CN113990778B - Substrate post-processing device - Google Patents
Substrate post-processing device Download PDFInfo
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- CN113990778B CN113990778B CN202111231889.0A CN202111231889A CN113990778B CN 113990778 B CN113990778 B CN 113990778B CN 202111231889 A CN202111231889 A CN 202111231889A CN 113990778 B CN113990778 B CN 113990778B
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- 239000000758 substrate Substances 0.000 title claims abstract description 79
- 238000012805 post-processing Methods 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 claims description 12
- 239000011241 protective layer Substances 0.000 claims description 8
- -1 polytetrafluoroethylene Polymers 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000009434 installation Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 235000012431 wafers Nutrition 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000000356 contaminant Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 210000003734 kidney Anatomy 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a substrate post-processing device, which comprises a tank body provided with a substrate post-processing module, wherein a bottom plate of the tank body is fixed on a base through an adjusting component; the adjusting assembly comprises a first connecting plate, and the bottom plate is arranged on the upper side of the base through the first connecting plate; the end part of the first connecting plate is provided with a vertically through threaded hole, and an adjusting nut is arranged in the threaded hole; the adjusting nut can be abutted against the base to enable the first connecting plate to be separated from the base, so that the gasket is placed in a gap between the first connecting plate and the base to adjust the levelness of the groove body.
Description
Technical Field
The invention belongs to the technical field of substrate manufacturing, and particularly relates to a substrate post-processing device.
Background
The integrated circuit industry is the core of the information technology industry and plays a key role in the process of converting and upgrading the boosting manufacturing industry into digital and intelligent conversion. The chip is a carrier of an integrated circuit, and the chip manufacturing involves the technological processes of chip design, wafer manufacturing, wafer processing, electrical measurement, dicing packaging, testing, and the like.
In the fabrication of integrated circuits, wafers (substrates) are exposed to a large number of particles through multiple processing steps such as thin film deposition, etching, polishing, and the like. In order to maintain the clean state of the substrate surface and eliminate the particles remained on the substrate surface during the process, the substrate after each process must be cleaned and dried, which is also commonly referred to as post-substrate treatment.
Typically, the substrate post-processing module includes a roll brush cleaning module, a megasonic cleaning module, a spin drying module, a lift drying module, and the like. When the substrate post-processing module is installed, the levelness of the substrate post-processing module and the position relationship between the substrate post-processing module and the carrying manipulator are required to be adjusted, so that interference between the substrate clamped by the carrying manipulator and the inlet of the groove body of the substrate post-processing module is avoided, and smooth transmission of the substrate to be processed is ensured.
The existing substrate post-processing module is also provided with a corresponding position adjusting device, but the structure is complex, the operation is complex, the installation and debugging efficiency of the substrate post-processing module is seriously affected, and the production takt of substrate manufacturing is not guaranteed.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art to a certain extent.
Therefore, the embodiment of the invention provides a substrate post-processing device, which comprises a groove body provided with a substrate post-processing module, wherein the bottom plate of the groove body is fixed on a base through an adjusting component; the adjusting assembly comprises a first connecting plate, and the bottom plate is arranged on the upper side of the base through the first connecting plate; the end part of the first connecting plate is provided with a vertically through threaded hole, and an adjusting nut is arranged in the threaded hole; the adjusting nut can be abutted against the base to enable the first connecting plate to be separated from the base, so that the gasket is placed in a gap between the first connecting plate and the base to adjust the levelness of the groove body.
As a preferred embodiment, the adjusting assembly further comprises a second connecting plate fixed to the underside of the base plate by bolts; the second connecting plate is provided with a kidney-shaped longitudinal adjustment hole, and the kidney-shaped longitudinal adjustment hole is fixed on the upper side of the first connecting plate through the longitudinal adjustment hole by bolts.
As a preferred embodiment, the corners of the bottom plate are provided with kidney-shaped lateral adjustment holes, through which bolts pass to fix the bottom plate to the second connection plate.
As an optimal embodiment, the top surface of the second connecting plate is provided with a pin shaft, the corresponding position of the bottom plate is provided with a pin hole, and the bottom plate can swing left and right along the transverse adjusting hole by taking the pin shaft as the center so as to adjust the positions of the bottom plate and the upper groove body of the bottom plate.
As a preferred embodiment, the end face of the first connecting plate is provided with a longitudinal adjusting seat, the longitudinal adjusting seat is provided with a longitudinal adjusting bolt, and the longitudinal adjusting bolt is rotationally connected with the longitudinal adjusting seat and is in threaded connection with the second connecting plate so as to drive the second connecting plate and the groove body on the upper side of the second connecting plate to move along the longitudinal adjusting hole.
