CN1605427A - Pb-free solder alloy, and solder material and solder joint using same - Google Patents
Pb-free solder alloy, and solder material and solder joint using same Download PDFInfo
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- CN1605427A CN1605427A CNA2004100921370A CN200410092137A CN1605427A CN 1605427 A CN1605427 A CN 1605427A CN A2004100921370 A CNA2004100921370 A CN A2004100921370A CN 200410092137 A CN200410092137 A CN 200410092137A CN 1605427 A CN1605427 A CN 1605427A
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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Abstract
A solder alloy based on an Sn-Zn-In-Ag system contains, in weight, 3.0%<Zn<5.0%, 0.1%<In<4.0%, 0.1%<Ag<0.4%, and the balance Sn. Therefore, the current Sn-Pb soldering method can be employed as it is. Further, a Pb-free solder material having a solder characteristic with excellent bonding strengths of the parts can be provided. Still further, since a difference between a solidus temperature and a liquidus temperature is small, floating of the parts leads can be suppressed, even in case where packaging processes are performed many times over. Still further, when the joint is exposed to the high temperature and high humidity atmosphere, the bonding strength can be prevented from being lowered.
Description
Invention field
The welded contact that the present invention relates to a kind of Pb-free solder alloy and a kind of welding material and use these materials.
Background technology
Recently, the toxicity problem of plumbous (Pb) impels people to take effective measures to control plumbous discharging in environment.Therefore, as the adhesives of electronic product components, traditional tin-lead solder is replaced by lead-free solder.
Alloy comprises the bonding strength at fusion temperature, tensile strength, elongation (perhaps extension property), wettability, contact position or the like as the necessary performance characteristic of welding material.
The fusion temperature of preferred solder is about 200 ℃.If the fusing point of scolder is too high, the heat resisting temperature of parts in will connecing above reflow welding, therefore present welding method may cause damage to these parts.On the other hand, if the fusing point of scolder is too low, scolder melts probably, like this when the parts ambient temperature uprises, can make element falling or peels off.
The Sn-37Pb welding alloy is a kind of typical solders that reflow welding connects that is used for, and lead has been used in this welding.In addition, after deliberation following Pb-free solder alloy.For example, Sn-Ag (Cu) base, Sn-Cu (Ni) base, basic, the Sn-Zn of Sn-Ag-Bi-Cu (Bi ,-Al) base, basic welding alloy of Sn-In-Ag-Bi or the like.
These welding alloies are called the I group.Except these, (Cu) (Ni) base, and Sn-Bi-Cu base welding alloy has that to measure fusing point be 210 ℃-230 ℃ alloying component, the welding that can be used for flowing, reflow welding connect method or the like to Sn-Ag for base, Sn-Cu.Yet the fusing point of these alloys is higher 30 ℃-40 ℃ than traditional Sn-Pb scolder.Thereby, under the temperature conditions that reflow welding connects, using these alloys, their fusing point may surpass the heat resisting temperature of parts.Technically, be difficult to use above-mentioned scolder to carry out the temperature that reflow welding connects to reach by the heat resistance that increases corresponding component.Simultaneously, (Bi ,-Al) base and Sn-In-Ag-Bi base welding alloy waits (being called the II group) to Sn-Zn, uses adopting reflow welding to connect in PCB (printed circuit board (PCB)) the assembling field of method usually.Yet II combination gold is highly oxidized with molten condition in air.And this point makes it be difficult to be applied to the welding method that flows technically.As scolder, though II combination gold has many shortcomings by comparison with the I group, its fusing point can be adjusted to the temperature range that approaches traditional Sn-Pb scolder, and this point is favourable.And, when using II combination gold,, its fusing point is dropped in about 180 ℃-210 ℃ scope by adjusting their composition.
