CN1484263A - Copper-based electrical contact composites for electrical contacts - Google Patents
Copper-based electrical contact composites for electrical contacts Download PDFInfo
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- CN1484263A CN1484263A CNA031325432A CN03132543A CN1484263A CN 1484263 A CN1484263 A CN 1484263A CN A031325432 A CNA031325432 A CN A031325432A CN 03132543 A CN03132543 A CN 03132543A CN 1484263 A CN1484263 A CN 1484263A
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- copper
- diboride
- contact
- lanthanum
- vanadium
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 29
- 239000010949 copper Substances 0.000 title claims abstract description 29
- 239000002131 composite material Substances 0.000 title claims abstract description 9
- QYEXBYZXHDUPRC-UHFFFAOYSA-N B#[Ti]#B Chemical compound B#[Ti]#B QYEXBYZXHDUPRC-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910033181 TiB2 Inorganic materials 0.000 claims abstract description 22
- 229910052746 lanthanum Inorganic materials 0.000 claims abstract description 22
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052714 tellurium Inorganic materials 0.000 claims abstract description 15
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052720 vanadium Inorganic materials 0.000 claims abstract description 15
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910001887 tin oxide Inorganic materials 0.000 claims abstract description 14
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000000203 mixture Substances 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 abstract description 45
- 239000011159 matrix material Substances 0.000 abstract description 13
- 238000012546 transfer Methods 0.000 abstract description 5
- 238000005245 sintering Methods 0.000 abstract description 3
- 230000003647 oxidation Effects 0.000 abstract description 2
- 238000007254 oxidation reaction Methods 0.000 abstract description 2
- 229910001215 Te alloy Inorganic materials 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- QZCHKAUWIRYEGK-UHFFFAOYSA-N tellanylidenecopper Chemical compound [Te]=[Cu] QZCHKAUWIRYEGK-UHFFFAOYSA-N 0.000 abstract 1
- 239000000470 constituent Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 238000002679 ablation Methods 0.000 description 4
- 239000002872 contrast media Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 229910000925 Cd alloy Inorganic materials 0.000 description 2
- 208000036142 Viral infection Diseases 0.000 description 2
- 230000003026 anti-oxygenic effect Effects 0.000 description 2
- 230000008033 biological extinction Effects 0.000 description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 2
- PLZFHNWCKKPCMI-UHFFFAOYSA-N cadmium copper Chemical compound [Cu].[Cd] PLZFHNWCKKPCMI-UHFFFAOYSA-N 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- QHGNHLZPVBIIPX-UHFFFAOYSA-N tin(ii) oxide Chemical compound [Sn]=O QHGNHLZPVBIIPX-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 230000001473 noxious effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
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- Contacts (AREA)
Abstract
本发明公开一种电器触点用铜基电接触复合材料，其成分重量百分比为：碲1.0～3.0、二硼化钛0.5～3.5、二硼化镧0.5～4.0、钒0.01～10.0、氧化锡1.0～10.0和作为余量的铜组成，二硼化钛和二硼化镧含量之和不超过4。本发明的材料中含有二硼化钛、二硼化镧、氧化锡和钒，这可降低触头的接触电阻，并使直流条件下的材料转移量降低，同时可使触头材料的持久强度提高。碲固溶于铜基体之中形成铜碲合金，可以明显提高基体的抗氧化性，使材料接触电阻低且稳定。二硼化钛和二硼化镧具有较高的导电性和强度，在相对较低的烧结温度下如900℃，与基体铜之间的界面结合强度很好，保证了开关电器的可靠性。钒会固溶于铜基体之中，材料会表现出较高的塑性。The invention discloses a copper-based electrical contact composite material for electrical contacts. The composition weight percent is: tellurium 1.0-3.0, titanium diboride 0.5-3.5, lanthanum diboride 0.5-4.0, vanadium 0.01-10.0, tin oxide 1.0 to 10.0 and copper as the balance, the sum of the content of titanium diboride and lanthanum diboride does not exceed 4. The material of the present invention contains titanium diboride, lanthanum diboride, tin oxide and vanadium, which can reduce the contact resistance of the contact, and reduce the amount of material transfer under DC conditions, and at the same time increase the durability of the contact material. improve. Tellurium is solid-dissolved in the copper matrix to form a copper-tellurium alloy, which can significantly improve the oxidation resistance of the matrix and make the contact resistance of the material low and stable. Titanium diboride and lanthanum diboride have high conductivity and strength. At a relatively low sintering temperature such as 900°C, the interface bonding strength with the substrate copper is very good, which ensures the reliability of the switching device. Vanadium will be dissolved in the copper matrix, and the material will show high plasticity.
