CN1455483A - Semiconductor laser and mfg. method thereof - Google Patents
Semiconductor laser and mfg. method thereof Download PDFInfo
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- CN1455483A CN1455483A CN03142312A CN03142312A CN1455483A CN 1455483 A CN1455483 A CN 1455483A CN 03142312 A CN03142312 A CN 03142312A CN 03142312 A CN03142312 A CN 03142312A CN 1455483 A CN1455483 A CN 1455483A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2301/00—Functional characteristics
- H01S2301/17—Semiconductor lasers comprising special layers
- H01S2301/173—The laser chip comprising special buffer layers, e.g. dislocation prevention or reduction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2054—Methods of obtaining the confinement
- H01S5/2081—Methods of obtaining the confinement using special etching techniques
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
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- Semiconductor Lasers (AREA)
Abstract
The invention discloses a manufacturing method of a semiconductor laser device. An AlGaAs-based semiconductor laser 29 is formed on an n-type GaAs substrate 21 and thereafter etching is carried out until reaching an n-type AlGaAs clad layer 23 from the surface. Next, the n-type AlGaAs clad layer 23 is removed by etching with an etchant having selectivity to GaAs. Subsequently, the surface of an n-type GaAs buffer layer 22 is lightly etched. Thus, the n-type GaAs buffer layer 22 of the AlGaAs-based semiconductor laser 29 is left in a slightly abraded state on the n-type GaAs substrate 21, maintaining the flatness of the groundwork layer during growing an AlGaInP-based semiconductor laser 38 at the second time. Therefore, the flatness of the crystals of, in particular, an active layer grown at the second time can be improved, and the poor characteristics of the AlGaInP-based semiconductor laser 38 attributed to the poor flatness of the groundwork can be improved.
Description
Technical field
The present invention relates to a kind of manufacture method that can on a Semiconductor substrate, form the semiconductor laser of a plurality of semiconductor lasers.
Background technology
In recent years, CD is extensively promoted, and existing many different records.When reading the CD of different size optically, need the laser of different size.For example, in order to read the CD of two types of CD (compact disk) and DVD (Digital video disc), need emission wavelength at infrared laser about 780nm and 780nm and emission wavelength the red laser about 650nm and 650nm.
In these cases, need a kind of semiconductor laser that can in an encapsulation, launch two kinds of wavelength laser bundles, to reduce the pick-up size and to reduce the pick-up cost.
And, except that CD, need a kind of semiconductor laser, can in an encapsulation, launch the laser beam of two wavelength, even or issue at identical wavelength and to penetrate that low output is used and two kinds of laser of high output application, be used for laser printer and CD-RW.And, can consider the double light beam laser device of identical wavelength and identical output.
In order to satisfy above-mentioned requirements, developed two semiconductor lasers have been integrated into a technology on the Semiconductor substrate.But, when on single Semiconductor substrate, forming the laser of two kinds of different qualities, realize that by a crystal growth this device usually is impossible.Therefore, use the method for on single Semiconductor substrate, carrying out repeatedly crystal growth.Just, laser structure of crystal growth formerly on Semiconductor substrate, stacked thereon growth forms another laser structure, and removes laser structure continue back formation from the laser structure of growth formerly.When another laser structure in the above-mentioned situation is stacked when growing on the laser structure of crystal growth formerly, the laser structure that crystal growth for the first time obtains partly is etched with the exposure Semiconductor substrate, carries out the crystal growth second time again on substrate.
Fig. 8 A and 8B show the profile of device when two semiconductor lasers of growth AlGaAs base semiconductor laser and AlGaInP base semiconductor laser on GaAs substrate 1.At first, shown in Fig. 8 A, the AlGaAs base semiconductor laser 9 that growth is made of n type GaAs resilient coating 2, n type AlGaAs cover layer 3, AlGaAs guide layer 4, multiple quantum well active layer 5, p type AlGaAs guide layer 6, p type AlGaAs cover layer 7 and p type GaAs contact layer (mixing with Zn) 8 on n type GaAs substrate 1.Then, by etching part remove AlGaAs base semiconductor laser 9, up to exposing GaAs substrate 1.
Subsequently, shown in Fig. 8 B, the AlGaInP base semiconductor laser 18 that growth is made of n type GaAs resilient coating 11, n type AlGaInP cover layer 12, AlGaInP guide layer 13, multiple quantum well active layer 14, AlGaInP guide layer 15, p type AlGaInP cover layer 16 and p type GaAs contact layer 17 on whole surface.