That is to say, because Sn-Zn (Bi,-Al) melting range of basic welding alloy is approximately 190 ℃-200 ℃, approach the fusing point of traditional Sn-37Pb welding alloy, therefore can connect at present reflow welding and use Sn-Zn (Bi under the condition,-A1) basic welding alloy, and its low cost is favourable in lead-free solder.Yet, it is believed that its wettability to the contact base material of scolder is unfavorable.And, if verified it is exposed under the hot and humid condition at the contact that welds on the copper base material, even the bonding strength of parts also reduces significantly after reflow welding connects.
And, owing in scolder, use Zn, Zn probably from scolder wash-out enter solder flux, thereby may cause that for example insulaion resistance reduces and produce the problem of migration.
Similar to the Sn-Zn parent metal, the fusing point of Sn-In-Ag-Bi base welding alloy and the fusing point of Sn-Pb scolder are approaching.When these alloy systems and copper base material when bonding, owing to do not use Zn, are not formed the Cu-Zn compound.Therefore under high temperature and high humility atmosphere, the significantly reduced phenomenon of bonding strength with the bonding adhesive surface of copper can not take place.
Simultaneously, under situation about being welded on the Ag electrode, can in adhesive surface, form the Ag-In compound.Verified, this compound increases in time mutually and grows up and become fragile, so boundary strength reduces.In addition, carry out a thermal cycle processing if observe under the state of adhering components, the welding of contact will be out of shape.The matrix of the development need design thin space of PCB technology, and require higher levels of packaging technology.
This technological trend causes the concern of short circuit problem that welding deformation is caused.And because scolder contains a large amount of rare and expensive indiums (In), so material cost is high and be difficult to guarantee the following supply that continues.
Because its temperature profile, melting range is widely used in the welding method at 180 ℃-210 ℃ welding alloy, and wherein welding is (welding of flowing after reflow welding connects, reflow welding connects or the like again after reflow welding connects) that the branch several times carry out.The problem here is in follow-up welding step, and peeling off of welding position taken place.Especially, in parts such as large scale integrated circuit, parts lead drifts out with scolder in PCB.The reason of this phenomenon is, in second welding or welding thereafter, and the contact solder portion fractional melting that forms by the front scolder, and bonding strength so and reduce.And in this state, contact peels off owing to the bending of PCB or the distortion of parts.Just, in the performance of welding alloy, the difference between the temperature (hereinafter referred to as liquidus curve) that temperature that welding alloy begins to melt (hereinafter referred to as solidus) and welding alloy melt fully is big more, and the possibility that contact peels off is just high more.
In traditional technology, for example, Japan Patent No.2599890 (list of references 1) improves its mechanical strength or creep resistance by add Zn in the Sn-Ag parent metal.
Simultaneously, it discloses by adding Zn or In, can reduce fusing point.
Yet the Ag concentration of describing in list of references 1 is too high, reaches 1 weight % or higher.For example, can find out from the measurement result of the DSC (differential scanning calorimetry) of Fig. 9, the alloy that contains high concentration (1 weight %) Ag as, among the Sn-6Zn-6In-1Ag, near the endothermic peak area of peak value 200 ℃ of fusing points becomes big.Thereby, connecing under the condition at the reflow welding identical with the Sn-Pb scolder, this scolder is not fully fusing probably.If this scolder is fully fusing not, the flowability of scolder reduces, and therefore just can not fully form contact.In this case, the space of staying in the scolder reduces bonding strength.And, in the open Heisei9-174278 (reference paper 2) of Japanese patent unexamined, in the alloy of the eutectic composition that is similar to Sn-Zn, add In, to reduce fusion temperature and to improve to the metallized wetability of parts.And, add Ag and make the Zn phase needle-like curing microstructure among the Sn-Zn-In be converted into spherical curing microstructure and make its even dispersion.Therefore, the concentration of Zn is 6-11 weight %, and the concentration of Ag is 0.5-3 weight %.
Traditional Pb-free solder may cause variety of issue for example because the wettability of the difference that causes of Zn, and this is Sn-Zn (Bi ,-Al) a problem of parent metal, and use copper electrode can reduce bonding strength under high temperature and high humidity.And, use rare metal as, In and Ag become a problem of Sn-In-Ag-Bi base welding alloy.
