CN1484263A - Copper base electric contact compound material for contactor of electric appliances - Google Patents
Copper base electric contact compound material for contactor of electric appliances Download PDFInfo
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- CN1484263A CN1484263A CNA031325432A CN03132543A CN1484263A CN 1484263 A CN1484263 A CN 1484263A CN A031325432 A CNA031325432 A CN A031325432A CN 03132543 A CN03132543 A CN 03132543A CN 1484263 A CN1484263 A CN 1484263A
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Abstract
This invention discloses a copper base electric contact compound material with the wt% of: Te: 1.0-3.0, TiB2: 0.5-3.5, LaB2: 0.5-4.0, V: 0.01-10.0, SnO: 1.0-10.0 and copper for rest, sum of TiB2 and LaB2 is not more than 4. TiB2, LaB2, SnO and V contained in the material can reduce contact resistance of the contactor and reduce transition of the material under DC. Te solved in the copper base forms a CuTe alloy in creasing its oxidation resistance, TiB2 and LaB2 can combine with the copper base strongly under rather low sintering temperature, such as 900deg.C ensuring reliability of switches and V can be solved in the copper base making the material more plastic.
Description
Technical field: the invention belongs to the electrical material field, mainly relate to the disjunction slider material of low-tension switch electric appliance.
Background technology: well-known, most of low-voltage electrical apparatus slider materials all are silver-base alloy or composite material.Although silver-based material can guarantee the good military service characteristic of contact and the reliably working of electrical equipment, a large amount of consumption of rare precious metal have been caused.The measure of joint silver and replacement silver contact should guarantee the quality of material, and simultaneously cheap again, this just makes people begin to attempt replacing silver with copper.Copper has many superior physical characteristics as contact material: indexs such as thermal conductivity, conductivity, thermal capacitance, fusing point, boiling point, the latent heat of fusion and the latent heat of vaporization are all higher, there have been some copper-base contact materials comparatively to approach engineering reality now, and obtained certain application achievements.This material is basic material with copper and contains cadmium metal and diadust (size is less than 2 microns), also contain some carbide formers in addition, for example W, Mo, Nb, V etc. are ablative in order to the arc resistant that improves material, and alloy element Cd, Zr, Te, La, Ce etc. are to improve the antioxygenic property of material.In some patent documentations adding carbide (WC, VC, TaC etc.) materials with high melting point has been proposed in the recent period, to improve the intensity of matrix.Though these materials have higher arc ablation resistance, lower volume resistivity (2.0～3.8 μ Ω cm), sufficiently high hardness (HB=600～650MPa) and resistance fusion welding, and comparatively stable contact resistance, but contact resistance numerical value is higher, and surface oxidation is violent, uses temperature rise value higher.Simultaneously, under DC condition, the substance transfer amount of material is also bigger, makes contact surface be easy to form micro-protuberance and pit, causes contact material to lose efficacy prematurely.In addition, because diamond particles poorly conductive, and the wetability between the copper matrix is relatively poor, when particularly on the boundary of diamond and matrix, forming carbide, interface bond strength is reduced, cause the rupture life strength of contact lower, cause that contact takes place to damage fast under heavy duty (AC4) condition after the cycling in several cycles.These all can make the reliability of device for switching reduce.The existence that a large amount of carbide elements form causes material plasticity to reduce, and itself and high base strength also are difficult to guarantee.The interpolation of alloy element Cd can improve the antioxygenic property of material and from arc extinction performance, but its hypertoxicity will make its application be restricted.Production and selling for the money base product that contains Cd has begun strict control in the world.