As mentioned above, partly the AlGaAs base semiconductor laser 9 that obtained by first time crystal growth of etching to be exposing GaAs substrate 1, and carries out the crystal growth second time subsequently.Why be like this because two growth interfaces of growth interface and the growth interface second time are included in the laser structure that forms by the crystal growth second time, unless Semiconductor substrate is removed unfriendly for the first time.
But the above conventional semiconductor laser manufacture method of carrying out repeatedly crystal growth on single Semiconductor substrate has following problem.Promptly as mentioned above, by the AlGaAs base semiconductor laser 9 that the crystal growth first time obtains, expose GaAs substrate 1 by etching partly.In above-mentioned situation, by using sulfuric acid system or hydrochloric acid system or NH simultaneously
3Be that etchant and HF are that etchant removes GaAs substrate 1.Then, on the exposed surface of GaAs substrate 1, carry out the crystal growth second time.
But, if as described above Semiconductor substrate is carried out etching, just have the problem of deterioration etched surfaces evenness, and the crystal that will when second time crystal growth, grow of bad evenness influence, on the characteristic surface of the semiconductor laser of being grown, have a negative impact.Especially when the multiple quantum well layer that wherein is laminated with extremely thin thin layer was used as the active layer of semiconductor laser, the thickness of control film can be extremely important.Therefore, the bad evenness of basal layer has produced tremendous influence to the deterioration in characteristics of multiple quantum well layer.
Summary of the invention
Therefore, the purpose of this invention is to provide a kind of manufacture method of semiconductor laser and the semiconductor laser of being made by this method, this semiconductor laser has a plurality of semiconductor lasers that can improve the characteristic of the semiconductor laser of growing in the second time by the smooth basis that is used for crystal growth for the second time.
To achieve these goals, provide a kind of semiconductor laser that on a Semiconductor substrate, is arranged in parallel a plurality of semiconductor laser layers, wherein:
In two semiconductor laser layers located adjacent one another one has the resilient coating that the resilient coating with another semiconductor laser layer forms simultaneously in its orlop.Therefore, semiconductor laser layer will be formed on the resilient coating that the resilient coating with second half conductor laser layer forms simultaneously.
Promptly need not to remove fully certain part of the resilient coating that is arranged in the semiconductor laser layer that formerly forms continue the semiconductor laser layer region of back formation by etching, and the semiconductor laser layer continue after growing period kept the evenness of basal layer.Thus, the situation that exposes Semiconductor substrate with the resilient coating of the semiconductor laser layer that formerly forms by etching is compared, and has improved the evenness of basal layer, and improved continue after the evenness of semiconductor laser layer (especially active layer) crystal that forms.
A kind of semiconductor laser that is arranged in parallel a plurality of semiconductor laser layers on a Semiconductor substrate also is provided, wherein:
Each is provided with the resilient coating of sharing with other contiguous semiconductor laser layer the semiconductor laser layer.Therefore, each semiconductor laser layer located adjacent one another can be formed on the resilient coating of sharing with other semiconductor laser layer.
In this case, need not fully to remove certain part that is arranged in a semiconductor laser floor of the resilient coating district of sharing with other semiconductor laser floor by etching, and in the evenness continue back growing period maintenance basal layer of semiconductor laser layer.Thus, compare with the situation that exposes Semiconductor substrate, improved the evenness of basal layer, and improved the evenness of semiconductor laser layer (especially active layer) crystal with the resilient coating of removing other semiconductor laser layer by etching.
A kind of semiconductor laser fabrication method that is used to form the semiconductor laser with a plurality of luminous zones also is provided, and the method comprising the steps of:
Form the first semiconductor laser layer by the crystal growth first time on Semiconductor substrate, this first semiconductor laser layer comprises resilient coating that is positioned at upper/lower positions and the contact layer that is positioned at uppermost position in fig-ure;
Remove the zone except becoming the first semiconductor laser layer luminous zone, keep the back of the body face side of remaining resilient coating;
Form the second semiconductor laser layer by the crystal growth second time; And
By removing the zone except becoming the second semiconductor laser layer luminous zone, expose the contact layer of the first semiconductor laser layer.Therefore, by remove this zone by etching, during forming the second semiconductor laser layer, kept basic evenness by the crystal growth second time.Thus, the situation that exposes Semiconductor substrate with the resilient coating of the first semiconductor laser layer that forms for the first time by etching is compared, improved the evenness of basal layer, and improved continue after the evenness of the second semiconductor laser layer (especially active layer) crystal that forms.