Summary of the invention
Therefore, the objective of the invention is to realize the fusion temperature feature identical, and solve traditional Sn-Zn (Bi, the-Al) problem that exists of parent metal and Sn-In-Ag-Bi parent metal with the Sn-Pb parent metal.
Especially, its free-revving engine is a reliability of improving welded contact under high temperature and high humidity.
In order to realize these purposes, be based on the alloy of Sn-Zn-In-Ag system according to welding alloy of the present invention, it contains, by weight: the Sn of 0.3%＜Zn＜5.0%, 0.1%≤In≤4.0%, 0.1%≤Ag≤0.4% and surplus.
The accompanying drawing summary
In the description of the following preferred implementation that provides in conjunction with the accompanying drawings, above-mentioned and other purpose of the present invention and feature will become clear, wherein:
The peel strength of the welded contact of the scolder that is to use the embodiment of the invention 1 of Fig. 1 and the graph of a relation of open-assembly time.
Fig. 2 A-2E is when the Sn-3In-0.3Ag adding concentration to the embodiment of the invention 1 is the Zn of 2-6 weight %, the dsc measurement result of welding alloy and the graph of a relation of temperature.
Fig. 3 A-3C is the typical structure view when among the Sn-4Zn-3In that a spot of Ag is joined the embodiment of the invention 2.
Fig. 4 is when adding a small amount of Ag in the Sn-4Zn-3In of the embodiment of the invention 3, electrochemical corrosion gesture and time relation figure;
Fig. 5 A-5E is when adding a small amount of Ag in the Sn-4Zn-3In of the embodiment of the invention 1, the graph of a relation of the variation of fusion temperature and Ag concentration;
Fig. 6 is that the mechanical performance of welding alloy changes the graph of a relation with In concentration when adding the In of 0-10 weight % in the Sn-4Zn-0.3Ag of the embodiment of the invention 6.
Fig. 7 is the mechanical performance variation and the graph of a relation of open-assembly time of the welding alloy of the embodiment of the invention 8;
Fig. 8 is the mechanical performance variation and the graph of a relation of open-assembly time of another welding alloy of the embodiment of the invention 8;
Fig. 9 is the dsc measurement figure as a result of traditional Sn-6Zn-6In-1Ag alloy.
DESCRIPTION OF THE PREFERRED
Hereinafter, with reference to the accompanying drawings the preferred embodiments of the invention are described in detail.
According to the present invention, welding alloy is the Sn-Zn-In-Ag scolder that contains a small amount of Ag, the purpose that contains a small amount of Ag is to prevent that the copper base material contact that has scolder is exposed to high temperature, high humidity atmosphere adhesive interface of following time intensity step-down, and this alloy has 210 ℃ or lower fusing point based on the Sn-Zn-In parent metal.
For fusion temperature and bonding reliability, the preferred concentration of each element is in this welding alloy, by weight:
3.0％＜Zn＜5.0％；
0.1%≤In≤20.0%; With
0.1％≤Ag≤0.4％。
Below, will explain this compositing range.
The Zn range of concentrations is about 3.0 weight %-5.0 weight %.When the concentration of Zn was lower than 3.0 weight %, the fusing point of scolder can not be lower than 200 ℃.And if the concentration of Zn is lower than 3.0 weight %, even improve the concentration of In, the gap between solidus temperature and the liquidus temperature also will enlarge.As a result, in the multistep welding process, the parts contact can peel off.
On the other hand, when the concentration of Zn surpassed 5.0 weight %, the adhesive interface intensity with the copper film under high temperature and high humidity can reduce.And if Zn concentration increases, the wettability of scolder reduces, and causes scolder oxidized, and the electrical insulating property of contact reduces.
The concentration of In is at the about 20.0 weight % of 0.1-.When concentration during, can not reduce fusing point less than about 0.1 weight %.If In concentration surpasses 20.0 weight %, it is too low that the solidus temperature of scolder fusing point becomes.For Sn-20In, solidus temperature is 153 ℃.If solidus temperature reduces, in the time of in being exposed to hot environment, scolder can melt and peel off.