Description
Technical field: the invention belongs to the electrical material field, mainly relate to the disjunction slider material of low-tension switch electric appliance.
Background technology: well-known, most of low-voltage electrical apparatus slider materials all are silver-base alloy or composite material.Although silver-based material can guarantee the good military service characteristic of contact and the reliably working of electrical equipment, a large amount of consumption of rare precious metal have been caused.The measure of joint silver and replacement silver contact should guarantee the quality of material, and simultaneously cheap again, this just makes people begin to attempt replacing silver with copper.Copper has many superior physical characteristics as contact material: indexs such as thermal conductivity, conductivity, thermal capacitance, fusing point, boiling point, the latent heat of fusion and the latent heat of vaporization are all higher, there have been some copper-base contact materials comparatively to approach engineering reality now, and obtained certain application achievements.This material is basic material with copper and contains cadmium metal and diadust (size is less than 2 microns), also contain some carbide formers in addition, for example W, Mo, Nb, V etc. are ablative in order to the arc resistant that improves material, and alloy element Cd, Zr, Te, La, Ce etc. are to improve the antioxygenic property of material.In some patent documentations adding carbide (WC, VC, TaC etc.) materials with high melting point has been proposed in the recent period, to improve the intensity of matrix.Though these materials have higher arc ablation resistance, lower volume resistivity (2.0～3.8 μ Ω cm), sufficiently high hardness (HB=600～650MPa) and resistance fusion welding, and comparatively stable contact resistance, but contact resistance numerical value is higher, and surface oxidation is violent, uses temperature rise value higher.Simultaneously, under DC condition, the substance transfer amount of material is also bigger, makes contact surface be easy to form micro-protuberance and pit, causes contact material to lose efficacy prematurely.In addition, because diamond particles poorly conductive, and the wetability between the copper matrix is relatively poor, when particularly on the boundary of diamond and matrix, forming carbide, interface bond strength is reduced, cause the rupture life strength of contact lower, cause that contact takes place to damage fast under heavy duty (AC4) condition after the cycling in several cycles.These all can make the reliability of device for switching reduce.The existence that a large amount of carbide elements form causes material plasticity to reduce, and itself and high base strength also are difficult to guarantee.The interpolation of alloy element Cd can improve the antioxygenic property of material and from arc extinction performance, but its hypertoxicity will make its application be restricted.Production and selling for the money base product that contains Cd has begun strict control in the world.
