CN113937007B - Surface treatment method for improving adhesive property of multilayer coating material - Google Patents
Surface treatment method for improving adhesive property of multilayer coating material Download PDFInfo
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- 239000000463 material Substances 0.000 title claims abstract description 77
- 238000004381 surface treatment Methods 0.000 title claims abstract description 43
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- 238000000576 coating method Methods 0.000 title abstract description 11
- 239000011248 coating agent Substances 0.000 title abstract description 8
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- 238000004026 adhesive bonding Methods 0.000 claims abstract description 16
- 238000011282 treatment Methods 0.000 claims abstract description 12
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- 239000011737 fluorine Substances 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 238000005542 laser surface treatment Methods 0.000 description 3
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/3568—Modifying rugosity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a surface treatment method for improving the adhesive property of a multilayer plating material, which relates to the technical field of integrated circuit packaging and comprises the steps of setting a surface treatment area layer, preprocessing the surface of the multilayer plating material by a first laser with the power of 5-10W and the frequency of 50-70KHz according to the surface treatment area layer, carrying out secondary processing by a second laser with the power of 15-20W and the frequency of 30-50KHz according to the surface treatment area layer, and then carrying out ultrasonic washing treatment and drying treatment. The surface treatment method can remove one or more layers of required coatings at will, simultaneously can enable the gluing area to meet the gluing strength requirement and the packaging air tightness requirement, and effectively improves the gluing performance of the multi-layer coating material.
Description
Technical Field
The invention relates to the technical field of integrated circuit packaging, in particular to a surface treatment method for improving the adhesive property of a multilayer plating material.
Background
The gluing process comprises 4 steps: the surface treatment of the bonded piece is the first step in the gluing process and is also the most important step, and the surface treatment is used for eliminating surface organic matters, improving the surface roughness to increase the mechanical meshing effect and increasing the contact area of the adhesive so as to improve the gluing performance. In the prior art, a technical scheme for performing laser surface treatment on a single alloy metal to improve the bonding performance is mainly provided, but a laser surface treatment scheme for a multi-layer coating material (semiconductor) is lacked, namely, how to control laser parameters to meet the requirement of arbitrarily removing one or more layers of coatings without influencing the material of an underlayer.
Although the adhesive performance of the semiconductor can be improved by adopting the prior art, for the semiconductor package, the adhesive performance is far insufficient to meet the requirement that the package is not broken (the adhered part meets the reliability verification and does not fall off). The sealing performance is an important performance index of semiconductor packaging, external water vapor or other corrosive gases may invade an internal chip or a bonding wire position to pollute a device, so that the performance of the device is reduced or even the device fails, therefore, in the field of semiconductor packaging, the improvement of the bonding performance needs to be evaluated by air tightness, which has higher requirements on the bonding performance, and meanwhile, the whole bonding area needs to be ensured to keep a uniform level. Therefore, the method for further optimizing the laser surface treatment method and improving the adhesive property of the multilayer plating material have important significance.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a surface treatment method for improving the bonding performance of a plurality of layers of plating materials, which can remove one or more layers of required plating layers at will aiming at the plurality of layers of plating materials and can ensure that the bonding area meets the bonding strength requirement and the encapsulation air tightness requirement.
In order to solve the technical problems, the invention adopts the following technical scheme:
a surface treatment method for improving the adhesive property of a multi-layer plating material comprises the following steps:
(S1) setting a surface treatment region layer: drawing software according to the area needing to be glued, and obtaining an area layer for carrying out surface treatment on the multilayer plating material;
(S2) pre-treating the surface of the multi-layer plating material according to the surface treatment region pattern layer of the step (S1) using a first laser emitted from a laser with a power of 5-10W and a frequency of 50-70KHz, the first laser scanning the surface of the multi-layer plating material and melting the surface to obtain a pre-treated surface with a rough surface;
(S3) performing secondary treatment on the pretreated surface in the step (S2) according to the surface treatment area pattern layer in the step (S1) by using second laser with power of 15-20W and frequency of 30-50KHz emitted by a laser, and scanning the pretreated surface by the second laser to obtain a bonding surface with a specific hook and tenon structure;
(S4) subjecting the multi-layer plating material treated in the step (S3) to ultrasonic water washing treatment;
(S5) the multi-layer plating material processed in the step (S4) is dried.