As a preferred embodiment, the center of the adjusting nut is provided with a vertical connecting hole, and a bolt passes through the connecting hole to connect the first connecting plate with the base.
As a preferred embodiment, the end face of the bottom plate is provided with a limiting block, the end face of the second connecting plate is provided with a pair of transverse adjusting seats, and the transverse adjusting seats are positioned on two sides of the limiting block; the transverse adjusting seat is provided with a transverse adjusting bolt arranged along the width direction of the bottom plate, and the transverse adjusting bolt is rotated to be abutted against the limiting block so as to drive the bottom plate to swing along the pin shaft.
As a preferred embodiment, the adjusting component is disposed at an operation end of the tank body, and the first connecting plate is connected to an end of the bottom plate in a length direction.
As a preferred embodiment, the outer circumferential surface of the pin shaft is provided with a protective layer, the protective layer is made of polytetrafluoroethylene, and the pin shaft provided with the protective layer is in clearance fit with the pin hole.
In addition, the invention also discloses a substrate post-processing method, which uses the substrate post-processing device, and comprises the following steps:
S1, rotating an adjusting nut according to a moving track of a carrying manipulator, and changing the thickness of a gasket between a first connecting plate and a base as required so as to adjust the levelness of a groove body;
s2, rotating a longitudinal adjusting bolt of a longitudinal adjusting seat according to the moving track of the carrying manipulator so as to adjust the longitudinal position of the groove body;
S3, rotating a transverse adjusting bolt of the transverse adjusting seat according to the moving track of the carrying manipulator, so that the bottom plate can swing around the pin shaft as a center along the transverse adjusting hole to adjust the position of the groove body;
S4, the carrying manipulator places the substrate in the groove body so as to finish the post-treatment of the substrate.
The beneficial effects of the invention include:
(1) The gap between the first connecting plate and the base is adjusted by rotating the adjusting nut, so that the levelness of the groove body is adjusted; the bolt is arranged at the center of the adjusting nut, so that the first connecting plate can be directly locked with the base, and the bolt does not need to be additionally arranged for locking, so that the adjusting nut has the advantage of convenience in operation;
(2) The bottom plate of the groove body can rotate by taking the pin shaft as the center by rotating the transverse adjusting bolt of the transverse adjusting seat so as to adjust the installation position of the groove body; the adjustment of the longitudinal installation position of the groove body is realized by rotating the longitudinal adjusting bolt of the longitudinal adjusting seat.
Drawings
The advantages of the present invention will become more apparent and more readily appreciated from the detailed description given in conjunction with the following drawings, which are meant to be illustrative only and not limiting of the scope of the invention, wherein:
FIG. 1 is a schematic view of a substrate post-processing apparatus according to the present invention;
FIG. 2 is a schematic view of a substrate post-processing apparatus without a substrate post-processing module according to the present invention;
FIG. 3 is a schematic view of the base and the first connecting plate separated from the bottom plate according to the present invention;
FIG. 4 is a schematic view of the second connecting plate of the present invention separated from the bottom plate;
FIG. 5 is a schematic view of a substrate post-processing apparatus of the present invention after preliminary installation;
FIG. 6 is a longitudinal cross-sectional view of a substrate aftertreatment device according to the present disclosure;
fig. 7 is a flow chart of a method for post-processing a substrate according to the present invention.
Detailed Description
The following describes the technical scheme of the present application in detail with reference to specific embodiments and drawings thereof. The examples described herein are specific embodiments of the present application for illustrating the concept of the present application; the description is intended to be illustrative and exemplary in nature and should not be construed as limiting the scope of the application in its aspects. In addition to the embodiments described herein, those skilled in the art can adopt other obvious solutions based on the disclosure of the claims and the specification thereof, including those adopting any obvious substitutions and modifications to the embodiments described herein.
The drawings in the present specification are schematic views, which assist in explaining the concept of the present invention, and schematically show the shapes of the respective parts and their interrelationships. It should be understood that for the purpose of clearly showing the structure of various parts of embodiments of the present invention, the drawings are not drawn to the same scale and like reference numerals are used to designate like parts in the drawings.
In the present invention, "Chemical Mechanical Polishing (CMP)" is also called "Chemical Mechanical Planarization (CMP)", and a Wafer (W) is also called a Substrate (Substrate), and the meaning and actual effect are equivalent.
