CN1404124A - Chip support for protecting chip from breakdown by static electricity - Google Patents
Chip support for protecting chip from breakdown by static electricity Download PDFInfo
- Publication number
- CN1404124A CN1404124A CN02132131A CN02132131A CN1404124A CN 1404124 A CN1404124 A CN 1404124A CN 02132131 A CN02132131 A CN 02132131A CN 02132131 A CN02132131 A CN 02132131A CN 1404124 A CN1404124 A CN 1404124A
- Authority
- CN
- China
- Prior art keywords
- wafer
- fluid bore
- liquid
- mounting panel
- chip support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Jigs For Machine Tools (AREA)
- Feeding Of Workpieces (AREA)
Abstract
A wafer holder includes a mounting plate for mounting a wafer and having a plurality of fluid holes, a decompressor for absorbing the wafer toward the mounting plate while sucking air between the mounting plate and the wafer through the fluid holes, and a liquid supply unit for supplying a liquid toward the wafer to release the wafer from the wafer holder. The liquid has a specific resistance lower than the specific resistance of water.
Description
Technical field
The present invention relates to a kind of chip support that wafer is installed thereon, protect chip from breakdown by static electricity simultaneously, particularly a kind of such as the chip support that is used for transmitting such as the treating stations of polissoir wafer from production line to.
Background technology
A wafer is included in wherein makes good a plurality of semiconductor device.If wafer has electric charge on first type surface, and settled the semiconductor device with precision element on this first type surface, then the electrostatic force of electric charge can damage in the inside connection that forms on the wafer or damage the etchant resist that is coated on the wafer.
For example, patent application JP-A-6-123924 and JP-A-11-289004 have described the chip support that is used for transmitting wafer from the production line to the polissoir.
In the chip support that JP-A-6-123924 describes, separation equipment or releasing parts provide a positive pressure gas between chip support and the wafer that is installed in by absorption, thereby discharge wafer, and wherein positive pressure gas is the ionization air.The ionization air has been offset the electric charge that is adsorbed on the wafer.
In the chip support that JP-A-11-289004 describes, a releasing parts provides water or comprises that a kind of mist of water is so that discharge wafer between support and arrangement wafer thereon.Like this, the glassware for drinking water that provides has polarity, has offset the electric charge of the remnants on the contact-making surface between support and the wafer.
The present invention has studied the chip support of above-mentioned routine, has been found that owing to form electrostatic charge by friction or the like on wafer, might can occur the electrostatic breakdown of wafer in the chip support of routine.More particularly, ionization air that uses in JP-A-6-123924 and the glassware for drinking water that uses in JP-A-11-289004 have a very big specific resistance, so just can not leak electrostatic charge and can not protect chip from breakdown by static electricity.
Summary of the invention
In view of foregoing, an object of the present invention is to provide a kind of chip support, a wafer is installed thereon, and particularly in whole release wafer process, can be effectively protected chip from breakdown by static electricity.
The invention provides a chip support comprises: a mounting panel is used for installing a wafer thereon; At least one fluid bore that on mounting panel, forms; A selectable fluid evacuation unit of linking up with fluid bore is used for by the fluid bore draw fluid so that emptying; And a liquid of optionally linking up with fluid bore provides the unit, is used for providing a kind of liquid by fluid bore, and liquid has a specific impedance of the specified impedance that is lower than water.
In addition, present embodiment provides a kind of method, is used for having by use wafer of a mounting panel processing of a fluid bore, and the method comprising the steps of: draw wafer to mounting panel, simultaneously by the air between fluid bore absorption wafer and the mounting panel; And discharge wafer from mounting panel, a kind of liquid with specified impedance of the specified impedance that is lower than water is provided simultaneously.
According to chip support of the present invention and method; liquid with specified impedance of the specified impedance that is lower than water has been protected the precision element on wafer effectively and has been guarded against the electrostatic breakdown of precision element; this is that lower specific impedance has effectively discharged electrostatic charge owing to discharging the process of wafer by the mounting panel of use liquid from chip support.