Further, in the step (S1), the software drawing of the region to be glued includes: designing the shape and size of an area layer according to an area needing to be subjected to adhesive bonding, and filling the area layer by using a filling line;
filling the filling lines from left to right, then filling from right to left, and then circularly filling according to the mode until the region layers are completely filled;
the line spacing between the fill lines is less than 0.05 mm.
Further, in the step (S2), the surface roughness Ra of the pre-treated surface is 0.5 to 0.7.
Further, in the step (S4), the ultrasonic water washing process includes: and placing the multilayer plating material in an ultrasonic cleaning machine, and carrying out ultrasonic cleaning by adopting pure water for 5-10 minutes.
Further, the resistivity of the pure water is 13 M.OMEGA.cm or more.
Further, in the step (S5), the drying process includes: firstly, drying the surface of the multilayer plating material by a hot air knife, and then baking and drying.
Further, in the step (S2) and the step (S3), the laser is an IPG fiber laser, the first laser and the second laser are pulsed lasers, the wavelength of the pulsed laser is 1064nm, and the pulse width is 200 ns.
Furthermore, a power amplifier of a master control oscillator for adjusting the pulse width of the laser is arranged on the IPG fiber laser, and the pulse widths of the first laser and the second laser are adjusted to 120 ns.
Compared with the prior art, the invention has the advantages that:
the surface treatment method of the invention is adopted to carry out surface treatment on the multilayer plating material, can randomly remove one or more layers of required plating layers, change the surface micro-morphology of the multilayer plating material, improve the surface roughness, improve the mechanical embedding force of the glue layer and the base material by forming a specific hook-and-tenon microstructure which is more three-dimensional and has a larger surface area, achieve the aim that the glue joint is not cracked and the glue joint strength is not reduced in MSL3 moisture level and temperature cycle test, keep destructive thrust of more than 4Kg, meet the strength requirement of the glue joint area, simultaneously achieve the sealing effect of IPX8, ensure that the IR5 fluorine oil detection has no air leakage, and meet the air tightness requirement of packaging.
Drawings
FIG. 1 is a schematic view of one embodiment of a surface treatment area layer.
FIG. 2 is a surface microtopography of sample one and sample two.
FIG. 3 is a drawing of EDS detection sampling of one surface of a sample.
FIG. 4 is an EDS detection spectrum.
FIG. 5 is a graph comparing destructive thrust parameters for sample one and sample two.
Fig. 6 is an optical photograph of sample three and sample four.
Fig. 7 is an optical photograph of sample one and sample five.
Detailed Description
The invention is described in further detail below with reference to the figures and specific examples.
The invention provides a surface treatment method for improving the adhesive property of a multilayer plating material, which comprises the following steps:
(S1) setting a surface treatment region layer: drawing software according to the area needing to be glued, and obtaining an area layer for carrying out surface treatment on the multilayer plating material;
(S2) pre-treating the surface of the multi-layer plating material according to the surface treatment region pattern layer of the step (S1) using a first laser emitted from a laser with a power of 5-10W and a frequency of 50-70KHz, the first laser scanning the surface of the multi-layer plating material and melting the surface to obtain a pre-treated surface with a rough surface;
(S3) performing secondary treatment on the pretreated surface in the step (S2) according to the surface treatment area pattern layer in the step (S1) by using second laser with power of 15-20W and frequency of 30-50KHz emitted by a laser, and scanning the pretreated surface by the second laser to obtain a bonding surface with a specific hook and tenon structure;
(S4) subjecting the multi-layer plating material treated in the step (S3) to ultrasonic water washing treatment;
(S5) the multi-layer plating material processed in the step (S4) is dried.