A kind of semiconductor laser fabrication method that is used to form the semiconductor laser with a plurality of luminous zones also is provided, and the method comprising the steps of:
Form the first semiconductor laser layer by the crystal growth first time on Semiconductor substrate, this first semiconductor laser layer comprises resilient coating that is positioned at upper/lower positions and the contact layer that is positioned at uppermost position in fig-ure;
Remove the zone except becoming the first semiconductor laser layer luminous zone, keep remaining resilient coating;
Form the second semiconductor laser layer by the crystal growth second time; And
By removing the zone except becoming the second semiconductor laser layer luminous zone, expose the contact layer of the first semiconductor laser layer.Therefore, the evenness that during forming the second semiconductor laser layer, keeps basal layer by the crystal growth second time.Thus, the situation that exposes Semiconductor substrate with the resilient coating of the first semiconductor laser layer that forms for the first time by etching is compared, improved the evenness of basal layer, and improved continue after the evenness of the second semiconductor laser layer (especially active layer) crystal that forms.
And, when the resilient coating of the first and second semiconductor laser layers is of identical composition, can be omitted in the new resilient coating that is formed for the second semiconductor laser layer on the first semiconductor laser layer that fully keeps.
And, when the p type AlGaInP of the p type AlGaAs cover layer of partly removing the first semiconductor laser layer by etchant or second semiconductor laser layer cover layer, in order to strengthen the etching control ability, etchant is set in cover layer can not etched etching stopping layer.For example, be respectively applied for p type AlGaAs and AlGaInP cover layer GaAs and GaInP layer as etching stopping layer.
In one embodiment of the invention, at least repeatedly remove the first semiconductor laser layer the subregion, keep the step of resilient coating and form the step of the second semiconductor laser layer.Therefore, by be considered as the first semiconductor laser layer by the second semiconductor laser layer that the second time, crystal growth formed by the first time, crystal growth formed, this first semiconductor laser layer (original is the second semiconductor laser layer) of removing part keeps resilient coating and form the second semiconductor laser layer (original is the 3rd semiconductor laser layer) on the resilient coating that keeps, and can form the 3rd semiconductor laser with high workload performance and high reliability on semi-conductive substrate.
Description of drawings
By the following detailed description that provides with for the accompanying drawing that provides and the present invention is not construed as limiting is described, the present invention will be more understandable, wherein:
Figure 1A to 1C is the profile of a kind of semiconductor laser of forming according to the manufacture method of semiconductor laser of the present invention in manufacture process;
Fig. 2 D to 2F is the profile from the manufacture process that Fig. 1 C continues;
Fig. 3 is the profile of demonstration according to another example of semiconductor laser of the manufacture method formation of the semiconductor laser shown in Figure 1A to 1C and 2D to 2F;
Fig. 4 A to 4C is the profile that shows the modification of the semiconductor laser fabrication method shown in Figure 1A to 1C;
Fig. 5 A to 5C is the profile of a kind of semiconductor laser of forming according to the semiconductor laser fabrication method that is different from Figure 1A to 1C and 2D to 2F in manufacture process;
Fig. 6 D to 6F is the profile from the manufacture process that Fig. 5 C continues;
Fig. 7 is the profile of demonstration according to another example of semiconductor laser of the manufacture method formation of the semiconductor laser shown in Fig. 5 A to 5C and 6D to 6F; And
Fig. 8 A to 8B is the profile of two semiconductor lasers of growing on substrate according to prior art.
Embodiment
Below, will describe the present invention in detail according to embodiment as shown in drawings.As mentioned above, on the GaAs substrate, form AlGaAs base semiconductor laser and to examine the result of etching state who removes its subregion by etching be to have found the following fact.
Promptly when with the AlGaAs cover layer that can select etched etchant etching on the GaAs resilient coating, do not have etching GaAs resilient coating, therefore, etched surfaces is smooth at all.And, if for example by being or NH with sulfuric acid
3Be that etchant carries out etching and removes this GaAs resilient coating to expose GaAs substrate, surface smoothness variation so.Therefore in above-mentioned situation,, have optionally etchant so can not use, and evenness is in case just can not be recovered by deterioration because only exist in below the GaAs resilient coating along the GaAs layer in the downward direction (to substrate).
Therefore, under the state that keeps fully of resilient coating of the semiconductor laser first time or grind off slightly under the state of resilient coating, the crystal growth of carrying out forming for the second time of semiconductor laser on Semiconductor substrate is effective.
(first embodiment)
In the present embodiment, be in the state that grinds off slightly at the resilient coating of the semiconductor laser that forms for the first time, and on this layer, carry out the crystal growth that semiconductor laser forms for the second time.