Description of drawings
Fig. 1 is the schematic block diagram according to the chip support of one embodiment of the invention;
Fig. 2 is a perspective view of mounting panel shown in Figure 1, has also described a wafer by a dotted line;
Fig. 3 A is the perspective view of another embodiment of mounting panel and the perspective view of the amplification that Fig. 3 B is the nozzle shown in Fig. 3 A.
Embodiment
In one embodiment of the invention, chip support is used for a chemico-mechanical polishing (CMP) equipment.This CMP equipment receives a wafer by chip support from production line, wafer is placed in the bistrique, and simultaneously thereon with the wafer centering, thus and polished wafer.
For identical thereon installation, chip support is used to draw wafer, and by use liquid from the state drawn to discharging wafer.
In one embodiment of the invention, when a handling machine people is placed on wafer on the mounting panel of chip support, the fluid evacuation parts are selectable links up and operation with fluid bore, so that draw the chip support ambient air, and draw wafer from fluid evacuation parts evacuation of air by fluid bore through fluid bore.
Then, chip support discharges wafer so that determine center wafer with CMP equipment from draw.In this stage, liquid provides that the unit is selectable to be linked up with fluid bore and provide liquid to wafer by fluid bore at mounting panel.Like this, wafer from mounting panel be released and the floating liquid that rests on the mounting panel on.
Liquid provides the unit to prepare the liquid with specified impedance that is lower than water in advance in a mixing apparatus.By using an adjuster that liquid is provided to fluid bore, adjuster is providing liquid on the pressure of an appointment and on the flow rate of liquid of an appointment.Fluid bore provides liquid on the surface of the wafer relative with chip support.
By the liquid with specified impedance that is lower than water is provided, the precision element that forms on wafer has been guarded against electrostatic breakdown by the protection of liquid through fluid bore.Preferably, liquid has a specified impedance that is equal to or less than 0.5 Ω-cm, and this just makes the precision element on the wafer seldom be with electrostatic charge, and the pressure or the flow velocity of the liquid that provides by fluid bore are not provided.
Arbon dioxide solution or aqueous ammonium are preferably as the liquid with a kind of specified impedance that is lower than water.Carbon dioxide can not influence the health of human body, and is easy to handle and need carry out particular processing.In addition, aqueous ammonium also is easy to handle and need carry out particular processing.Carbon dioxide preferably is not because it distributes smell.
In a preferred structure of the present invention, on the installation surface of mounting panel, provide a plurality of fluid bore.Consider the less possibility of electrostatic breakdown, the liquid that preferably adopts a lower pressure and low flow velocity is so that the precision element on the protection wafer.On the other hand, according to the liquid that provides from fluid bore, when wafer emersion mounting panel, lower flow rate of liquid can cause that the mobile of wafer slow down.In the case, after fluid bore begins liquid is provided, definite time span of needs may occur and be used for wafer emersion mounting panel, perhaps not make the transmission failure of wafer owing to wafer has complete emersion mounting panel.
By using an adjuster and a plurality of fluid bore,, can suppress the charged of wafer by storing and providing liquid at leisure with specified impedance that is lower than water.According to provide liquid on the flow velocity of appointment, a plurality of fluid bore have reduced the flow velocity of liquid, and the flow velocity of appointment is enough to make wafer emersion mounting panel on the speed that requires.
Preferably, arranging a plurality of fluid bore on the mounting panel so that each fluid bore has the elongation opening that the direction outside radiation direction is extended.In a replaceable mode, fluid bore can be arranged with a kind of constant density on mounting panel.These configurations allow the pressure of liquid to be maintained at one than on the low value, and improve the speed of wafer emersion mounting panel.
In the surface of the vicinity of mounting panel, each fluid bore can have a kind of funnel shaped, thereby reduces the flow rate of liquid of fluid bore per unit area, so that further suppress the charged of wafer.