Further, in the step (S1), the software drawing of the region to be glued includes: designing the shape and size of an area layer according to an area needing to be subjected to adhesive bonding, and filling the area layer by using a filling line; filling the filling lines from left to right, then filling from right to left, and then circularly filling according to the mode until the region layers are completely filled; the line spacing between the fill lines is less than 0.05 mm. In one embodiment of the present invention, as shown in fig. 1, the area of the multilayer plating material to be glued is a T-shaped area, according to the product design requirement, a T-shaped boundary of the surface treatment area layer is drawn on software, a filling line is filled in the T-shaped boundary, the filling line starts from the bottom of the T-shaped boundary, fills from left to right first, and then fills from right to left (i.e. bidirectional filling), and the filling line is cyclically filled in the T-shaped boundary according to the bidirectional filling manner until the filling line ends at the top of the T-shaped boundary, and the drawing of the surface treatment area layer is completed; the line spacing between the filling lines is less than 0.05mm, the effect is to ensure that the areas needing to be glued can be scanned by laser, otherwise, the surface coating is not processed, and the gluing performance of part of the positions is possibly weak, and the air tightness is seriously even affected.
Further, in the step (S2), the surface roughness Ra of the pre-treated surface is 0.5 to 0.7.
Further, in the step (S4), the ultrasonic water washing process includes: the multilayer plating material is placed in an ultrasonic cleaning machine, ultrasonic cleaning is carried out by adopting pure water, the cleaning time is 5-10 minutes, dust generated in the laser process can be removed, the surface of the multilayer plating material is clean, and other impurities are not introduced.
Further, the resistivity of pure water is 13 M.OMEGA.cm or more.
Further, in the step (S5), the drying process includes: the hot air knife is firstly adopted to blow the surfaces of the multiple layers of plating materials dry, and then baking and drying are carried out, so that the multiple layers of plating materials can be kept dry, and the storage life can be prolonged.
Further, in the step (S2) and the step (S3), the laser is an IPG fiber laser, the first laser and the second laser are pulsed lasers, the wavelength of the pulsed laser is 1064nm, and the pulse width is 200 ns.
Furthermore, a power amplifier of a master control oscillator for adjusting the pulse width of the laser is arranged on the IPG optical fiber laser, and the pulse widths of the first laser and the second laser are adjusted to be 120 ns.
In one embodiment of the present invention, in step (S2), the power of the first laser is 5W and the frequency is 60 KHz.
In one embodiment of the present invention, in step (S3), the power of the second laser is 15W and the frequency is 40 KHz.
The above embodiments may be implemented individually or in any combination.
The above embodiments will be described in more detail with reference to specific examples.
The first embodiment is as follows:
first, the processing equipment and material related to this embodiment
(1) The laser adopts an IPG fiber laser, and the wavelength of the pulse laser emitted by the laser is 1064nm, and the pulse width is 200ns (fixed and unadjustable).
(2) The CPM material is a multilayer composite material of copper, molybdenum copper and tungsten copper core materials, has high thermal conductivity, is easy to adjust Coefficient of Thermal Expansion (CTE), is easy to be welded and matched with Kovar alloy and alumina ceramic, and is the mainstream high-power chip heat dissipation substrate at present. CPC is a kind of CPM material, and a CPC core material default in the industry is Mo70Cu30 material, and since copper (Cu) is very easily oxidized in air and corroded to affect the life of the CPC core material, nickel (Ni) and gold (Au) are mainly used to plate the surface of the CPC core material to prolong the service life of the CPC. In the field of electronic packaging, the reliability and hermeticity of the connection of a CPC to a lead frame are important. In this example, the plating layer structure of the CPC multi-layer plating material is shown in table 1.
TABLE 1 coating layer structure of CPC multilayer coating material
| Core material | Surface coating-secondary outer layer | Surface coating-outermost layer |
| Mo70Cu30 | Ni（3-6μm） | Au（0.1-0.2μm） |
Second, embodiment 1:
the surface of the CPC multilayer plating material is treated by the surface treatment method of the invention by adopting a first laser with the power of 5W and the frequency of 60KHz and a second laser with the power of 15W and the frequency of 40KHz to obtain a sample I.
The surface of the CPC multilayer plating material was treated by a laser with a power of 15W and a frequency of 40KHz according to the surface treatment method of the prior art, and a sample two was obtained.