The IC process is a process operation in which a substrate is subjected to various steps in a clean room using chemicals such as organic and inorganic substances. Due to the influence of personnel, environment and other factors, a large amount of pollutants can be generated in the substrate processing process. These contaminants generally include particles, organics, metal contaminants and/or oxides, etc., with particle sizes varying from a few nanometers to hundreds of nanometers.
The post-treatment of the substrate is usually to remove contaminants attached to the surface of the substrate after the substrate is polished, thinned, etc., so as to control the size and the number of the contaminant particles on the surface of the substrate within the scope of the process requirement. In the substrate post-treatment, the accurate and efficient transmission of the substrate is beneficial to controlling the post-treatment efficiency of the substrate and improving the productivity (Wafer Per Hour, WPH) of production equipment. The centering and checking of the handling robot and the substrate post-processing module are key to the normal transfer of the substrate, which generally requires a lot of effort, and affects the installation and debugging efficiency of the production equipment to a certain extent.
Fig. 1 is a schematic structural view of a substrate post-processing apparatus according to the present invention, which includes a tank 10 provided with a substrate post-processing module, and a bottom plate 11 of the tank 10 is fixed to a base 30 through an adjusting assembly 20.
Further, the adjusting assembly 20 includes a first connection plate 21, and the base plate 11 is disposed on the upper side of the base 30 through the first connection plate 21; the end of the first connecting plate 21 is provided with a vertically penetrating threaded hole, and as shown in fig. 3, an adjusting nut 21a is arranged in the threaded hole; the adjusting nut 21a can abut against the base 30 so that the first connecting plate 21 is separated from the base 30, and a spacer is placed in a gap between the first connecting plate 21 and the base 30 to realize adjustment of levelness of the tank body 10.
In the embodiment shown in fig. 2, the number of first connection plates 21 is a pair, which are provided at the end in the longitudinal direction of the base plate 11. That is, the first connecting plate 21 is disposed on the operation surface of the substrate post-processing apparatus, so that an operator can conveniently rotate the adjusting nut 21a to adjust the levelness of the tank 11. Specifically, a level may be placed on the top surface of the base plate 11, and by observing the position change of the bubble in the level, the adjusting nut 21a on the first connecting plate 21 is rotated, and the adjusting nut 21a may jack up the mechanism on the upper side of the base 30 as a whole, so as to adjust the levelness of the substrate post-processing apparatus.
As an embodiment of the present invention, the center of the adjustment nut 21a is provided with a vertical connection hole through which a bolt passes to connect the first connection plate 21 with the base 30. That is, after the levelness adjustment is completed, the positions of the first connection plate 21 and the substrate post-processing module thereon are relatively fixed by the adjustment nuts 21a, and the first connection plate 21 and the base 30 are locked by bolts.
As an embodiment of the present invention, the adjusting assembly 20 further includes a second connection plate 22 fixed to the lower side of the base plate 11 by bolts; the second connection plate 22 is provided with a kidney-shaped longitudinal adjustment hole 22a, and as shown in fig. 4, the second connection plate 22 is fixed to the upper side of the first connection plate 21 through the longitudinal adjustment hole 22a by a bolt.
Further, the corners of the bottom plate 11 are provided with lateral adjustment holes 11a shown in fig. 4, and bolts pass through the lateral adjustment holes 11a to fix the bottom plate 11 to the second connection plate 22. Specifically, the lateral adjustment holes 11a are vertically penetrating in the thickness direction of the base plate 11, and their cross sections are formed in a kidney shape so as to adjust the positions of the base plate 11 and the substrate post-processing modules thereon.
As another embodiment of the present invention, the top surface of the second connecting plate 22 is provided with a pin 22b, as shown in fig. 4, a pin hole 11b is provided at a corresponding position of the bottom plate 11, and the bottom plate 11 can swing left and right along the lateral adjustment hole 11a with the pin 22b as a center, so as to adjust the positions of the bottom plate 11 and the upper groove body 10 thereof, thereby realizing the position adjustment of the substrate post-processing module.
After the preliminary mounting, the substrate post-processing apparatus generally occurs as shown in fig. 5. Namely, the mounting positions of the base plate 11 and the substrate post-processing module thereon are deviated; the dotted line is the position of the substrate after the preliminary installation of the substrate after the treatment device, and the solid line is the position after adjustment and check. According to a conventional position adjustment structure, a position adjustment mechanism is generally provided in the lateral and longitudinal directions to achieve position adjustment of the base plate 11 and the substrate processing modules thereon. Because the position adjusting structure is configured independently in the prior art, the position of the bottom plate 11 can be adjusted from the transverse direction and the longitudinal direction, so that the degree of freedom of the bottom plate 11 is overlarge, and the position adjusting efficiency of the bottom plate 11 is affected to a certain extent.