In addition, the heat that is produced by device therefor may cause same damage.And, because solidus temperature (153 ℃) and the liquidus temperature (199 ℃) of Sn-20In are too wide in the gap each other, in second welding step or step thereafter the phenomenon that scolder peels off may take place.
The concentration of Ag is between 0.1%-0.4 weight %.If concentration is less than about 0.1 weight %, after welding, be exposed to high temperature and high humidity environment following time, just can not reach the effect that stops the bonding strength reduction.
If Ag concentration surpasses 0.4 weight %, scolder is tending towards melting under the temperature higher in the melting temperature district of scolder, and this makes reflow welding connect the mobile variation of fusion welding in the step.
And, list preferred compositing range below, by weight:
0.3％＜Zn＜5.0％
0.1%≤In≤4.0%; With
0.1％≤Ag≤0.4％
If In concentration increases in the welding alloy, the elongation of welding alloy can reduce.And, if In concentration is 4 weight % and littler, can guarantee 30% or bigger elongation.Therefore, when generation stress such as thermal shock, because the scolder distortion, stress will be released.On the contrary, if scolder does not have elongation, when PCB or parts expansion or contraction, in welded contact, may produce the crack.
Simultaneously, " high temperature and high humility " of the present invention is meant that environment temperature is 85 ℃ and 85%RH (relative humidity).
Embodiment
Embodiment 1
In embodiment 1, change according to the bonding strength that is exposed in high temperature and the high humidity environment, measured the peel strength of the contact that contains 3 weight %In and 0-6 weight %Zn (surplus is Sn).
At first, about 1kg being mixed the welding alloy of being scheduled to composition remains under 230 ℃.Then, by using adhesive that QFP (Quad FlatPackage) parts of 0.65mm spacing and 100 pins are fixed on the glass epoxy resin PCB that adheres to copper.On sample, be coated with solder flux, weld by in scolder, soaking then.Clean welded articles by the microwave rinsing maching with acetone, so that remove the remnant of deflux.Welding PCB sample after cleaning is put into Constant Temperature and Humidity Chambers (constant temperature and humidity stove), remain under 85 ℃ and the 85%RH, measured the intensity of peeling off of plumbous bonding (lead bongding strength) intensity then every 250 hours.
Fig. 1 represents to work as with the In that contains 3 weight %, and when the Zn of 0-6 weight % and the scolder of surplus Sn welding QFP parts, lead welding connects the variation of intensity.Here, the Zn of the 0-6 weight % meaning refers to that Zn concentration is 0-6 weight %.And, notice that the bonding strength that is exposed under high temperature and the high humility state descends significantly along with Zn concentration increases.And when Zn concentration was 6 weight %, open-assembly time was that bonding strength becomes 1kgf or littler after 500 hours.
Just, when the concentration of Zn increased in scolder, the bonding strength of parts under high temperature and super-humid conditions was tending towards reducing.Zn is diffused in the adhesive surface mutually in scolder, and issues biochemical reaction with copper-based material at high temperature and high humility atmosphere, forms and grow a kind of Cu-Zn compound layer thus.In this course, because oxidation takes place the effect Zn of high humility, the Cu-Zn compound layer bonding strength at the interface that has the adhesive surface of scolder thus significantly reduces.As can be seen from Figure 1, preferred Zn concentration is for being lower than about 5 weight %.
Simultaneously, Fig. 2 A-2E has described by weight every part and has comprised 3% In, the Zn of 2-6%, the dsc measurement result of the scolder of 0.3% the Ag and the Sn of surplus.If the concentration of Zn is lower than 3 weight %, the fusing point of metal will be above 210 ℃.Therefore, preferred Zn concentration is higher than about 3 weight %.