Summary of the invention: the present invention is intended to overcome the electrical contact material useful life of prior art and reliability is low and the defective of distributing noxious substance when using, and provides a kind of useful life and reliability high and appliance contact composite material free from environmental pollution.Material composition scheme of the present invention is as follows; By weight percentage, tellurium 1.0～3.0, titanium diboride 0.5～3.5, lanthanum diboride 0.5～4.0, vanadium 0.01～10.0, tin oxide 1.0～10.0, copper surplus, wherein titanium diboride and lanthanum diboride content sum are no more than 4.Contain titanium diboride, lanthanum diboride, tin oxide and vanadium in the material of the present invention, this can reduce the contact resistance of contact and the material transfer amount under the DC condition, and the rupture life strength of contact material is improved.The tellurium solid solution that contains in this material forms kuttern among the copper matrix, can obviously improve the non-oxidizability of matrix, makes the material contact resistance low and stable.And compare with copper cadmium alloy, tellurium is to matrix resistivity effects minimum.Oxidation kinetics analysis and resistivity measurement show that the combination property of kuttern is more excellent, can replace virose copper cadmium alloy.Compare with diamond, the titanium diboride and the lanthanum diboride that add have higher conductivity and intensity, under relatively low sintering temperature (as 900 ℃), and the interface bond strength between the matrix copper is fine, therefore the contact mechanical strength rises, especially the material rupture life strength under the cyclic loading effect raises, and has guaranteed the reliability of device for switching.In addition, the refractory metal elemental vanadium meeting solid solution of being added in the above-mentioned material is among the copper matrix, and the coefficient of dispersion in the copper matrix is bigger, and therefore under the shock loading condition, material can show higher plasticity.The interpolation of tin oxide mainly be reinforcing material from the arc extinguishing ability.When tin oxide decomposes, can be cracked into the high stannous oxide polymolecular chain of ionization energy under arcing, absorb a large amount of arc energies, thereby play the effect that promotes arc extinction at 1270K.It and tellurium acting in conjunction can substitute virose cadmium metal fully.
Utilize powder metallurgic method above-mentioned material can be prepared into contact members.Above-mentioned interpolation constituent element powder is mixed according to a certain ratio; Then mixed-powder is pressed into blank and carries out sintering; And then exert pressure, purpose is to improve density of material; The final employing annealed to eliminate stress and to optimize tissue.Utilize the prepared contact members performance index that go out of the present invention as follows: density: 8.3～8.8g/cm
3; Hardness: HB650～800MPa; Resistivity: 2.3～3.6 μ Ω cm;
The contact standard specimen of contact members of preparing as stated above and standard carries out the contrast experiment on the special test stand, electrical wear amount under the test interchange condition, the contact voltage drop U of contact surface when working lining occurring, detailed data is listed in (the contrast sample is represented with X) among the table 1.Experimental condition is: I=30A, and U=380V, cos =0.8, the ON/OFF cycle-index is 10000 times.Voltage is reduced to the mean value of 30 tests.The electrical wear amount is the mean value of contact to wear extent.
The electrical contact material performance tabulation of table 1 different component
| Sequence number | Add constituent element (percentage by weight) | Electrical wear amount gram/10 6Inferior | Contact voltage drop mV | ||||
| ????Te | ????SnO 2 | ????V | ????LaB 2 | ????TiB 2 | |||
| ????1 | ????2.1 | ????8.0 | Do not have | Do not have | Do not have | ????15.2 | ????650 |
| ????2 | ????1.9 | ????6.0 | ????3.0 | ????1.0 | ????1.2 | ????11.1 | ????540 |
| ????3 | ????1.4 | ????4.0 | ????4.0 | ????0.5 | ????1.5 | ????9.9 | ????520 |
| ????4 | ????1.4 | ????2.0 | ????2.0 | ????0.5 | ????2.0 | ????8.6 | ????490 |
| ????5 | ????0.4 | ????12.0 | Do not have | Do not have | Do not have | ????21.3 | ????680 |
| ????6 | ????1.8 | ????1.0 | ????1.0 | ????1.0 | ????1.5 | ????10.0 | ????470 |
| ????7 | ????0.8 | ????1.5 | Do not have | Do not have | Do not have | ????16.2 | ????760 |
| ????8 | ????2.6 | Do not have | ????0.01 | Do not have | Do not have | ????15.1 | ????1210 |
| ????9 | ????1.7 | ????0.5 | ????0.5 | ????0.5 | ????2.5 | ????11.7 | ????530 |
