the position alignment device of mask and exposure object structure, reduced the error link of position alignment, directly reduce cost, improved position alignment precision.In addition, above-mentioned position alignment device all is in and holds the bed top, is convenient to and the integrated of other subsystem and test.
Description of drawings
Fig. 1 is a system architecture synoptic diagram of the present invention;
Fig. 2 is mask mark used in the present invention and the position description figure of logical light window on mask;
Fig. 3 is the position description figure of wafer-supporting platform reference mark used in the present invention on wafer-supporting platform;
Fig. 4 is exposure object mark operation instruction figure used in the present invention.
Embodiment
Below in conjunction with the drawings and specific embodiments the present invention is elaborated.
Fig. 1 is the projection aligner for manufacturing integrated circuit or printed circuit board (PCB), and the mask 40 of describing exposure circuit pattern 44 places and holds on the bed 30, is displaced into X ', Y ', θ ' direction by holding bed motion control device 31.The exposure object 60 that applies photoresist places on the wafer-supporting platform 70, and is removable in X, Y, and θ direction by wafer-supporting platform motion control device 71 control wafer-supporting platform 70.In conjunction with Fig. 2, optical projection system 50 is exposed by the ultraviolet band of exposure light source 20, circuit pattern on the mask 44 is done projection to be transferred on the exposure object 60, the enlargement ratio of optical projection system 50 decision-making circuit patterns 44, the motion wafer-supporting platform can make wafer-supporting platform reference mark 72, exposure object mark 61,62 be imaged onto on the mark camera 15 by optical projection system 50 to assigned address simultaneously.
Position alignment device 1 is made up of lighting unit 10, mark camera 15, mark illumination image formation optical unit 17.Lighting unit 10 is made of lighting source 101 and lighting fiber 102; Constitute by mark illumination optics unit and mark image formation optical unit on mark illumination image formation optical unit 17 functions, the mark illumination optics unit is made up of lens combination 11, Amici prism 12, lens combination 13 and catoptron 14, is used to form even illumination light and shines on the alignment mark; The mark image formation optical unit comprises catoptron 14, lens combination 13 and Amici prism 12 compositions, and the picture blur-free imaging that can make alignment mark is to the target surface of mark camera 15.
80 pairs of marking image processing units 16 of overhead control device, position alignment device 1, exposure light source 20, optical projection system 50, hold subsystems such as bed motion control device 31 and wafer-supporting platform motion control device 71 and do unified control, and realize alignment procedures.
Fig. 2 is the mask mark 42,43 on the mask 40 and the position description figure of logical light window 41.Mask mark the 42, the 43rd, the amplitude type reflecrtive mark is located at the periphery of circuit pattern, and with respect to circuit pattern 44, the mask mark is very little, and size is in the submillimeter rank.Mask mark 42,43 be shaped as " ten " font, this shape can be set as required, no particular restriction.Logical light window 41 is in order to allow the illumination and the imaging of wafer-supporting platform reference mark 72 and exposure object mark 61,62 be provided with by mask 40.
Fig. 3 is exposure object 60 and the position description figure of wafer-supporting platform reference mark 72 on wafer-supporting platform 70, exposes in same circuit pattern different position on exposure object, and through postchannel process processing aftershaping.Wafer-supporting platform reference mark 72 is arranged on the wafer-supporting platform, and this is labeled as the amplitude type reflecrtive mark, and actual conditions are: this mark is very little with respect to exposure object 60, and size is in the submillimeter rank.
Fig. 4 is exposure object mark 61,62 operation instruction figure, exposure object mark 61,62 among the figure is exaggerated demonstration, actual conditions are: this mark is chosen on the formed minimum unit circuit pattern 63 of preceding road technology, and this is marked in the minimum unit circuit pattern 63 has uniqueness, and very little with respect to circuit pattern 63, size is in the submillimeter rank.This mark shape can be set as required in addition, Any shape all can, no particular restriction.