And, if Zn concentration greater than 5 weight %, the bonding strength under high temperature and high humidity can reduce gradually.Therefore, preferred Zn concentration is less than about 5 weight %.
From Fig. 3 A-3C as can be known, along with the increase of Ag concentration, needle-like Zn reduces mutually.And, notice that in Fig. 3 B and 3C, spherical Zn-Ag increases mutually.Further, can confirm the fine structure of scolder.Zn disperses the connection between the Zn phase is disappeared mutually uniformly.Thereby the Zn oxidation that causes bonding strength to reduce can not be diffused into the inside of scolder, and has restrained the reduction of bonding strength under the hot and humid condition.
As shown in Figure 3A, when Ag concentration is 0.1 weight %, observe the Zn phase of many needle-likes.Yet, confirm to have spherical Zn-Ag layer really.
Embodiment 3
In embodiment 3, when in Sn-4Zn-3In, adding a spot of Ag, the variation of electrochemical corrosion gesture is made explanations.
Every part of scolder contains the Zn of 4 weight %, the In of 3 weight %, and the Ag of 0-0.5 weight % and the Sn of surplus, being made into cross section is the bar-shaped of 5mm * 5mm.The surface of bar-shaped sample is polished with 1200 purpose water-resistance polishing papers, then by using Al
2O
3The suspension polishing.Then, under 25 ℃, sample is immersed in the NaCl aqueous solution of 3.5 weight %.And,, measure the electrical potential difference between silver label collimator electrode and the solder sample by using the normal electrode of silver electrode, silver chloride electrode and the saturated KCl aqueous solution.The results are shown in Figure 4.The electrochemical corrosion gesture of the Sn-3In scolder that does not contain Zn as a reference example further, has been described.
As can be seen from Figure 4, when electromotive force approached the electromotive force of Sn-3In scolder, the oxidation of Zn became difficult in the scolder.In other words, by adding 0.1 weight % or more Ag, can obtain to stop like this effect of oxidation development.
In embodiment 4, the observed result of the adhesive surface when with Sn-4Zn-31n-0.3Ag and copper coin welding has been described.The Sn-4Zn-31n-0.3Ag scolder of 0.3g is put on the copper coin, and adds solder flux.Then, heating and welding on 230 ℃ heating plate.After this, sample is loaded into resin, polishing, and evaporation are observed the cross section of adhesive surface by using SEM and X-ray microanalysis device (XMA).By using SEM and XMA observation, the result can observe and form Zn layer and Ag layer in the adhesive surface between scolder and the copper coin.Just, in the adhesive surface between copper coin and the adhesive surface, form the Zn-Ag phase as can be known.If in adhesive surface, formed Zn-Cu compound phase, will have the oxidation of the solder interface of Zn-Cu compound, thereby cause the reduction of bonding strength.Just, by preventing to form the Zn-Cu compound layer, can prevent the reduction of bonding strength.
Embodiment 5
In embodiment 5, with the variation of explanation fusing point when joining small amount of silver among the Sn-4Zn-3In.Fig. 5 A-5E represents that every part of scolder contains the Zn of 4 weight %, the %In of 3 weight, the Ag of 0-0.5 weight % and the Sn of surplus by using the result of dsc measurement scolder fusing point.From Fig. 5 A-5E as can be seen, along with the increase of Ag concentration, near the peak value of the representative caloric receptivity 205 ℃-210 ℃ increases, and also increases in the fusing amount of this humidity province scolder.If Ag concentration becomes 0.5 weight %, near identical basically with 190 ℃ of amount that near the endothermic peak 205 ℃-210 ℃ increases.Thereby, when used as scolder, be difficult to fusing.In other words, scolder at first is in lower temperature (about 193 ℃) fusing down, fusing again under a higher temperature again.And, the wettability of scolder or mobile the reduction.
From aforementioned measurement result as can be known, by adding 0.1 weight % or more Ag, can improve the electrochemical corrosion gesture.On the other hand, if the Ag that adds amount surpasses 0.5 weight %, shown in the dsc measurement of alloy, can increase higher temperature peaks.Correspondingly, scolder can be difficult to fusing, therefore causes wettability or mobile variation.