Can provide a plurality of nozzles in chip support of the present invention, each nozzle has a plurality of fluid bore.This configuration has reduced the flow velocity of the liquid of wafer per unit area, has suppressed the charged of wafer and allowed to make wafer emersion mounting panel with higher speed.
Chip support can have the defluent adjuster that a pure water provides unit and other processing pure water that the unit is provided, and is used to control the pressure and the flow velocity of pure water.Chip support can provide unit selection liquid or provide the unit to select pure water from pure water from liquid.
When providing a kind of liquid by fluid bore, the rubbing head of CMP equipment can be washed by chip support.Consider the precision element of protection on the wafer, should Be Controlled although discharge the pressure of liquid the process of wafer and flow velocity from mounting panel, pressure and flow velocity do not need Be Controlled in the process of whole flushing polissoir subsequently.On the contrary, preferably keep higher pressure in the rubbing head washing at a high speed.
Now, in conjunction with describing the present invention with reference to the accompanying drawings more specifically.With reference to figure 1, according to one embodiment of the present of invention usually be used to a polissoir by chip supports of numeral 10 expressions, by at polissoir be used to produce between the production line of wafer and transmit wafer.
By the people's wafer 12 of 10 transmission from the production line to the support of operating machine, this wafer 12 is positioned on the support 10 by an orientation tool 14, drawn and hung by a rubbing head 16, rubbing head 16 can rotate and move in vertical direction around a vertical axis, is sent to CMP equipment then.The wafer 12 that support 10 is drawn and kept being positioned then discharges wafer from absorption, thereby transmits wafer 12 between production line and CMP equipment.
In the present embodiment, relative with support 10 and form precision element on the first type surface of wafer 12, and the lower surface of wafer 12 is with respect to rubbing head 16.Yet the first type surface of wafer 12 and lower surface can be respectively with respect to rubbing head 16 and supports 10.
If first selector valve 24 and second selector valve 26 are selected primary importance respectively, then fluid bore and fluid evacuation unit 28 are linked up.If first selector valve 24 and second selector valve 26 are selected the primary importance and the second place respectively, then fluid bore and pure water provide unit 32 to link up.If first selector valve 24 is selected the second place, then fluid bore and liquid provide unit 30 to link up.
Liquid provides unit 30 to comprise a mixing apparatus 36 and an adjuster 38.Mixing apparatus 36 is prepared the arbon dioxide solution with specific concentrations by dissolved carbon dioxide in pure water.Carbon dioxide can be substituted by other gas.
The arbon dioxide solution that is used for present embodiment has specific impedance 0.5 a Ω-cm or lower.Have specific impedance 0.5 a Ω-cm or lower arbon dioxide solution and prevented precision element charged on the wafer 12 effectively, and the pressure and the flow velocity of the liquid that provides from fluid bore need not be provided.
Pure water provides unit 32 to have a function, is used for through pipe 22 and first selector valve 24 pure water being provided to fluid bore from a pure water holder (not shown).Pure water provides unit 32 to provide pure water by pipe 22, uses so that rubbing head 16 is used for polishing.It should be noted that in pure water provides the system of unit 32 provides an adjuster in addition, and pressure and flow velocity by this adjuster control pure water.
With reference to figure 2, on the end face of mounting panel 18, mounting panel 18 has a plurality of fluid bore 20.The cross section of each fluid bore 20 is in the crack that extends to form an elongation on extraradial direction.The fluid bore of a plurality of elongations is being arranged on the four direction on the mounting panel 18, and each direction has the angle of one 90 degree each other.
Provide by fluid bore 20 process of liquid in the whole unit 30 that provides from liquid, guard against electrostatic breakdown in order to protect the precision element on the wafer 12, the pressure of liquid and flow velocity should be reduced.In the present embodiment, by a plurality of fluid bore 20 are provided on mounting panel 18, thereby from fluid bore 20 towards wafer 12 pressure and the flow velocitys that provide liquid to reduce liquid uniformly.A plurality of fluid bore 20 have guaranteed that the enough flow velocitys that obtained are so that make wafer 12 emersion mounting panels 18 on the speed of expectation.