Summary of the invention: the present invention is intended to overcome the electrical contact material useful life of prior art and reliability is low and the defective of distributing noxious substance when using, and provides a kind of useful life and reliability high and appliance contact composite material free from environmental pollution.Material composition scheme of the present invention is as follows; By weight percentage, tellurium 1.0～3.0, titanium diboride 0.5～3.5, lanthanum diboride 0.5～4.0, vanadium 0.01～10.0, tin oxide 1.0～10.0, copper surplus, wherein titanium diboride and lanthanum diboride content sum are no more than 4.Contain titanium diboride, lanthanum diboride, tin oxide and vanadium in the material of the present invention, this can reduce the contact resistance of contact and the material transfer amount under the DC condition, and the rupture life strength of contact material is improved.The tellurium solid solution that contains in this material forms kuttern among the copper matrix, can obviously improve the non-oxidizability of matrix, makes the material contact resistance low and stable.And compare with copper cadmium alloy, tellurium is to matrix resistivity effects minimum.Oxidation kinetics analysis and resistivity measurement show that the combination property of kuttern is more excellent, can replace virose copper cadmium alloy.Compare with diamond, the titanium diboride and the lanthanum diboride that add have higher conductivity and intensity, under relatively low sintering temperature (as 900 ℃), and the interface bond strength between the matrix copper is fine, therefore the contact mechanical strength rises, especially the material rupture life strength under the cyclic loading effect raises, and has guaranteed the reliability of device for switching.In addition, the refractory metal elemental vanadium meeting solid solution of being added in the above-mentioned material is among the copper matrix, and the coefficient of dispersion in the copper matrix is bigger, and therefore under the shock loading condition, material can show higher plasticity.The interpolation of tin oxide mainly be reinforcing material from the arc extinguishing ability.When tin oxide decomposes, can be cracked into the high stannous oxide polymolecular chain of ionization energy under arcing, absorb a large amount of arc energies, thereby play the effect that promotes arc extinction at 1270K.It and tellurium acting in conjunction can substitute virose cadmium metal fully.
Utilize powder metallurgic method above-mentioned material can be prepared into contact members.Above-mentioned interpolation constituent element powder is mixed according to a certain ratio; Then mixed-powder is pressed into blank and carries out sintering; And then exert pressure, purpose is to improve density of material; The final employing annealed to eliminate stress and to optimize tissue.Utilize the prepared contact members performance index that go out of the present invention as follows: density: 8.3～8.8g/cm
3; Hardness: HB650～800MPa; Resistivity: 2.3～3.6 μ Ω cm;
The contact standard specimen of contact members of preparing as stated above and standard carries out the contrast experiment on the special test stand, electrical wear amount under the test interchange condition, the contact voltage drop U of contact surface when working lining occurring, detailed data is listed in (the contrast sample is represented with X) among the table 1.Experimental condition is: I=30A, and U=380V, cos =0.8, the ON/OFF cycle-index is 10000 times.Voltage is reduced to the mean value of 30 tests.The electrical wear amount is the mean value of contact to wear extent.
The electrical contact material performance tabulation of table 1 different component
| Sequence number | Add constituent element (percentage by weight) | Electrical wear amount gram/10 6Inferior | Contact voltage drop mV | ||||
| ????Te | ????SnO 2 | ????V | ????LaB 2 | ????TiB 2 | |||
| ????1 | ????2.1 | ????8.0 | Do not have | Do not have | Do not have | ????15.2 | ????650 |
| ????2 | ????1.9 | ????6.0 | ????3.0 | ????1.0 | ????1.2 | ????11.1 | ????540 |
| ????3 | ????1.4 | ????4.0 | ????4.0 | ????0.5 | ????1.5 | ????9.9 | ????520 |