In the technical scheme provided by the invention, the bottom plate 11 is provided with the pin holes 11b, and the top surface of the second connecting plate 22 is correspondingly provided with the pin shafts 22b. The pin 22b can limit the movable space of the bottom plate 11 to a certain extent, and the position adjustment efficiency is improved. Specifically, the base plate 11 can swing left and right along the lateral adjustment hole 11a with the pin 22b as a center to achieve position adjustment of the substrate post-processing module.
In the invention, the pin shaft 22b and the pin hole 11b are in clearance fit, and the clearance between the pin shaft and the pin hole is controlled to be 0.02-0.8mm. In order to avoid adhesion of the same materials, the outer circumferential surface of the pin shaft 22b is provided with a protective layer made of polytetrafluoroethylene, and the pin shaft 22b provided with the protective layer is in precise clearance fit with the pin hole 11 b. It will be appreciated that the protective layer may also be made of other non-metallic materials; considering the environment in which the substrate post-processing apparatus is used, it is preferable to use some chemical-resistant materials.
In the embodiment shown in fig. 4, the end surface of the bottom plate 11 is provided with a limiting block 24, the end surface of the second connecting plate 22 is provided with a pair of transverse adjusting seats 25, and the transverse adjusting seats 25 are positioned at two sides of the limiting block 24; the lateral adjustment seat 25 is provided with a lateral adjustment bolt 25a provided along the width direction of the bottom plate 11, and the bottom plate 11 is driven to swing along the pin 22b by rotating the lateral adjustment bolt 25a to abut against the stopper 24.
As another embodiment of the present invention, the end surface of the first connecting plate 21 is provided with a longitudinal adjustment seat 23, as shown in fig. 3 and 6, the longitudinal adjustment seat 23 is provided with a longitudinal adjustment bolt 23a, the longitudinal adjustment bolt 23a is rotatably connected to the longitudinal adjustment seat 23, and the end of the longitudinal adjustment bolt 23a is screwed to the second connecting plate 22, so as to drive the second connecting plate 22 and the groove body 10 on the upper side thereof to move along the longitudinal adjustment hole 22a, thereby realizing the adjustment of the longitudinal positions of the second connecting plate 22 and the substrate post-processing module arranged on the upper side thereof.
Meanwhile, the invention also discloses a substrate post-processing method, which uses the substrate post-processing device, and the substrate post-processing method is a flow chart as shown in fig. 7, and specifically comprises the following steps:
s1, according to the moving track of the carrying manipulator, rotating an adjusting nut 21a, and optionally changing the thickness of a gasket between a first connecting plate 21 and a base 30 to adjust the levelness of the tank body 10;
S2, rotating a longitudinal adjusting bolt 23a of the longitudinal adjusting seat 23 according to the moving track of the carrying manipulator so as to adjust the longitudinal position of the tank body 10;
S3, rotating a transverse adjusting bolt 25a of a transverse adjusting seat 25 according to the moving track of the carrying manipulator, so that the bottom plate 11 can swing around a pin 22b as a center along the transverse adjusting hole 11a to adjust the position of the groove body 10;
s4, the substrate is placed in the groove body 10 by the carrying manipulator so as to finish the post-treatment of the substrate.
It will be appreciated that the adjustment steps in steps S1 to S3 are independent of each other and are not sequential. When the position adjustment is performed, step S2 may be performed first, and then steps S1 and S3 may be performed, so that the position adjustment of the substrate post-processing module is finally realized, so that the carrying manipulator is opposite to the opening position on the tank body 10, the installation and debugging efficiency of the substrate post-processing device is improved, and efficient transmission of the wafer is ensured.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the invention, the scope of which is defined by the claims and their equivalents.