In order to reduce the pressure near the liquid fluid bore 20 open-topped, preferably the flow direction along liquid has bigger cross section in fluid bore 20 in the open top of fluid bore 20.
With reference to figure 3A, another example that is used for the mounting panel 19 of Fig. 1 chip support has a plurality of nozzles 21, and each nozzle has the top that the end face with mounting panel 19 flushes.With reference to figure 3B, each nozzle 21 has a plurality of fluid bore 20 ' on the top of nozzle 21.Each fluid bore 20 ' of nozzle 21 is linked up with the pipe 22 in Fig. 1 of nozzle 21 bottoms.When liquid provided unit 30 to provide liquid to nozzle 21 by pipe 22, the fluid bore 20 ' by each nozzle 21 provided liquid with one than hanging down the first type surface of flow velocity towards wafer 12 respectively.
The fluid bore 20 ' that forms in each of a plurality of nozzles 21 has reduced the flow velocity of the per unit area of wafer 12 first type surfaces, thereby has reduced towards the flow velocity of wafer 12 and suppressed the charged of wafer 12, and does not postpone the speed of wafer 12 emersion mounting panels 18.Therefore, wafer 12 is sent to the production phase subsequently fast.
Next in conjunction with maintenance and the release of associating CMP equipment by the wafer 12 of chip support 10 is described in detail in detail with reference to figure 1.Aforesaid wafer after CMP equipment is sent to production line, orientation tool 14 is in the release condition to wafer.Mounting panel 18 is positioned with vertical direction away from rubbing head 16.The position that first selector valve 24 and second selector valve 26 mediate, wherein pipe 22 breaks away from fluid evacuation unit 28, and liquid provides unit 30 and pure water that unit 32 is provided.
After second selector valve 26 has been selected the second place, and first selector valve 24 selects primary importance, pure water to provide unit 32 to link up by pipe 22 and fluid bore 20.Under this state, 16 provide pure water so that cleaning polishing head 16 apace with a kind of high relatively pressure from fluid bore 20 towards rubbing head.
After second selector valve 26 was transformed into primary importance, mounting panel 18 and pure water provided the pressure in path to be reduced, and the remaining pure water in system provides the path from mounting panel 18 and pure water and bled off.The a plurality of fluid bore 20 that evenly form on mounting panel 18 allow to be easy to bleed off pure water from the end face of mounting panel 18.Remaining pure water is stored in the dehydrator and is bled off therefrom.After past, second selector valve 26 turns back to the centre position an official hour length.
Subsequently, the people that operates machine places next wafer on mounting panel 18.Second selector valve 26 is then selected primary importance so that link up fluid bore 20 and fluid evacuation unit 28.The first type surface of mounting panel 18 absorption wafers 12 is so that keep wafer 12 on mounting panel 18.
First selector valve 24 is selected the second places so that link up pipe 22 and adjuster 38 then, whereby liquid provide unit 28 with appointment pressure and the flow velocity of appointment in adjuster 38, provide arbon dioxide solution to arrive fluid bore 20.Fluid bore 20 provides arbon dioxide solution between mounting panel 18 and wafer 12 so that wafer 12 emersion mounting panels 18.
Subsequently, mounting panel 18 is upwards raise.Rubbing head 16 has in its bottom towards barrier film of mounting panel 18 expansion or diaphragm.According to the rising that makes progress of mounting panel, wafer 12 touches the barrier film of the expansion of rubbing head 16.Subsequently, rubbing head 16 hangs wafer 12 by absorption.When rubbing head hung wafer 12, first selector valve 24 was selected the second place in fact at one time, provided arbon dioxide solution by fluid bore 20 whereby so that discharge wafer 12 from the absorption of mounting panel 18.Like this, wafer 12 is sent to rubbing head 16 from mounting panel 18.
Subsequently, rubbing head 16 pivoted are come polished wafer 12.After 12 polished 16 polishings of wafer, rubbing head 16 turns back to wafer 12 on the mounting panel 18.In this stage, when the barrier film of rubbing head 16 was expanded, mounting panel 18 was raised simultaneously.