Figure 1A to 1C and 2D to 2F show the profile of semiconductor laser in manufacture process, form this device according to the manufacture method of the semiconductor laser of this embodiment.At first, shown in Figure 1A, on n type GaAs substrate 21, form n type GaAs resilient coating 22, n type AlGaAs cover layer 23, AlGaAs guide layer 24, multiple quantum well active layer 25, p type AlGaAs guide layer 26, p type AlGaAs cover layer 27 and p type GaAs contact layer (doping of Zn) 28 successively by MOCVD (metal organic-matter chemical vapour deposition), form AlGaAs base semiconductor laser 29, as an example of the first semiconductor laser layer.
And, the not Doped GaAs protective layer 30 of formation thickness 0.2 μ m on the p of AlGaAs base semiconductor laser 29 type GaAs contact layer 28.Thus, carried out crystal growth for the first time.
Then, shown in Figure 1B, remove the subregion of AlGaAs base semiconductor laser 29 and keep n type GaAs resilient coating 22 by etching.Particularly, be that etchant carries out etching up to arriving n type AlGaAs cover layer 23 at first with sulfuric acid.Then, be that etchant is removed remaining n type AlGaAs cover layer 23 by etching with HF system or hydrochloric acid.Because can not etching GaAs, therefore stop etching on the surface of n type GaAs resilient coating 22 with above-mentioned etchant.Continue with, with sulfuric acid system or NH
3Be etchant slightly etching the surface of n type GaAs resilient coating 22.
In this case, on the p type GaAs contact layer 28 of residual A lGaAs base semiconductor laser 29 on the n type GaAs substrate 21, form not Doped GaAs protective layer 30.Therefore, when n type GaAs substrate being put into the growth furnace of the second time growth that is used for semiconductor laser, prevented the impurity Zn that causes by high temperature in the stove evaporation, thereby prevented reducing of contact layer surface carrier concentration from p type GaAs contact layer 28.
Then, shown in Fig. 1 C, on whole surface, form n type GaAs resilient coating 31, n type AlGaInP cover layer 32, AlGaInP guide layer 33, multiple quantum well active layer 34, AlGaInP guide layer 35, p type AlGaInP cover layer 36 and p type GaAs contact layer 37 successively by MOCVD, form AlGaInP base semiconductor laser 38, as an example of the second semiconductor laser layer.Thus, carry out the crystal growth second time.In Fig. 1 C, illustrated that these layers can vertically extend with right-angle bending and on the AlGaInP base semiconductor laser 38 and the border between the AlGaInP base semiconductor laser 38 of growth on the AlGaAs base semiconductor laser 29 of growth on the GaAs substrate 21.Yet in fact these layers form shaped form.
Then, shown in Fig. 2 D, by etching remove belong to continue after the AlGaInP base semiconductor laser 38 that forms and be superimposed upon the zone that forms on the AlGaAs base semiconductor laser 29 that formerly forms and Doped GaAs protective layer 30 not.
Particularly, be that etchant carries out etching up to the n type AlGaInP cover layer 32 that arrives AlGaInP base semiconductor laser 38 at first with sulfuric acid.Then, be that etchant is etched to n type GaAs resilient coating 31 with remaining n type AlGaInP cover layer 32 with hydrochloric acid system or phosphoric acid.In this case, have optionally etchant, therefore on n type GaAs resilient coating 31, stop etching because use.Subsequently, be etchant or NH with sulfuric acid
3Be etchant by etching remove n type GaAs resilient coating 31 and not Doped GaAs protective layer 30 to expose the p type GaAs contact layer 28 of AlGaAs base semiconductor laser 29.
And then, shown in Fig. 2 E, remove AlGaAs base semiconductor laser 29 on n type GaAs substrate 21 and the borderline region between the AlGaInP base semiconductor laser 38, up to exposing n type GaAs substrate, form semiconductor laser, wherein on n type GaAs substrate 21, be arranged in parallel AlGaAs base semiconductor laser 29 and AlGaInP base semiconductor laser 38.In this case, the n type GaAs resilient coating 22 of the boundary of allow retention between AlGaAs base semiconductor laser 29 and AlGaInP base semiconductor laser 38.
Then, shown in Fig. 2 F, remove the p type GaAs contact layer 28 and the p type AlGaAs cover layer 27 of AlGaAs base semiconductor laser 29 respectively by etching fully and partly, keep the core of preset width on perpendicular to the paper direction of figure, form banded ridge part at core.Meanwhile, remove the p type GaAs contact layer 37 and the p type AlGaInP cover layer 36 of AlGaInP base semiconductor laser 38 respectively by etching fully and partly, form banded ridge part at core.Then, forming p type AuZn/Au/Mo/ Au electrode 39 and 40 on the ridge part of AlGaAs base semiconductor laser 29 and on the ridge part of AlGaInP base semiconductor laser 38.And then, on the surface of n type GaAs substrate 21, form n type AuGe/Ni/Mo/Au electrode 41.Thus, form semiconductor laser with two luminous components.