And if Ag is added in the scolder that contains Zn, the Zn of needle-like reduces mutually, and spherical Zn-Ag increases mutually.Thereby, by can confirm the fine structure of scolder to the observation of its structure.And if the concentration of Ag is 0.1 weight %, can observe the Zn phase of needle-like, as mentioned above, can improve the electrochemical corrosion gesture in this case.
And, when on Cu, welding, in bonding surface, form Zn-Ag compound phase by adding Ag, be used to prevent react between Cu and the Zn as the barrier layer thus.As a result, can suppress to be easy to the formation of the Zn-Cu compound layer of oxidation,, stop the decline of bonding strength thus so that prevent the oxidation in bonding surface.
Every part of scolder contains, by weight, 4% Zn, the In of 0-10%, 0.3% the Ag and the Sn of surplus under the temperature that is higher than 50 ℃ of scolder liquidus temperatures, are molten into sheet with it.
Sample is the JIS4 sample.Tension test is to carry out under the rate of extension of 5.0mm/min.
The result as shown in Figure 6.Obviously find out from Fig. 6, when In content is 0-4 weight %, kept 30% or higher stretching.
Embodiment 7
Preferably, in bonding wire and welding paste, use the leadless welding material that forms by welding alloy and solder flux.Here, comprise based on the welding alloy of Sn-Zn-In-Ag system, by weight:
3.0％＜Zn＜5.0％；
0.1％≤In≤4.0％；
0.1%≤Ag≤0.4; With
The Sn of surplus.
And solder flux can use known solder flux.
In embodiment 8, by using welding alloy weld bonds intensity is described, described welding alloy is based on the Sn-Zn-In-Ag system, and comprises the element of at least a Ni of being selected from, Ti, Mg, Al and Co, and described welding alloy comprises by weight:
3.0％＜Zn＜5.0％；
0.1%≤In≤4.0%; With
0.1％≤Ag≤0.4％。
Wherein, the total concentration of described at least a element is 0.001 weight %-0.05 weight %, and surplus is Sn.
Following sample is carried out high temperature and humidity test.What Fig. 7 represented is the variation of their bonding strength.Adopt the method measurement bonding strength the same with embodiment 1.Prepare sample with welding alloy, every duplicate samples comprises a kind of aforementioned elements and carry out reflow welding on the Cu film and connects.
In Fig. 7, F represents standard Pb-free solder alloy of the present invention.And A, B, C, D and E have the composition identical with F (except Sn), and comprise the Ti of 0.004 weight % respectively, the Ni of 0.01 weight %, the Mg of 0.01 weight %, the Co of the Al of 0.05 weight % and 0.05 weight %.And their remainder is Sn.After exposing 1000 hours under high temperature and the high humidity, relatively bonding strength is found sample A, B, and C and E are superior to reference material F.And, notice that sample D keeps being equal to or greater than at least the bonding strength of F.
What Fig. 8 showed is under high temperature and high humidity, the variation of the bonding strength of three kinds of welded contact compositions (Sn-8Znn-3Bi, Sn-4Zn-3In-0.3Ag, and Sn-4Zn-3In-0.3Ag-0.003Ti).And, adopt the method identical to form welded contact with embodiment 1.Can be clear that from Fig. 8, Ti be added in 1500 hours after be effective.
And in comparative example Sn-8Zn-3Bi, bonding strength is less than 1kgf after 250 hours.Other element such as Ni, Mg, Al and Co provide the effect identical with Ti.
Embodiment 9
In embodiment 9, will be used in bonding wire and the welding paste by the leadless welding material that welding alloy and solder flux form.Here, described welding alloy is based on the Sn-Zn-In-Ag system, and comprises the element of at least a Ni of being selected from, Ti, Mg, Al and Co, and described welding alloy comprises by weight:
3.0％＜Zn＜5.0％；
0.1%≤In≤4.0%; With
0.1％≤Ag≤0.4％。
Wherein, the total concentration of described at least a element is the about 0.05 weight % of about 0.001 weight %-, and surplus is Sn.And solder flux can use known solder flux.