And respectively carrying out microstructure detection, bonding area strength detection and packaging airtightness detection on the first sample and the second sample:
(1) microstructure detection
Referring to fig. 2-4, wherein fig. 2 is a surface micro-topography map of sample one and sample two; FIG. 3 is a drawing of EDS detection sampling of one surface of a sample; FIG. 4 is an EDS detection spectrum; table 2 is the EDS detection quantitative results table.
In the process of bonding, the surface roughness is improved, and the mechanical embedding force of a glue layer formed by the adhesive with good fluidity and the base material is improved, so that the bonding strength of the glue layer is improved. After the laser beam irradiates the surface of the material, the surface of the material absorbs the laser energy to cause the material to generate phenomena of metamorphosis, melting, evaporation and the like, and for the CPC multilayer plating material, the outermost layer of the CPC multilayer plating material is Au, the surface is bright and smooth, and high reflectivity and low laser absorption rate are easily generated to light.
Specifically, a first laser with the power of 5-10W and the frequency of 50-70KHz is used for scanning to complete pretreatment, so that on one hand, impurities on the surface of a CPC multilayer plating material can be removed, on the other hand, when a first low-power laser irradiates the surface of Au, the surface of the Au is melted, the liquid Au is pushed to the edge, the outermost layer of Au is removed, meanwhile, partial energy of the first laser is used for melting the Ni part of the secondary outer layer, the surface roughness Ra of the material is adjusted to be 0.5-0.7, the uniform surface is enabled to form uneven texture similar to frosted texture, and appropriate surface roughness is provided for secondary treatment of a second laser; and the secondary treatment is completed by adopting a second laser with the power of 15-20W and the frequency of 30-50KHz, and because the Au layer which generates high reflectivity and low laser absorption rate to the laser is removed, when the high-power second laser scans, the surface Ni layer fully absorbs energy, and simultaneously, the roughness difference causes microscopic influence to the light absorption, and the carving is performed at high energy to form the microstructure of the specific hook tenon.
As shown in fig. 2, it was found by comparison that when the surface of the CPC multi-layer plating material was treated by the surface treatment method of the prior art using a laser with a power of 15W and a frequency of 40KHz, the surface of the multi-layer plating material formed a neat and uniform "fish scale" microstructure. Compared with the second sample with the scale-type microstructure, the first sample with the specific hook-tenon microstructure can ensure that the bonding process has high reliability (high bonding strength and high air tightness) through a more three-dimensional shape and a larger surface area.
As shown in fig. 3, EDS detection sampling is performed on one surface of the sample, and the EDS spots 1, 2 and the selected area 1 are respectively subjected to sampling quantitative detection, and the EDS detection results are shown in fig. 4 and table 2. As can be seen from table 2, Au and Ni were detected in EDS spot 2 and selection area 1 of the area not treated by the technique of the present invention, indicating that Au, which is the outermost layer of the CPC multilayer plating material, was not removed; the EDS Point 1 of the area treated by the technique of the present invention detected Ni and Cu, indicating that Au at the outermost layer of the CPC multilayer plating material was removed by the treatment of the present invention. Note: the EDS point 1 of the area treated by the technology of the invention detects a small amount of Cu, because EDS sampling has a certain detection depth (3-5 mu m).
TABLE 2 EDS quantitative results table
(2) Strength detection of glued area
And (3) detecting the strength of the first adhesive bonding area of the sample, wherein the detection result meets the requirement of the strength of the adhesive bonding area and can meet pre-conditioning test (MSL 3) and Temperature Cycling Test (TC), the adhesive bonding part is not broken, the adhesive bonding strength is not reduced, and the destructive thrust of more than 4Kg is kept. Referring to fig. 5 and table 6, fig. 5 is a comparison of destructive thrust parameters for sample one and sample two, from which it can be seen that the destructive thrust for sample one is at a minimum of 4.48Kg, greater than 4 Kg; the destructive pushing force of sample two was a minimum of 2.68Kg, greater than 2.5 Kg. Sample one had a higher bond strength than sample two.