As mentioned above, when the border between AlGaAs base semiconductor laser 29 and AlGaInP base semiconductor laser 38 keeps n type GaAs resilient coating 22, formed semiconductor laser as shown in Figure 3.
As mentioned above, in the present embodiment, on n type GaAs substrate 21, form AlGaAs base semiconductor laser 29, thereafter, carry out etching from the surface up to arriving n type AlGaAs cover layer 23.Then, use the etchant that GaAs is had system of HF optionally or a hydrochloric acid system to remove n type AlGaAs cover layer 23 by etching.Subsequently, with sulfuric acid system or NH
3It is the etchant surface of etching n type GaAs resilient coating 22 slightly.
Therefore, be in the state that resilient coating 22 is ground off slightly by the n type GaAs resilient coating 22 that makes the AlGaAs base semiconductor laser 29 that on n type GaAs substrate 21, forms, during the AlGaInP base semiconductor laser 38 of growing for the second time, can keep the evenness of basal layer by the first time.Thus, compare, improved the evenness of basal layer, especially when growing for the second time, improved the evenness of active layer crystal with the situation of removing n type GaAs resilient coating 22 exposure n type GaAs substrates 21 by etching.
Promptly, can improve bad evenness, cause the undesirable feature of the AlGaInP base semiconductor laser 38 of growth for the second time and formation owing to basal layer according to this embodiment.
The modification of present embodiment shown in Fig. 4 A to 4C; allow on n type GaAs substrate 21 to form AlGaAs base semiconductor laser 29, and subsequently at the p of the superiors of AlGaAs base semiconductor laser 29 type GaAs contact layer 28 with belong to the AlGaAs base doped with Al GaAs etching stopping layer 42 not that different component is set between the not Doped GaAs protective layer 30 of GaAs system together.
Use this arrangement; by using the GaAs layer had optionally HF system or hydrochloric acid is etchant; when similar to Fig. 2 D by continue after etching when removing not Doped GaAs protective layer 30 and removing unadulterated AlGaAs etching stopping layer 42 subsequently, when exposing p type GaAs contact layer 28, stop etching.That is, the thickness of p type GaAs contact layer 28 has been controlled in strictness, and has obtained predetermined contact performance.
(second embodiment)
Present embodiment is retained in the resilient coating of the semiconductor laser that forms for the first time fully, and forms the crystal growth second time of semiconductor laser on this layer.
Fig. 5 A to 5C and 6D to 6F show in the manufacturing step of device the profile of the semiconductor laser that the manufacture method according to the semiconductor laser of present embodiment forms.At first, shown in Fig. 5 A, on n type GaAs substrate 51, form n type GaAs resilient coating 52, n type AlGaAs cover layer 53, AlGaAs guide layer 54, multiple quantum well active layer 55, p type AlGaAs guide layer 56, p type AlGaAs cover layer 57 and p type GaAs contact layer (doping of Zn) 58 successively by MOCVD, form AlGaAs base semiconductor laser 59.
And, the not doped with Al GaAs etching stopping layer 60 of growth thickness 0.1 μ m and the not Doped GaAs protective layer 61 of thickness 0.2 μ m on the p of AlGaAs base semiconductor laser 59 type GaAs contact layer 58.Thus, carried out crystal growth for the first time.
Then, shown in Fig. 5 B, the subregion of removing AlGaAs base semiconductor laser 59 by etching is up to n type AlGaAs cover layer 53, to expose n type GaAs resilient coating 52.Particularly, be that etchant at first carries out etching up to reaching n type AlGaAs cover layer 53 with sulfuric acid.Then, be that etchant is removed remaining n type AlGaAs cover layer 53 by etching with HF system or hydrochloric acid.Because can not etching GaAs, stop etching on the surface of n type GaAs resilient coating 52 with above-mentioned etchant.Thus, expose n type GaAs resilient coating 52.
Then, shown in Fig. 5 C, by MBE (molecular beam epitaxy) growing n-type GaAs resilient coating 62, n type AlGaInP cover layer 63, AlGaInP guide layer 64, multiple quantum well active layer 65, AlGaInP guide layer 66, p type AlGaInP cover layer 67 and p type GaAs contact layer 68 successively on whole surface, form AlGaInP base semiconductor laser 69.Thus, carry out the crystal growth second time.