Its alignment methods below is described:
Mark camera 15 and the action of wafer-supporting platform reference mark 72 position alignment:
Wafer-supporting platform motion control device 71 moves wafer-supporting platform 70 to the precalculated position, makes wafer-supporting platform reference mark 72 in the field range of mark image formation optical unit; Hold bed motion control device 31 and will hold bed and move to the precalculated position, make the logical light window 41 of mask in the field range of mark camera 15.
Light the lighting unit 10 in the alignment device 1, make alignment device 1 and graphics processing unit 16 in running order, the light uniform irradiation is on wafer-supporting platform reference mark 72,16 pairs of wafer-supporting platform reference marks 72 of graphics processing unit imaging on mark camera 15 target surfaces is handled, and the positional information of center on mark camera 15 target surfaces of record wafer-supporting platform reference mark 72 pictures, the positional information of wafer-supporting platform motion control device 71 record wafer-supporting platforms 70 this moment simultaneously.
By above-mentioned alignment actions, set up the relative position relation between mark camera 15 and the wafer-supporting platform reference mark 72.
The position alignment of mask mark 42,43 and mark camera 15:
Hold bed motion control device 31 and move and hold bed 30, mask mark 42 is entered in the field range of image-generating unit to the precalculated position.The picture of 16 pairs of mask marks 42 of graphics processing unit is handled, and the positional information of center on mark camera 15 target surfaces of record mask mark 42 pictures.Simultaneously by holding the positional information that bed motion control device 31 records hold bed 30 at this moment.
In like manner, hold bed motion control device 31 and move and hold bed 30, mask mark 43 is entered in the field range of image-generating unit to the precalculated position.The picture of 16 pairs of mask marks 43 of graphics processing unit is handled, and the positional information of center on mark camera 15 target surfaces of record mask mark 43 pictures.Simultaneously by holding the positional information that bed motion control device 31 records hold bed 30 at this moment.
May occur holding bed motion control device 31 in the said process and move and hold bed 30 behind the precalculated position, the mask mark is the situation in the image-generating unit field range not, and need carry out mask mark 42 or 43 is carried out target search this moment.
The center information of wafer-supporting platform reference mark 72 pictures that overhead control device 80 is write down according to graphics processing unit 16, the center information of mask mark 42,43 pictures, and corresponding wafer-supporting platform 70, the positional information of holding bed 30, by a series of evolution algorithms, hold the required amount of movement of bed (Δ X ' when calculating mask registration, Δ Y ', Δ θ '), and by holding bed motion control device 31 write down the positional information of holding bed 30 this moment.
By above-mentioned alignment actions, set up the relative position relation between mask and the mark camera 15.
The position alignment of exposure object mark 61,62 and mark camera 15:
Hold bed motion control device 31 and move and hold bed 30, logical light window 41 is entered in the field range of mark camera 15 to the precalculated position, and by holding the positional information that bed motion control device 31 records hold bed 30 this moment; Wafer-supporting platform motion control device 71 moves wafer-supporting platform 70 to the precalculated position, exposure object mark 62 also is in the field range of mark camera 15, the picture of 16 pairs of exposure object marks 62 of graphics processing unit on mark camera 15 target surfaces handled, and write down its center positional information, write down the positional information of wafer-supporting platforms 70 this moment simultaneously by wafer-supporting platform motion control device 71.
In like manner, wafer-supporting platform motion control device 71 moves wafer-supporting platform 70 to the precalculated position, make exposure object mark 61 in the field range of mark camera 15, the picture of 16 pairs of exposure object marks 61 of graphics processing unit on mark camera 15 target surfaces handled, and write down its center positional information, write down the positional information of wafer-supporting platforms 70 this moment simultaneously by wafer-supporting platform motion control device 71.
By above-mentioned alignment actions, set up the relative position relation between exposure object 60 and the mark camera 15.