TABLE 6 comparison of the results of the first and second samples
(3) Package hermeticity detection
In integrated circuit packaging technologyIn the technical field, infrared reflow soldering (IR for short) is a soldering device for various surface-mounted chip components, namely, an IC after packaging is soldered on a circuit board by infrared reflow soldering. During the mounting of the packaged IC, in the process of passing through the high temperature region of 240-260 ℃ of IR-reflex, because the thermal expansion coefficients of materials consisting of all the packages are inconsistent after being heated, the glued area is easy to crack, and the electronic element is easy to be affected with damp and damaged, the MSL moisture sensitivity in the industry is measured, and the air tightness requirement of the package needs to meet the requirements of IR-reflex 3 times (simulating the loading, the maintenance and the removal of the IC, and the maintenance and the loading of the IC). The air tightness detection result of the first sample shows that the bonding area can pass through IR-reflex 5 times (namely IR 5), air tightness of fluorine oil detection can be ensured, the sealing effect of IPX8 can be achieved, and the helium leakage rate of the cavity after packaging is less than 5 x 10-10Pa•m3/s。
In summary, the detection results of the first sample and the second sample are compared, and the specific comparison condition is shown in table 3.
TABLE 3 comparison of the results of the first and second samples
The experiment of the embodiment 1 shows that the surface treatment method can be used for randomly removing one or more required coatings, changing the surface micro-morphology of a plurality of layers of coating materials, improving the surface roughness, improving the mechanical embedding force of an adhesive layer and a base material by forming a specific hook-and-tenon microstructure which is more three-dimensional and has a larger surface area, achieving the aim that the adhesive joint is not cracked and the adhesive strength is not reduced in MSL3 moisture level and temperature cycle tests, keeping the destructive thrust of more than 4Kg, meeting the strength requirement of the adhesive joint area, simultaneously achieving the sealing effect of IPX8, ensuring that the IR5 fluorine oil detection has no air leakage, and meeting the air tightness requirement of packaging.
Third, embodiment 2:
respectively processing the surfaces of two CPC multilayer coating materials by adopting a first laser with the power of 5W and the frequency of 60KHz and a second laser with the power of 15W and the frequency of 40KHz according to the surface processing method of the invention to obtain a third sample and a fourth sample, wherein the difference is that: the area layer in the step (S1) according to sample three, in which the line pitch between the filling lines is 0.03mm (less than 0.05 mm); and (3) the area layer in the step (S1) according to sample four, wherein the line spacing between the filling lines is 0.1mm (greater than 0.05 mm).
Referring to fig. 6 and table 4, fig. 6 is an optical photograph of sample three and sample four, and table 4 is a comparison table of results of sample three and sample four. It is shown by the embodiment 2 that, in the step (S1) of the present invention, the line spacing between the filling lines of the surface-treated region pattern layer is less than 0.05mm, which is used to ensure that all the regions to be bonded can be scanned by laser, and if the line spacing is greater than 0.05mm, there is a possibility that some parts of the surface coating layer are not treated, which results in poor bonding performance at some positions and even serious influence on the air tightness.
TABLE 4 COMPARATIVE TABLE OF THE RESULT OF SAMPLE III AND SAMPLE IV
Example two:
first, the processing equipment and material related to this embodiment
(1) The laser adopts an IPG fiber laser, a power amplifier (Mopa) of a master control oscillator for adjusting the laser pulse width is arranged on the IPG fiber laser, the wavelength of the pulse laser emitted by the power amplifier is 1064nm, and the pulse width is 120 ns.
(2) In this embodiment, the plating layer structure of the CPC multi-layer plating material is as shown in the above table 1.
Second, embodiment 3:
the surface of the CPC multilayer plating material was treated according to the surface treatment method of the present invention using a first laser with a power of 5W and a frequency of 60KHz, a second laser with a power of 15W and a frequency of 40KHz, to obtain sample five. Sample one and sample five differ in that: the sample is obtained by processing a first laser with the pulse width of 200ns and a second laser; sample five was obtained by first and second laser treatment with a pulse width of 120 ns.