Then, shown in Fig. 6 D, remove zone, unadulterated AlGaAs etching stopping layer 60 and the unadulterated GaAs protective layer 61 that belongs to AlGaInP base semiconductor laser 69 and be superimposed upon formation on the AlGaAs base semiconductor laser 59 that formerly forms by etching.
Particularly, be that etchant at first carries out etching up to the n type AlGaInP cover layer 63 that reaches AlGaInP base semiconductor laser 69 with sulfuric acid.Then, be that the remaining n type of etchant etching AlGaInP cover layer 63 is to n type GaAs resilient coating 62 with hydrochloric acid system or phosphoric acid.In this case, have optionally etchant, therefore on n type GaAs resilient coating 62, stop etching because use.Subsequently, with sulfuric acid system or NH
3Being etchant removes n type GaAs resilient coating 62 and Doped GaAs protective layer 61 not by etching.In this case, because use sulfuric acid system and NH
3Therefore be etchant, when exposing not doped with Al GaAs etching stopping layer 60, stop etching.Subsequently, be that etchant is removed not doped with Al GaAs etching stopping layer 60 with HF system or hydrochloric acid.Thus, expose the p type GaAs contact layer 58 of AlGaAs base semiconductor laser 59.
And then, shown in Fig. 6 E, remove AlGaAs base semiconductor laser 59 on n type GaAs substrate 51 and the boundary member between the AlGaInP base semiconductor laser 69, up to exposing n type GaAs substrate 51, form semiconductor laser, wherein on n type GaAs substrate 51, be arranged in parallel AlGaAs base semiconductor laser 59 and AlGaInP base semiconductor laser 69.In this case, the n type GaAs resilient coating 52 of the certain boundary of allow retention between AlGaAs base semiconductor laser 59 and AlGaInP base semiconductor laser 69.
Then, shown in Fig. 6 F, remove the p type GaAs contact layer 58 and the p type AlGaAs cover layer 57 of AlGaAs base semiconductor laser 59 respectively by etching fully and partly, form ridge part.Meanwhile, remove the p type GaAs contact layer 68 and the p type AlGaInP cover layer 67 of AlGaInP base semiconductor laser 69 respectively by etching fully and partly, form ridge part.Then, forming p type AuZn/Au/Mo/ Au electrode 70 and 71 on the ridge part of AlGaAs base semiconductor laser 59 and on the ridge part of AlGaInP base semiconductor laser 69.In addition, on the surface of n type GaAs substrate 51, form n type AuGe/Ni/Mo/Au electrode 72.Thus, form semiconductor laser with two luminous components.
When the boundary between aforesaid AlGaAs base semiconductor laser 59 and AlGaInP base semiconductor laser 69 keeps n type GaAs resilient coating 52, formed semiconductor laser as shown in Figure 7.
As mentioned above, in the present embodiment, on n type GaAs substrate 51, form AlGaAs base semiconductor laser 59, thereafter, carry out etching from the surface up to reaching n type AlGaAs cover layer 53.Then, use the etchant that GaAs is had system of HF optionally or a hydrochloric acid system to remove n type AlGaAs cover layer 53 by etching.
Therefore, kept the n type GaAs resilient coating 52 of the AlGaAs base semiconductor laser 59 that is formed by the first time fully on n type GaAs substrate 51, it helps keeping the evenness of basal layer during the AlGaInP base semiconductor laser 69 of growing for the second time.Thus, compare, improved the evenness of basal layer, especially improved when growing for the second time the evenness of active layer crystal with the situation of removing n type GaAs resilient coating 52 exposure n type GaAs substrates 51 by etching.
Promptly, can improve bad evenness, cause the undesirable feature of the AlGaInP base semiconductor laser 69 of growth for the second time and formation owing to basal layer according to this embodiment.
And; the AlGaAs base that different component is set between p type GaAs contact layer 58 that belongs to GaAs system together and unadulterated GaAs protective layer 61 etching stopping layer 60 that do not mix, wherein p type GaAs contact layer 58 is the superiors at growth for the first time and the AlGaAs base semiconductor laser 59 that forms.Therefore, when the GaAs layer is had optionally HF system or hydrochloric acid is etchant when removing not doped with Al GaAs etching stopping layer 60 by using, when exposing p type GaAs contact layer 58, stopped etching.That is, the thickness of p type GaAs contact layer 58 has been controlled in strictness, and has obtained predetermined contact performance.
In a second embodiment, the n type GaAs resilient coating 52 of AlGaAs base semiconductor laser 59 has identical crystal composition with the n type GaAs resilient coating 62 of the AlGaInP base semiconductor laser 69 that forms on this layer.Therefore, in above-mentioned situation, be used for the growth of the n type GaAs resilient coating 62 of the second semiconductor laser layer, and simplified crystal growth for the second time by omission.