| ????10 | ????3.1 | Do not have | ????7.0 | Do not have | ????3.0 | ????10.8 | ????640 |
| ????11 | ????1.2 | ????2.0 | ????5.0 | Do not have | Do not have | ????14.8 | ????700 |
| ????12 | ????1.5 | ????1.0 | ????6.0 | ????4.5 | Do not have | ????27.5 | ????920 |
| ????13 | ????4.2 | Do not have | ????8.0 | Do not have | Do not have | ????20.9 | ????840 |
| ????14 | ????0.6 | Do not have | Do not have | Do not have | ????3.0 | ????16.0 | ????810 |
| ????15 | ????0.8 | ????2.0 | ????2.0 | ????2.0 | Do not have | ????13.4 | ????520 |
| ????16 | ????1.4 | ????1.0 | Do not have | Do not have | Do not have | ????14.2 | ????580 |
| ????17 | ????2.9 | ????1.0 | Do not have | ????1.0 | Do not have | ????14.1 | ????590 |
| ????18 | ????0.8 | Do not have | Do not have | Do not have | ????0.3 | ????20.6 | ????740 |
| ????19 | ????2.1 | Do not have | ????6.0 | ????0.2 | Do not have | ????15.0 | ????760 |
| ????20 | ????2.1 | ????1.0 | ????4.0 | ????1.0 | ????1.0 | ????13.3 | ????600 |
| ????21 | ????2.2 | ????2.0 | Do not have | ????2.0 | ????0.5 | ????10.3 | ????510 |
| ????22 | ????1.8 | ????3.0 | ????10.0 | ????4.0 | ????0.5 | ????22.7 | ????750 |
| ????23 | ????1.7 | ????5.0 | Do not have | ????0.5 | ????4.0 | ????22.8 | ????790 |
| ????24 | ????3.2 | Do not have | Do not have | ????0.5 | ????3.5 | ????18.2 | ????690 |
| ????X | ????1.1 | Do not have | Do not have | Do not have | Do not have | ????12.9 | ????720 |
Test shows, prescribes a time limit when the content that adds constituent element is lower than under the above-mentioned component content, and these constituent elements are to the not bigger contribution of military service performance of basis material; And when the content that adds constituent element is higher than above-mentioned component upper content limit, will cause the rapid deterioration of contact performance.Compare with contrast material in the table 1, the interpolation of constituent element can reduce the contact resistance of contact material, effectively improves the arc ablation resistance and the resistance fusion welding of material, strengthens the kuttern matrix, also can make the intensity of material keep lasting.
Embodiment one: it is formed by tellurium 1.0～3.0, titanium diboride 0.5～3.5, lanthanum diboride 0.5～4.0, vanadium 0.01～10.0, tin oxide 1.0～10.0 with as the copper of surplus, its composition proportion is a percentage by weight, and titanium diboride and lanthanum diboride content sum are no more than 4.
Embodiment two: it is formed by tellurium 1.0～2.0, titanium diboride 0.5～2, lanthanum diboride 0.5～2.5, vanadium 0.01～5.0, tin oxide 1.0～5.0 with as the copper of surplus, its composition proportion is a percentage by weight, and titanium diboride and lanthanum diboride content sum are no more than 4.
Embodiment three: it is formed by tellurium 2.1～3.0, titanium diboride 2.1～3.5, lanthanum diboride 2.6～4.0, vanadium 5.1～10.0, tin oxide 5.1～10.0 with as the copper of surplus, its composition proportion is a percentage by weight, and titanium diboride and lanthanum diboride content sum are no more than 4.
Embodiment four: it is formed by tellurium 1.4, titanium diboride 2.0, lanthanum diboride 0.5, vanadium 2.0, tin oxide 2.0 with as the copper of surplus, and its composition proportion is a percentage by weight.Present embodiment is a preferred forms, the contact members of utilizing present embodiment to prepare is as shown in table 2 with anti-ablation and the substance transfer amount experiment of contrast exemplar under DC condition, the percentage by weight of contrast exemplar composition is that copper is 98.9, tellurium is 1.1, experimental condition is: I=100A, U=400V, the ON/OFF cycle-index is 10000 times, and (+) expression quality increases, and (-) expression quality reduces.
The material of table 2 present embodiment and contrast material be performance comparison under DC condition
| Material | Closed wear extent gram/hundred ten thousand times | Disconnect wear extent gram/hundred ten thousand times | ||
| Moving contact-anode | Fixed contact-negative electrode | Moving contact-anode | Fixed contact-negative electrode | |
| Contrast material | ??+4.1 | ??-4.9 | ??-1.2 | ??-4.4 |
| The invention material | ??+0.2 | ??-0.3 | ??-0.5 | ??-1.6 |
By the table in as seen, the wear extent of contact material proposed by the invention is extremely low with respect to contrast material, thereby prove that of the present invention material has higher arc ablation resistance, working face contact voltage drop (being contact resistance) is lower, and the isoelectric substance transfer amount under the DC condition is extremely low.Result of the test shows, compares with the contrast sample, and contact material provided by the present invention can improve the reliability and the useful life of appliance switch.