| ????4 | ????1.4 | ????2.0 | ????2.0 | ????0.5 | ????2.0 | ????8.6 | ????490 |
| ????5 | ????0.4 | ????12.0 | Do not have | Do not have | Do not have | ????21.3 | ????680 |
| ????6 | ????1.8 | ????1.0 | ????1.0 | ????1.0 | ????1.5 | ????10.0 | ????470 |
| ????7 | ????0.8 | ????1.5 | Do not have | Do not have | Do not have | ????16.2 | ????760 |
| ????8 | ????2.6 | Do not have | ????0.01 | Do not have | Do not have | ????15.1 | ????1210 |
| ????9 | ????1.7 | ????0.5 | ????0.5 | ????0.5 | ????2.5 | ????11.7 | ????530 |
| ????10 | ????3.1 | Do not have | ????7.0 | Do not have | ????3.0 | ????10.8 | ????640 |
| ????11 | ????1.2 | ????2.0 | ????5.0 | Do not have | Do not have | ????14.8 | ????700 |
| ????12 | ????1.5 | ????1.0 | ????6.0 | ????4.5 | Do not have | ????27.5 | ????920 |
| ????13 | ????4.2 | Do not have | ????8.0 | Do not have | Do not have | ????20.9 | ????840 |
| ????14 | ????0.6 | Do not have | Do not have | Do not have | ????3.0 | ????16.0 | ????810 |
| ????15 | ????0.8 | ????2.0 | ????2.0 | ????2.0 | Do not have | ????13.4 | ????520 |
| ????16 | ????1.4 | ????1.0 | Do not have | Do not have | Do not have | ????14.2 | ????580 |
| ????17 | ????2.9 | ????1.0 | Do not have | ????1.0 | Do not have | ????14.1 | ????590 |
| ????18 | ????0.8 | Do not have | Do not have | Do not have | ????0.3 | ????20.6 | ????740 |
| ????19 | ????2.1 | Do not have | ????6.0 | ????0.2 | Do not have | ????15.0 | ????760 |
| ????20 | ????2.1 | ????1.0 | ????4.0 | ????1.0 | ????1.0 | ????13.3 | ????600 |
| ????21 | ????2.2 | ????2.0 | Do not have | ????2.0 | ????0.5 | ????10.3 | ????510 |
| ????22 | ????1.8 | ????3.0 | ????10.0 | ????4.0 | ????0.5 | ????22.7 | ????750 |
| ????23 | ????1.7 | ????5.0 | Do not have | ????0.5 | ????4.0 | ????22.8 | ????790 |
| ????24 | ????3.2 | Do not have | Do not have | ????0.5 | ????3.5 | ????18.2 | ????690 |
| ????X | ????1.1 | Do not have | Do not have | Do not have | Do not have | ????12.9 | ????720 |
Test shows, prescribes a time limit when the content that adds constituent element is lower than under the above-mentioned component content, and these constituent elements are to the not bigger contribution of military service performance of basis material; And when the content that adds constituent element is higher than above-mentioned component upper content limit, will cause the rapid deterioration of contact performance.Compare with contrast material in the table 1, the interpolation of constituent element can reduce the contact resistance of contact material, effectively improves the arc ablation resistance and the resistance fusion welding of material, strengthens the kuttern matrix, also can make the intensity of material keep lasting.
Embodiment one: it is formed by tellurium 1.0～3.0, titanium diboride 0.5～3.5, lanthanum diboride 0.5～4.0, vanadium 0.01～10.0, tin oxide 1.0～10.0 with as the copper of surplus, its composition proportion is a percentage by weight, and titanium diboride and lanthanum diboride content sum are no more than 4.
Embodiment two: it is formed by tellurium 1.0～2.0, titanium diboride 0.5～2, lanthanum diboride 0.5～2.5, vanadium 0.01～5.0, tin oxide 1.0～5.0 with as the copper of surplus, its composition proportion is a percentage by weight, and titanium diboride and lanthanum diboride content sum are no more than 4.
Embodiment three: it is formed by tellurium 2.1～3.0, titanium diboride 2.1～3.5, lanthanum diboride 2.6～4.0, vanadium 5.1～10.0, tin oxide 5.1～10.0 with as the copper of surplus, its composition proportion is a percentage by weight, and titanium diboride and lanthanum diboride content sum are no more than 4.
Embodiment four: it is formed by tellurium 1.4, titanium diboride 2.0, lanthanum diboride 0.5, vanadium 2.0, tin oxide 2.0 with as the copper of surplus, and its composition proportion is a percentage by weight.Present embodiment is a preferred forms, the contact members of utilizing present embodiment to prepare is as shown in table 2 with anti-ablation and the substance transfer amount experiment of contrast exemplar under DC condition, the percentage by weight of contrast exemplar composition is that copper is 98.9, tellurium is 1.1, experimental condition is: I=100A, U=400V, the ON/OFF cycle-index is 10000 times, and (+) expression quality increases, and (-) expression quality reduces.