Claims (7)
1. The substrate post-processing device is characterized by comprising a groove body provided with a substrate post-processing module, wherein the bottom plate of the groove body is fixed on a base through an adjusting component; the adjusting assembly comprises a first connecting plate, and the bottom plate is arranged on the upper side of the base through the first connecting plate; the end part of the first connecting plate is provided with a vertically through threaded hole, and an adjusting nut is arranged in the threaded hole; the adjusting nut can be abutted against the base to enable the first connecting plate to be separated from the base, so that a gasket is placed in a gap between the first connecting plate and the base to realize adjustment of levelness of the groove body;
The adjusting assembly further comprises a second connecting plate which is fixed on the lower side of the bottom plate through bolts; the second connecting plate is provided with a kidney-shaped longitudinal adjusting hole, and the kidney-shaped longitudinal adjusting hole is fixed on the upper side of the first connecting plate through a bolt penetrating through the longitudinal adjusting hole;
the corner of the bottom plate is provided with a kidney-shaped transverse adjusting hole, and a bolt penetrates through the transverse adjusting hole to fix the bottom plate and the second connecting plate;
The top surface of the second connecting plate is provided with a pin shaft, the corresponding position of the bottom plate is provided with a pin hole, and the bottom plate can swing left and right around the pin shaft as a center along the transverse adjusting hole so as to adjust the positions of the bottom plate and the upper groove body of the bottom plate.
2. The substrate post-processing apparatus according to claim 1, wherein the end face of the first connecting plate is provided with a longitudinal adjustment seat, the longitudinal adjustment seat is provided with a longitudinal adjustment bolt, and the longitudinal adjustment bolt is rotatably connected to the longitudinal adjustment seat and is in threaded connection with the second connecting plate so as to drive the second connecting plate and a groove body on the second connecting plate to move along the longitudinal adjustment hole.
3. The substrate post-processing apparatus according to claim 1, wherein the adjusting nut is provided with a vertical connection hole at a center thereof, through which a bolt passes to connect the first connection plate with the base.
4. The substrate post-processing apparatus according to claim 1, wherein the end face of the bottom plate is provided with a stopper, and the end face of the second connecting plate is provided with a pair of lateral adjustment seats, the lateral adjustment seats being located on both sides of the stopper; the transverse adjusting seat is provided with a transverse adjusting bolt arranged along the width direction of the bottom plate, and the transverse adjusting bolt is rotated to be abutted against the limiting block so as to drive the bottom plate to swing along the pin shaft.
5. The substrate post-processing apparatus according to claim 1, wherein the adjusting member is provided at an operation end of the tank body, and the first connection plate is connected to an end portion in a longitudinal direction of the base plate.
6. The substrate post-processing apparatus according to claim 1, wherein the outer circumferential surface of the pin is provided with a protective layer made of polytetrafluoroethylene, and the pin provided with the protective layer is in clearance fit with the pin hole.
7. A substrate post-processing method characterized by using the substrate post-processing apparatus according to any one of claims 1 to 6, comprising the steps of:
S1, rotating an adjusting nut according to a moving track of a carrying manipulator, and changing the thickness of a gasket between a first connecting plate and a base as required so as to adjust the levelness of a groove body;
s2, rotating a longitudinal adjusting bolt of a longitudinal adjusting seat according to the moving track of the carrying manipulator so as to adjust the longitudinal position of the groove body;
S3, rotating a transverse adjusting bolt of the transverse adjusting seat according to the moving track of the carrying manipulator, so that the bottom plate can swing around the pin shaft as a center along the transverse adjusting hole to adjust the position of the groove body;
S4, the carrying manipulator places the substrate in the groove body so as to finish the post-treatment of the substrate.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111231889.0A CN113990778B (en) | 2021-10-22 | 2021-10-22 | Substrate post-processing device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111231889.0A CN113990778B (en) | 2021-10-22 | 2021-10-22 | Substrate post-processing device |
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| CN113990778A CN113990778A (en) | 2022-01-28 |
| CN113990778B true CN113990778B (en) | 2024-08-20 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201315105Y (en) * | 2008-12-03 | 2009-09-23 | 吴玉华 | Numerical control machine tool mechanical debugging practical training device |
| CN105449957A (en) * | 2015-12-10 | 2016-03-30 | 湖北三江航天红阳机电有限公司 | Automatic stator and rotor combining machine |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101003758B1 (en) * | 2010-01-11 | 2010-12-23 | 현대체육산업(주) | Support apparatus for ice panel |
| CN106783694A (en) * | 2017-02-06 | 2017-05-31 | 广东工业大学 | A kind of wafer stage chip upside-down mounting locating platform |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201315105Y (en) * | 2008-12-03 | 2009-09-23 | 吴玉华 | Numerical control machine tool mechanical debugging practical training device |
| CN105449957A (en) * | 2015-12-10 | 2016-03-30 | 湖北三江航天红阳机电有限公司 | Automatic stator and rotor combining machine |
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| CN113990778A (en) | 2022-01-28 |
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