After above-mentioned a series of alignment actions, overhead control device 80 holds required amount of movement (the Δ X ' of bed 30 when holding positional information that bed 30 write down, positional information that wafer-supporting platform 70 writes down at wafer-supporting platform motion control device 71, mask registration in holding bed motion control device 31, Δ Y ', Δ θ ') and exposure object amount of movement (the Δ X required to punctual wafer-supporting platform 70, Δ Y, Δ θ), obtain mask and exposure object to holding bed 30 and wafer-supporting platform 70 needed amount of movements on time.Hold bed motion control device 31 and wafer-supporting platform motion control device 71 and hold bed and wafer-supporting platform motion, realize that finally accurate relative position is aimed between mask and the exposure object according to these amount of movement controls.
Though disclose the preferred embodiments of the present invention, those skilled in the art will appreciate that under the situation that does not deviate from disclosed scope of the present invention in claims any various modifications, interpolation and replacement all belong to protection scope of the present invention.
Claims (16)
1. a position aligning system that is used for projection aligner comprises
The position alignment device is used to set up the relative position relation between mask and the exposure object, comprises lighting unit (10), mark camera (15) and mark illumination image formation optical unit (17);
Exposure light source (20) is used to provide the exposure light source of projection aligner;
Marking image processing unit (16) is used for that mask mark, wafer-supporting platform reference mark and exposure object are marked at mark camera imaging and handles;
Mask (40) is described the masterplate of circuit pattern;
Hold bed (30), be used to support mask;
Exposure object (60), the circuit pattern that is used to receive on the mask passes through the optical projection system imaging;
Wafer-supporting platform (70) is used to support exposure object;
Mask mark (42,43) is located on the mask, is used for the position alignment of mask;
Wafer-supporting platform reference mark (72) is used to establish the relative position relation between mask and the wafer-supporting platform, and the relative position relation between exposure object and the wafer-supporting platform;
Exposure object mark (61,62) is located on the described exposure object, is used for the position alignment of exposure object;
Hold bed and wafer-supporting platform motion control device (31,71), in the process of setting up mask mark and exposure object mark relative position, the motion of holding bed and wafer-supporting platform by control makes mask aim at exposure object;
Optical projection system (50), utilize exposure light source with the circuit pattern described on the mask with certain amplification or the multiplying power projection imaging dwindled on exposure object;
Overhead control device (80) is used for marking image processing unit, position alignment device, exposure light source, optical projection system, holds bed motion control device and the unified control of wafer-supporting platform motion control device do;
It is characterized in that: also be provided with logical light window on mask (40), be positioned at mask mark one side, the light that the position alignment device is reflected can enter optical projection system by this logical light window; Described position alignment device only is provided with a cover.
2. position aligning system as claimed in claim 1, it is characterized in that: described mark illumination image formation optical unit (17) can comprise mark illumination optics unit and mark image formation optical unit from function, the mark illumination optics unit is connected in turn by a lens combination (11), Amici prism (12), another lens combination (13) and catoptron (14), and described mark image formation optical unit is connected in turn by catoptron (14), another lens (13) and Amici prism (12).
3. position aligning system as claimed in claim 2 is characterized in that: being provided with sensor in the described mark image formation optical unit is CCD or CMOS.
4. position aligning system as claimed in claim 1 is characterized in that: described lighting unit (10) comprises lighting source (101) and the lighting fiber (102) that connects in turn, and lighting fiber can import to the emergent light of lighting source the mark illuminator.
5. position aligning system as claimed in claim 1 is characterized in that: described mark camera (15) is provided with sensor, and this sensor can be CCD or CMOS.
6. position aligning system as claimed in claim 1 is characterized in that: described mask mark quantity can be selected a plurality of according to mask position alignment precision demand.
7. position aligning system as claimed in claim 1 is characterized in that described exposure object mark is located on the minimum circuit structural unit of exposure object, and its geometric properties has uniqueness in this minimum circuit structural unit, and size is the submillimeter rank.
8 position aligning system as claimed in claim 1 is characterized in that: described optical projection system can be refraction projection optical system or refraction and reflection projection optical system.
9. position aligning system as claimed in claim 1 is characterized in that: described exposure light source wavelength is in ultraviolet band.