Claims (4)
1, a kind of appliance contact copper base electric contact composite material, it is characterized in that it forms by tellurium 1.0～3.0, titanium diboride 0.5～3.5, lanthanum diboride 0.5～4.0, vanadium 0.01～10.0, tin oxide 1.0～10.0 with as the copper of surplus, its composition proportion is a percentage by weight, and titanium diboride and lanthanum diboride content sum are no more than 4.
2, appliance contact according to claim 1 copper base electric contact composite material, it is characterized in that it forms by tellurium 1.0～2.0, titanium diboride 0.5～2, lanthanum diboride 0.5～2.5, vanadium 0.01～5.0, tin oxide 1.0～5.0 with as the copper of surplus, its composition proportion is a percentage by weight, and titanium diboride and lanthanum diboride content sum are no more than 4.
3, appliance contact according to claim 1 copper base electric contact composite material, it is characterized in that it forms by tellurium 2.1～3.0, titanium diboride 2.1～3.5, lanthanum diboride 2.6～4.0, vanadium 5.1～10.0, tin oxide 5.1～10.0 with as the copper of surplus, its composition proportion is a percentage by weight, and titanium diboride and lanthanum diboride content sum are no more than 4.
4, appliance contact according to claim 1 is with copper base electric contact composite material, and the composition that it is characterized in that it is that tellurium 1.4, titanium diboride 2.0, lanthanum diboride 0.5, vanadium 2.0, tin oxide 2.0, copper are surplus, and its composition proportion is a percentage by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03132543 CN1207740C (en) | 2003-07-30 | 2003-07-30 | Copper base electric contact compound material for contactor of electric appliances |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03132543 CN1207740C (en) | 2003-07-30 | 2003-07-30 | Copper base electric contact compound material for contactor of electric appliances |
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| CN1484263A true CN1484263A (en) | 2004-03-24 |
| CN1207740C CN1207740C (en) | 2005-06-22 |
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| CN 03132543 Expired - Fee Related CN1207740C (en) | 2003-07-30 | 2003-07-30 | Copper base electric contact compound material for contactor of electric appliances |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101609751A (en) * | 2009-07-27 | 2009-12-23 | 上海市机械制造工艺研究所有限公司 | Nano-doping stannic oxide powder and preparation method thereof |
| CN101892400A (en) * | 2010-06-30 | 2010-11-24 | 天津大学 | Copper-silver-titanium-tin oxide composite electrical contact material and preparation method thereof |
| CN102304658A (en) * | 2011-08-25 | 2012-01-04 | 哈尔滨东大高新材料股份有限公司 | Copper alloy contact material for alternating current contactor and preparation method thereof |
| CN112259278A (en) * | 2020-10-19 | 2021-01-22 | 西安工程大学 | Preparation method of particle composite fiber reinforced copper tin oxide contact material |
| CN112735866A (en) * | 2020-12-21 | 2021-04-30 | 哈尔滨东大高新材料股份有限公司 | Cu-VB for low-voltage electrical apparatus2-La contact material and preparation method thereof |
-
2003
- 2003-07-30 CN CN 03132543 patent/CN1207740C/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101609751A (en) * | 2009-07-27 | 2009-12-23 | 上海市机械制造工艺研究所有限公司 | Nano-doping stannic oxide powder and preparation method thereof |
| CN101892400A (en) * | 2010-06-30 | 2010-11-24 | 天津大学 | Copper-silver-titanium-tin oxide composite electrical contact material and preparation method thereof |
| CN102304658A (en) * | 2011-08-25 | 2012-01-04 | 哈尔滨东大高新材料股份有限公司 | Copper alloy contact material for alternating current contactor and preparation method thereof |
| CN112259278A (en) * | 2020-10-19 | 2021-01-22 | 西安工程大学 | Preparation method of particle composite fiber reinforced copper tin oxide contact material |
| CN112259278B (en) * | 2020-10-19 | 2022-05-03 | 西安工程大学 | Preparation method of particle composite fiber reinforced copper tin oxide contact material |
| CN112735866A (en) * | 2020-12-21 | 2021-04-30 | 哈尔滨东大高新材料股份有限公司 | Cu-VB for low-voltage electrical apparatus2-La contact material and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN1207740C (en) | 2005-06-22 |
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