The material of table 2 present embodiment and contrast material be performance comparison under DC condition
| Material | Closed wear extent gram/hundred ten thousand times | Disconnect wear extent gram/hundred ten thousand times | ||
| Moving contact-anode | Fixed contact-negative electrode | Moving contact-anode | Fixed contact-negative electrode | |
| Contrast material | ??+4.1 | ??-4.9 | ??-1.2 | ??-4.4 |
| The invention material | ??+0.2 | ??-0.3 | ??-0.5 | ??-1.6 |
By the table in as seen, the wear extent of contact material proposed by the invention is extremely low with respect to contrast material, thereby prove that of the present invention material has higher arc ablation resistance, working face contact voltage drop (being contact resistance) is lower, and the isoelectric substance transfer amount under the DC condition is extremely low.Result of the test shows, compares with the contrast sample, and contact material provided by the present invention can improve the reliability and the useful life of appliance switch.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03132543 CN1207740C (en) | 2003-07-30 | 2003-07-30 | Copper base electric contact compound material for contactor of electric appliances |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03132543 CN1207740C (en) | 2003-07-30 | 2003-07-30 | Copper base electric contact compound material for contactor of electric appliances |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1484263A true CN1484263A (en) | 2004-03-24 |
| CN1207740C CN1207740C (en) | 2005-06-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03132543 Expired - Fee Related CN1207740C (en) | 2003-07-30 | 2003-07-30 | Copper base electric contact compound material for contactor of electric appliances |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101609751A (en) * | 2009-07-27 | 2009-12-23 | 上海市机械制造工艺研究所有限公司 | Nano-doping stannic oxide powder and preparation method thereof |
| CN101892400A (en) * | 2010-06-30 | 2010-11-24 | 天津大学 | Copper-silver-titanium-tin oxide composite electrical contact material and preparation method thereof |
| CN102304658A (en) * | 2011-08-25 | 2012-01-04 | 哈尔滨东大高新材料股份有限公司 | Copper alloy contact material for alternating current contactor and preparation method thereof |
| CN112259278A (en) * | 2020-10-19 | 2021-01-22 | 西安工程大学 | A kind of preparation method of particle composite fiber reinforced copper tin oxide contact material |
| CN112735866A (en) * | 2020-12-21 | 2021-04-30 | 哈尔滨东大高新材料股份有限公司 | Cu-VB for low-voltage electrical apparatus2-La contact material and preparation method thereof |
-
2003
- 2003-07-30 CN CN 03132543 patent/CN1207740C/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101609751A (en) * | 2009-07-27 | 2009-12-23 | 上海市机械制造工艺研究所有限公司 | Nano-doping stannic oxide powder and preparation method thereof |
| CN101892400A (en) * | 2010-06-30 | 2010-11-24 | 天津大学 | Copper-silver-titanium-tin oxide composite electrical contact material and preparation method thereof |
| CN102304658A (en) * | 2011-08-25 | 2012-01-04 | 哈尔滨东大高新材料股份有限公司 | Copper alloy contact material for alternating current contactor and preparation method thereof |
| CN112259278A (en) * | 2020-10-19 | 2021-01-22 | 西安工程大学 | A kind of preparation method of particle composite fiber reinforced copper tin oxide contact material |
| CN112259278B (en) * | 2020-10-19 | 2022-05-03 | 西安工程大学 | A kind of preparation method of particle composite fiber reinforced copper tin oxide contact material |
| CN112735866A (en) * | 2020-12-21 | 2021-04-30 | 哈尔滨东大高新材料股份有限公司 | Cu-VB for low-voltage electrical apparatus2-La contact material and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN1207740C (en) | 2005-06-22 |
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