Referring to fig. 7 and table 5, fig. 7 is an optical photograph of sample one and sample five, and table 5 is a comparison table of the results of sample one and sample five. The pulse width of the IPG fiber laser which is the mainstream in the market is 200ns (fixed and not adjustable), but after the laser beam irradiates the surface of the material, the surface of the material absorbs the laser energy, so that the phenomena of metamorphosis, melting, evaporation and the like are generated, and the longer the pulse width is, the more heat is dissipated to the periphery, so that if the side effect caused by the heat radiation of the laser needs to be reduced, a power amplifier (Mopa) of a master-controlled oscillator needs to be matched, and the thermal influence is reduced by reducing the pulse width. Embodiment 3 shows that by practical tuning to a pulse width of 120ns, the thermal influence can be reduced to an optimum level, as shown in fig. 7, i.e. not visible to the eye.
TABLE 5 COMPARATIVE TABLE OF THE RESULTS OF SAMPLE I AND SAMPLE FIVE
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above-described embodiments. Modifications and variations that may occur to those skilled in the art without departing from the spirit and scope of the invention are to be considered as within the scope of the invention.
Claims (8)
1. A surface treatment method for improving the adhesive property of a multi-layer plating material is characterized by comprising the following steps:
(S1) setting a surface treatment region layer: drawing software according to the area needing to be glued, and obtaining an area layer for carrying out surface treatment on the multilayer plating material;
(S2) pre-treating the surface of the multi-layer plating material according to the surface treatment region pattern layer of the step (S1) using a first laser emitted from a laser with a power of 5-10W and a frequency of 50-70KHz, the first laser scanning the surface of the multi-layer plating material and melting the surface to obtain a pre-treated surface with a rough surface;
(S3) performing secondary treatment on the pretreated surface in the step (S2) according to the surface treatment area pattern layer in the step (S1) by using second laser with power of 15-20W and frequency of 30-50KHz emitted by a laser, and scanning the pretreated surface by the second laser to obtain a bonding surface with a specific hook and tenon structure;
(S4) subjecting the multi-layer plating material treated in the step (S3) to ultrasonic water washing treatment;
(S5) the multi-layer plating material processed in the step (S4) is dried.
2. The surface treatment method for improving adhesive bonding performance of a multi-layer plating material according to claim 1, wherein the step (S1) of drawing the area to be adhered by software comprises: designing the shape and size of an area layer according to an area needing to be subjected to adhesive bonding, and filling the area layer by using a filling line;
filling the filling lines from left to right, then filling from right to left, and then circularly filling according to the mode until the region layers are completely filled;
the line spacing between the fill lines is less than 0.05 mm.
3. The surface treatment method for improving adhesive properties of a multi-layer plating material according to claim 1, wherein in the step (S2), the surface roughness Ra of the pre-treated surface is 0.5-0.7.
4. The surface treatment method for improving adhesive properties of a multi-layer plating material according to claim 1, wherein in the step (S4), the ultrasonic water washing treatment comprises: and placing the multilayer plating material in an ultrasonic cleaning machine, and carrying out ultrasonic cleaning by adopting pure water for 5-10 minutes.
5. The surface treatment method for improving adhesion of a multilayer plating material according to claim 4, wherein the resistivity of the pure water is 13M Ω -cm or more.
6. The surface treatment method for improving adhesive properties of a multi-layer plating material according to claim 1, wherein in the step (S5), the drying process comprises: firstly, drying the surface of the multilayer plating material by a hot air knife, and then baking and drying.
7. The surface treatment method for improving adhesive bonding performance of a multi-layer plated material according to claim 1, wherein in the steps (S2) and (S3), the laser is an IPG fiber laser, the first laser and the second laser are pulsed lasers, the wavelength of the pulsed laser is 1064nm, and the pulse width is 200 ns.
8. The surface treatment method for improving the bonding performance of a plurality of layers of cladding materials according to claim 7, wherein the IPG fiber laser is provided with a power amplifier of a master-controlled oscillator for adjusting the pulse width of laser light, and the pulse widths of the first laser light and the second laser light are adjusted to 120 ns.
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