First selector valve 24 is selected the second place, thereby the arbon dioxide solution that will be stored in the adjuster 38 is provided to fluid bore 20 with the pressure of appointment and the flow velocity of appointment.Between mounting panel 18 and wafer 12, provide arbon dioxide solution from fluid bore 20, make wafer 12 emersion mounting panels 18 whereby.
Subsequently, orientation tool 14 begins emersion mounting panels 18 for positions wafer 12 with respect to rubbing head 16.First selector valve 24 is selected primary importances so that fluid bore 20 is linked up fluid evacuation unit 28, thereby between mounting panel 18 and wafer 12 the emptying arbon dioxide solution.Then on the first type surface of wafer 12, adsorb wafer 12, and orientation tool 14 discharges wafer 12 by mounting panel 18.
At last, the people that operates machine transmits wafers 12 to production line from mounting panel 18.In this step, first selector valve 24 and second selector valve 26 are selected the primary importance and the second place respectively, so that communication fluid bore 20 and pure water provide unit 32.After being subjected to polishing, wafer 12 polished liquid adhere to.Like this, wafer 12 can not suffer electrostatic breakdown by pure water emersion mounting panel 18.Yet, in the floating step of wafer 12, can replace pure water with arbon dioxide solution.
Because the above embodiments only are presented for purpose of illustration, thereby the present invention is not limited to the above embodiments, and as those of ordinary skill in the art, without departing from the scope of the invention, can easily make various modifications and replacement.
Claims (13)
1. chip support comprises:
A mounting panel is used for installing a wafer thereon;
At least one fluid bore that on described mounting panel, forms;
The fluid evacuation unit that selectable and described fluid bore is linked up is used for by described fluid bore draw fluid so that emptying; With
The liquid that selectable and described fluid bore is linked up provides the unit, is used for providing liquid by described fluid bore, and described liquid has a specific impedance of the specified impedance that is lower than water.
2. chip support as claimed in claim 1, wherein said liquid provides the unit to comprise adjuster, before providing described liquid by described fluid bore, controls the pressure and the flow velocity of described liquid.
3. chip support as claimed in claim 1, wherein said liquid have the specified impedance of 0.5 Ω-cm or lower.
4. chip support as claimed in claim 1 wherein obtains described liquid by dissolved carbon dioxide in water.
5. chip support as claimed in claim 1, wherein said liquid comprises ammonium and water.
6. chip support as claimed in claim 1, wherein said at least one fluid bore comprises a plurality of fluid bore.
7. chip support as claimed in claim 1, wherein on described mounting panel, when when a Way out of described fluid bore is seen, described fluid bore has a bigger cross section.
8. chip support as claimed in claim 1, wherein said mounting panel comprises a plurality of nozzles, each of described nozzle comprises described a plurality of fluid bore.
9. chip support as claimed in claim 1 comprises that further a pure water provides the unit, is used to prepare pure water, wherein by selectable described liquid and the described pure water of providing of described fluid bore.
10. a mounting panel that has a fluid bore by use is handled the method for wafer, and described method comprises step:
The absorption wafer is to mounting panel, simultaneously by the air between fluid bore absorption wafer and the mounting panel; With
Discharge wafer from mounting panel, the liquid of a specified impedance with the specified impedance that is lower than water is provided simultaneously.
11. method as claimed in claim 10, wherein said liquid have the specified impedance of 0.5 Ω-cm or lower impedance.
12. method as claimed in claim 10 further comprises the step that pure water is provided by fluid bore.