As mentioned above, be to be approximately 3-5 weight % according to the concentration range of Zn of the present invention, can improve the reliability of the welded contact under high temperature and the high humility atmosphere thus.And welding alloy of the present invention can be strip scolder (molten solder) and the no Pb welding alloy that is suitable for Diffusion Welding.Further, the present invention includes electricity and the electronic equipment welded contact that uses welding alloy of the present invention.
The lead-free solder of use welding alloy of the present invention has the fusing point of traditional no better than Sn-Pb scolder.Therefore, Sn-Pb welding method and present parts or process units can use as it is at present.And, leadless welding material is provided, it has the welding characteristic with the adhering components excellent strength.
And, because the difference between solidus temperature and the liquidus temperature is little,, still can prevent drifting out of parts lead even repeatedly encapsulate.And, when being exposed in high temperature and the high humility atmosphere, contact can prevent the reduction of bonding strength.
Though show and described the present invention by preferred embodiment, be understood that those skilled in the art in the defined spirit and scope of claim, can make variations and modifications below not deviating from.
Claims (6)
1. welding alloy based on the Sn-Zn-In-Ag system, this welding alloy comprise, by weight: 3.0%＜Zn＜5.0%; 0.1%≤In≤4.0%; 0.1%≤Ag≤0.4%; Sn with surplus.
2. leadless welding material, it comprises welding alloy and solder flux, and wherein said welding alloy is based on the Sn-Zn-In-Ag system, and this system comprises by weight:
3.0％＜Zn＜5.0％；
0.1％≤In≤4.0％；
0.1%≤Ag≤0.4%; With
The Sn of surplus.
3. welding alloy based on the Sn-Zn-In-Ag system, it comprises the element of at least a Ni of being selected from, Ti, Mg, Al and Co, and described welding alloy comprises by weight:
3.0％＜Zn＜5.0％；
0.1%≤In≤4.0%; With
1％≤Ag≤0.4％，
The total concentration of wherein said at least a element is the about 0.05 weight % of about 0.001 weight %-, and surplus is Sn.
4. leadless welding material, it comprises welding alloy and solder flux, and wherein said welding alloy is based on the Sn-Zn-In-Ag system, and comprises the element of at least a Ni of being selected from, Ti, Mg, Al and Co, and described welding alloy comprises:
3.0％＜Zn＜5.0％；
0.1%≤In≤4.0%; With
0.1％≤Ag≤0.4％，
Wherein, the total concentration of described at least a element is the about 0.05 weight % of about 0.001 weight %-, and surplus is Sn.
5. the welded contact of electricity and electronic equipment, it comprises the welding alloy of claim 1.
6. the welded contact of electricity and electronic equipment, it comprises the welding alloy of claim 3.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003352015 | 2003-10-10 | ||
| JP352015/2003 | 2003-10-10 | ||
| JP223189/2004 | 2004-07-30 | ||
| JP2004223189A JP4453473B2 (en) | 2003-10-10 | 2004-07-30 | Lead-free solder alloys, solder materials and solder joints using them |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1605427A true CN1605427A (en) | 2005-04-13 |
| CN1311950C CN1311950C (en) | 2007-04-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2004100921370A Expired - Fee Related CN1311950C (en) | 2003-10-10 | 2004-10-10 | Pb-free solder alloy, and solder material and solder joint using same |
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| Country | Link |
|---|---|
| US (1) | US20050079092A1 (en) |
| JP (1) | JP4453473B2 (en) |
| KR (1) | KR100678803B1 (en) |
| CN (1) | CN1311950C (en) |
| SG (1) | SG111229A1 (en) |
| TW (1) | TWI301854B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101804527A (en) * | 2010-04-06 | 2010-08-18 | 山东大学 | Sn-Zn based unleaded brazing material with low Zn |
| CN106238951A (en) * | 2016-08-26 | 2016-12-21 | 王泽陆 | A kind of environment-friendly high-intensity lead-free brazing and preparation technology thereof |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1749616A1 (en) * | 2005-08-05 | 2007-02-07 | Grillo-Werke AG | Process for arc or beam soldering or welding of workpieces from same or different metal or metallic aloys using a Sn-Basis alloy filler; Wire of Tin-basis alloy |
| US20080225490A1 (en) * | 2007-03-15 | 2008-09-18 | Daewoong Suh | Thermal interface materials |
| MX2014011514A (en) | 2012-03-28 | 2015-01-16 | Nippon Steel & Sumitomo Metal Corp | Tailored blank for hot stamping, hot-stamped member, and processes for producing same. |
| CN104411449B (en) | 2012-04-18 | 2016-03-23 | 千住金属工业株式会社 | Solder alloy |
| JP5780365B2 (en) * | 2012-08-31 | 2015-09-16 | 千住金属工業株式会社 | Conductive adhesive material |
| CN103212919A (en) * | 2013-03-22 | 2013-07-24 | 宁波市鄞州品达电器焊料有限公司 | Improved lead-free solder wire and flux thereof |
| CN109926750B (en) * | 2019-05-17 | 2021-03-30 | 云南锡业集团（控股）有限责任公司研发中心 | Low-temperature lead-free solder alloy and vacuum casting method thereof |
| US11383330B2 (en) | 2020-09-21 | 2022-07-12 | Aptiv Technologies Limited | Lead-free solder composition |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR0168964B1 (en) * | 1995-06-30 | 1999-01-15 | 이형도 | Pb free solder |
| EP0855242B1 (en) * | 1995-09-29 | 2004-07-07 | Matsushita Electric Industrial Co., Ltd. | Lead-free solder |
| JPH10193171A (en) * | 1996-12-27 | 1998-07-28 | Murata Mfg Co Ltd | Soldering article |
| JPH10249578A (en) * | 1997-03-11 | 1998-09-22 | Hitachi Cable Ltd | Copper and copper alloy brazing sheet |
| JPH10328880A (en) * | 1997-06-04 | 1998-12-15 | Mitsui Mining & Smelting Co Ltd | Tin-silver based lead-free solder |
| JP2001321983A (en) * | 2000-05-16 | 2001-11-20 | Canon Inc | Solder paste and method for soldering electronic parts using the same |
| US20030021718A1 (en) * | 2001-06-28 | 2003-01-30 | Osamu Munekata | Lead-free solder alloy |
-
2004
- 2004-07-30 JP JP2004223189A patent/JP4453473B2/en not_active Expired - Fee Related
- 2004-10-07 KR KR1020040079790A patent/KR100678803B1/en not_active IP Right Cessation
- 2004-10-08 US US10/960,116 patent/US20050079092A1/en not_active Abandoned
- 2004-10-08 TW TW093130582A patent/TWI301854B/en not_active IP Right Cessation
- 2004-10-08 SG SG200405932A patent/SG111229A1/en unknown
- 2004-10-10 CN CNB2004100921370A patent/CN1311950C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101804527A (en) * | 2010-04-06 | 2010-08-18 | 山东大学 | Sn-Zn based unleaded brazing material with low Zn |
| CN106238951A (en) * | 2016-08-26 | 2016-12-21 | 王泽陆 | A kind of environment-friendly high-intensity lead-free brazing and preparation technology thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI301854B (en) | 2008-10-11 |
| TW200519216A (en) | 2005-06-16 |
| US20050079092A1 (en) | 2005-04-14 |
| JP2005131705A (en) | 2005-05-26 |
| CN1311950C (en) | 2007-04-25 |
| SG111229A1 (en) | 2005-05-30 |
| KR20050035083A (en) | 2005-04-15 |
| KR100678803B1 (en) | 2007-02-06 |
| JP4453473B2 (en) | 2010-04-21 |
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