And, in a second embodiment, on the p of AlGaAs base semiconductor laser 59 type GaAs contact layer 58, grown not doped with Al GaAs etching stopping layer 60 and not Doped GaAs protective layer 61.But, similar to first embodiment, allow and omit the not formation of doped with Al GaAs etching stopping layer 60.
And, with the situation that forms two semiconductor laser layers on semi-conductive substrate above-mentioned each embodiment has been described as an example.But, on semi-conductive substrate, also may form three or more semiconductor laser layer by the described step of repeated combination related embodiment.For example, in AlGaInP base semiconductor laser 69 processes in removing Fig. 6 D on the AlGaAs base semiconductor laser 59, remove the subregion of AlGaInP base semiconductor laser 69 on n type GaAs substrate 51, keep n type GaAs resilient coating 52 or n type GaAs resilient coating 62.Subsequently, if, can on same n type GaAs substrate 51, form three semiconductor laser layers so the process that is considered as carrying out Fig. 5 C to 6F at the AlGaInP base semiconductor laser layer 69 that forms for the second time at the semiconductor laser layer that forms for the first time.
And, the invention is not restricted to the foregoing description, allow the multiple each other combination of various growing methods, crystal composition and conduction type certainly.
So described the present invention, it is tangible that the present invention can change in many ways.Think that these variations do not break away from the spirit and scope of the present invention, and be that significantly these modifications comprise within the scope of the appended claims for a person skilled in the art.
Claims (8)
1. a semiconductor laser wherein is arranged in parallel a plurality of semiconductor laser layers on a Semiconductor substrate, wherein:
In two semiconductor laser layers located adjacent one another one has the resilient coating that the resilient coating with other semiconductor laser layers forms simultaneously in its orlop.
2. a semiconductor laser wherein is arranged in parallel a plurality of semiconductor laser layers on a Semiconductor substrate, wherein:
Each is provided with the resilient coating of sharing with other contiguous semiconductor laser layer the semiconductor laser layer.
3. semiconductor laser as claimed in claim 1, wherein
The resilient coating that forms simultaneously with the resilient coating of other semiconductor laser layer is the GaAs resilient coating.
4. semiconductor laser as claimed in claim 2, wherein
The resilient coating of sharing with other contiguous semiconductor laser layer is the GaAs resilient coating.
5. semiconductor laser manufacture method that is used to form semiconductor laser with a plurality of luminous zones, the method comprising the steps of:
Form the first semiconductor laser layer by the crystal growth first time on Semiconductor substrate, this first semiconductor laser layer comprises resilient coating that is positioned at upper/lower positions and the contact layer that is positioned at uppermost position in fig-ure;
Remove the zone except becoming the first semiconductor laser layer luminous zone, keep the back of the body face side of above-mentioned resilient coating;
Form the second semiconductor laser layer by the crystal growth second time; And
By removing the zone except becoming the second semiconductor laser layer luminous zone, expose the contact layer of the first semiconductor laser layer.
6. semiconductor laser manufacture method that is used to form semiconductor laser with a plurality of luminous zones, the method comprising the steps of:
Form the first semiconductor laser layer by the crystal growth first time on Semiconductor substrate, this first semiconductor laser layer comprises resilient coating that is positioned at upper/lower positions and the contact layer that is positioned at uppermost position in fig-ure;
Remove the zone except becoming the first semiconductor laser layer luminous zone, keep all above-mentioned resilient coatings;
Form the second semiconductor laser layer by the crystal growth second time; And
By removing the zone except becoming the second semiconductor laser layer luminous zone, expose the contact layer of the first semiconductor laser layer.
7. semiconductor laser manufacture method as claimed in claim 5, wherein:
At least the subregion that repeats to remove the first semiconductor laser layer keeps the step of resilient coating and forms the step of the second semiconductor laser layer.