13. the method for a chemical machinery ground polished wafer, by using rubbing head and the relevant mounting panel with fluid bore, described method comprises step:
The absorption wafer is to mounting panel, simultaneously by the air between fluid bore absorption wafer and the mounting panel;
Discharge wafer from chip support, the liquid of a specified impedance with the specified impedance that is lower than water is provided simultaneously; And
Provide pure water to scrub rubbing head by fluid bore.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP262271/2001 | 2001-08-30 | ||
| JP2001262271A JP2003077993A (en) | 2001-08-30 | 2001-08-30 | Wafer holder and suction releasing method of wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1404124A true CN1404124A (en) | 2003-03-19 |
Family
ID=19089190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN02132131A Pending CN1404124A (en) | 2001-08-30 | 2002-08-30 | Chip support for protecting chip from breakdown by static electricity |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20030045218A1 (en) |
| JP (1) | JP2003077993A (en) |
| KR (1) | KR20030019254A (en) |
| CN (1) | CN1404124A (en) |
| GB (1) | GB2383468A (en) |
| TW (1) | TW556305B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102486989A (en) * | 2010-12-01 | 2012-06-06 | 天威新能源控股有限公司 | Method and loading plate for degumming cleaning silicon wafer |
| CN103915364A (en) * | 2012-12-28 | 2014-07-09 | 大日本网屏制造株式会社 | Substrate processing apparatus and substrate processing method |
| WO2016070547A1 (en) * | 2014-11-07 | 2016-05-12 | 京东方科技集团股份有限公司 | Machine stand |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008147591A (en) * | 2006-12-13 | 2008-06-26 | Nec Electronics Corp | Apparatus and method for manufacturing semiconductor |
| US20080268753A1 (en) * | 2007-04-24 | 2008-10-30 | Tetsuya Ishikawa | Non-contact wet wafer holder |
| WO2021094057A1 (en) * | 2019-11-14 | 2021-05-20 | Asml Netherlands B.V. | Substrate support, lithographic apparatus, method for manipulating charge distribution and method for preparing a substrate |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS587831A (en) * | 1981-07-07 | 1983-01-17 | Sumitomo Shoji Kk | Washing method for wafer by high pressured water and device thereof |
| DE3884435T2 (en) * | 1987-03-25 | 1994-02-17 | Hitachi Ltd | Processes for producing high-purity water and process for using this water. |
| JP2867051B2 (en) * | 1989-12-28 | 1999-03-08 | 住友シチックス株式会社 | Wafer peeling method |
| JP2506219B2 (en) * | 1990-06-19 | 1996-06-12 | 富士通株式会社 | Electrostatic adsorption method |
| JPH04267541A (en) * | 1991-02-22 | 1992-09-24 | Shibayama Kikai Kk | Method of removing semiconductor wafer in chuck mechanism |
| JPH06123924A (en) * | 1992-10-12 | 1994-05-06 | Nikon Corp | Substrate holder |
| JPH06177078A (en) * | 1992-12-08 | 1994-06-24 | Tokyo Electron Ltd | Electrostatic chuck |
| US5607718A (en) * | 1993-03-26 | 1997-03-04 | Kabushiki Kaisha Toshiba | Polishing method and polishing apparatus |
| JP3671379B2 (en) * | 1994-02-03 | 2005-07-13 | アネルバ株式会社 | Plasma processing apparatus having mechanism for removing electrostatically attracted substrate and method for removing electrostatically attracted substrate |
| US5979475A (en) * | 1994-04-28 | 1999-11-09 | Hitachi, Ltd. | Specimen holding method and fluid treatment method of specimen surface and systems therefor |
| US5738574A (en) * | 1995-10-27 | 1998-04-14 | Applied Materials, Inc. | Continuous processing system for chemical mechanical polishing |
| US6336845B1 (en) * | 1997-11-12 | 2002-01-08 | Lam Research Corporation | Method and apparatus for polishing semiconductor wafers |
| JP3693483B2 (en) * | 1998-01-30 | 2005-09-07 | 株式会社荏原製作所 | Polishing equipment |
| JP2974303B2 (en) * | 1998-04-03 | 1999-11-10 | 山口日本電気株式会社 | Method of removing workpiece and electrostatic chuck device |
-
2001