10. position aligning system as claimed in claim 1 is characterized in that: described mask is labeled as the amplitude type reflecrtive mark, and size is the submillimeter rank.
11. position aligning system as claimed in claim 1 is characterized in that: described wafer-supporting platform reference mark is the amplitude type reflecrtive mark, and size is the submillimeter rank.
12. an alignment methods that is used for projection aligner is characterized in that may further comprise the steps:
(1), the mark camera aims at the wafer-supporting platform reference mark, sets up the relative position relation between mark camera and the wafer-supporting platform reference mark;
(2), the mask mark aims at the mark camera, sets up the relative position relation between mask mark and the mark camera;
(3), the exposure object mark aims at the mark camera, sets up the relative position relation between exposure object mark and the mark camera;
(4), the overhead control device calculates exposure object and aims at wafer-supporting platform required amount of movement, mask and exposure object to holding the required amount of movement of bed and wafer-supporting platform on time, thereby carries out the aligning of corresponding mask and exposure object.
13. alignment methods as claimed in claim 12, it is characterized in that: the alignment procedures of described mark camera and wafer-supporting platform reference mark is specially: move and hold bed and wafer-supporting platform, logical light window of mask and wafer-supporting platform reference mark are in the field range of mark camera, and by the logical light window illumination wafer-supporting platform reference mark on the mask, take the wafer-supporting platform reference mark by the mark camera, and store the positional information of this picture centre on mark camera target surface, write down the positional information of holding bed and wafer-supporting platform this moment respectively by holding bed motion control device and wafer-supporting platform motion control device simultaneously.
14. alignment methods as claimed in claim 12, it is characterized in that: described mask mark and mark camera alignment procedures are specially: move and to hold bed the mask mark is in the mark camera field range, evenly behind the illumination mask mark, by image-generating unit the mask mark is imaged onto on the mark camera target surface, and the positional information of center on target surface of record mask marker image, hold the bed positional information of this moment by holding bed motion control device record simultaneously.
15. alignment methods as claimed in claim 12, it is characterized in that: described exposure object mark and mark camera alignment procedures are specially: the mobile bed that holds is in the mark camera field range the logical light window of mask, and by holding the positional information that bed motion control device record holds bed at this moment; Mobile then wafer-supporting platform is in the mark camera field range exposure object, and the positional information of center on target surface of record exposure object marker image, simultaneously by the wafer-supporting platform motion control device record wafer-supporting platform positional information of this moment.
16. alignment methods as claimed in claim 12, it is characterized in that: the indication respective aligned specifically comprises in described the 4th step: required amount of movement moves mask to aligned position when holding the bed motion control device according to mask registration, the wafer-supporting platform motion control device according to exposure object to punctual required amount of movement moving exposure object to aligned position, finish the aligning of mask and exposure object.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 200610023683 CN1808287A (en) | 2006-01-26 | 2006-01-26 | Position aligning system for projection exposure apparatus and position aligning method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 200610023683 CN1808287A (en) | 2006-01-26 | 2006-01-26 | Position aligning system for projection exposure apparatus and position aligning method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101114134B (en) * | 2007-07-24 | 2010-05-19 | 上海微电子装备有限公司 | Alignment method and micro-device manufacturing method used for shadow cast scan photo-etching machine |
| CN106255922A (en) * | 2014-05-06 | 2016-12-21 | 上海微电子装备有限公司 | EUV lithography device and exposure method thereof |
-
2006
- 2006-01-26 CN CN 200610023683 patent/CN1808287A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101114134B (en) * | 2007-07-24 | 2010-05-19 | 上海微电子装备有限公司 | Alignment method and micro-device manufacturing method used for shadow cast scan photo-etching machine |
| CN106255922A (en) * | 2014-05-06 | 2016-12-21 | 上海微电子装备有限公司 | EUV lithography device and exposure method thereof |
| CN106255922B (en) * | 2014-05-06 | 2018-06-29 | 上海微电子装备（集团）股份有限公司 | EUV lithography device and its exposure method |
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Open date: 20060726 |