8. the manufacture method of semiconductor laser as claimed in claim 6, wherein:
At least the subregion that repeats to remove the first semiconductor laser layer keeps the step of resilient coating and forms the step of the second semiconductor laser layer.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP112155/02 | 2002-04-15 | ||
| JP2002112155A JP4253461B2 (en) | 2002-04-15 | 2002-04-15 | Semiconductor laser device and manufacturing method thereof |
| JP112155/2002 | 2002-04-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1455483A true CN1455483A (en) | 2003-11-12 |
| CN1302588C CN1302588C (en) | 2007-02-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031423124A Expired - Lifetime CN1302588C (en) | 2002-04-15 | 2003-04-15 | Semiconductor laser and mfg. method thereof |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7034341B2 (en) |
| JP (1) | JP4253461B2 (en) |
| CN (1) | CN1302588C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100379106C (en) * | 2004-06-02 | 2008-04-02 | 夏普株式会社 | Semiconductor laser device |
| CN104363159A (en) * | 2014-07-02 | 2015-02-18 | 北京邮电大学 | Virtual open network building system and method based on software definition network |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI239702B (en) * | 2004-04-30 | 2005-09-11 | United Epitaxy Co Ltd | Dual wavelength semiconductor laser emitting apparatus and manufacturing method thereof |
| JP7323783B2 (en) | 2019-07-19 | 2023-08-09 | 日亜化学工業株式会社 | Light-emitting device manufacturing method and light-emitting device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01204487A (en) | 1988-02-10 | 1989-08-17 | Nec Corp | Semiconductor laser |
| JPH039589A (en) | 1989-06-07 | 1991-01-17 | Matsushita Electric Ind Co Ltd | Multi-beam semiconductor laser device |
| JPH03127889A (en) | 1989-10-13 | 1991-05-30 | Canon Inc | Semiconductor laser with modulator |
| JP3149961B2 (en) * | 1991-01-30 | 2001-03-26 | キヤノン株式会社 | Multi-wavelength semiconductor laser device and driving method thereof |
| JPH0629618A (en) | 1992-07-10 | 1994-02-04 | Sumitomo Electric Ind Ltd | Multibeam semiconductor laser and manufacturing method thereof |
| JP3344096B2 (en) * | 1994-07-21 | 2002-11-11 | 松下電器産業株式会社 | Semiconductor laser and manufacturing method thereof |
| JPH0936487A (en) | 1995-07-21 | 1997-02-07 | Fujitsu Ltd | Fabrication of semiconductor device |
| JP3493276B2 (en) | 1997-02-21 | 2004-02-03 | シャープ株式会社 | Semiconductor laser device and method of manufacturing the same |
| JP2000068604A (en) * | 1998-08-26 | 2000-03-03 | Furukawa Electric Co Ltd:The | Vertical resonator type surface emitting laser element |
| JP2000101200A (en) | 1998-09-25 | 2000-04-07 | Sony Corp | Semiconductor laser and multi semiconductor laser |
| JP3818815B2 (en) | 1999-02-08 | 2006-09-06 | シャープ株式会社 | Semiconductor laser device and manufacturing method thereof |
| JP2001077457A (en) * | 1999-09-08 | 2001-03-23 | Sony Corp | Semiconductor laser and manufacture thereof |
| JP2001244570A (en) * | 2000-02-29 | 2001-09-07 | Sony Corp | Semiconductor laser, laser coupler data regenerating device, data recording device and method of manufacturing semiconductor laser |
| US6546035B2 (en) * | 2000-02-29 | 2003-04-08 | Matsushita Electric Industrial Co., Ltd. | Semiconductor laser diode array and method of fabricating the same |
| CN1124653C (en) * | 2000-06-29 | 2003-10-15 | 中国科学院半导体研究所 | Integrated device of laser and photoelectric switch |
-
2002
- 2002-04-15 JP JP2002112155A patent/JP4253461B2/en not_active Expired - Lifetime
-
2003
- 2003-04-14 US US10/412,280 patent/US7034341B2/en not_active Expired - Lifetime
- 2003-04-15 CN CNB031423124A patent/CN1302588C/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100379106C (en) * | 2004-06-02 | 2008-04-02 | 夏普株式会社 | Semiconductor laser device |
| CN104363159A (en) * | 2014-07-02 | 2015-02-18 | 北京邮电大学 | Virtual open network building system and method based on software definition network |
| CN104363159B (en) * | 2014-07-02 | 2018-04-06 | 北京邮电大学 | A kind of opening virtual network constructing system and method based on software defined network |
Also Published As
| Publication number | Publication date |
|---|---|
| US7034341B2 (en) | 2006-04-25 |
| US20030197204A1 (en) | 2003-10-23 |
| JP4253461B2 (en) | 2009-04-15 |
| CN1302588C (en) | 2007-02-28 |
| JP2003309328A (en) | 2003-10-31 |
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| TR01 | Transfer of patent right |
Effective date of registration: 20220406 Address after: Asahi 1, Damen Machi, Fukuyama, Hiroshima, Japan Patentee after: Sharp Fukuyama laser Co.,Ltd. Address before: Osaka, Japan Patentee before: Sharp Corp. |
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| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20070228 |