- 2001-08-30 JP JP2001262271A patent/JP2003077993A/en active Pending
-
2002
- 2002-08-29 TW TW091119657A patent/TW556305B/en not_active IP Right Cessation
- 2002-08-30 US US10/232,451 patent/US20030045218A1/en not_active Abandoned
- 2002-08-30 CN CN02132131A patent/CN1404124A/en active Pending
- 2002-08-30 GB GB0220191A patent/GB2383468A/en not_active Withdrawn
- 2002-08-30 KR KR1020020052031A patent/KR20030019254A/en not_active Application Discontinuation
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102486989A (en) * | 2010-12-01 | 2012-06-06 | 天威新能源控股有限公司 | Method and loading plate for degumming cleaning silicon wafer |
| CN102486989B (en) * | 2010-12-01 | 2013-10-23 | 天威新能源控股有限公司 | Method and loading plate for degumming cleaning silicon wafer |
| CN103915364A (en) * | 2012-12-28 | 2014-07-09 | 大日本网屏制造株式会社 | Substrate processing apparatus and substrate processing method |
| CN103915364B (en) * | 2012-12-28 | 2017-03-01 | 斯克林集团公司 | Substrate board treatment and substrate processing method using same |
| US9972515B2 (en) | 2012-12-28 | 2018-05-15 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus and substrate processing method |
| WO2016070547A1 (en) * | 2014-11-07 | 2016-05-12 | 京东方科技集团股份有限公司 | Machine stand |
| US10330963B2 (en) | 2014-11-07 | 2019-06-25 | Boe Technology Group Co., Ltd. | Machine table |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20030019254A (en) | 2003-03-06 |
| US20030045218A1 (en) | 2003-03-06 |
| JP2003077993A (en) | 2003-03-14 |
| GB2383468A (en) | 2003-06-25 |
| GB0220191D0 (en) | 2002-10-09 |
| TW556305B (en) | 2003-10-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7364616B2 (en) | Wafer demounting method, wafer demounting device, and wafer demounting and transferring machine | |
| CN1135605C (en) | Substrate cleaning method and apparatus | |
| US7513262B2 (en) | Substrate meniscus interface and methods for operation | |
| CN1243630C (en) | Cutting machine | |
| CN1575872A (en) | A cleaning device and cleaning method | |
| CN1611429A (en) | System and method for conveying flat panel display | |
| CN1993188A (en) | Deposit removing device | |
| CN1404124A (en) | Chip support for protecting chip from breakdown by static electricity | |
| US10699918B2 (en) | Chemical supply unit and apparatus for treating a substrate | |
| CN1774790A (en) | Integrated system for processing semiconductor wafers | |
| CN101834116A (en) | The method of operation of liquid-scattering prevention cup, substrate processing apparatus and equipment | |
| CN101067998A (en) | Semiconductor apparatus and cleaning unit thereof | |
| CN1577720A (en) | Docking-type system and method for transferring and treating substrate | |
| CN112053979A (en) | Glass powder filling device for wafer manufacturing and using method thereof | |
| CN1791325A (en) | Component delivering apparatus, surface install machinery and component testing apparatus | |
| CN1462063A (en) | Base plate processing device | |
| WO2018205404A1 (en) | Electroplating apparatus and electroplating method for wafer | |
| CN1990125A (en) | Apparatus for removing particle and method of the same | |
| JP4471747B2 (en) | Semiconductor device manufacturing equipment | |
| KR100806223B1 (en) | Substrate cleaning apparatus | |
| CN210378986U (en) | Wafer cleaning platform and semiconductor equipment | |
| CN114724992A (en) | Wafer cleaning and feeding device | |
| CN1573434A (en) | Substrate treatment apparatus | |
| KR20100046799A (en) | Single type substrate treating apparatus and method | |
| JP5136127B2 (en) | Coating apparatus, coating method, and storage medium |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: NEC ELECTRONICS TAIWAN LTD. Free format text: FORMER OWNER: NIPPON ELECTRIC CO., LTD. Effective date: 20030331 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20030331 Applicant after: NEC Corp. Applicant before: NEC Corp. |
|
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |